LC709203FXE-04MH

Smart LiB Gauge Battery Fuel Gauge LSI For 1‐Cell Lithium‐ion/ Polymer (Li+) LC709203F www.onsemi.com Overview LC709203F is a Fuel Gauge for a single lithium ion/polymer battery. It is part of our Smart LiB Gauge family of Fuel Gauges which measure the battery RSOC (Relative State Of Charge) using its unique algorithm called HG−CVR. The HG−CVR algorithm eliminates the use of a sense resistor and provides accurate RSOC information even under unstable conditions (e.g. changes of battery; temperature, loading, aging and self-discharge). An accurate RSOC contributes to the operating time of portable devices. LC709203F is available in two small packages realizing the industries smallest PCB footprint for the complete solution. It has minimal parameters to be set by the user enabling simple, quick setup and operation. 1 WDFN8 CASE 509AF MARKING DIAGRAMS WDFN8 9203F ** ASWLYW G Features • HG−CVR Algorithm Technology No External Sense Resistor ♦ 2.8% Accuracy of RSOC ♦ Accurate RSOC of Aging Battery ♦ Automatic Convergence of Error ♦ Adjustment for the Parasitic Impedance around the Battery ♦ Simple and Quick Setup Low Power Consumption ♦ 3 A Operational Mode Precision Voltage Measurement ♦ ±7.5 mV Precision Timer ♦ ±3.5% Alerts for Low RSOC and/or Low Voltage Temperature Compensation ♦ Sense Thermistor Input ♦ Via I2C Detect Battery Insertion I2C Interface (up to 400 kHz Supported) These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant ♦ • • • • • • • • Applications • • • • • • Wireless Handsets Smartphones/PDA Devices MP3 Players Digital Cameras Portable Game Players USB-related Devices © Semiconductor Components Industries, LLC, 2015 November, 2020 − Rev. 17 WLCSP9 CASE 567JH 9203F** = Specific Device Code ** = 01 (LC709203FQH−01TWG) 02 (LC709203FQH−02TWG) 03 (LC709203FQH−03TWG) 04 (LC709203FQH−04TWG) AS = Assembly Location WL = Lot Number YW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) WLCSP9 203** YMXXX 203** ** Y M XXX = Specific Device Code = 01 (LC709203FXE−01MH) 02 (LC709203FXE−02MH) 03 (LC709203FXE−03MH) 04 (LC709203FXE−04MH) 05 (LC709203FXE−05MH) = Year = Month Code = Lot Number ORDERING INFORMATION See detailed ordering and shipping information on page 19 of this data sheet. 1 Publication Order Number: LC709203F/D LC709203F Application Circuit Example System VDD 10 k 10 k I2C Bus VDD Master TSW TSENSE Battery Pack SDA SCL T ASIC ALARMB VDD VSS 10 k Interrupt Input PACK+ PACK− TEST LC709203F 1 F VSS System System VSS Figure 1. Example of an Application Schematic using LC709203F (Temperature Input via I2C) System VDD 10 k 10 k I2C Bus VDD Battery Pack Master 10 k (same as Thermistor Resistance Value) TSW SDA SCL 10 k Thermistor TSENSE 100  T ASIC PACK+ PACK− ALARMB VDD VSS TEST LC709203F 10 k Interrupt Input 1 F VSS System System VSS Figure 2. Example of an Application Schematic using LC709203F (The Temperature is Measured Directly by a Thermistor) www.onsemi.com 2 LC709203F SDA ALARMB I2C Interface SCL TEST VDD Drv TSW Look Up Table for Internal Battery Impedance & OCV Processing Unit ADC TSENSE VDD Voltage Sense VSS Reference Voltage Timer Power On Reset Figure 3. Simplified Block Diagram ALARMB (Bottom View) VDD (Bottom View) VSS WLCSP9 1.60x1.76 “Pb-Free, Halogen Free Type” TEST WDFN8 3x4, 065P “Pb-Free, Halogen Free Type” 1 2 3 4 9 C1 C2 C3 SDA SCL TSENSE B1 B2 B3 TEST NC TSW A2 A3 8 7 6 5 SCL SDA TSENSE TSW A1 VSS Figure 4. Pin Assignment www.onsemi.com 3 ALARMB VDD LC709203F Table 1. PIN FUNCTION WDFN8 WLP9 Pin Name I/O 1 B1 TEST I Connect this pin to VSS. Description 2 A1 VSS − Connect this pin to the battery’s negative (−) pin. 3 A3 VDD − Connect this pin to the battery’s positive (+) pin. 4 A2 ALARMB O This pin indicates alarm by low output(open drain). Pull-up must be done externally. Alarm conditions are specified by registers (0x13 or 0x14). Connect this pin to VSS when not in use. 5 B3 TSW O Power supply output for thermistor. This pin goes HIGH during temperature read operation. Resistance value of TSW (for thermistor pull-up) must be the same value as the thermistor. (Note 1) 6 C3 TSENSE I Thermistor sense input. If you connect this pin to thermistor, insert 100  resistance between them for ESD. (Note 1) 7 C1 SDA I/O I2C Data pin (open drain). Pull-up must be done externally. 