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KAC-12040
4000 (H) x 3000 (V)
CMOS Image Sensor
Description
The KAC−12040 Image Sensor is a high-speed 12 megapixel
CMOS image sensor in a 4/3″ optical format based on a 4.7 mm 5T
CMOS platform. The image sensor features very fast frame rate,
excellent NIR sensitivity, and flexible readout modes with multiple
regions of interest (ROI). The readout architecture enables use of 8, 4,
or 2 LVDS output banks for full resolution readout of 70 frames per
second.
Each LVDS output bank consists of up to 8 differential pairs
operating at 160 MHz DDR for a 320 Mbps data rate per pair.
The pixel architecture allows rolling shutter operation for motion
capture with optimized dynamic range or global shutter for precise
still image capture.
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Table 1. GENERAL SPECIFICATIONS
Parameter
Typical Value
Architecture
5T Global Shutter CMOS
Resolution
12 Megapixels
Aspect Ratio
4:3
Pixel Size
4.7 mm (H) × 4.7 mm (V)
Total Number of Pixels
4224 (H) × 3192 (V)
Number of Effective Pixels
4016 (H) × 3016 (V)
Number of Active Pixels
4000 (H) × 3000 (V)
Active Image Size
18.8 mm (H) × 14.1 mm (V)
23.5 mm (Diagonal), 4/3″ Optical Format
Master Clock Input Speed
5 MHz to 50 MHZ
Maximum Pixel Clock Speed
160 MHz DDR LVDS, 320 Mbps
Number of LVDS Outputs
64 Differential Pairs
Number of Output Banks
8, 4, or 2
Frame Rate, 12 Mp
1−70 fps 10 bits
1−75 fps 8 bits
Charge Capacity
16,000 electrons
Quantum Efficiency
KAC−12040−CBA
KAC−12040−ABA
40%, 47%, 45% (470, 540, 620 nm)
53%, 15%, 10% (500, 850, 900 nm)
Read Noise
(at Maximum LVDS Clock)
3.7 e− rms, Rolling Shutter
25.5 e− rms, Global Shutter
Dynamic Range
73 dB, Rolling Shutter
56 dB, Global Shutter
Blooming Suppression
> 10,000x
Image Lag
1.3 electron
Digital Core Supply
2.0 V
Analog Core Supply
1.8 V
Pixel Supply
2.8 V & 3.5 V
Power Consumption
1.5 W for 12 Mp @ 70 fps 10 bits
Package
267 Pin Ceramic Micro-PGA
Cover Glass
AR Coated, 2-sides
Figure 1. KAC−12040 CMOS Image Sensor
Features
•
•
•
•
•
Global Shutter and Rolling Shutter
Very Fast Frame Rate
High NIR Sensitivity
Multiple Regions of Interest
Interspersed Video Streams
Applications
• Machine Vision
• Intelligent Transportation Systems
• Surveillance
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
NOTE: All Parameters are specified at T = 40°C unless otherwise noted.
© Semiconductor Components Industries, LLC, 2016
March, 2016 − Rev. 5
1
Publication Order Number:
KAC−12040/D
KAC−12040
The image sensor has a pre-configured QFHD (4 × 1080p,
16:9) video mode, fully programmable, multiple ROI for
windowing, programmable sub-sampling, and reverse
readout (flip and mirror). The two ADCs can be configured
for 8-bit, 10-bit, 12-bit or 14-bit conversion and output.
Additional features include interspersed video streams
(dual-video), on-chip responsivity calibration, black
clamping, overflow pixel for blooming reduction, black-sun
correction (anti-eclipse), column and row noise correction,
and integrated timing generation with SPI control, 4:1 and
9:1 averaging decimation modes.
ORDERING INFORMATION
Table 2. ORDERING INFORMATION − KAC−12040 IMAGE SENSOR
Part Number
Description
KAC−12040−ABA−JD−BA
Monochrome, Micro-PGA Package, Sealed Clear Cover Glass with AR
Coating (Both Sides), Standard Grade.
KAC−12040−ABA−JD−AE
Monochrome, Micro-PGA Package, Sealed Clear Cover Glass with AR
Coating (Both Sides), Engineering Grade.
KAC−12040−CBA−JD−BA
Bayer (RGB) Color Filter Pattern, Micro-PGA Package, Sealed Clear Cover
Glass with AR Coating (Both Sides), Standard Grade.
KAC−12040−CBA−JD−AE
Bayer (RGB) Color Filter Pattern, Micro-PGA Package, Sealed Clear Cover
Glass with AR Coating (Both Sides), Engineering Grade.
Marking Code
KAC−12040−ABA
Serial Number
KAC−12040−CBA
Serial Number
1. Engineering Grade samples might not meet final production testing limits, especially for cosmetic defects such as clusters, but also possibly
column and row artifacts. Overall performance is representative of final production parts.
