LB1863M-TLM-E

LB1863M, LB1869M Two‐Phase Brushless Motor Driver Monolithic Digital IC Overview www.onsemi.com The LB1863M and LB1869M are 2-phase unipolar brushless motor drivers that are provided in a miniature flat package that contributes to end product miniaturization and supports automatic mounting. These products support the implementation of motor drive lock protection and automatic recovery circuits, and alarm specifications with a minimal number of external components. Features SOIC14 W / MFP14S CASE 751CB • Hall Elements can be Connected Directly to the IC itself • 1.5-A Output Current Output Transistors Built in • Rotation Detection Function that Provides a Low-level Output • • • MARKING DIAGRAM during Motor Drive and a High-level Output when the Motor is Stopped Motor Lock Protection and Automatic Recovery Functions Built in Thermal Shutdown Circuit Switching Noise can be Reduced with an External Ceramic Capacitor XXXXXXXX YMDDD Classification NOTE: System Voltage Package (MFP−14S) 12 V LB1869M 24 V LB1863M The LB1869M and LB1863M are pin compatible so that the same printed circuit board can be used for both 12 V and 24 V products. XXXX Y M DDD = Specific Device Code = Year = Month = Additional Traceability Data PIN ASSIGNMENT 14 1 IN− VIN IN+ RD C B1 NC B2 OUT1 OUT2 NC NC GND NC 7 (Top View) 8 ORDERING INFORMATION See detailed ordering and shipping information on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2014 February, 2018 − Rev. 2 1 Publication Order Number: LB1863M/D LB1863M, LB1869M SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Symbol ICC max Parameter Conditions Ratings Unit Maximum input current t ≤ 20 ms 200 mA VOUT Output voltage LB1863M LB1869M −0.3 to +85 −0.3 to +60 V IOUT Output current 1.5 A IRD RD influx current 10 mA VRD RD voltage 30 V 800 mW Pd max Allowable power dissipation When mounted (on a 20 × 15 × 1.5-mm3 glass-epoxy printed circuit board) Topr Operating temperature −30 to +80 °C Tstg Storage temperature −55 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ALLOWABLE OPERATING RANGES (TA = 25°C) Symbol ICC VICM Parameter Conditions Ratings Unit 6.0 to 50 mA 0 to VIN − 1.5 V Input Current Range Common-mode Input Voltage Range Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. ELECTRICAL CHARACTERISTICS (TA = 25°C, ICC = 10 mA) Symbol VOR VO(SUS) VO(sat)1 Parameter Output Voltage 1 Output Voltage 2 Output Saturation Voltage VO(sat)2 VIN VOFF IBA Min Typ Max Unit LB1863M Conditions 80 − − V LB1869M 60 − − V LB1863M: IO = 0.1 A 65 − − V LB1869M: IO = 0.1 A 40 − − V IO = 0.5 A − 0.95 1.2 V IO = 1.0 A Input Voltage ICC = 7.0 mA Amplifier Input Offset Voltage Amplifier Input Bias Current VRD(sat) RD Output Saturation Voltage IC1 Capacitor Discharge Current IRD = 5 mA IC2 VTH1 Comparator Input Threshold Voltage VTH2 − 1.15 1.5 V 6.4 6.7 7.0 V −7 0 +7 mA −250 − − nA − 0.1 0.3 V 2.1 3 3.9 mA 0.31 0.44 0.59 mA 0.77 0.8 VIN 0.83 V 0.42 0.45 VIN 0.48 V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 2 LB1863M, LB1869M Figure 1. Pd max − TA BLOCK DIAGRAM Figure 2. Block Diagram www.onsemi.com 3 LB1863M, LB1869M APPLICATION CIRCUIT Figure 3. Sample Application Circuit SAMPLE APPLICATION CIRCUIT OUTPUT WAVEFORMS Figure 4. Output Waveforms TRUTH TABLE IN+ IN− C OUT1 H L L L H H L L H H www.onsemi.com 4 OUT2 RD H L L L H H H H LB1863M, LB1869M DESIGN DECUMENTATION (See the Application Circuit Diagram) 3. Output Transistors (OUT1 and OUT2 Pins) Output current: IO = 1.5 A maximum Output saturation voltage: VOsat = 1.15 V/1.0 A (typical) Applications should adopt one of the following three output protection techniques.  If a capacitor is inserted between OUT and ground, use a capacitor with a value up to C = 10 mF, and design that value so that the kickback and reverse voltages do not exceed VOR.  If a Zener diode is added, determine a value for the Zener voltage that is lower than VO(SUS). If radio-frequency noise is a problem, insert a capacitor between B1 and B2.  If a capacitor is inserted between OUT and B1, set the capacitor value so that the kickback voltage is lower than VO(SUS). If oscillation occurs, insert a resistor in series with the capacitor. 