8 C2 SCL I/O I2C Clock pin (open drain). Pull-up must be done externally. − B2 NC − Don’t care. 9 − Exposed PAD − Don’t care. 1. TSW and TSENSE must be disconnected as Figure 1 when not in use. Table 2. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, VSS = 0 V) Specification Parameter Symbol Maximum Supply Voltage Pin/Remarks Conditions VDD (V) Min Typ Max Unit V VDD max VDD − −0.3 − +6.5 Input Voltage VI (1) TSENSE − −0.3 − VDD + 0.3 Output Voltage Vo (1) TSW − −0.3 − VDD + 0.3 Vo (2) ALARMB − −0.3 − Input/Output Voltage VIO (1) SDA, SCL − −0.3 − +5.5 Allowable Power Dissipation Pd max WDFN8 − − − 480 WLP9 TA = −40 to +85_C − − − 210 Operating Ambient Temperature Topr − −40 − +85 Storage Ambient Temperature Tstg − −55 − +125 mW _C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 3. ALLOWABLE OPERATING CONDITIONS (TA = −40 to +85°C, VSS = 0 V) Specification VDD (V) Min Typ Max Unit VDD − 2.5 − 4.5 V VIH (1) TSENSE 2.5 to 4.5 0.7 VDD − VDD VIH (2) ALARMB, SDA, SCL 2.5 to 4.5 1.4 − − VIL (1) TSENSE 2.5 to 4.5 VSS − 0.25 VDD VIL (2) ALARMB, SDA, SCL 2.5 to 4.5 − − 0.5 Parameter Symbol Pin/Remarks Operating Supply Voltage VDD (1) High Level Input Voltage Low Level Input Voltage Conditions Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 4 LC709203F Table 4. ELECTRICAL CHARACTERISTICS (TA = −40 to +85°C, VSS = 0 V) Specification Symbol Pin/Remarks Conditions VDD (V) Min High Level Input Current IIH (1) SDA, SCL VIN = VDD (including output transistor off leakage current) 2.5 to 4.5 − − 1 Low Level Input Current IIL (1) SDA, SCL VIN = VSS (including output transistor off leakage current) 2.5 to 4.5 −1 − − VOH (1) TSW IOH = −0.4 mA 3.0 to 4.5 VDD − 0.4 − − IOH = −0.2 mA 2.5 to 4.5 VDD − 0.4 − − IOL = 3.0 mA 3.0 to 4.5 − − 0.4 IOL = 1.3 mA 2.5 to 4.5 − − 0.4 2.5 to 4.5 − 0.1 VDD − 2.5 to 4.5 − 10 − pF − − 2.4 V − − 90 ms Parameter High Level Output Voltage VOH (2) Low Level Output Voltage Hysteresis Voltage VOL (2) TSW, ALARMB, SDA, SCL VOL (1) VHYS(1) SDA, SCL Pin Capacitance CP All pins Reset Release Voltage (Note 2) VRR VDD Initialization Time after Reset Release (Note 2) TINIT Auto Sleep Set Time TATS Time Measurement Accuracy TME Consumption Current (Note 3) IDD (1) Voltage Measurement Accuracy VME (1) 2.4 to 4.5 VDD IDD (2) VME (2) Pins other than the pin under test VIN = VSS TA = 25_C VDD Typ Max Unit A V 2.4 to 4.5 − 1 1.2 s TA = −20_C to +70_C 2.5 to 4.5 −3.5 − +3.5 % Operational mode 2.5 to 4.5 − 3 4.5 A Sleep mode 2.5 to 4.5 − 1 2 TA = +25_C 3.6 −7.5 − +7.5 TA = −20_C to +70_C 2.5 to 4.5 −20 − +20 mV/cell Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Once VDD voltage exceeds over the VRR, this LSI will release RESET status. And the LSI goes into Sleep mode TINIT after it. 3. Consumption current is a value in the range of −20_C to +70_C. www.onsemi.com 5 LC709203F Table 5. I2C SLAVE CHARACTERISTICS (TA = −40 to +85°C, VSS = 0 V) Specification Min Max Unit − 400 kHz (See Figure 5) 1.3 − s SCL, SDA (See Figure 5) 1.1 − s THD:RSTA SCL, SDA (See Figure 5) 0.6 − s Repeated START Condition Setup Time TSU:STA SCL, SDA (See Figure 5) 0.6 − s STOP Condition Setup Time TSU:STO SCL, SDA (See Figure 5) 0.6 − s Data Hold Time THD:DAT SCL, SDA (See Figure 5) 0 0.9 s Data Setup Time TSU:DAT SCL, SDA (See Figure 5) 100 − ns Clock Low Period TLOW SCL (See Figure 5) 1.3 − s Clock High Period (See Figure 5) Parameter Symbol Pin/Remarks Clock Frequency TSCL SCL Bus Free Time between STOP Condition and START Condition TBUF SCL, SDA Hold Time START Condition. First clock pulse is generated after this interval THD:STA Hold Time Repeated START Condition Conditions VDD (V) 2.5 to 4.5 THIGH SCL 0.6 − s Clock/Data Fall Time TF SCL, SDA 20 + 0.1CB 300 ns Clock/Data Rise Time TR SCL, SDA 20 + 0.1CB 300 ns Time-out Interval (Notes 4, 5) TTMO SCL, SDA (See Figure 6) 9 11 s Wake Up Time from Sleep Mode TWU SDA (See Figure 7) − 400 s SDA Low Pulse Width to Wake Up TSP SDA (See Figure 7) 0.6 − s Wake Up Retention Time from the Falling Edge of SDA TWR1 SDA (See Figure 7) 500 − ms Wake Up Retention Time from STOP Condition TWR2 SCL, SDA (See Figure 7) 500 − ms 4. This LSI resets I2C communication if the communication takes more than TTMO. It initializes an internal timer to measure the interval when it detects ninth clock pulse. It can receive a new START condition after the reset. 