LA6583MC
Fan Motor Driver,
BTL Driver Single‐Phase
Full‐Wave
Monolithic Linear IC
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Overview
The LA6583MC is a low-saturation BTL output linear driving
motor driver for single-phase bipolar fan motors. It features quite, low
power, high efficiency drive that suppresses ineffective current. It is
optimal for use in applications that require miniaturization and low
noise, such as CPU cooling fan motors and 5 to 12 V electronic game
products.
MFP10SK
CASE 751DA
Features
• Single-phase Full-wave Linear Drive with BTL Output
•
•
•
•
•
•
•
•
(Gain Resistance 1 kW−360 kW): Most Appropriate for Consumer
Appliances Power Supply, Namely Equipment that Requires Silence
because this has No Switching Noise
Low-voltage Operation Possible, with Wide Operable Voltage Range
(2.8 to 13.8 V)
Low Saturation Output (Upper + Lower Saturation Voltages:
VO sat (Total) = 1.1 V Typ, IO = 200 mA): High Coil Efficiency and
Small Current Drain. Small Heat Generation from IC itself
Lock Protection and Auto Return Circuits Built-in
Lock Protection Signal Output (L during Rotation, H at Stop; Open
Collector Output)
FG Output (Rotation Speed Detection Output: Open Collector
Output)
Hall Bias Built-in (VHB = 1.3 V)
Heat Protection Circuit (Design Guarantee): When the Large Current
Flows because of Output Short-circuit, Raising the IC Chip
Temperature above 180_C, the Heat Protection Circuit Suppresses
the Drive Current, Preventing IC Burn and Breakdown
Compact and High Heat Capacity Package
MARKING DIAGRAM
XXXXXXXX
YMDDD
XXXX
Y
M
DDD
= Specific Device Code
= Year
= Month
= Additional Traceability Data
PIN ASSIGNMENT
IN+ 1
10 RD
HB 2
9
FG
IN− 3
8
VCC
CT 4
7
OUT2
OUT1 5
6
GND
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
© Semiconductor Components Industries, LLC, 2016
February, 2018 − Rev. 1
1
Publication Order Number:
LA6583MC/D
LA6583MC
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Symbol
Parameter
Conditions
Ratings
Unit
VCC max
Supply Voltage
15
V
IOUT max
Output Current
0.8
A
VOUT max
Output Withstand Voltage
15
V
VRD/FG max
RD/FG Output Withstand
15
V
IRD/FG max
RD/FG Output Current
5
mA
HB Output Current
10
mA
IB max
Pd max
Allowable Dissipation
Mounted on a specified board (Note 1)
Topr
Operating Temperature
(Note 2)
Tstg
Storage Temperature
800
mW
−30 to +100
°C
−55 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Mounted on a specified board: 114.3 × 76.1 × 1.6 mm3, glass epoxy board.
2. Tj = 150°C. Use this IC within a range where the chip temperature does not exceed Tj = 150°C during operation.
CAUTION: Absolute maximum ratings represent the value which cannot be exceeded for any length of time.
CAUTION:
Even when the device is used within the range of absolute maximum ratings, as a result of continuous usage under high
temperature, high current, high voltage, or drastic temperature change, the reliability of the IC may be degraded. Please contact
us for the further details.