Table 3. ORDERING INFORMATION − EVALUATION SUPPORT
Part Number
Description
KAC−12040−CB−A−GEVK
Evaluation Hardware for KAC−12040 Image Sensor (Color). Includes Image Sensor.
KAC−12040−AB−A−GEVK
Evaluation Hardware for KAC−12040 Image Sensor (Monochrome). Includes Image Sensor.
LENS−MOUNT−KIT−C−GEVK
Lens Mount Kit that Supports C, CS, and F Mount Lenses. Includes IR Cut-filter for Color Imaging.
See the ON Semiconductor Device Nomenclature document (TND310/D) for a full description of the naming convention
used for image sensors. For reference documentation, including information on evaluation kits, please visit our web site at
www.onsemi.com.
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2
KAC−12040
DEVICE DESCRIPTION
LVDS Bank 3
LVDS Bank 5
7D0 − 7D6
Clk7
5D0 − 5D6
Clk5
Clk3
3D0 − 3D6
Architecture
3.5 VA
3.3 VD
2.8 VA
2.0 VD
1.8 VA
LVDS Bank 7
B G
G R
B G
G R
8
B G
G R
(0, 0)
104
104
8
4000 (H) y 3000 (V)
4.7 mm Pixel
B G
G R
8
88
Chip Clock (2 Pins)
TRIGGER
RESETN
CSN
SCLK
MOSI
MISO
ADC_Ref1
4.02 kW ±1%
Even Row ADC, Analog Gain, Black-Sun Correction
LVDS Bank 2
Timing Control, Sub-Sampling/Averaging
88
8
LVDS Bank 4
ADC_Ref2
LVDS Bank 6
Figure 2. Block Diagram
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3
6D0 − 6D6
Clk6
4D0 − 4D6
Clk4
VSS 0 V
2D0 − 2D6
Clk0
Digital Gain/Offset, Noise Correction
0D0 − 0D6
LVDS Bank 0
Clk1
Clk2
1D0 − 1D6
LVDS Bank 1
Odd Row ADC, Analog Gain, Black-Sun Correction
Serial
Peripheral
Interface
(SPI)
KAC−12040
Physical Orientation
1 2 3 4
5
6
7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
A
B
C
D
E
LVDS Bank 5
LVDS Bank 7
LVDS Bank 2
LVDS Bank 4
LVDS Bank 6
LVDS Bank 0
LVDS Bank 1
LVDS Bank 3
AA
AB
AC
AD
AE
1 2 3 4
5
6
7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
Notes:
1. The center of the pixel array is aligned to the physical package center.
2. The region under the sensor die is clear of pins enabling the use of a heat sink.
3. Non-symmetric mounting holes provide orientation and mounting precision.
4. Non-symmetric pins prevent incorrect placement in PCB.
5. Letter “F” indicator shows default readout direction relative to package pin 1.
Figure 3. Package Pin Orientation − Top X-Ray View
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4
KAC−12040
Table 4. PRIMARY PIN DESCRIPTION
Pin
Name
Type
AB09
RESETN
DI
Sensor Reset (0 V = Reset State)
Description
E07
CLK_In1
DI
Sensor Input Clk_In1 (45−50 MHz)
D08
CLK_In2
DI
Sensor Input Clk_In2 (Connect to Clk1)
AB08
TRIGGER
DI
Trigger Input (Optional)
AA05
SCLK
DI
SPI Master Clock
AA08
MOSI
DI
SPI Master Output, Slave Input
AA07
MISO
DO
SPI Master Input, Slave Output
AA06
CSN
DI
SPI Chip Select (0 V = Selected)
AA14
ADC_Ref1
AO
4.02 kW ±1% Resistor between Ref1 & Ref2
AA15
ADC_Ref2
AO
4.02 kW ±1% Resistor between Ref1 & Ref2
AB07
MSO
DO
Mechanical Shutter Output Sync (Optional)
AB06
FLO
DO
Flash Output Sync (Optional)
E05
FEN
DO
Frame Enable Reference Output (Optional)
E06
LEN
DO
Line Enable Reference Output (Optional)
1.
2.
3.
4.
5.
DI = Digital Input, DO = Digital Output, AO = Analog Output.
Tie unused DI pins to Ground, NC unused DO pins.
By default Clk_In2 should equal Clk_In1 and should be the same source clock.
The RESETN pin has a 62 kW internal pull-up resistor, so if left floating the chip will not be in reset mode.
The TRIGGER pin has an internal 100 kW pull down resistor. If left floating (and at default polarity) then the sensor state will not be affected
by this pin (i.e. defaults to ‘not triggered’ mode if floated).
