LB1863M, LB1869M
Two‐Phase Brushless
Motor Driver
Monolithic Digital IC
Overview
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The LB1863M and LB1869M are 2-phase unipolar brushless motor
drivers that are provided in a miniature flat package that contributes to
end product miniaturization and supports automatic mounting. These
products support the implementation of motor drive lock protection
and automatic recovery circuits, and alarm specifications with
a minimal number of external components.
Features
SOIC14 W / MFP14S
CASE 751CB
• Hall Elements can be Connected Directly to the IC itself
• 1.5-A Output Current Output Transistors Built in
• Rotation Detection Function that Provides a Low-level Output
•
•
•
MARKING DIAGRAM
during Motor Drive and a High-level Output when the Motor is
Stopped
Motor Lock Protection and Automatic Recovery Functions Built in
Thermal Shutdown Circuit
Switching Noise can be Reduced with an External Ceramic Capacitor
XXXXXXXX
YMDDD
Classification
NOTE:
System Voltage
Package (MFP−14S)
12 V
LB1869M
24 V
LB1863M
The LB1869M and LB1863M are pin compatible so that the same
printed circuit board can be used for both 12 V and 24 V products.
XXXX
Y
M
DDD
= Specific Device Code
= Year
= Month
= Additional Traceability Data
PIN ASSIGNMENT
14
1
IN−
VIN
IN+
RD
C
B1
NC
B2
OUT1
OUT2
NC
NC
GND
NC
7
(Top View)
8
ORDERING INFORMATION
See detailed ordering and shipping information on page 6 of
this data sheet.
© Semiconductor Components Industries, LLC, 2014
February, 2018 − Rev. 2
1
Publication Order Number:
LB1863M/D
LB1863M, LB1869M
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Symbol
ICC max
Parameter
Conditions
Ratings
Unit
Maximum input current
t ≤ 20 ms
200
mA
VOUT
Output voltage
LB1863M
LB1869M
−0.3 to +85
−0.3 to +60
V
IOUT
Output current
1.5
A
IRD
RD influx current
10
mA
VRD
RD voltage
30
V
800
mW
Pd max
Allowable power dissipation
When mounted (on a 20 × 15 × 1.5-mm3
glass-epoxy printed circuit board)
Topr
Operating temperature
−30 to +80
°C
Tstg
Storage temperature
−55 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
ALLOWABLE OPERATING RANGES (TA = 25°C)
Symbol
ICC
VICM
Parameter
Conditions
Ratings
Unit
6.0 to 50
mA
0 to VIN − 1.5
V
Input Current Range
Common-mode Input Voltage Range
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
ELECTRICAL CHARACTERISTICS (TA = 25°C, ICC = 10 mA)
Symbol
VOR
VO(SUS)
VO(sat)1
Parameter
Output Voltage 1
Output Voltage 2
Output Saturation Voltage
VO(sat)2
VIN
VOFF
IBA
Min
Typ
Max
Unit
LB1863M
Conditions
80
−
−
V
LB1869M
60
−
−
V
LB1863M: IO = 0.1 A
65
−
−
V
LB1869M: IO = 0.1 A
40
−
−
V
IO = 0.5 A
−
0.95
1.2
V
IO = 1.0 A
Input Voltage
ICC = 7.0 mA
Amplifier Input Offset Voltage
Amplifier Input Bias Current
VRD(sat)
RD Output Saturation Voltage
IC1
Capacitor Discharge Current
IRD = 5 mA
IC2
VTH1
Comparator Input Threshold Voltage
VTH2
−
1.15
1.5
V
6.4
6.7
7.0
V
−7
0
+7
mA
−250
−
−
nA
−
0.1
0.3
V
2.1
3
3.9
mA
0.31
0.44
0.59
mA
0.77
0.8 VIN
0.83
V
0.42
0.45 VIN
0.48
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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2
LB1863M, LB1869M
Figure 1. Pd max − TA
BLOCK DIAGRAM
Figure 2. Block Diagram
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3
LB1863M, LB1869M
APPLICATION CIRCUIT
Figure 3. Sample Application Circuit
SAMPLE APPLICATION CIRCUIT OUTPUT WAVEFORMS
Figure 4. Output Waveforms
TRUTH TABLE
IN+
IN−
C
OUT1
H
L
L
L
H
H
L
L
H
H
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4
OUT2
RD
H
L
L
L
H
H
H
H
LB1863M, LB1869M
DESIGN DECUMENTATION
(See the Application Circuit Diagram)
3. Output Transistors (OUT1 and OUT2 Pins)
Output current: IO = 1.5 A maximum
Output saturation voltage: VOsat = 1.15 V/1.0 A
(typical)
Applications should adopt one of the following
three output protection techniques.
If a capacitor is inserted between OUT and
ground, use a capacitor with a value up to
C = 10 mF, and design that value so that the
kickback and reverse voltages do not exceed
VOR.
