LC709203F
Smart LiB Gauge
Battery Fuel Gauge LSI
For 1‐Cell Lithium‐ion/
Polymer (Li+)
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Overview
LC709203F is a Fuel Gauge for a single lithium ion/polymer
battery. It is part of our Smart LiB Gauge family of Fuel Gauges
which measure the battery RSOC (Relative State Of Charge) using its
unique algorithm called HG−CVR. The HG−CVR algorithm
eliminates the use of a sense resistor and provides accurate RSOC
information even under unstable conditions (e.g. changes of battery;
temperature, loading, aging and self-discharge). An accurate RSOC
contributes to the operating time of portable devices.
LC709203F is available in two small packages realizing the
industries smallest PCB footprint for the complete solution. It has
minimal parameters to be set by the user enabling simple, quick setup
and operation.
1
WDFN8
CASE 509AF
MARKING DIAGRAMS
WDFN8
9203F
**
ASWLYW
G
Features
• HG−CVR Algorithm Technology
♦
•
•
•
•
•
•
•
•
No External Sense Resistor
♦ 2.8% Accuracy of RSOC
♦ Accurate RSOC of Aging Battery
♦ Automatic Convergence of Error
♦ Adjustment for the Parasitic Impedance around the Battery
♦ Simple and Quick Setup
Low Power Consumption
♦ 3 A Operational Mode
Precision Voltage Measurement
♦ ±7.5 mV
Precision Timer
♦ ±3.5%
Alerts for Low RSOC and/or Low Voltage
Temperature Compensation
♦ Sense Thermistor Input
♦ Via I2C
Detect Battery Insertion
I2C Interface (up to 400 kHz Supported)
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
•
•
•
•
•
•
Wireless Handsets
Smartphones/PDA Devices
MP3 Players
Digital Cameras
Portable Game Players
USB-related Devices
© Semiconductor Components Industries, LLC, 2015
December, 2017 − Rev. 13
WLCSP9
CASE 567JH
9203F** = Specific Device Code
**
= 01 (LC709203FQH−01TWG)
02 (LC709203FQH−02TWG)
03 (LC709203FQH−03TWG)
04 (LC709203FQH−04TWG)
AS
= Assembly Location
WL
= Lot Number
YW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
WLCSP9
203**
YMXXX
203**
**
Y
M
XXX
= Specific Device Code
= 01 (LC709203FXE−01MH)
02 (LC709203FXE−02MH)
03 (LC709203FXE−03MH)
04 (LC709203FXE−04MH)
05 (LC709203FXE−05MH)
= Year
= Month Code
= Lot Number
ORDERING INFORMATION
See detailed ordering and shipping information on page 19 of
this data sheet.
1
Publication Order Number:
LC709203F/D
LC709203F
Application Circuit Example
System VDD
10 k
10 k
I2C Bus VDD
Master
TSW
TSENSE
Battery
Pack
SDA
SCL
T
ASIC
PACK+
PACK−
ALARMB
VDD
VSS
TEST
LC709203F
10 k
Interrupt Input
1 F
VSS
System
System VSS
Figure 1. Example of an Application Schematic using LC709203F
(Temperature Input via I2C)
System VDD
10 k
10 k
I2C Bus VDD
Battery
Pack
Master
10 k (same as Thermistor
Resistance Value)
TSW
SDA
SCL
10 k
Thermistor
TSENSE
100
T
ASIC
PACK+
PACK−
ALARMB
VDD
VSS
TEST
LC709203F
10 k
Interrupt Input
1 F
VSS
System
System VSS
Figure 2. Example of an Application Schematic using LC709203F
(The Temperature is Measured Directly by a Thermistor)
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2
LC709203F
SDA
ALARMB
I2C
Interface
TEST
SCL
VDD
Drv
TSW
Look Up
Table for
Internal
Battery
Impedance
& OCV
Processing
Unit
ADC
TSENSE
VDD
Voltage
Sense
VSS
Reference
Voltage
Timer
Power On
Reset
Figure 3. Simplified Block Diagram
TSW
(Bottom View)
TSENSE
(Top View)
SDA
WLCSP9 1.60x1.76
“Pb-Free, Halogen Free Type”
SCL
WDFN8 3x4, 065P
“Pb-Free, Halogen Free Type”
8
7
6
5
LC709203F
4
ALARMB
3
VDD
2
VSS
TEST
1
Figure 4. Pin Assignment
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3
C3
B3
A1
TSENSE
TSW
VDD
C2
B2
A2
SCL
NC
ALARMB
C1
B1
A1
SDA
TEST
VSS
LC709203F
Table 1. PIN FUNCTION
WDFN8
WLP9
Pin Name
I/O
1
1B
TEST
I
Connect this pin to VSS.