6. All of the DI and DO pins nominally operate at 0 V → 2.0 V and are associated with the VDD_DIG power supply.
Table 5. POWER PIN DESCRIPTION
Name
Voltage
VDD_LVDS
3.3 V D
C04, C05, C23, C24, D04, D24, E04, E24, AA04, AA24,
AB04, AB24, AC04, AC05 AC23, AC24
Pins
LVDS Output Supply
Description
VDD_DIG
2.0 V D
C18, C19, D18, D19, E18, AA18, AB18, AB19, AC18, AC19,
C20, C21, C22, D20, D21, D22, D23, E20, E21, E22, AA20,
AA21, AA22, AB20, AB21, AB22, AB23, AC20, AC21,
AC22, AB15, E08
Digital Core Supply
AVDD_HV
3.5 V A
C11, D11, E11, AA11, AB11, AC11, C10, D10, E10, AA10,
AB10, AC10
Pixel Supply 1
Vref_P
2.8 V A
C13, D13, E13, AA13, AB13, AC13
Pixel Supply 2
AVDD_LV
1.8 V A
C17, D16, D17, E17, AA17, AB16, AB17, AC17
Analog Low Voltage Supply
Vpixel_low
0V
E09
Pixel Supply 3. Combine with VSS for
normal operation. Can be pulsed for
Extended Dynamic Range Operation.
VSS
0V
C12, C14, D12, D14, E12, AA12, AB12, AB14, AC12, AC14,
E15, D15, AA09, A02, A14, A26, B14, C03, C06, C25, D03,
D25, E03, E19, E23, E25, AA03, AA19, AA23, AA25, AB25,
AC03, AC06, AC25, AD14, AE02, AE14, AE26
Sensor Ground Reference
No Connect
NA
A01, AC09, E14, E16, C09, D09, D05, D06, D07, AA16,
AB05
Unused and test-only pins. These
pins must be floated.
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5
KAC−12040
Table 6. LVDS PIN DESCRIPTION
Pin
Name
Description
Pin
Name
Description
Pin
Name
Description
Pin
Name
Description
E01
1DCLK+
Bank 1
C07
3DCLK+
Bank 3
C15
5DCLK+
Bank 5
A22
7DCLK+
Bank 7
E02
1DCLK−
LVDS Clock
C08
3DCLK−
LVDS Clock
C16
5DCLK−
LVDS Clock
B22
7DCLK−
LVDS Clock
D01
1DATA0+
A07
3DATA0+
A15
5DATA0+
A23
7DATA0+
D02
1DATA0−
B07
3DATA0−
B15
5DATA0−
B23
7DATA0−
C01
1DATA1+
A08
3DATA1+
A16
5DATA1+
A24
7DATA1+
C02
1DATA1−
B08
3DATA1−
B16
5DATA1−
B24
7DATA1−
B01
1DATA2+
A09
3DATA2+
A17
5DATA2+
A25
7DATA2+
B02
1DATA2−
B09
3DATA2−
B17
5DATA2−
B25
7DATA2−
A03
1DATA3+
A10
3DATA3+
A18
5DATA3+
B27
7DATA3+
Bank 1
LVDS Data
Bank 3
LVDS Data
Bank 5
LVDS Data
B03
1DATA3−
B10
3DATA3−
B18
5DATA3−
B26
7DATA3−
A04
1DATA4+
A11
3DATA4+
A19
5DATA4+
C27
7DATA4+
B04
1DATA4−
B11
3DATA4−
B19
5DATA4−
C26
7DATA4−
A05
1DATA5+
A12
3DATA5+
A20
5DATA5+
D27
7DATA5+
B05
1DATA5−
B12
3DATA5−
B20
5DATA5−
D26
7DATA5−
A06
1DATA6+
A13
3DATA6+
A21
5DATA6+
E27
7DATA6+
B06
1DATA6−
B13
3DATA6−
B21
5DATA6−
E26
7DATA6−
Bank 7
LVDS Data
Pin
Name
Description
Pin
Name
Description
Pin
Name
Description
Pin
Name
AA01
0DCLK+
Bank 0
AC07
2DCLK+
Bank 2
AC15
4DCLK+
Bank 4
AE22
6DCLK+
Bank 6
AA02
0DCLK−
LVDS Clock
AC08
2DCLK−
LVDS Clock
AC16
4DCLK−
LVDS Clock
AD22
6DCLK−
LVDS Clock
AB01
0DATA0+
AE07
2DATA0+
AE15
4DATA0+
AE23
6DATA0+
AB02
0DATA0−
AD07
2DATA0−
AD15
4DATA0−
AD23
6DATA0−
AC01
0DATA1+
AE08
2DATA1+
AE16
4DATA1+
AE24
6DATA1+
AC02
0DATA1−
AD08
2DATA1−
AD16
4DATA1−
AD24
6DATA1−
AD01
0DATA2+
AE09
2DATA2+
AE17
4DATA2+
AE25
6DATA2+
AD02
0DATA2−
AE03
0DATA3+
AD03
0DATA3−
Bank 0
LVDS Data
AD09
2DATA2−
AE10
2DATA3+
AD10
2DATA3−
Bank 2
LVDS Data
AD17
4DATA2−
AE18
4DATA3+
AD25
6DATA2−
AD26
6DATA3+
AD18
4DATA3−
AD27
6DATA3−
6DATA4+
Bank 4
LVDS Data
AE04
0DATA4+
AE11
2DATA4+
AE19
4DATA4+
AC26
AD04
0DATA4−
AD11
2DATA4−
AD19
4DATA4−
AC27
6DATA4−
AE05
0DATA5+
AE12
2DATA5+
AE20
4DATA5+
AB26
6DATA5+
AD05
0DATA5−
AD12
2DATA5−
AD20
4DATA5−
AB27
6DATA5−
AE06
0DATA6+
AE13
2DATA6+
AE21
4DATA6+
AA26
6DATA6+
AD06
0DATA6−
AD13
2DATA6−
AD21
4DATA6−
AA27
6DATA6−
1.