5. This LSI may lose I2C communication at this reset operation. Then if a master can’t receive a response it must restart transaction from START condition. TBUF SDA THD:STA TLOW TR THD:DAT THIGH TF TSU:DAT TSU:STA THD:RSTA TSU:STO SCL P S Sr Figure 5. I2C Timing Diagram P SDA TTMO SCL 1 S 2 8 1 9 ACK Figure 6. I2C Time-out Interval www.onsemi.com 6 2 8 9 ACK LC709203F I2C Communication Protocol Communication protocol type: I2C Frequency: Supported up to 400 kHz Slave Address: 0001011 (The first 8−bits after the Strat Condition is 0x16 (WRITE) or 0x17 (READ).) This LSI will stretch the clock. Bus Protocols S Sr Rd Wr A N P CRC−8 … Read Word Protocol S : : : : : : : : : : : Start Condition Repeated Start Condition Read (bit value of 1) Write (bit value of 0) ACK (bit value of 0) NACK (bit value of 1) Stop Condition Slave Address to Last Data (CRC−8−ATM : ex.3778 mV : 0x16, 0x09, 0x17, 0xC2, 0x0E → 0x86) Master-to-Slave Slave-to-Master Continuation of protocol Slave Address Wr A Command Code A Sr Slave Address Rd A Data Byte Low A A CRC−8 N P … Data Byte High * When you do not read CRC−8, LSI data is not reliable. CRC−8−ATM ex: (5 bytes) 0x16, 0x09, 0x17, 0xC2, 0x0E → 0x86 Write Word Protocol S Data Byte Low Slave Address Wr A A Command Code Data Byte High A A CRC−8 * When you do not add CRC−8, the Written data (Data byte Low/High) become invalid. CRC−8−ATM ex: (4 bytes) 0x16, 0x09, 0x55, 0xAA → 0x3B www.onsemi.com 7 … A P … LC709203F Wake Up from Sleep Mode Sleep Mode Enable I2C Communication Disable I2C Communication Disable I2C Communication TSP SDA TWU TWR1 (Not to Scale) Sleep Mode Enable I2C Communication SCL Disable I2C Communication TWR2 SDA (Not to Scale) STOP Condition Figure 7. I2C Wake up Timing Diagram To wake up from Sleep mode, and to start I2C communication, Host side must set SDA low prior to the I2C communication. The Fuel Gauge LSI enables I2C communication after the TWU time period which is measured from the falling edge of SDA, as above timing chart. This “Wake up condition” is invalid for the following two cases: 1. After TWR1 timing following the falling edge of SDA, the Fuel Gauge LSI “Wake up condition” goes into autonomous disable. Once I2C communication is started, the operation doesn’t go into disable until the TWR2 timing has elapsed after STOP condition (below case). 2. After TWR2 timing following I2C Bus STOP condition, the Fuel gauge LSI “Wake up condition” goes into autonomous disable. If the “Wake up condition” goes into disable, set SDA low to once again wake up from the Sleep mode prior to the I2C communication. If Operational mode is set, it is possible to start I2C communication without this “Wake up operation”. Notice for I2C Communication Shared with Another Device When the I2C Bust (on which the Fuel Gauge LSI is connected) is shared with another device the Fuel Gauge LSI must be in its operation mode before the other Device starts I2C communication. www.onsemi.com 8 LC709203F Table 6. FUNCTION OF REGISTERS Command Code Register Name R/W Range 0x04 Before RSOC W 0xAA55: Initialize RSOC 0x06 Thermistor B R/W 0x0000 to 0xFFFF 0x07 Initial RSOC W 0xAA55: Initialize RSOC 0x08 Cell Temperature R 0x0000 to 0xFFFF Unit W 0x09E4 to 0x0D04 (I2C mode) Initial Value Description Executes RSOC initialization with sampled maximum voltage when 0xAA55 is set. 1K Sets B−constant of the thermistor to be measured. Executes RSOC initialization when 0xAA55 is set. 0.1K (0.0°C = 0x0AAC) Displays Cell Temperature Sets Cell Temperature in mode 1 mV I2C Displays Cell Voltage − 0x0D34 − 0x0BA6 (25°C) 0x09 Cell Voltage R 0x0000 to 0xFFFF − 0x0A Current Direction R/W 0x0000: Auto mode 0x0001: Charge mode 0xFFFF: Discharge mode Selects Auto/Charge/Discharge mode 0x0000 0x0B APA (Adjustment Pack Application) R/W 0x0000 to 0x00FF Sets Adjustment parameter − 0x0C APT (Adjustment Pack Thermistor) R/W 0x0000 to 0xFFFF Sets a value to adjust temperature measurement delay timing 0x001E 0x0D RSOC R/W 0x0000 to 0x0064 1% Displays RSOC value based on a 0−100 scale − 0x0F ITE (Indicator to Empty) R 0x0000 to 0x03E8 0.1% Displays RSOC value based on a 0−1000 scale − 0x11 IC Version R 0x0000 to 0xFFFF Displays an ID number of an IC − 0x12 Change Of The Parameter R/W 0x0000 or 0x0001 Selects a battery profile 0x0000 0x13 Alarm Low RSOC R/W 0x0000: Disable 0x0001to0x0064: Threshold 1% Sets RSOC threshold to generate Alarm signal 0x0008 0x14 Alarm Low Cell Voltage R/W 0x0000: Disable 0x0001to0xFFFF: Threshold 1 mV Sets Voltage threshold to generate Alarm signal 0x0000 0x15 IC Power Mode R/W 0x0001: Operational mode 0x0002: Sleep mode Selects Power mode (Note 6) 0x16 Status Bit R/W 0x0000: I2C mode 0x0001: Thermistor mode Selects Temperature obtaining method 0x0000 0x1A Number of The Parameter R 0x0301 or 0x0504 Displays Battery profile code − NOTE: 0xXXXX = Hexadecimal notation 6. See “Power-on Reset/Battery Insertion Detection” and Figure 17. Before RSOC (0x04) “Before RSOC” command can obtain historical voltage data in-between Release reset and “Before RSOC” command timing. And this command initializes RSOC with the maximum battery voltage which was obtained. (See Figure 9) Don’t use this command if battery is charged in the term. This LSI will get initial RSOC by Open Circuit Voltage (OCV) of a battery. It is desirable for battery current to be less than 0.025C to get expected OCV. (i.e. less than 75 mA for 3000 mAh design capacity battery.) This LSI initializes RSOC by measured battery voltage in initial sequence. (See Figure 8) But if reported RSOC after reset release is not expected value, “Before RSOC” command (0x04 = AA55) or “Initial RSOC” command (0x07 = AA55) can initialize RSOC again. Thermistor B (0x06) Sets B-constant of the thermistor to be measured. Refer to the specification sheet of the thermistor for the set value to use. www.onsemi.com 9 LC709203F Initial RSOC (0x07) Cell Voltage (0x09) The LSI can be forced to initialize RSOC by sending the Before RSOC Command (0×04 = AA55) or the Initial RSOC Command (0×07 = AA55). This register contains the voltage on VDD 1 mV units. Current Direction (0x0A) This register is used to control the reporting of RSOC. In Auto mode the RSOC is reported as it increases or decreases. In Charge mode the RSOC is not permitted to decrease. In Discharge mode the RSOC is not permitted to increase. With consideration of capacity influence by temperature, we recommend operating in Auto because RSOC is affected by the cell temperature. A warm cell has more capacity than a cold cell. Be sure not to charge in the Discharge mode and discharge in the Charge mode; it will create an error. An example of RSOC reporting is shown in Figures 11 and 12. Figure 8. RSOC Automatic Initialization Figure 10. Initial RSOC Command Figure 9. Before RSOC Command The LSI initializes RSOC by the measured voltage at that time when the Initial RSOC command is written. (See Figure 10). The maximum time to initialize RSOC after the command is written is 1.5 ms. Cell Temperature (0x08) This register contains the cell temperature from −20_C (0×09E4) to +60_C (0×0D04) measured in 0.1_C units. In the Thermistor mode (0×16 = 01) the LSI measures the attached thermistor and loads the temperature into the Cell Temperature register. In the Thermistor mode, the thermistor shall be connected to the LSI as shown in Figure 2. The temperature is measured by having TSW pin to provide power into the thermistor and TSENSE pin to sense the output voltage from the thermistor. Temperature measurement timing is controlled by the LSI, and the power to the thermistor is not supplied for other reasons except to measure the temperature. In the I2C mode (0×16 = 00) the temperature is provided by the host processor. During discharge/charge the register should be updates when