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)
Parameter
Symbol
VCC
Supply Voltage
VICM
Common-phase Input Voltage Range of
Hall Input
Conditions
Min
Typ
Max
Unit
2.8
−
14.0
V
0
−
VCC–1.5
V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 12 V, unless otherwise specified)
Symbol
ICC1
Parameter
Circuit Current
ICC2
Conditions
During drive (CT = L)
Typ
Max
Unit
4
6
9
mA
2
4
6
mA
ICT1
Lock Detection Capacitor Charge
Current
2.0
2.8
3.5
mA
ICT2
Capacitor Discharge Current
0.15
0.23
0.30
mA
RCT
Capacitor Charge/Discharge Current
Ratio
9
12
15
−
VCT1
CT Charge Voltage
1.6
1.7
1.8
V
VCT2
At lock protection (CT = H)
Min
RCT = ICT1/ICT2
0.6
0.7
0.8
V
VOL
OUT Output L Saturation Voltage
CT Discharge Voltage
IO = 200 mA
−
0.2
0.3
V
VOH
OUT Output H Saturation Voltage
IO = 200 mA
−
0.9
1.2
V
VHN
Hall Input Sensitivity
Zero peak value
(Including offset and hysteresis)
−
7
15
mV
VRD/FG
RD/FG Output Pin L Voltage
IRD/FG = 5 mA
−
0.1
0.2
V
IRD/FGL
RD/FG Output Pin Leak Current
VRD/FG = 15 V
−
1
30
mA
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2
LA6583MC
ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 12 V, unless otherwise specified) (continued)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VHB
HB Output Voltage
IHB = 5 mA
1.3
1.5
1.7
V
TSD
Thermal Protection Circuit
Design target value (Note 3)
150
180
210
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. This is a design guarantee value and no measurement with an independent unit is made. Thermal protection circuit is built in this IC for the
prevention of burnout of IC and thermal destruction. But, since the operation is outside the guarantee temperature range, thermal design
must be made so that the thermal protection circuit is not activated during normal fan operation.
TRUTH TABLE
IN−
IN+
CT
OUT1
OUT2
FG
RD
Mode
H
L
L
H
L
L
L
During rotation
L
H
L
H
H
−
−
OFF
OFF
−
H
Lock protection
−: Don’t care.
1.0
Allowable Power Dissipation, Pd − W
NOTE:
H
Specified board:
114.3 × 76.1 × 1.6 mm3
glass epoxy board.
0.8
0.6
0.4
0.2
0
−30 −20
0
20
40
60
Ambient Temperature, TA − 5C
Figure 1. Pd max − TA
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3
80
100
LA6583MC
BLOCK DIAGRAM
VCC
1.5 V REG
HB
IN+
H
OUT1
OUT2
IN−
GND
FG
Control
Circuit
Charge Discharge
RD
Discharge Pulse
CT = 0.47 to 1 mF
Figure 2. Internal Equivalent Circuit Diagram
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4
LA6583MC
APPLICATION CIRCUIT EXAMPLE
Di
*4
Cr
*1
VCC
R2
RD
*2
HB
FG
HB
LA6583MC
H
IN−
OUT1
IN+
OUT2
*3 R1
H
IN−
*5
GND
IN+
Elements in Substrate
Figure 3. Application Circuit Example
Therefore, the switching time of the current
application direction is determined by the Hall
output, causing change in the characteristics of
motor. If the Hall element output amplitude is
large, the start-up performance and efficiency of
the IC are improved. On the other hand, if the Hall
element output amplitude is small, low-noise drive
is ensured. Adjust the Hall element output
amplitude by R1.
*4: Keep this open when this is not used.
*5: When the wiring from the Hall output to IC Hall
input is long, noise may be carried through the
wiring.
In this case, insert the capacitor as shown in the
figure.
*1: When Di to prevent breakdown in case of reverse
connection is used, it is necessary to insert
a capacitor Cr to secure the regenerative current
route. Similarly, Cr is necessary to enhance the
reliability when there is no capacitor near the fan
power line.
*2: When the Hall bias is taken from the HB pin,
constant-voltage bias is made with about 1.3 V.
Therefore, the Hall output becomes the stable
amplitude voltage satisfactory in temperature
characteristics.
By inserting R2 to obtain the Hall bias from both
VCC and HB, as shown in the figure, heat
generation of IC can be suppressed.
*3: In this IC, the Hall output amplitude is amplified
to produce the drive waveform.
ORDERING INFORMATION
Package
Wire Bond
Shipping† (Qty / Packing)
LA6583MC−AH
MFP10SK (225mil)
Au−wire
1,000 / Tape & Reel
LA6583MC−W−AH
MFP10SK (225mil)
Cu−wire
1,000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC10W / MFP10SK (225 mil)
CASE 751DA
ISSUE A
SOLDERING FOOTPRINT*
DATE 23 OCT 2013
GENERIC
MARKING DIAGRAM*
5.60
(Unit: mm)
1.0
0.47
1.0
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON80819E
XXXXXXXX
YMDDD
XXXX
Y
M
DDD
= Specific Device Code
= Year
= Month
= Additional Traceability Data
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SOIC10W / MFP10SK (225 MIL)
PAGE 1 OF 1
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