2.
3.
4.
5.
6.
Description
Bank 6
LVDS Data
All LVDS Data and Clock lines must be routed with 100 W differential transmission line traces.
All the traces for a single LVDS Bank should be the same physical length to minimize skew between the clock and data lines.
In 2 Bank mode, only LVDS banks 0 and 1 are active.
In 4 Bank mode, only LVDS bank 0, 1, 2, and 3 are active.
Float the pins of unused LVDS Banks to conserve power.
Unused pins in active banks (due to ADC bit depth < 14) are automatically tri-stated to save power, but these can also be floated.
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6
KAC−12040
IMAGING PERFORMANCE
Table 7. TYPICAL OPERATIONAL CONDITIONS
(Unless otherwise noted, the Imaging Performance Specifications are measured using the following conditions.)
Condition
Description
Notes
Light Source
Continuous Red, Green and Blue LED Illumination
1
Temperature
Measured Die Temperature: 40°C and 27°C
Integration Time
16.6 ms (1400d LL, Register 0201h)
Readout Mode
Dual-Scan, Global Shutter, 320 MHz, PLL2
Clamps
Column/Row Noise Corrections Active, Frame Black Level Clamp Active
ADC Bit Depth
10 bit
Analog Gain
Unity Gain or Referred Back to Unit Gain
1. For monochrome sensor, only green LED used.
Table 8. KAC−12040−ABA CONFIGURATION (MONOCHROME)
Unit
Sampling
Plan
Temperature
Tested at
(5C)
%
Design
27
−
ke *
Lux @ s
Design
27
20
−
V
Lux @ s
Design
27
21
Temperature
Tested at
(5C)
Test
Wavelength
(nm)
Min.
Nom.
Max.
550
850
900
−
−
−
53
15
10
−
−
−
Responsivity
−
84
Responsivity
−
7.0
Description
Symbol
Peak Quantum Efficiency
Green
NIR1
NIR2
QEMAX
Test
Table 9. KAC−12040−CBA CONFIGURATION (BAYER RGB)
Wavelength
(nm)
Min.
Nom.
Max.
Unit
Sampling
Plan
470
540
620
850
900
−
−
−
−
−
40
47
45
15
10
−
−
−
−
−
%
Design
27
Responsivity
Blue
Green
Red
−
−
−
17
35
38
−
−
−
ke *
Lux @ s
Design
27
20
Responsivity
Blue
Green
Red
−
−
−
1.4
2.9
3.2
−
−
−
V
Lux @ s
Design
27
21
Description
Symbol
Peak Quantum Efficiency
Green
NIR1
NIR2
QEMAX
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7
KAC−12040
Table 10. PERFORMANCE SPECIFICATIONS ALL CONFIGURATIONS
Temperature
Tested at
(5C)
Test
Symbol
Min.
Nom.
Max.
