LB1868M-TLM-E

LB1868M 2‐phase Brushless Fan Motor Driver Monolithic Digital IC Overview www.onsemi.com The LB1868M is a 2-phase unipolar brushless motor driver. With only a few peripheral parts, lockup protection and automatic recovery can be implemented. The IC can be configured for 12 V or 24 V operation and a wide range of variations, from Low speed to H-High speed and from 60 cm to 120 cm square using the same PCB. This makes it easy to design highly reliable fan motor installations. Features MFP14S CASE 751CB • Output Protection Zener Diode with Variable Withstand Voltage Z1, Z2 Pins Open: VOLM = 57 V (24 V Specification) Z1, Z2 pins shorted: VOLM = 32 V (12 V Specification) ♦ External Zener Diode Connected across Z1 − VCC Pins: Support for Fans with Large Drive Current External Resistor Allows Configuration for 12 V or 24 V Direct Hall Element Connection Possible (Built-in Hall Amplifier with Hysteresis Supports Core without Auxiliary Electrode) Built-in Output Transistor with 1.0 A Output Current (Strengthened Negative-current Support for Core without Auxiliary Electrode) Built-in Rotation Detection Function: Low during Rotation and High during Stop Built-in Lockup Protection with Automatic Recovery ST Pin for Motor Stop/Drive (for Standby Mode of Copiers etc.) FG Output Pin for Rotation Detection BC Pin for Kickback Noise Reduction (with 2 External Capacitors) Built-in Thermal Shutdown ♦ ♦ • • • • • • • • • MARKING DIAGRAM XXXXXXXXXX YMDDD XXXXX Y M DDD = Specific Device Code = Year = Month = Additional Traceability Data PIN ASSIGNMENT 1 14 IN− VIN IN+ RD CT FG ST Z2 BC Z1 OUT2 OUT1 GND NC 7 (Top View) 8 ORDERING INFORMATION See detailed ordering and shipping information on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2013 March, 2018 − Rev. 1 1 Publication Order Number: LB1868M/D LB1868M SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Symbol ICC max Parameter Maximum Input Current Conditions Ratings Unit 200 mA Internal V t ≤ 20 ms VOUT max Maximum Applied Output Voltage IOUT max Maximum Output Current 1.0 A IRD max Current Flowing into RD, FG 10 mA VRD max RD, FG Applied Voltage 30 V VST max ST Applied Voltage 7.5 V Pd max Allowable Power Dissipation 800 mW Mounted on a specified board (Note 1) Topr Operating Temperature −30 to +80 °C Tstg Storage Temperature −55 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. .Specified board: 20 mm × 15 mm × 1.5 mm, glass epoxy board. ALLOWABLE OPERATING RANGES (TA = 25°C) Parameter Symbol ICC Conditions Ratings Unit 6.0 to 50 mA 0.2 to VIN−1.5 V Input Current Range VICM Common Mode Input Voltage Range VSTH ST High Voltage 4.5 to 7.0 V VSTL ST Low Voltage 0 to 0.5 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. ELECTRICAL CHARACTERISTICS (TA = 25°C, ICC = 10 mA) Symbol VOLM1 Parameter Output Limiter Withstand Voltage VOLM2 VOsat1 Output Saturation Voltage VOsat2 VIN Min Typ Max Unit Z1, Z2 open Conditions 54 57 60 V Z1, Z2 short 31 33 35 V IO = 0.5 A − 0.95 1.2 V IO = 1.0 A − 1.15 1.5 V 6.4 6.7 7.0 V VIN Voltage ICC = 7.0 mA VHN Hall Input Sensitivity (at Zero Peak) Including offset and hysteresis − − 20 mV VRDsat RD, FG Output Saturation Voltage IRD = 5 mA − 0.1 0.3 V IC1 CT Drain Current C = GND 2.7 3.8 4.9 mA IC2 CT Discharge Current C = VIN 0.19 0.30 0.41 mA 0.77 0.8VIN 0.83 V 0.42 0.45VIN 0.48 V VTH1 Comp Input Threshold Voltage VTH2 IST TSD DTSD ST Input Current VST = 5 V − 80 120 mA Thermal Protection Operating Temperature Design target value (Note 2) − 180 − °C Thermal Protection Circuit Hysteresis Design target value (Note 2) − 40 − °C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 2 LB1868M 2. Design target value, Do not measurement. Allowable Power Dissipation, Pd max − W 1.0 Specified board: 20 × 15 × 1.5 mm glass epoxy board 0.8 0.6 0.4 0.2 0.0 −30 −20 0 40 20 60 80 100 Ambient Temperature, TA − 5C Figure 1. Pd max − TA PIN FUNCTION Pin No. Pin Name Function 1 IN− Hall input + pin. Hysteresis amplifier 2 IN+ Hall input − pin. Hysteresis amplifier 3 CT Lockup protection time setting capacitor pin (0.47 to 4.7 mF) 4 ST Start/stop pin 5 BC Output transistor common base pin 6 OUT1 Output 1 pin 9 OUT2 Output 2 pin 7 GND GND pin 10 Z1 External Zener diode pin (external Zener diode to be connected between power supply and Z1) 11 Z2 Kickback absorption voltage alteration pin (shorted to Z1: 12 V operation) 12 FG Rotation frequency detector pin 13 RD Lockup detection pin (latch type) 14 VIN Regulated power supply input pin (limiting resistor to be inserted between power supply and VIN) TRUTH TABLE ST IN+ IN− CT OUT1 OUT2 RD FG H H L L H H L L L H L H H L H H L L H L L L L H L L H L H H L H H H H L L H H H H H H L or OPEN NOTE: RD is a latch type output. www.onsemi.com 3 LB1868M BLOCK DIAGRAM Figure 2. Block Diagram www.onsemi.com 4 LB1868M APPLICATION CIRCUIT 1. 12 V Supply Voltage Figure 3. 12 V Supply Voltage 2. 24 V Supply Voltage Figure 4. 24 V Supply Voltage www.onsemi.com 5 LB1868M 3. High-power Fan (120 mm-HH-Speed) Figure 5. High-power Fan (120 mm-HH-Speed) ORDERING INFORMATION Package Wire Bond Shipping† (Qty / Packing) LB1868M−TLM−E MFP14S (225 mil) (Pb−Free) Au wire 1,000 / Tape & Reel LB1868M−TLM−H MFP14S (225 mil) (Pb−Free / Halogen Free) Au wire 1,000 / Tape & Reel LB1868M−W−AH MFP14S (225 mil) (Pb−Free / Halogen Free) Cu wire 1,000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC14 W / MFP14S (225 mil) CASE 751CB ISSUE A DATE 25 OCT 2013 1.10 SOLDERING FOOTPRINT* GENERIC MARKING DIAGRAM* 5.70 (Unit: mm) 1.00 XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data 0.47 NOTE: The measurements are not to guarantee but for reference only. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON67224E XXXXXXXXXX YMDDD *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. SOIC14 W / MFP14S (225 MIL) PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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