If a Zener diode is added, determine a value for
the Zener voltage that is lower than VO(SUS). If
radio-frequency noise is a problem, insert a
capacitor between B1 and B2.
If a capacitor is inserted between OUT and B1,
set the capacitor value so that the kickback
voltage is lower than VO(SUS). If oscillation
occurs, insert a resistor in series with the
capacitor.
4. Output Protection Function (C Pin)
This pin connects the capacitor that forms the
automatic recovery circuit. If rotation stops due to,
for example, a motor overload, the pin voltage
rises and the output stops. The system
automatically recovers from stopped to drive mode
when the load is set to an appropriate level.
The lock detection time can be set by changing the
value of the capacitor.
1. Power-supply Voltage (VIN Pin)
Since these miniature flat package products supply
power to the Hall amplifier block and the control
block from an internal parallel regulator, they
operate with good stability with respect to
kickback currents from the motor and variations in
the power−supply voltage. They also provide an
adequate ability to withstand surges. The resistor
R1 between the VCC and VIN pins should be set up
so that a current in the range ICC = 6 to 50 mA
flows into the VIN pin in the fan motor
power-supply voltage range.
VIN has a typical value of 6.7 V when ICC is
7 mA. The current flowing into VIN can be
calculated with the following formula.
I CC +
V CC * V IN
(eq. 1)
R1
• Abnormal voltage considerations
The maximum allowable current for the VIN pin is
200 mA. Therefore, the IC design allows it to
withstand voltages up to the plus side abnormal
voltage Vsurge give by formula (2).
V surge + V IN ) R1
20 mA
(eq. 2)
2. Hall Input Pin Voltages (IN– and IN+ Pins)
The Hall element output voltages to the Hall
element input pins must be in the range 0 to
(VIN –1.5 V). The gain from the Hall input pins to
the output pin is over 100 dB. The Hall input
amplifier offset voltage is ±7 mV. This means that
the Hall element output must be set up taking this
±7 mV offset into account.
For a 1-mF capacitor:
Lock detection time
Lock protection time
(output on)
(output off)
About 2 seconds
About 1 second
About 6 seconds
Figure 5. Automatic Recovery Circuit Pin C Voltage
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5
LB1863M, LB1869M
While the blades are turning, the capacitor is
charged with a current of about 3 mA (typical),
and C is discharged by pulses that correspond
to the motor speed.
When the blades lock, the capacitor is no longer
discharged, and the voltage across the capacitor
increases. The output is turned off when that
voltage reaches 0.8 × VIN.
When the output is turned off, the capacitor is
discharged at a current of about 0.44 mA
(typical). When the capacitor voltage falls
under VTH2, if the lock state is not yet cleared
the capacitor continues discharging until VTH1.
(Note that the output is turned on at this time.)
These operations, i.e. items and , are
repeated with a ton:toff ratio of about 1:6 to
protect the motor.
④ If the lock state has been cleared when the
capacitor voltage reaches VTH2, motor rotation
is started by turning the output on.
5. Rotation Detection Signal (RD Pin)
This is an open collector output, and outputs a low
level in drive mode and a high level when the
motor is stopped.
6. Radio-frequency Noise Reduction Function
(B1 and B2 Pins)
These are base pins for Darlington pair outputs.
Add capacitors of about 0.01 to 0.1 mF if
radio-frequency noise is a problem.
7. Thermal Shutdown Function
Turns off the output in response to coil shorting or
IC overheating.
ORDERING INFORMATION
Package
Wire Bond
Shipping† (Qty / Packing)
LB1863M−MPB−E
SOIC14 W / MFP14S (225 mil)
(Pb−Free)
Au wire
60 / Fan−Fold
LB1863M−MPB−H
SOIC14 W / MFP14S (225 mil)
(Pb−Free / Halogen Free)
Au wire
60 / Fan−Fold
LB1863M−TLM−E
SOIC14 W / MFP14S (225 mil)
(Pb−Free)
Au wire
1,000 / Tape & Reel
LB1863M−TLM−H
SOIC14 W / MFP14S (225 mil)
(Pb−Free / Halogen Free)
Au wire
1,000 / Tape & Reel
LB1863M−W−AH
SOIC14 W / MFP14S (225 mil)
(Pb−Free / Halogen Free)
Cu wire
1,000 / Tape & Reel
LB1869M * Discontinued
SOIC14 W / MFP14S (225 mil)
(Pb−Free)
Au wire
−/−
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC14 W / MFP14S (225 mil)
CASE 751CB
ISSUE A
DATE 25 OCT 2013
1.10
SOLDERING FOOTPRINT*
GENERIC
MARKING DIAGRAM*
5.70
(Unit: mm)
1.00
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
0.47
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON67224E
XXXXXXXXXX
YMDDD
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SOIC14 W / MFP14S (225 MIL)
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