LA72900VA-TLM-E

Initial Product/Process Change Notification Document # : IPCN20981XA Issue Date: 16 July 2015 Title of Change: Copper wire conversion and mold compound change for LA72900VA Proposed first ship date: 15 January 2016 Contact information: Contact your local ON Semiconductor Sales Office or Samples: Samples should be available after completion of qualification. Contact your local ON Semiconductor Sales Office or Type of notification: This is an Initial Product/Process Change Notification (IPCN) sent to customers. IPCNs are issued at least 120 days prior to implementation of the change. An IPCN is advance notification about an upcoming change and contains general information regarding the change details and devices affected. It also contains the preliminary reliability qualification plan. The completed qualification and characterization data will be included in the Final Product/Process Change Notification (FPCN). This IPCN notification will be followed by a Final Product/Process Change Notification (FPCN) at least 90 days prior to implementation of the change. In case of questions, contact . Change Part Identification: Affected products will be identified with date code. Change category: Wafer Fab Change Change Sub-Category(s): Manufacturing Site Change/Addition Manufacturing Process Change Sites Affected: All site(s) not applicable Assembly Change Test Change Other _______________ Datasheet/Product Doc change Shipping/Packaging/Marking Other: _______________________ Material Change Product specific change ON Semiconductor site(s) : ON Tarlac City, Philippines External Foundry/Subcon site(s) Description and Purpose: This is an Initial Process Change Notification for below contents. 1) Gold wire connecting chip and Lead will be changed to Copper wire. 2) Mold resin will be changed to suitable for Copper wire. There is no change of the electrical characteristic specifications with this changing. Qualification Plan: Estimated date for qualification completion: 31 July 2015 Package name :SSOP024（V4B90） Test Items Test Condition Test Time High Temperature Operating Life Tj=Tjmax, Vcc=Operatingmax 1000hrs Temperature Humidity Bias * Ta=85degC,RH=85%, Vcc=Recommended T 1000hrs Temperature Cycle * Ta=-65degC(30min) ⇔ Ta=150degC (30min) 100cycles Pressure Cooker * Ta=121degC,RH=100% ,205kPa High Temperature Storage Resistance to Soldering heat (Reflow Soldering ) 50hrs Ta=150degC 1000hrs 255degC,10s (Peak260degC) 2times Notes: The test items with * mark are put into operation after the reflow soldering (at 255degC for 10seconds) -> SMD Temperature Humidity Bias Test: PD>=0.1W -> Intermittent power application consists of 1h ON and 3h OFF. Judgment Criteria： Judgment Criteria are due to the limits of the electrical characteristics in the detail specification TEM001091 Rev. E Page 1 of 2 Initial Product/Process Change Notification Document # : IPCN20981XA Issue Date: 16 July 2015 List of affected Standard Parts: Part Number LA72900VA-TLM-E TEM001091 Rev. E Qualification Vehicle LA72900VA-TLM-E Page 2 of 2