Description
2
1A
VSS
−
Connect this pin to the battery’s negative (−) pin.
3
3A
VDD
−
Connect this pin to the battery’s positive (+) pin.
4
2A
ALARMB
O
This pin indicates alarm by low output(open drain). Pull-up must be done externally.
Alarm conditions are specified by registers (0x13 or 0x14).
Connect this pin to VSS when not in use.
5
3B
TSW
O
Power supply output for thermistor. This pin goes HIGH during temperature read
operation. Resistance value of TSW (for thermistor pull-up) must be the same value
as the thermistor. (Note 1)
6
3C
TSENSE
I
Thermistor sense input. If you connect this pin to thermistor, insert 100 resistance
between them for ESD. (Note 1)
7
1C
SDA
I/O
I2C Data pin (open drain). Pull-up must be done externally.
8
2C
SCL
I/O
I2C Clock pin (open drain). Pull-up must be done externally.
−
2B
NC
−
Don’t care.
1. TSW and TSENSE must be disconnected as Figure 1 when not in use.
Table 2. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, VSS = 0 V)
Specification
VDD (V)
Min
Typ
Max
Unit
VDD
−
−0.3
−
+6.5
V
VI (1)
TSENSE
−
−0.3
−
VDD + 0.3
Output Voltage
Vo (1)
TSW
−
−0.3
−
VDD + 0.3
Vo (2)
ALARMB
−
−0.3
−
Input/Output Voltage
VIO (1)
SDA, SCL
−
−0.3
−
+5.5
Allowable Power Dissipation
Pd max
WDFN8
−
−
−
480
−
−
−
210
Symbol
Pin/Remarks
VDD max
Input Voltage
Parameter
Maximum Supply Voltage
WLP9
Conditions
TA = −40 to
+85_C
Operating Ambient Temperature
Topr
−
−40
−
+85
Storage Ambient Temperature
Tstg
−
−55
−
+125
mW
_C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 3. ALLOWABLE OPERATING CONDITIONS (TA = −40 to +85°C, VSS = 0 V)
Specification
VDD (V)
Min
Typ
Max
Unit
VDD
−
2.5
−
4.5
V
VIH (1)
TSENSE
2.5 to 4.5
0.7 VDD
−
VDD
VIH (2)
ALARMB, SDA, SCL
2.5 to 4.5
1.4
−
−
VIL (1)
TSENSE
2.5 to 4.5
VSS
−
0.25 VDD
VIL (2)
ALARMB, SDA, SCL
2.5 to 4.5
−
−
0.5
Parameter
Symbol
Pin/Remarks
Operating Supply Voltage
VDD (1)
High Level Input Voltage
Low Level Input Voltage
Conditions
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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LC709203F
Table 4. ELECTRICAL CHARACTERISTICS (TA = −40 to +85°C, VSS = 0 V)
Specification
Symbol
Pin/Remarks
Conditions
VDD (V)
Min
Typ
Max
Unit
High Level Input Current
IIH (1)
SDA, SCL
VIN = VDD
(including output
transistor off leakage
current)
2.5 to 4.5
−
−
1
A
Low Level Input Current
IIL (1)
SDA, SCL
VIN = VSS
(including output
transistor off leakage
current)
2.5 to 4.5
−1
−
−
VOH (1)
TSW
IOH = −0.4 mA
3.0 to 4.5
VDD − 0.4
−
−
IOH = −0.2 mA
2.5 to 4.5
VDD − 0.4
−
−
IOL = 3.0 mA
3.0 to 4.5
−
−
0.4
IOL = 1.3 mA
2.5 to 4.5
−
−
0.4
2.5 to 4.5
−
0.1 VDD
−
2.5 to 4.5
−
10
−
pF
−
−
2.4
V
Parameter
High Level Output Voltage
VOH (2)
Low Level Output Voltage
V
VOL (2)
TSW,
ALARMB,
SDA, SCL
VHYS(1)
SDA, SCL
Pin Capacitance
CP
All pins
Reset Release Voltage
(Note 2)
VRR
VDD
Initialization Time after
Reset Release (Note 2)
TINIT
2.4 to 4.5
−
−
90
ms
Auto Sleep Set Time
TATS
2.4 to 4.5
−
1
1.2
s
Time Measurement
Accuracy
TME
TA = −20_C to +70_C
2.5 to 4.5
−3.5
−
+3.5
%
Operational mode
2.5 to 4.5
−
3
4.5
A
Sleep mode
2.5 to 4.5
−
1
2
TA = +25_C
3.6
−7.5
−
+7.5
TA = −20_C to +70_C
2.5 to 4.5
−20
−
+20
Hysteresis Voltage
VOL (1)
Consumption Current
(Note 3)
IDD (1)
Voltage Measurement
Accuracy
VME (1)
VDD
IDD (2)
VME (2)
VDD
Pins other than
the pin under test
VIN = VSS
TA = 25_C
mV/cell
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Once VDD voltage exceeds over the VRR, this LSI will release RESET status. And the LSI goes into Sleep mode TINIT after it.