Unit
Sampling
Plan
Photodiode Charge
Capacity
PNe
−
16
−
ke−
Die
27, 40
16
Read Noise
ne−T
−
−
3.7 RS
25.5 GS
−
−
e− rms
Die
27
8
1
−
−
4.5 RS
28.3 GS
−
−
e− rms
Die
27
19
1
Description
Total Pixelized Noise
Notes
Dynamic Range
DR
−
−
73 RS
56 GS
−
−
dB
Die
27
Column Noise
CN
−
−
0.6 RS
3.0 GS
−
−
e− rms
Die
27
9
1, 6
Row Noise
RN
−
−
1.0 RS
5.0 GS
−
−
e− rms
Die
27
10
1, 7
Dark Field Local
Non-Uniformity Floor
DSNU_flr
−
−
3.0 RS
21 GS
−
−
e− rms
Die
27, 40
1
1, 5
Bright Field Global
Photoresponse
Non-Uniformity
PRNU_1
−
1.5
−
% rms
Die
27, 40
2
2
Bright Field Global Peak to
Peak Photoresponse
Non-Uniformity
PRNU_2
−
6.5
−
% pp
Die
27, 40
3
2
Maximum Photoresponse
Non-Linearity
NL
−
6.3
−
%
Die
27, 40
11
3
Maximum Gain Difference
between Outputs
DG
−
0.3
−
%
Die
27, 40
12
8
Photodiode Dark Current
IPD
−
4.6
70
e/p/s
Die
40
13
9
Storage Node Dark Current
IVD
−
1,200
5,000
e/p/s
Die
40
14
5
Image Lag
Lag
−
1.3
10
−
Design
27, 40
15
W/cm2
Design
27
7
14
6
10
Black-Sun Anti-Blooming
−
−
12
> 10,000
−
−
xllumSat
−
730
−
−
Design
27
Dual-Video WDR
−
−
140 RS
120 GS
−
−
dB
Design
27
1, 11,
12
Pulsed Pixel WDR
(GS Only)
−
100
−
dB
Design
27
12, 13
Parasitic Light Sensitivity
XAB
1, 4
PLS
1. RS = Rolling Shutter Operation Mode, GS = Global Shutter Operation Mode.
2. Measured per color, worst of all colors reported.
3. Value is over the range of 10% to 90% of photodiode saturation, Green response used.
4. Uses 20LOG (PNe / ne−T).
5. Photodiode dark current made negligible.
6. Column Noise Correction active.
7. Row Noise Correction active.
8. Measured at ~70% illumination.
9. Storage node dark current made negligible.
10. GSE (Global Shutter Efficiency) = 1 − 1 / PLS.
11. Min vs Max integration time at 30 fps.
12. WDR measures expanded exposure latitude from linear mode DR.
13. Min/Max responsivity in a 30 fps image.
14. Saturation Illumination referenced to a 3 line time integration.
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8
KAC−12040
TYPICAL PERFORMANCE CURVES
Figure 4. Monochrome QE (with Microlens)
Figure 5. Bayer QE (with Microlens)
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9
KAC−12040
Angular Quantum Efficiency
For the curves marked “Horizontal”, the incident light angle is varied along the wider array dimension.
For the curves marked “Vertical”, the incident light angle is varied along the shorter array dimension.
Figure 6. Monochrome Relative Angular QE (with Microlens)
Figure 7. Bayer Relative Angular QE (with Microlens)
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KAC−12040
Dark Current vs. Temperature
NOTE: “Dbl” denotes an approximate doubling temperature for the dark current for the displayed temperature range.
Figure 8. Dark Current vs. Temperature
Power vs. Frame Rate
The most effective method to use the maximum PLL2
speed (313 → 320 MHz) and control frame rate with
minimum Power and maximum image quality is to adjust
Vertical Blanking. (register 01F1h). Unnecessary chip
operations are suspended during Vertical Blanking
conserving significant power consumption and also
minimizing the image storage time on the storage node when
in Global Shutter Operation.
NOTE: The LVDS clock is ½ the PLL2 clock speed.
Figure 9. Power vs. Frame Rate, 10 bit Mode
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11
KAC−12040
Power and Frame Rate vs. ADC Bit Depth
Increasing the ADC bit depth impacts the frame rate by
changing the ADC conversion time. The following figure
shows the power and Frame rate range for several typical
cases.
Figure 10. ADC Bit Depth Impact on Frame Rate and Power
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KAC−12040
DEFECT DEFINITIONS
Table 11. OPERATION CONDITIONS FOR DEFECT TESTING
Description
Condition
Notes
Operational Mode
10 bit ADC, 8 LVDS Outputs, Global Shutter and Rolling Shutter Modes,
Dual-Scan, Black Level Clamp ON, Column/Row Noise Corrections ON,
1× Analog Gain, 1× Digital Gain
Pixels per Line
4,000
Lines per Frame
3,000
Line Time
8.7 ms
Frame Time
13.9 ms
Photodiode Integration Time
33 ms
Storage Readout Time
13.9 ms
Temperature
40°C and 29°C
Light Source
Continuous Red, Green and Blue LED Illumination
Operation
Nominal Operating Voltages and Timing, PLL1 = 320 MHz, Wafer Test
1
1. For monochrome sensor, only the green LED is used.
Table 12. DEFECT DEFINITIONS FOR TESTING
Description
Definition
40°C
RS: Defect ≥ 30 dn
GS: Defect ≥ 240 dn
Limit
Test
Notes
120
4
1, 4, 5
5
2, 5
Dark Field Defective Pixel
30°C
RS: Defect ≥ 20 dn
GS: Defect ≥ 180 dn
Bright Field Defective Pixel
Defect ≥ ±12% from Local Mean
120
Cluster Defect
A group of 2 to 10 contiguous defective pixels, but
no more than 3 adjacent defects horizontally.