4. Output Protection Function (C Pin) This pin connects the capacitor that forms the automatic recovery circuit. If rotation stops due to, for example, a motor overload, the pin voltage rises and the output stops. The system automatically recovers from stopped to drive mode when the load is set to an appropriate level. The lock detection time can be set by changing the value of the capacitor. 1. Power-supply Voltage (VIN Pin) Since these miniature flat package products supply power to the Hall amplifier block and the control block from an internal parallel regulator, they operate with good stability with respect to kickback currents from the motor and variations in the power−supply voltage. They also provide an adequate ability to withstand surges. The resistor R1 between the VCC and VIN pins should be set up so that a current in the range ICC = 6 to 50 mA flows into the VIN pin in the fan motor power-supply voltage range. VIN has a typical value of 6.7 V when ICC is 7 mA. The current flowing into VIN can be calculated with the following formula. I CC + V CC * V IN (eq. 1) R1 • Abnormal voltage considerations The maximum allowable current for the VIN pin is 200 mA. Therefore, the IC design allows it to withstand voltages up to the plus side abnormal voltage Vsurge give by formula (2). V surge + V IN ) R1 20 mA (eq. 2) 2. Hall Input Pin Voltages (IN– and IN+ Pins) The Hall element output voltages to the Hall element input pins must be in the range 0 to (VIN –1.5 V). The gain from the Hall input pins to the output pin is over 100 dB. The Hall input amplifier offset voltage is ±7 mV. This means that the Hall element output must be set up taking this ±7 mV offset into account. For a 1-mF capacitor: Lock detection time Lock protection time (output on) (output off) About 2 seconds About 1 second About 6 seconds Figure 5. Automatic Recovery Circuit Pin C Voltage www.onsemi.com 5 LB1863M, LB1869M  While the blades are turning, the capacitor is charged with a current of about 3 mA (typical), and C is discharged by pulses that correspond to the motor speed.  When the blades lock, the capacitor is no longer discharged, and the voltage across the capacitor increases. The output is turned off when that voltage reaches 0.8 × VIN.  When the output is turned off, the capacitor is discharged at a current of about 0.44 mA (typical). When the capacitor voltage falls under VTH2, if the lock state is not yet cleared the capacitor continues discharging until VTH1. (Note that the output is turned on at this time.) These operations, i.e. items  and , are repeated with a ton:toff ratio of about 1:6 to protect the motor. ④ If the lock state has been cleared when the capacitor voltage reaches VTH2, motor rotation is started by turning the output on. 5. Rotation Detection Signal (RD Pin) This is an open collector output, and outputs a low level in drive mode and a high level when the motor is stopped. 6. Radio-frequency Noise Reduction Function (B1 and B2 Pins) These are base pins for Darlington pair outputs. Add capacitors of about 0.01 to 0.1 mF if radio-frequency noise is a problem. 7. Thermal Shutdown Function Turns off the output in response to coil shorting or IC overheating. ORDERING INFORMATION Package Wire Bond Shipping† (Qty / Packing) LB1863M−MPB−E SOIC14 W / MFP14S (225 mil) (Pb−Free) Au wire 60 / Fan−Fold LB1863M−MPB−H SOIC14 W / MFP14S (225 mil) (Pb−Free / Halogen Free) Au wire 60 / Fan−Fold LB1863M−TLM−E SOIC14 W / MFP14S (225 mil) (Pb−Free) Au wire 1,000 / Tape & Reel LB1863M−TLM−H SOIC14 W / MFP14S (225 mil) (Pb−Free / Halogen Free) Au wire 1,000 / Tape & Reel LB1863M−W−AH SOIC14 W / MFP14S (225 mil) (Pb−Free / Halogen Free) Cu wire 1,000 / Tape & Reel LB1869M * Discontinued SOIC14 W / MFP14S (225 mil) (Pb−Free) Au wire −/− Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC14 W / MFP14S (225 mil) CASE 751CB ISSUE A DATE 25 OCT 2013 1.10 SOLDERING FOOTPRINT* GENERIC MARKING DIAGRAM* 5.70 (Unit: mm) 1.00 XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data 0.47 NOTE: The measurements are not to guarantee but for reference only. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON67224E XXXXXXXXXX YMDDD *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. SOIC14 W / MFP14S (225 MIL) PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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