3. Consumption current is a value in the range of −20_C to +70_C.
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LC709203F
Table 5. I2C SLAVE CHARACTERISTICS (TA = −40 to +85°C, VSS = 0 V)
Specification
Min
Max
Unit
−
400
kHz
(See Figure 5)
1.3
−
s
SCL, SDA
(See Figure 5)
0.6
−
s
TSU:STA
SCL, SDA
(See Figure 5)
0.6
−
s
STOP Condition Setup Time
TSU:STO
SCL, SDA
(See Figure 5)
0.6
−
s
Data Hold Time
THD:DAT
SCL, SDA
(See Figure 5)
0
0.9
s
Data Setup Time
TSU:DAT
SCL, SDA
(See Figure 5)
100
−
ns
1.3
−
s
0.6
−
s
Symbol
Pin/Remarks
Clock Frequency
TSCL
SCL
Bus Free Time between STOP condition
and START condition
TBUF
SCL, SDA
Hold Time (repeated) START condition.
First clock pulse is generated after this
interval
THD:STA
Repeated START Condition Setup Time
Parameter
Conditions
VDD (V)
2.5 to 4.5
Clock Low Period
TLOW
SCL
(See Figure 5)
Clock High Period
THIGH
SCL
(See Figure 5)
Clock/Data Fall Time
TF
SCL, SDA
20 + 0.1CB
300
ns
Clock/Data Rise Time
TR
SCL, SDA
20 + 0.1CB
300
ns
Wake Up Time from Sleep Mode
TWU
SDA
(See Figure 6)
−
400
s
SDA Low Pulse Width to Wake Up
TSP
SDA
(See Figure 6)
0.6
−
s
SDA
(See Figure 6)
500
−
ms
SCL, SDA
(See Figure 6)
500
−
ms
Wake Up Retention Time from the Falling
Edge of SDA
TWR1
Wake Up Retention Time from STOP
Condition
TWR2
SDA
tLOW
tf
tSU;DAT
tr
tf
tHD;STA
tBUF
tr
SCL
tSU;STA
tHD;STA
S
tHD;DAT
tHIGH
tSU;STO
S
Figure 5. I2C Timing Diagram
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6
P
S
LC709203F
I2C Communication Protocol
Communication protocol type: I2C
Frequency: Supported up to 400 kHz
IC address [Slave Address]: 0x16 (It becomes “0001011X” when you write a binary, because the slave address is 7 bits. [X] = Rd/Wr.)
Bus Protocols
S
Sr
Rd
Wr
A
N
P
CRC−8
…
Read Word Protocol
S
:
:
:
:
:
:
:
:
:
:
:
Start Condition
Repeated Start Condition
Read (bit value of 1)
Write (bit value of 0)
ACK (bit value of 0)
NACK (bit value of 1)
Stop Condition
Slave Address to Last Data (CRC−8−ATM : ex.3778 mV : 0x16, 0x09, 0x17, 0xC2, 0x0E → 0x86)
Master-to-Slave
Slave-to-Master
Continuation of protocol
Slave Address
Wr
A
Command Code
A
Sr
Slave Address
Rd
A
Data Byte Low
A
A
CRC−8
N
P
…
Data Byte High
…
* When you do not read CRC−8, there is not the reliability of data. CRC−8−ATM ex: (5 bytes) 0x16, 0x09, 0x17, 0xC2,
0x0E → 0x86
Write Word Protocol
S
Data Byte Low
Slave Address
Wr
A
A
Command Code
Data Byte High
A
A
CRC−8
* When you do not add CRC−8, the Written data (Data byte Low/High) become invalid.
CRC−8−ATM ex: (4 bytes) 0x16, 0x09, 0x55, 0xAA → 0x3B
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7
…
A
P
LC709203F
Wake Up from Sleep Mode
Sleep Mode
Enable I2C
Communication
Disable I2C Communication
Disable I2C
Communication
TPS
SDA
TWU
TWR1
(Not to Scale)
Sleep Mode
Enable I2C Communication
SCL
Disable I2C Communication
TWR2
SDA
(Not to Scale)
STOP Condition
Figure 6. I2C Wake up Timing Diagram
To wake up from Sleep mode, and to start I2C
communication, Host side must set SDA low prior to the I2C
communication. The Fuel Gauge LSI enables I2C
communication after the TWU time period which is
measured from the falling edge of SDA, as above timing
chart. This “Wake up condition” is invalid for the following
two cases:
1. After TWR1 timing following the falling edge of
SDA, the Fuel Gauge LSI “Wake up condition”
goes into autonomous disable. Once I2C
communication is started, the operation doesn’t go
into disable until the TWR2 timing has elapsed
after STOP condition (below case).
