LB1668M-TLM-H

LB1668M 2‐phase Unipolar Brushless Motor Driver Monolithic Digital IC Overview www.onsemi.com The LB1668M is 2-phase unipolar drive brushless motor driver that features a wide usable voltage range and a minimal number of required external components. It also supports the formation of motor lock protection and automatic recovery circuits. Features • Output protection Zener Diodes with Variable Breakdown Voltages When the Z1 and Z2 Pins are Open: VOLM = 57 V When the Z1 and Z2 Pins are Shorted: VOLM = 32 V ♦ An External Zener Diode can be Connected between Z1 and VCC Can Support Both 12 V and 24 V Power Supplies by Changing an External Resistor Hall Elements can be Connected Directly 1.5 A Output Current Output Transistors Built in Built-in Rotation Detection Function that Outputs Low when Driven and High when Stopped Motor Lock Protection and Automatic Recovery Functions Built in Thermal Shutdown Function ♦ MFP14S CASE 751CB ♦ • • • • • • MARKING DIAGRAM XXXXXXXXXX YMDDD XXXXX Y M DDD = Specific Device Code = Year = Month = Additional Traceability Data PIN ASSIGNMENT 1 14 IN− VIN IN+ RD C Z2 NC Z1 OUT1 OUT2 NC NC GND NC 7 (Top View) 8 ORDERING INFORMATION See detailed ordering and shipping information on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2013 March, 2018 − Rev. 1 1 Publication Order Number: LB1668M/D LB1668M SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Symbol Parameter ICC max Maximum Input Current VOUT Output Supply Voltage IOUT Conditions Ratings Unit 200 mA Internal V Output Current 1.5 A IRD/IFG RD/FG Flow-in Current 10 mA VRD/VFG RD/FG Supply Voltage 30 V 0.8 W Pd max Allowable Power Dissipation t ≤ 20 ms With specified board (Note 1) Topr Operating Temperature −30 to +80 °C Tstg Storage Temperature −55 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. .Specified board: 20 mm × 15 mm × 1.5 mm, glass epoxy. ALLOWABLE OPERATING RANGES (TA = 25°C) Symbol ICC VICM Parameter Conditions Ratings Unit 6.0 to 50 mA 0 to VIN−1.5 V Input Current Range Common-mode Input Voltage Range Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. ELECTRICAL CHARACTERISTICS (TA = 25°C, ICC = 10 mA) Symbol VOLM1 Parameter Output Limit Voltage VOLM2 VO(sat)1 Output Saturation Voltage Conditions Min Typ Max Unit Z1, Z2 open 54 57 60 V Z1, Z2 short 31 33 35 V IO = 0.5 A − 0.95 1.2 V VO(sat)2 IO = 1.0 A − 1.15 1.5 V VO(sat)3 IO = 1.5 A − 1.4 2.0 V 6.4 6.7 7.0 V Amp Input Offset Voltage −7.0 0 +7.0 mV Amp Input Bias Current −250 − − nA VIN VOFF IBA VRD(sat) VIN Input Voltage − 0.1 0.3 V IC1 C Flow-out Current 2.1 3.0 3.9 mA IC2 C Discharge Current 0.31 0.44 0.59 mA Comparator Input Threshold Voltage 0.77 0.8 VIN 0.83 V 0.42 0.45 VIN 0.48 V Thermal Shutdown Current Operating Design target value (Note 2) Temperature − 180 − °C Thermal Shutdown Circuit Hysteresis − 40 − °C VTH1 RD Output Saturation Voltage ICC = 7.0 mA IRD = 5 mA VTH2 TSD DTSD Design target value (Note 2) Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Design target value and si not measured. www.onsemi.com 2 LB1668M Allowable Power Dissipation, Pd max − W 1.0 Specified board: 20 × 15 × 1.5 mm glass epoxy 0.8 0.6 0.4 0.2 0.0 −30 −20 0 40 20 60 80 100 Ambient Temperature, TA − 5C Figure 1. Pd max − TA TRUTH TABLE IN+ IN− C OUT1 OUT2 RD H L L H L L L H L L H L H L H H H H L H H H H H BLOCK DIAGRAM Figure 2. Block Diagram www.onsemi.com 3 LB1668M APPLICATION CIRCUITS 1. 12 V Power Supply Type Figure 3. 12 V Power Supply Type 2. 24 V Power Supply Type Figure 4. 24 V Power Supply Type 3. Circuit for use when large output currents are required and heat dissipation is high. Figure 5. Circuit for Use when Large Output Currents are Required and Heat Dissipation is High www.onsemi.com 4 LB1668M DESIGN DOCUMENTATION (See the Sample Application Circuits) 1. Power Supply Voltage (VIN pin): The resistor R1 (when VCC = 12 V, R1 = 330 W, and when VCC = 24, R1 = about 1.2 kW) is inserted between VIN and the power supply VCC pin. When the ICC current is set in the range 6 to 50 mA, the VIN pin will be regulated to be 6.7 V. Not only does this provide stability with respect to power supply voltage variations and motor kickback, but it also provides adequate strength to withstand surges. 