22
Column/Row Major Defect
A group of more than 10 contiguous defective pixels
along a single column or row.
0
Dark Field Faint Column/Row Defect
RS: 3 dn Threshold
GS: 10 dn Threshold
0
17
1
Bright Field Faint Column/Row Defect
RS: 12 dn Threshold
GS: 18 dn Threshold
0
18
1
3
1.
2.
3.
4.
RS = Rolling Shutter, GS = Global Shutter.
For the color devices, all bright defects are defined within a single color plane, each color plane is tested.
Cluster defects are separated by no less than two good pixels in any direction.
Rolling Shutter Dark Field points are dominated by photodiode integration time, Global Shutter Dark Field defects are dominated by the
readout time.
5. The net sum of all bright and dark field pixel defects in rolling and global shutter are combined and then compared to the test limit.
Defect Map
The defect map supplied with each sensor is based upon
testing at an ambient (29°C) temperature. All defective
pixels are reference to pixel (0, 0) in the defect maps. See
Figure 11 for the location of pixel (0, 0).
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KAC−12040
TEST DEFINITIONS
Test Regions of Interest
Image Area ROI:
Active Area ROI:
Center ROI:
Pixel (0, 0) to Pixel (4015, 3015)
Pixel (8, 8) to Pixel (3999, 2999)
Pixel (1958, 1458) to Pixel (2057, 1557)
Only the Active Area ROI pixels are used for performance and defect tests.
88
8
B G
G R
8
104
4000 (H) y 3000 (V)
4.7 mm Pixel
104
8
8,8
B G
G R
0,0
B G
G R
8
88
Figure 11. Regions of Interest
Test Descriptions
The highest sub-ROI average (Maximum Signal) and the
lowest sub-ROI average (Minimum Signal) are then used in
the following formula to calculate PRNU_2.
1) Dark Field Local Non-Uniformity Floor (DSNU_flr)
This test is performed under dark field conditions.
A 4 frame average image is collected. This image is
partitioned into 300 sub-regions of interest, each of which is
200 by 200 pixels in size. For each sub-region the standard
deviation of all its pixels is calculated. The dark field local
non-uniformity is the largest standard deviation found from
all the sub regions of interest. Units: e− rms (electrons rms).
PRNU_2 + 100 @
ǒ
Ǔ
Max. Signal * Min. Signal
Active Area Signal
Units : % pp
4) Dark Field Defect Test
This test is performed under dark field conditions.
The sensor is partitioned into 300 sub regions of interest,
each of which is 128 by 128 pixels in size. In each region of
interest, the median value of all pixels is found. For each
region of interest, a pixel is marked defective if it is greater
than or equal to the median value of that region of interest
plus the defect threshold specified in the Defect Definition
Table section.
2) Bright Field Global Photoresponse Non-Uniformity
(PRNU_1)
The sensor illuminated to 70% of saturation (~700 dn). In
this condition a 4 frame average image is collected. From
this 4 frame average image a 4 frame average dark image is
subtracted. The Active Area Standard Deviation is the
standard deviation of the resultant image and the Active
Area Signal is the average of the resultant image.
PRNU_1 + 100 @
ǒ
5) Bright Field Defect Test
This test is performed with the imager illuminated to
a level such that the output is at approximately 700 dn.
The average signal level of all active pixels is found.
The bright and dark thresholds are set as:
Dark Defect Threshold = Active Area Signal ⋅ Threshold
Bright Defect Threshold = Active Area Signal ⋅ Threshold
Ǔ
Active Area Standard Deviation
Active Area Signal
Units : % rms
3) Bright Field Global Peak to Peak Non-Uniformity
(PRNU_2)
This test is performed with the sensor uniformly
illuminated to 70% of saturation (~700 dn), a 4 frame
average image is collected and a 4 frame averaged dark
image is subtracted. The resultant image is partitioned into
300 sub regions of interest, each of which is 200 by
200 pixels in size. The average signal level of each sub
regions of interest (sub-ROI) is calculated.
The sensor is then partitioned into 300 sub regions of
interest, each of which is 128 by 128 pixels in size. In each
region of interest, the average value of all pixels is found.
For each region of interest, a pixel is marked defective if it
is greater than or equal to the median value of that region of
interest plus the bright threshold specified or if it is less than
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KAC−12040
7) Black-Sun Anti-Blooming
A typical CMOS image sensor has a light response profile
that goes from 0 dn to saturation (1023 dn for KAC−12040
in 10 bit ADC mode) and, with enough light, back to 0 dn.