the temperature changes more than 1_C Figure 11. Discharge Mode (An example with increasing in temperature. A warm cell has more capacity than a cold cell. Therefore RSOC increases without charging in Auto mode) www.onsemi.com 10 LC709203F Table 7. TYPICAL APA Figure 12. Charge Mode (An example with decreasing in temperature. A cold cell has less capacity than a warm cell. Therefore RSOC decreases without discharging in Auto mode) APA(0x0B) Design Capacity of Battery Type−01, Type−03 Type−06 Type−07 100 mAh 0x08 0x0D 0x07 200 mAh 0x0B 0x15 0x0C 500 mAh 0x10 0x20 0x18 1000 mAh 0x19 − 0x28 2000 mAh 0x2D − 0x40 3000 mAh 0x36 − 0x4D Design Capacity of Battery Type−04 Type−05 2600 mAh 0x1A 0x0D APA(0x0B) Adjustment Pack Application (0x0B) This register contains the adjustment value for a battery type to improve the RSOC precision. Figure 13 and Table 7 show typical values of APA according to the design capacities per 1 cell and battery type. When some batteries are connected in parallel, the design capacity per 1 cell is applied to the table. The APA values of Type−04 and Type−05 are used for battery type that is specified in Table 8. Please contact ON Semiconductor if you don’t satisfy the RSOC precision. The deeper adjustment of APA may improve the accuracy. Figure 14. An Example of a Capacitor Across the Thermistor RSOC (0x0D) RSOC is reported in 1% units over the range 0% to 100%. When this register is written in operational mode the data may be updated to close it to actual RSOC of a battery. Set Sleep mode to keep the data. Writing to this register is not necessary in normal operation. ITE (0x0F) will be updated with the writing too. Figure 13. Typical APA Indicator to Empty (0x0F) This is the same as RSOC with a resolution of 0.1% over the range 0.0% to 100.0%. Adjustment Pack Thermistor (0x0C) This is used to compensate for the delay of the thermistor measurement caused by a capacitor across the thermistor. The default value has been found to meet most of circuits where a capacitor like showing in Figure 14 is not put. Please contact ON Semiconductor if you have an unusual circuit implementation. IC Version (0x11) This is an ID number of an LSI. Change of the Parameter (0x12) The LSI contains a data file comprised of two battery profiles. This register is used to select the battery profile to be used. See Table 8. Register Number of the Parameter (0x1A) contains identity of the data file. www.onsemi.com 11 LC709203F is counted continuously to measure the RSOC in Operational mode. If battery is discharged or charged in the Sleep mode, the count breaks off. When it is switched from Sleep mode to Operational mode, RSOC calculation is continued by using the data which was measured in the previous Operational mode. The Data file is loaded during final test depending on the part number ordered. Most of the time, battery nominal/rated voltage or charging voltage values are used to determine which profile data shall be used. Please contact ON Semiconductor if you cannot identify which profile to select. Alarm Low RSOC (0x13) The ALARMB pin will be set low when the RSOC value falls below this value, will be released from low when RSOC value rises than this value. Set to Zero to disable. Figure 15. Figure 16. Alarm Low Cell Voltage Status Bit (0x16) This selects the Thermistor mode. Thermistor mode (0x16 = 01) the LSI measures the attached thermistor and loads the temperature into the Cell Temperature register. I2C mode (0x16 = 00) the temperature is provided by the host processor. Figure 15. Alarm Low RSOC Alarm Low Cell Voltage (0x14) The ALARMB pin will be set low if VDD falls below this value, will be released from low if VDD rises than this value. Set to Zero to disable. Figure 16. Number of the Parameter (0x1A) The LSI contains a data file comprised of two battery profiles. This register contains identity of the data file. Please see register Change of the Parameter (0x12) to select the battery profile to be used. See Table 8. The Data file is loaded during final test depending on the part number ordered. This file can be loaded in the