2. Output Transistors (OUT1 and OUT2 Pins) A Zener diodes with the following characteristics is inserted between the collector and base of each output transistor to absorb kickback voltages at 57 V (typical) and provide output protection. • Sustained output voltage: VO = 65 V minimum (design guarantee) • Output current: IO = 1.5 A maximum • Output saturation voltage: VO sat = 1.25 V/1.0 A (typical) • Safe operating range: IO = 1.0 A, VOLM = 57 V, t = 200 ms 3. Output Circuit Kickback Voltage Protection (Z1 and Z2 pins): These ICs support output protection that minimizes kickback noise by changing the kickback absorption voltage and absorption method according to the output current and power supply voltage used. 1) When the Z1 and Z2 pins are shorted: The output protection voltage will be 32 V (typical) using a VCC = 12 V power supply. 2) When the Z1 and Z2 pins are open: The output protection voltage will be 57 V (typical) using a VCC = 24 V power supply. 3) With a Zener diode inserted between Z1 and VCC or between Z1 and ground: This technique handles 120mm square H speed applications which require large output currents and involve large amounts of heat generated in the IC by dissipating the motor coil switching loss in external Zener diodes. 4. Output Protection when the Motor is Lock (C and FG pins): This circuit detects motor stopping due to, for example, overloading, and cuts the coil current. It also automatically recovers drive and motor turning from the output stopped state when the load returns to an appropriate level. The lock detection time is set with the value of an external capacitor. When C = 0.47 mF • Lock detection time: about 1 s • Lock protection time: about 0.5 s (output on) about 3 s (output off) The RD pin is an open collector output and outputs a low level during drive and a high level when stopped. 5. Thermal Shutdown: This circuit turns the output off in response to coil shorting or IC overheating. 6. In applications that use an external transistor to turn the cooling fan power on and off, connect a capacitor of about 0.47 to 10 mF between the fan power supply VCC and ground to provide a regenerative route for the fan motor coil current. Figure 6. www.onsemi.com 5 LB1668M AUTOMATIC RECOVERY CIRCUIT C-PIN VOLTAGE Figure 7. Automatic Return Circuit C-pin Voltage 1. While the blades are turning, the capacitor is charged with a current of about 3 mA (typical), and C is discharged by pulses that correspond to the motor speed. 2. When the blades lock, the capacitor is no longer discharged, and the voltage across the capacitor increases. The output is turned off when that voltage reaches 0.8 × VIN. 3. When the output is turned off, the capacitor is discharged at about 0.44 mA (typical). When the capacitor voltage falls under VTH2, if the lock state is not yet cleared the capacitor continues discharging until VTH1. (Note that the output is turned on at this time.) These operations, i.e. items 2. and 3., are repeated with a ton:toff ratio of about 1 : 6 to protect the motor. 4. If the lock is cleared at the point the capacitor voltage reaches VTH2, motor rotation is started by turning the output on. Figure 8. VO(sat) − IO Figure 9. ASO www.onsemi.com 6 LB1668M Figure 10. VIN − ICC ORDERING INFORMATION Package Wire Bond Shipping† (Qty / Packing) LB1668M−TLM−E MFP14S (225mil) (Pb−Free) Au−wire 1,000 / Tape & Reel LB1668M−TLM−H MFP14S (225mil) (Pb−Free / Halogen Free) Au−wire 1,000 / Tape & Reel LB1668M−W−AH MFP14S (225mil) (Pb−Free / Halogen Free) Cu−wire 1,000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 7 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC14 W / MFP14S (225 mil) CASE 751CB ISSUE A DATE 25 OCT 2013 1.10 SOLDERING FOOTPRINT* GENERIC MARKING DIAGRAM* 5.70 (Unit: mm) 1.00 XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data 0.47 NOTE: The measurements are not to guarantee but for reference only. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON67224E XXXXXXXXXX YMDDD *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. SOIC14 W / MFP14S (225 MIL) PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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