2. After TWR2 timing following I2C Bus STOP
condition, the Fuel gauge LSI “Wake up
condition” goes into autonomous disable.
If the “Wake up condition” goes into disable, set SDA low
to once again wake up from the Sleep mode prior to the I2C
communication. If Operational mode is set, it is possible to
start I2C communication without this “Wake up operation”.
Notice for I2C Communication Shared with Another
Device
When the I2C Bust (on which the Fuel Gauge LSI is
connected) is shared with another device the Fuel Gauge LSI
must be in its operation mode before the other Device starts
I2C communication.
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LC709203F
Table 6. FUNCTION OF REGISTERS
Command
Code
Register Name
R/W
Range
0x04
Before RSOC
W
0xAA55: Initialize RSOC
0x06
Thermistor B
R/W
0x0000 to 0xFFFF
0x07
Initial RSOC
W
0xAA55: Initialize RSOC
0x08
Cell Temperature
R
0x0000 to 0xFFFF
Unit
W
0x09E4 to 0x0D04
(I2C mode)
Initial
Value
Description
Executes RSOC initialization with sampled
maximum voltage when 0xAA55 is set.
1K
Sets B−constant of the
thermistor to be measured.
Executes RSOC initialization when 0xAA55
is set.
0.1K
(0.0°C =
0x0AAC)
Displays Cell Temperature
Sets Cell Temperature in
mode
1 mV
I2C
Displays Cell Voltage
−
0x0D34
−
0x0BA6
(25°C)
0x09
Cell Voltage
R
0x0000 to 0xFFFF
0x0A
Current Direction
R/W
0x0000: Auto mode
0x0001: Charge mode
0xFFFF: Discharge mode
0x0B
APA
(Adjustment Pack
Application)
R/W
0x0000 to 0x00FF
0x0C
APT
(Adjustment Pack
Thermistor)
R/W
0x0000 to 0xFFFF
0x0D
RSOC
R
0x0000 to 0x0064
1%
Displays RSOC value based
on a 0−100 scale
−
0x0F
ITE (Indicator to
Empty)
R
0x0000 to 0x03E8
0.1%
Displays RSOC value based
on a 0−1000 scale
−
0x11
IC Version
R
0x0000 to 0xFFFF
Displays an ID number of an IC
−
0x12
Change Of The
Parameter
R/W
0x0000 or 0x0001
Selects a battery profile
0x0000
0x13
Alarm Low RSOC
R/W
0x0000: Disable
0x0001to0x0064: Threshold
1%
Sets RSOC threshold to
generate Alarm signal
0x0008
0x14
Alarm Low Cell
Voltage
R/W
0x0000: Disable
0x0001to0xFFFF: Threshold
1 mV
Sets Voltage threshold to
generate Alarm signal
0x0000
0x15
IC Power Mode
R/W
0x0001: Operational mode
0x0002: Sleep mode
Selects Power mode
(Note 4)
0x16
Status Bit
R/W
0x0000: I2C mode
0x0001: Thermistor mode
Selects Temperature obtaining method
0x0000
0x1A
Number of The
Parameter
R
0x0301 or 0x0504
Displays Battery profile code
−
Selects Auto/Charge/Discharge mode
Sets Parasitic impedance
1 m
Sets a value to adjust temperature
measurement delay timing
−
0x0000
−
0x001E
NOTE: 0xXXXX = Hexadecimal notation
4. See “Power-on Reset/Battery Insertion Detection” and Figure 16.
Before RSOC (0x04)
command when the Before RSOC command is written. (See
Figure 8).
This LSI obtains Open Circuit Voltage (OCV) reading
10 ms after Power-on reset to initialize RSOC (See
Figure 7).
Or the LSI can be forced to initialize RSOC by sending the
Before RSOC Command (0×04 = AA55) or the Initial
RSOC Command (0×07 = AA55). The accuracy of the
Initialization requires the OCV reading to be taken with
minimal load or charge, under 0.025C, on the battery. (i.e.
less than 75 mA for 3000 mAh design capacity battery.).
The LSI initializes RSOC by the maximum voltage
between initialize after Power-on reset and setting the
Thermistor B (0x06)
Sets B-constant of the thermistor to be measured. Refer to
the specification sheet of the thermistor for the set value to
use.
Initial RSOC (0x07)
The LSI can be forced to initialize RSOC by sending the
Before RSOC Command (0×04 = AA55) or the Initial
RSOC Command (0×07 = AA55).
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LC709203F
Cell Voltage (0x09)
This register contains the voltage on VDD 1 mV units.