field if required. Please contact ON Semiconductor if you cannot identify which profile to select. IC Power Mode (0x15) The LSI has two power modes. Sleep (0x15 = 02) or Operational mode (0x15 = 01). In the Sleep mode only I2C communication functions. In the Operational mode all functions operate with full calculation and tracking of RSOC during charge and discharge. If the battery is significantly charged or discharged during sleep mode, the RSOC will not be accurate. Moved charge www.onsemi.com 12 LC709203F Table 8. BATTERY PROFILE VS. REGISTER IC Type LC709203Fxx−01xx LC709203Fxx−03xx LC709203Fxx−04xx Battery Type Nominal/Rated Voltage Charging Voltage Design Capacity Number of the Parameter (0x1A) Change of the Parameter (0x12) 03 3.8 V 4.35 V ≥ 500 mAh 0x0301 0x0000 01 3.7 V 4.2 V − 06 3.8 V 4.35 V < 500 mAh 01 3.7 V 4.2 V − 05 0x0601 0x0001 0x0001 3.85 V 4.4 V − 06 3.8 V 4.35 V < 500 mAh 0x0706 Hybrid Gauging by Current-Voltage Tracking with Internal Resistance V(VARIED) RM FCC 100% (eq. 3) Then the decreased FCC must be preliminarily measured with learning cycle. But HG−CVR can measure the RSOC of deteriorated battery without learning cycle. The internal battery impedance that HG−CVR uses to calculate the current correlates highly with FCC. The correlation is based on battery chemistry. The RSOC that this LSI reports using the correlation is not affected by aging. Figures 24−26 show RSOC measurement result of a battery with decreased FCC due to its aging. The shown RSOC is based on the decreased FCC even with a battery with 80% FCC after executing 300 times of discharge/ charge. HG−CVR is ON Semiconductor’s unique method which is used to calculate accurate RSOC. HG−CVR first measures battery voltage and temperature. Precise reference voltage is essential for accurate voltage measurement. LC709203F has accurate internal reference voltage circuit with little temperature dependency. It also uses the measured battery voltage and internal impedance and Open Circuit Voltage (OCV) of a battery for the current measurement. OCV is battery voltage without load current. The measured battery voltage is separated into OCV and varied voltage by load current. The varied voltage is the product of load current and internal impedance. Then the current is determined by the following formulas. V(VARIED) + V(MEASURED) * OCV 0x0000 0x0001 RSOC + R(INTERNAL) 0x0000 UR18650ZY (Panasonic) 07 HG−CVR I+ 0x0000 0x0504 ICR18650−26H (SAMSUNG) 04 LC709203Fxx−05xx 0x0001 Automatic Convergence of the Error A problem of coulomb counting method is the fact that the error is accumulated over time − This error must be corrected. The general gauges using coulomb counting method must find an opportunity to correct it. This LSI with HG−CVR has the feature that the error of RSOC converges autonomously, and doesn’t require calibration opportunities. The error constantly converges in the value estimated from the Open Circuit Voltage. Figure 27 shows the convergent characteristic example from the initialize error. Also, coulomb counting method cannot detect accurate residual change because the amount of the current from self-discharge is too small but HG−CVR is capable to deal with such detection by using the voltage information. (eq. 1) (eq. 2) Where V(VARIED) is varied voltage by load current, V(MEASURED) is measured voltage, R(INTERNAL) is internal impedance of a battery. Detailed information about the internal impedance and OCV is installed in the LSI. The internal impedance is affected by remaining capacity, load-current, temperature, and more. Then the LSI has the information as look up table. HG−CVR accumulates battery coulomb using the information of the current and a steady period by a high accuracy internal timer. The remaining capacity of a battery is calculated with the accumulated coulomb. Simple and Quick Setup In general, it is necessary to obtain multiple parameters for a fuel gauge and it takes a lot of resource and additional development time of the users. One of the unique features of LC709203F is very small number of parameters to be prepared by the beginning