The sensor reaching 0 dn at very bright illumination is often
called the “Black-sun” artifact and is undesirable. Black-sun
artifact is typically the dominant form of anti-blooming
image distortion. For the KAC−12040 the Black-sun artifact
threshold is measured at the onset of saturation distortion,
not at the point where the output goes to 0 dn. To first order
the onset of black-sun artifact for the KAC−12040 is not
proportional to the integration time or readout time.
The sensor is placed in the dark at unity gain and
illuminated with a 532 nm laser with the intensity of about
26 W/cm2 at the center of the sensor. The laser is strong
enough to make the center of the laser spot below 1020 dn
without any ND filters. ND filters are added to adjust the
laser intensity until the signal in the region at the center of
the spot increases to > 1020 dn.
This illumination intensity at this ND filter is recorded
(W/cm2) as the Black-Sun Anti-blooming.
The ‘xIlumSat’ unit is calculated using and integration
time of 100 msec.
Exposing the sensor to very strong illumination for
extended periods of time will permanently alter the sensor
performance in that localized region.
or equal to the median value of that region of interest minus
the dark threshold specified.
Example for bright field defective pixels:
• Average value of all active pixels is found to be 700 dn
• Lower defect threshold: 700 dn ⋅ 12% = 84 dn
• A specific 128 × 128 ROI is selected:
♦ Median of this region of interest is found to be
690 dn.
♦ Any pixel in this region of interest that is
≤ (690 − 84 dn) in intensity will be marked
defective.
♦ Any pixel in this region of interest that is
≥ (690 − 84 dn) in intensity will be marked
defective.
• All remaining 299 sub regions of interest are analyzed
for defective pixels in the same manner.
6) Parasitic Light Sensitivity (PLS)
Parasitic Light Sensitivity is the ratio of the light
sensitivity of the photodiode to the light sensitivity of the
storage node in Global Shutter. There is no equivalent
distortion in Rolling Shutter. A low PLS value can provide
distortion of the image on the storage node by the scene
during readout.
PLS +
Photodiode Responsivity
Storage Node Responsivity
(UnitlessRatio)
8) Read Noise
This test is performed with no illumination and one line of
integration time. The read noise is defined as one standard
deviation of the frequency histogram containing the values
of all pixels after the excessively deviant pixels (± three
standard deviations) are removed.
GSE (Global Shutter Efficiency) is a related unit.
ǒ
GSE + 1 *
Ǔ
1
%
PLS
Detailed Method: Photodiode Responsivity:
The sensor is set in global shutter serial mode (integration
time not overlapping readout) and the FLO signal is used to
control a 550 nm normal incident (or large f# focused)
illumination source so that the sensor is illuminated only
during photodiode integration time (not illuminated during
readout time). The integration time is not critical but should
be large enough to create a measurable mean during this
time. A 16 frame-average illuminated photodiode image is
recorded. A 16 frame-average dark frame using the same
sensor settings is captured and is subtracted from the
illuminated image.
9) Column Noise
After all rows are averaged together. Shading (low
frequency change wrt column address) is removed.
A frequency histogram is constructed of the resulting
column values. The column noise is the standard deviation
of the frequency histogram of the column values.
10) Row Noise
All columns are averaged together. Shading (low
frequency change wrt row address) is removed. A frequency
histogram is constructed of the resulting row values.
The row noise is the standard deviation of the frequency
histogram of the row values.
Detailed Method: Storage Node Responsivity:
The sensor is set to a special characterization mode where
the PD signal is discarded and does not impact the storage
node. A long total frame time (storage node exposure time)
is used to increase the storage node signal. A 16
frame-average dark frame is captured. The sensor is
illuminated by the same 550 nm incident light source used
for the photodiode responsivity. A 16 frame-average
illuminated photodiode image is recorded; the dark frame
image is subtracted from this. The integration time is not
critical but should be set such that a significant response is
detected, typically several orders of magnitude greater than
the photodiode integration time.
11) Maximum Photoresponse Non-Linearity
The photoresponse non-linearity is defined as the
deviation from the best fit of the sensor response using 70%
of saturation and zero signal as the reference points.
The different signal levels are determined by varying the
integration time. The sensor saturation level is (1023-dark
offset). The dark offset is subtracted from the image for the
following MAVG and LAVG.
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KAC−12040
• The integration time is varied until the integration time
•
•
Analog gain is set to 8. With no illumination a 64 average
dark image is recorded (Dark_ref). The ‘el-per-DN’ is
measured using the photon transfer method.
Illumination is adjusted blink every other frame such that
the mean image output is 70% of the Photodiode Charge
Capacity for even frames, and with no illumination for odd
frames. A 64 frame average of Odd Dark Frames is recorded
as Dark_Lag.
required to reach the 70% saturation is determined.