Current Direction (0x0A)
This register is used to control the reporting of RSOC. In
Auto mode the RSOC is reported as it increases or decreases.
In Charge mode the RSOC is not permitted to decrease. In
Discharge mode the RSOC is not permitted to increase.
With consideration of capacity influence by temperature,
we recommend operating in Auto because RSOC is affected
by the cell temperature. A warm cell has more capacity than
a cold cell. Be sure not to charge in the Discharge mode and
discharge in the Charge mode; it will create an error.
An example of RSOC reporting is shown in Figures 10
and 11.
Figure 7. RSOC Automatic Initialization
Figure 8. Before RSOC Command
Figure 9. Initial RSOC Command
The LSI initializes RSOC by the measured voltage at that
time when the Initial RSOC command is written. (See
Figure 9). The maximum time to initialize RSOC after the
command is written is 1.5 ms.
Cell Temperature (0x08)
This register contains the cell temperature from −20_C
(0×09E4) to +60_C (0×0D04) measured in 0.1_C units.
In the Thermistor mode (0×16 = 01) the LSI measures the
attached thermistor and loads the temperature into the Cell
Temperature register. In the Thermistor mode, the
thermistor shall be connected to the LSI as shown in
Figure 2. The temperature is measured by having TSW pin
to provide power into the thermistor and TSENSE pin to
sense the output voltage from the thermistor. Temperature
measurement timing is controlled by the LSI, and the power
to the thermistor is not supplied for other reasons except to
measure the temperature.
In the I2C mode (0×16 = 00) the temperature is provided
by the host processor. During discharge/charge the register
should be updates when the temperature changes more than
1_C
Figure 10. Discharge Mode
(An example with increasing in temperature. A warm
cell has more capacity than a cold cell. Therefore
RSOC increases without charging in Auto mode)
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LC709203F
Table 7. TYPICAL APA
APA(0x0B)
Figure 11. Charge Mode
(An example with decreasing in temperature. A cold
cell has less capacity than a warm cell. Therefore
RSOC decreases without discharging in Auto mode)
Design
Capacity
of Battery
Type−01,
Type−03
Type−06
Type−07
100 mAh
0x08
0x0D
0x07
200 mAh
0x0B
0x15
0x0C
500 mAh
0x10
0x20
0x18
1000 mAh
0x19
−
0x28
2000 mAh
0x2D
−
0x40
3000 mAh
0x36
−
0x4D
Design
Capacity
of Battery
Type−04
Type−05
2600 mAh
0x1A
0x0D
APA(0x0B)
Adjustment Pack Application (0x0B)
This register contains the adjustment value for a battery
type to improve the RSOC precision. Figure 12 and Table 7
show typical values of APA according to the design
capacities per 1 cell and battery type. When some batteries
are connected in parallel, the design capacity per 1 cell is
applied to the table. The APA values of Type−04 and
Type−05 are used for battery type that is specified in Table 8.
Please contact ON Semiconductor if you don’t satisfy the
RSOC precision. The deeper adjustment of APA may
improve the accuracy.
Figure 13. An Example of a Capacitor Across
the Thermistor
RSOC (0x0D)
RSOC is reported in 1% units over the range 0% to 100%.
Indicator to Empty (0x0F)
This is the same as RSOC with a resolution of 0.1% over
the range 0.0% to 100.0%.
IC Version (0x11)
Figure 12. Typical APA
This is an ID number of an LSI.
Adjustment Pack Thermistor (0x0C)
Change of the Parameter (0x12)
This is used to compensate for the delay of the thermistor
measurement caused by a capacitor across the thermistor.
The default value has been found to meet most of circuits
where a capacitor like showing in Figure 13 is not put.
Please contact ON Semiconductor if you have an unusual
circuit implementation.
The LSI contains a data file comprised of two battery
profiles. This register is used to select the battery profile to
be used. See Table 8. Register Number of the Parameter
(0x1A) contains identity of the data file.
The Data file is loaded during final test depending on the
part number ordered.
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11
LC709203F
Operational mode. If battery is discharged or charged in the
Sleep mode, the count breaks off.
When it is switched from Sleep mode to Operational
mode, RSOC calculation is continued by using the data
which was measured in the previous Operational mode.
Most of the time, battery nominal/rated voltage or
charging voltage values are used to determine which profile
data shall be used. Please contact ON Semiconductor if you
cannot identify which profile to select.
Alarm Low RSOC (0x13)
The ALARMB pin will be set low when the RSOC value
falls below this value, will be released from low when RSOC
value rises than this value. Set to Zero to disable. Figure 14.
Figure 15. Alarm Low Cell Voltage
Status Bit (0x16)
This selects the Thermistor mode. Thermistor mode
(0x16 = 01) the LSI measures the attached thermistor and
loads the temperature into the Cell Temperature register.
