LA74330V-TLM-H

Initial Product/Process Change Notification Document # :IPCN21092X Issue Date: 25 November 2015 Title of Change: Copper wire conversion and mold compound change for LA74330V. Proposed first ship date: 6 June 2016 Contact information: Contact your local ON Semiconductor Sales Office or Samples: Contact your local ON Semiconductor Sales Office. Type of notification: This is an Initial Product/Process Change Notification (IPCN) sent to customers. IPCNs are issued at least 120 days prior to implementation of the change. An IPCN is advance notification about an upcoming change and contains general information regarding the change details and devices affected. It also contains the preliminary reliability qualification plan. The completed qualification and characterization data will be included in the Final Product/Process Change Notification (FPCN). This IPCN notification will be followed by a Final Product/Process Change Notification (FPCN) at least 90 days prior to implementation of the change. In case of questions, contact . Change Part Identification: Affected products will be identified with date code. Change category: Wafer Fab Change Change Sub-Category(s): Manufacturing Site Change/Addition Manufacturing Process Change Sites Affected: All site(s) not applicable Assembly Change Test Change Other _______________ Datasheet/Product Doc change Shipping/Packaging/Marking Other: _______________________ Material Change Product specific change External Foundry/Subcon site(s) ON Semiconductor site(s) : ON Tarlac City, Philippines Description and Purpose: This is an Initial Process Change Notification for below contents. 1) 2) Gold wire connecting chip and Lead will be changed to Copper wire. Mold resin will be changed to suitable for Copper wire. There is no change of the electrical characteristic specifications with this changing. Qualification Plan: Estimated date for qualification completion: 12 February 2016 Package name : SSOP030（V4B90） Test Specification Condition Interval HTOL JESD22-A108 Tj=Tjmax, , Vcc=Operatingmax 1008 hrs THB JESD22-A101 85°C, 85% RH, Vcc=Operatingmax 1008 hrs HTS JESD22-A104 Ta= 150°C 1008 hrs TC JESD22-A104 Ta= -65°C to +150°C 500 cyc AC JESD22-A102 Ta=121degC,15psig 96 hrs PC J-STD-020 JESD-A113 MSL 3 @ 260 °C Notes: The test items with * mark are put into operation after the reflow soldering (at 255degC for 10seconds) -> SMD Temperature Humidity Bias Test: PD>=0.1W -> Intermittent power application consists of 1h ON and 3h OFF. Judgment Criteria： Judgment Criteria are due to the limits of the electrical characteristics in the detail specification TEM001091 Rev. E Page 1 of 2 Initial Product/Process Change Notification Document # :IPCN21092X Issue Date: 25 November 2015 List of Affected Standard Parts: Part Number LA74330V-TLM-H TEM001091 Rev. E Qualification Vehicle LA74330V-TLM-H Page 2 of 2