of battery measurement – the minimum amount of parameter which users may make is one because Adjustment pack application register has to How to Identify Aging By repeating discharge/charge, internal impedance of a battery will gradually increase, and the Full Charge Capacity (FCC) will decrease. In coulomb counting method RSOC is generally calculated using the FCC and the Remaining Capacity (RM). www.onsemi.com 13 LC709203F have one. Such simple and quick start-up is realized by having multiple profile data in the LSI to support various types of batteries. Please contact your local sales office to learn more information on how to measure a battery that cannot use already-prepared profile data. into Sleep mode. LC709203FQH−0xTWG doesn’t set itself into Sleep mode automatically. Figure 17. This LSI will also execute system reset automatically if a battery voltage exceeds under the VRR during operation. Furthermore after Change of the Parameter (0x12) command input it will execute LSI initialization like battery insertion. Figure 18. Low Power Consumption Low power consumption of 3 A is realized in the Operation mode. This LSI monitors charge/discharge condition of a battery and changes the sampling rate according to its change of current. Power consumption reduction without deteriorating its RSOC accuracy was enabled by utilizing this method. Parasitic Resistance The LSI measures RSOC by using internal impedance of a battery. Therefore, the parasitic resistance which exists in VDD/VSS Lines between measured Battery or Battery Pack to the LSI can become an error factor. But the resistance of Lines which is not connected other than the LSI is not included. Figure 19. The lower resistance may improve the RSOC precision. Please see LC709203F Application note for information about layout method of VDD/VSS Lines to reduce it. Power-on Reset/Battery Insertion Detection When this LSI detects battery insertion, it starts Power-on reset automatically. Once the battery voltage exceeds over the VRR, it will release RESET status and will complete LSI initialization within TINIT to enter into Operational mode. All registers are initialized after Power-on reset. Then I2C communication can be started. LC709203FXE−0xMH sets itself into Sleep mode automatically after TATS from the end of initialization. Therefore set to operational mode manually after it enters Measurement Starting Flow After Reset release, users can start battery measurement by writing appropriate value into the registers by following the flow shown in Figures 20−21. Please refer to Register function section for more information about each register. LC709203FQH−0xTWG Reset Initialization Operation Mode VDD VRR TINT LC709203FXE−0xMH Reset Initialization Operation Mode TINT TATS VDD VRR (Not to Scale) Figure 17. Power On Timing Diagram www.onsemi.com 14 Sleep Mode LC709203F LC709203FQH−0xTWG 0x12 Command Initialization Operation Mode SCL TINIT SDA Stop Condition LC709203FXE−0xMH 0x12 Command Initialization Operation Mode Sleep Mode SCL TINIT TATS SDA Stop Condition (Not to Scale) Figure 18. Timing Diagram after 0x12 Command VDD Application LC709203F VSS Application Processor The components that the resistance must be measured. Figure 19. An Example of Parasitic Resistance www.onsemi.com 15 Battery or Battery Pack LC709203F STARTING FLOW Power On Input SDA Pulse (Note 7) Wake Up from Sleep Mode Set 0x0001 to Register 0x15 (Note 7) Set Operational Mode Set 0xZZZZ to Register 0x0B Set APA Set 0x000Z to Register 0x12 Initial RSOC Set 0xAA55 to Register 0x04 or 0x07 (Note 8) Set Thermistor Mode Set 0x0001 to Register 0x16 Set B-constant of Thermistor Set 0xZZZZ to Register 0x06 Initialization End 7. It’s unnecessary if initial power mode is Operational mode. SDA pulse can be substituted in some kind of commands. Ex: Input “Set Operational mode” twice. 