I2C mode (0x16 = 00) the temperature is provided by the
host processor.
Figure 14. Alarm Low RSOC
Alarm Low Cell Voltage (0x14)
The ALARMB pin will be set low if VDD falls below this
value, will be released from low if VDD rises than this value.
Set to Zero to disable. Figure 15.
Number of the Parameter (0x1A)
The LSI contains a data file comprised of two battery
profiles. This register contains identity of the data file.
Please see register Change of the Parameter (0x12) to select
the battery profile to be used. See Table 8.
The Data file is loaded during final test depending on the
part number ordered. This file can be loaded in the field if
required.
Please contact ON Semiconductor if you cannot identify
which profile to select.
IC Power Mode (0x15)
The LSI has two power modes. Sleep (0x15 = 02) or
Operational mode (0x15 = 01). In the Sleep mode only I2C
communication functions. In the Operational mode all
functions operate with full calculation and tracking of
RSOC during charge and discharge.
If the battery is significantly charged or discharged during
sleep mode, the RSOC will not be accurate. Moved charge
is counted continuously to measure the RSOC in
Table 8. BATTERY PROFILE VS. REGISTER
IC Type
LC709203Fxx−01xx
LC709203Fxx−03xx
LC709203Fxx−04xx
LC709203Fxx−05xx
Battery
Type
Nominal/Rated
Voltage
Charging
Voltage
Design
Capacity
Number of
the Parameter
(0x1A)
Change of
the Parameter
(0x12)
03
3.8 V
4.35 V
≥ 500 mAh
0x0301
0x0000
01
3.7 V
4.2 V
−
06
3.8 V
4.35 V
< 500 mAh
01
3.7 V
4.2 V
−
05
ICR18650−26H (SAMSUNG)
04
UR18650ZY (Panasonic)
0x0000
0x0001
0x0000
0x0001
3.85 V
4.4 V
−
06
3.8 V
4.35 V
< 500 mAh
12
0x0601
0x0504
07
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0x0001
0x0706
0x0000
0x0001
LC709203F
Automatic Convergence of the Error
HG−CVR
A problem of coulomb counting method is the fact that the
error is accumulated over time − This error must be
corrected. The general gauges using coulomb counting
method must find an opportunity to correct it.
This LSI with HG−CVR has the feature that the error of
RSOC converges autonomously, and doesn’t require
calibration opportunities. The error constantly converges in
the value estimated from the Open Circuit Voltage.
Figure 26 shows the convergent characteristic example
from the initialize error.
Also, coulomb counting method cannot detect accurate
residual change because the amount of the current from
self-discharge is too small but HG−CVR is capable to deal
with such detection by using the voltage information.
Hybrid Gauging by Current-Voltage Tracking with
Internal Resistance
HG−CVR is ON Semiconductor’s unique method which
is used to calculate accurate RSOC. HG−CVR first
measures battery voltage and temperature. Precise reference
voltage is essential for accurate voltage measurement.
LC709203F has accurate internal reference voltage circuit
with little temperature dependency.
It also uses the measured battery voltage and internal
impedance and Open Circuit Voltage (OCV) of a battery for
the current measurement. OCV is battery voltage without
load current. The measured battery voltage is separated into
OCV and varied voltage by load current. The varied voltage
is the product of load current and internal impedance. Then
the current is determined by the following formulas.
V(VARIED) + V(MEASURED) * OCV
I+
V(VARIED)
R(INTERNAL)
Simple and Quick Setup
In general, it is necessary to obtain multiple parameters for
a fuel gauge and it takes a lot of resource and additional
development time of the users. One of the unique features of
LC709203F is very small number of parameters to be
prepared by the beginning of battery measurement – the
minimum amount of parameter which users may make is
one because Adjustment pack application register has to
have one. Such simple and quick start-up is realized by
having multiple profile data in the LSI to support various
types of batteries. Please contact your local sales office to
learn more information on how to measure a battery that
cannot use already-prepared profile data.
(eq. 1)
(eq. 2)
Where V(VARIED) is varied voltage by load current,
V(MEASURED) is measured voltage, R(INTERNAL) is
internal impedance of a battery. Detailed information about
the internal impedance and OCV is installed in the LSI. The
internal impedance is affected by remaining capacity,
load-current, temperature, and more. Then the LSI has the
information as look up table. HG−CVR accumulates battery
coulomb using the information of the current and a steady
period by a high accuracy internal timer. The remaining
capacity of a battery is calculated with the accumulated
coulomb.
Low Power Consumption
Low power consumption of 3 A is realized in the
Operation mode. This LSI monitors charge/discharge
condition of a battery and changes the sampling rate
according to its change of current. Power consumption
reduction without deteriorating its RSOC accuracy was
enabled by utilizing this method.