MAVG = the active array mean at the 70% saturation
integration time.
The integration is set to 1/14 (5% exposure point).
LAVG = meant at the 5% exposure point.
PRNL (@ 5% saturation) = ((LAVG/MAVG) ⋅ (14/1) −1)
⋅ 100
Lag + (Dark_Lag * Dark_Ref) @ el−per−DN
12) Maximum Gain Difference between Outputs
The sensor contains two ADC and four channels of analog
data in its highest frame rate configuration. The sensor is
factory calibrated to reduce the gain differences between the
channels. The gain variations are manifest as a row oriented
pattern where every other row uses a different ADC. Using
triple scan read out mode, an additional two analog channels
are introduced resulting in a four row pattern. With one
channel (‘Top Ping’) used as the reference, the residual gain
difference is defined as:
ǒ
16) Photodiode Charge Capacity
The sensor analog gain is reduced to < 1 to prevent ADC
clipping at 1023 dn. The ‘el-per-DN’ is measured using the
photon transfer method. The sensor is illuminated at a light
level ~1.5x the illumination at which the pixel output no
longer linearly changes with illumination level.
The Photodiode Charge Capacity is equal to the average
signal (DN) ⋅ el-per-DN. Units: electrons rms.
Ǔ
Bottom Ping Row Average
* 1 @ 100
Top Ping Row Average
ǒ
ǒ
Units : Electrons rms
17) Dark Field Faint Column/Row Defect
A 4 frame average, no illumination image is acquired at
one line time of integration. Major defective pixels are
removed (> 5 Sigma). All columns or rows are averaged
together. The average of the local ROI of 128 columns or
rows about the column/row being tested is determined. Any
columns/rows greater than the local average by more than
the threshold are identified.
Ǔ
Top Pong Row Average
* 1 @ 100
Top Ping Row Average
Ǔ
Bottom Pong Row Average
* 1 @ 100
Top Ping Row Average
13) Photodiode Dark Current
The photodiode dark current is measured in rolling shutter
read out mode using 105 ms integration time and an analog
gain = 8. The value is converted to electrons/pix/sec using
the formula:
Photodiode Dark Current + Aver. Signal (DN) @
18) Bright Field Faint Column/Row Defect
A 4 frame average, 70% illumination image is acquired at
one line time of integration. Major defective pixels are
removed (> 5 Sigma). All columns or rows are averaged
together. The average of the local ROI of 128 columns or
rows about the column/row being tested is determined. Any
columns/rows greater than the local average by more than
the threshold are identified.
el−per−DN (gain=8)
0.105 seconds
where ‘average signal (DN)’ is the average of all pixels in
the sensor array, and ‘el-per-DN (gain=8)’ is measured on
each sensor using the photon transfer method.
19) Total Pixelized Noise
This test is performed with no illumination and one line of
integration time. A single image is captured including both
Temporal and Fixed Pattern Noise (FPN). A spatial low pass
filter is applied to remove shading and deviant pixels
(± three standard deviations) are removed. The Total
Pixelized Noise is defined as one standard deviation of the
frequency histogram.
14) Storage Node Dark Current
The storage node dark current is measured in global
shutter read out mode using a special timing mode to prevent
the photodiode dark current from being transferred to the
storage node. In global shutter mode, the integration time of
the storage node is the time it takes to read out a frame. The
sensor analog gain is set to 2:
where ‘average signal (DN)’ is the average of all pixels in
the sensor array and ‘el-per-DN (gain=2)’ is measured on
each sensor using the photon transfer method.
20) Responsivity ke −/lux-sec
This number is calculated by integrating the
multiplication of the sensor QE by the human photopic
response assuming a 3200K light source with a QT100 IR
filter. This is a sharp 650 nm cutoff filter. If the IR filter is
removed a higher response value will result.
15) Lag
Lag is measured as the number of electrons left in the
photodiode after readout when the sensor is illuminated at
70% of Photodiode Charge Capacity.
21) Responsivity V/lux-sec
Voltage levels are not output from the sensor. This metric
uses the pixel output in volts at the ADC input for 1x Analog
Gain.
el−per−DN (gain=2)
Storage Node Dark Current + Aver. Signal (DN) @
0.138 seconds
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KAC−12040
OPERATION
This section is a brief discussion of the most common
features and functions assuming default conditions. See the
KAC−12040 User Guide for a full explanation of the sensor
operation modes, options, and registers.
All SPI reads are to an even address, all SPI writes are to an
odd address.
Sensor States
Figure 12 shows the sensor states, see the KAC−12040
User Guide for detailed explanation of the States.
Register Address
The last bit of any register address is a Read/Write bit.
Most references in this document refer to the Write address.
RESETN low or
reset Reg 4060h
RESET