8. It’s unnecessary if OCV can be get at automatic initialization. Set Battery Profile Figure 20. Starting Flow at Thermistor Mode Power On Input SDA Pulse (Note 9) Wake Up from Sleep Mode Set 0x0001 to Register 0x15 (Note 9) Set 0xZZZZ to Register 0x0B Set 0x000Z to Register 0x12 Initial RSOC Set 0xAA55 to Register 0x04 or 0x07 (Note 10) Set via I2C Mode Set 0x0000 to Register 0x16 Set Operational Mode Set Temperature Set 0xZZZZ to Register 0x08 Set APA Initialization End 9. It’s unnecessary if initial power mode is Operational mode. SDA pulse can be substituted in some kind of commands. Ex: Input “Set Operational mode” twice. 10. It’s unnecessary if OCV can be get at automatic initialization. Set Battery Profile Figure 21. Starting Flow at I2C Mode www.onsemi.com 16 LC709203F TYPICAL CHARACTERISTICS Figure 22. Discharge Characteristics by Temperature Change Figure 23. Discharge Characteristics by Load Change www.onsemi.com 17 LC709203F TYPICAL CHARACTERISTICS Figure 24. Discharge/Charge Cycle Figure 25. Battery Capacity Deterioration Figure 26. Discharge Characteristics of Deterioration Battery www.onsemi.com 18 LC709203F TYPICAL CHARACTERISTICS Figure 27. Convergent Characteristic from the Initialize Error This Graph is the Example for Starting Point 48% (Includes 52% Error Case) Instead of 100% (No Error) Table 9. ORDERING INFORMATION Package Shipping† LC709203FQH−01TWG WDFN8 3x4, 0.65P (Pb-Free / Halogen Free) 2,000 / Tape & Reel LC709203FQH−02TWG WDFN8 3x4, 0.65P (Pb-Free / Halogen Free) 2,000 / Tape & Reel LC709203FQH−03TWG WDFN8 3x4, 0.65P (Pb-Free / Halogen Free) 2,000 / Tape & Reel LC709203FQH−04TWG WDFN8 3x4, 0.65P (Pb-Free / Halogen Free) 2,000 / Tape & Reel LC709203FXE−01MH WLCSP9, 1.60x1.76 (Pb-Free / Halogen Free) 5,000 / Tape & Reel LC709203FXE−02MH WLCSP9, 1.60x1.76 (Pb-Free / Halogen Free) 5,000 / Tape & Reel LC709203FXE−03MH WLCSP9, 1.60x1.76 (Pb-Free / Halogen Free) 5,000 / Tape & Reel LC709203FXE−04MH WLCSP9, 1.60x1.76 (Pb-Free / Halogen Free) 5,000 / Tape & Reel LC709203FXE−05MH WLCSP9, 1.60x1.76 (Pb-Free / Halogen Free) 5,000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NOTE: IC performance may vary depend on the types of battery to be in use. Contact your local sales office for assistance in choosing the correct model. ON Semiconductor is licensed by the Philips Corporation to carry the I2C bus protocol. All other brand names and product names appearing in this document are registered trademarks or trademarks of their respective holders. www.onsemi.com 19 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN8 3x4, 0.65P CASE 509AF ISSUE C 1 SCALE 2:1 L A B D DATE 06 MAY 2014 L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM THE TERMINAL TIP. 4. PROFILE TOLERANCE APPLIES TO THE EXPOSED PAD AS WELL AS THE LEADS. L1 DETAIL A PIN ONE REFERENCE 2X 0.10 C 2X ALTERNATE CONSTRUCTIONS ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ 0.10 C E ÉÉ ÉÉ ÇÇ EXPOSED Cu MOLD CMPD DETAIL B ALTERNATE CONSTRUCTIONS TOP VIEW A (A3) DETAIL B 0.10 C DIM A A1 A3 b D D2 E E2 e L L1 GENERIC MARKING DIAGRAM* XXXXX XXXXX AYWWG G 0.08 C NOTE 4 SIDE VIEW 1 C SEATING PLANE 0.10 C A B D2 DETAIL A A1 4 0.10 C A B 8X MILLIMETERS MIN MAX −−− 0.80 0.00 0.05 0.20 REF 0.20 0.30 3.00 BSC 1.70 1.90 4.00 BSC 2.30 2.50 0.65 BSC 0.45 0.55 −−− 0.10 L A Y WW G = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. E2 8 5 e/2 8X RECOMMENDED SOLDERING FOOTPRINT* b 1.96 ÇÇÇ ÇÇÇ ÇÇÇ ÇÇÇ 0.10 C A B e BOTTOM VIEW 0.05 C NOTE 3 8X 0.70 2.56 4.30 ÇÇÇ ÇÇÇ ÇÇÇ ÇÇÇ 1 0.65 PITCH 8X 0.35 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON80983E WDFN8 3X4, 0.65P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP9, 1.60x1.76 CASE 567JH ISSUE B SCALE 4:1 ÈÈ ÈÈ PIN A1 REFERENCE 2X E A B DATE 23 JAN 2014 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO THE SPHERICAL CROWNS OF THE SOLDER BALLS. D DIM A A1 b D E e 0.05 C 2X 0.05 C TOP VIEW BACKCOAT A 0.10 C 0.08 C 9X C SIDE VIEW PACKAGE OUTLINE SEATING PLANE e b 0.05 C A B RECOMMENDED SOLDERING FOOTPRINT* A1 A1 NOTE 3 MILLIMETERS MIN MAX 0.51 −−− 0.09 0.19 0.20 0.30 1.60 BSC 1.76 BSC 0.50 BSC e C 0.03 C B 0.50 PITCH 9X 0.25 0.50 PITCH DIMENSIONS: MILLIMETERS A 1 2 3 BOTTOM VIEW DOCUMENT NUMBER: DESCRIPTION: 98AON79525F WLCSP9, 1.60X1.76 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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