How to Identify Aging
By repeating discharge/charge, internal impedance of
a battery will gradually increase, and the Full Charge
Capacity (FCC) will decrease. In coulomb counting method
RSOC is generally calculated using the FCC and the
Remaining Capacity (RM).
RM
RSOC +
FCC
100%
Power-on Reset/Battery Insertion Detection
When this LSI detects battery insertion, it starts Power-on
reset automatically. Once the battery voltage exceeds over
the VRR, it will release RESET status and will complete LSI
initialization within TINIT to enter into Operational mode.
All registers are initialized after Power-on reset. Then I2C
communication can be started.
LC709203FXE−0xMH sets itself into Sleep mode
automatically after TATS from the end of initialization.
Therefore set to operational mode manually after it enters
into Sleep mode. LC709203FQH−0xTWG doesn’t set itself
into Sleep mode automatically. Figure 16.
This LSI will also execute system reset automatically if
a battery voltage exceeds under the VRR during operation.
Furthermore after Change of the Parameter (0x12)
command input it will execute LSI initialization like battery
insertion. Figure 17.
(eq. 3)
Then the decreased FCC must be preliminarily measured
with learning cycle. But HG−CVR can measure the RSOC
of deteriorated battery without learning cycle. The internal
battery impedance that HG−CVR uses to calculate the
current correlates highly with FCC. The correlation is based
on battery chemistry. The RSOC that this LSI reports using
the correlation is not affected by aging.
Figures 23−25 show RSOC measurement result of
a battery with decreased FCC due to its aging. The shown
RSOC is based on the decreased FCC even with a battery
with 80% FCC after executing 300 times of discharge/
charge.
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13
LC709203F
Parasitic Resistance
Measurement Starting Flow
The LSI measures RSOC by using internal impedance of
a battery. Therefore, the parasitic resistance which exists in
VDD/VSS Lines between measured Battery or Battery Pack
to the LSI can become an error factor. But the resistance of
Lines which is not connected other than the LSI is not
included. Figure 18.
The lower resistance may improve the RSOC precision.
Please see LC709203F Application note for information
about layout method of VDD/VSS Lines to reduce it.
After Reset release, users can start battery measurement
by writing appropriate value into the registers by following
the flow shown in Figures 19−20. Please refer to Register
function section for more information about each register.
LC709203FQH−0xTWG
Reset
Initialization
Operation Mode
VDD
VRR
TINT
LC709203FXE−0xMH
Reset
Initialization
Operation Mode
TINT
TATS
Sleep Mode
VDD
VRR
(Not to Scale)
Figure 16. Power On Timing Diagram
LC709203FQH−0xTWG
0x12
Command
Initialization
Operation Mode
SCL
TINIT
SDA
Stop Condition
LC709203FXE−0xMH
0x12
Command
Initialization
Operation Mode
Sleep Mode
SCL
TINIT
TATS
SDA
Stop Condition
(Not to Scale)
Figure 17. Timing Diagram after 0x12 Command
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14
LC709203F
VDD
Application
LC709203F
VSS
Application
Processor
The components that the resistance must be measured.
Figure 18. An Example of Parasitic Resistance
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15
Battery
or
Battery Pack
LC709203F
STARTING FLOW
Power On
Input SDA Pulse
(Note 5)
Wake Up from
Sleep Mode
Set 0x0001
to Register 0x15
(Note 5)
Set Operational
Mode
Set 0xZZZZ
to Register 0x0B
Set APA
Set 0x000Z
to Register 0x12
Initial RSOC
Set 0xAA55
to Register 0x04 or 0x07
(Note 6)
Set Thermistor
Mode
Set 0x0001
to Register 0x16
Set B-constant
of Thermistor
Set 0xZZZZ
to Register 0x06
Initialization End
5. It’s unnecessary if initial power mode is
Operational mode.
SDA pulse can be substituted in some kind of
commands.
Ex: Input “Set Operational mode” twice.
6. It’s unnecessary if OCV can be get at automatic
initialization.
Set Battery Profile
Figure 19. Starting Flow at Thermistor Mode
Power On
Input SDA Pulse
(Note 7)
Wake Up from
Sleep Mode
Set 0x0001
to Register 0x15
(Note 7)
Set 0xZZZZ
to Register 0x0B
Set 0x000Z
to Register 0x12
Initial RSOC
Set 0xAA55
to Register 0x04 or 0x07
(Note 8)
Set via I2C
Mode
Set 0x0000
to Register 0x16
Set Operational
Mode
Set Temperature
Set 0xZZZZ
to Register 0x08
Set APA
Initialization End
7. It’s unnecessary if initial power mode is
Operational mode.
SDA pulse can be substituted in some kind of
commands.
Ex: Input “Set Operational mode” twice.
8. It’s unnecessary if OCV can be get at automatic
initialization.
Set Battery Profile
Figure 20. Starting Flow at I2C Mode
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16
LC709203F
TYPICAL CHARACTERISTICS
Figure 21. Discharge Characteristics by Temperature Change
Figure 22. Discharge Characteristics by Load Change
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17
LC709203F
TYPICAL CHARACTERISTICS
Figure 23. Discharge/Charge Cycle
Figure 24. Battery Capacity Deterioration
Figure 25. Discharge Characteristics of Deterioration Battery
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18
LC709203F
TYPICAL CHARACTERISTICS
Figure 26. Convergent Characteristic from the Initialize Error
This Graph is the Example for Starting Point 48% (Includes 52% Error Case) Instead of 100% (No Error)
Table 9. ORDERING INFORMATION
Package
Shipping†
LC709203FQH−01TWG
WDFN8 3x4, 0.65P
(Pb-Free / Halogen Free)
2,000 / Tape & Reel
LC709203FQH−02TWG
WDFN8 3x4, 0.65P
(Pb-Free / Halogen Free)
2,000 / Tape & Reel
LC709203FQH−03TWG
WDFN8 3x4, 0.65P
(Pb-Free / Halogen Free)
2,000 / Tape & Reel
LC709203FQH−04TWG
WDFN8 3x4, 0.65P
(Pb-Free / Halogen Free)
2,000 / Tape & Reel
LC709203FXE−01MH
WLCSP9, 1.60x1.76
(Pb-Free / Halogen Free)
5,000 / Tape & Reel
LC709203FXE−02MH
WLCSP9, 1.60x1.76
(Pb-Free / Halogen Free)
5,000 / Tape & Reel
LC709203FXE−03MH
WLCSP9, 1.60x1.76
(Pb-Free / Halogen Free)
5,000 / Tape & Reel
LC709203FXE−04MH
WLCSP9, 1.60x1.76
(Pb-Free / Halogen Free)
5,000 / Tape & Reel
LC709203FXE−05MH
WLCSP9, 1.60x1.76
(Pb-Free / Halogen Free)
5,000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NOTE: IC performance may vary depend on the types of battery to be in use. Contact your local sales office for
assistance in choosing the correct model.
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19
LC709203F
PACKAGE DIMENSIONS
WDFN8 3x4, 0.65P
CASE 509AF
ISSUE C
L
A
B
D
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30mm FROM THE TERMINAL TIP.
4. PROFILE TOLERANCE APPLIES TO THE
EXPOSED PAD AS WELL AS THE LEADS.
L1
DETAIL A
PIN ONE
REFERENCE
2X
0.10 C
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
0.10 C
2X
ALTERNATE
CONSTRUCTIONS
E
ÉÉ
ÉÉ
ÇÇ
EXPOSED Cu
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTIONS
TOP VIEW
0.08 C
NOTE 4
SIDE VIEW
MILLIMETERS
MIN
MAX
−−−
0.80
0.00
0.05
0.20 REF
0.20
0.30
3.00 BSC
1.70
1.90
4.00 BSC
2.30
2.50
0.65 BSC
0.45
0.55
−−−
0.10
A
(A3)
DETAIL B
0.10 C
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
A1
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
ÇÇ
Ç
ÇÇÇ
ÇÇ
ÇÇÇ
Ç
1.96
0.10 C A B
D2
DETAIL A
1
4
0.10 C A B
8X
L
E2
ÇÇ
Ç
ÇÇ
Ç
ÇÇÇÇ
ÇÇ
1
0.65
PITCH
8
5
e/2
e
8X
b
0.10 C A B
0.05 C
8X
0.70
2.56 4.30
8X
0.35
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
BOTTOM VIEW
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20
LC709203F
PACKAGE DIMENSIONS
WLCSP9, 1.60x1.76
CASE 567JH
ISSUE B
ÈÈ
PIN A1
REFERENCE
E
A B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
D
DIM
A
A1
b
D
E
e
0.05 C
2X
0.05 C
2X
TOP VIEW
BACKCOAT
MILLIMETERS
MIN
MAX
0.51
−−−
0.09
0.19
0.20
0.30
1.60 BSC
1.76 BSC
0.50 BSC
A
0.10 C
RECOMMENDED
SOLDERING FOOTPRINT*
0.08 C
A1
A1
NOTE 3
C
SIDE VIEW
PACKAGE
OUTLINE
SEATING
PLANE
e
9X
b
0.05 C A B
e
0.50
PITCH
C
0.03 C
B
9X
0.25
0.50
PITCH
DIMENSIONS: MILLIMETERS
A
1
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
3
BOTTOM VIEW
I2C Bus is a trademark of Philips Corporation. All other brand names and product names appearing in this document are registered
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LC709203F/D
