LC709511FQD-A00TWG

LC709511F Power Bank Controller with USB Type-C & Quick Charget 3.0 for 1-Cell Li-Ion and Li-Poly Battery www.onsemi.com Overview LC709511F is a Lithium ion switching charger controller for Power Bank. This device has all functions to control Power Bank application. It includes Type−C port control, Quick Charge 3.0 HVDCP and Smart switch. The built-in switching controller can output from 5 V up to 12 V for Quick Charge. The high power output for USB Type−C and Quick Charge is possible with appropriate external MOSFETs. Features • • • • • • • • • • • • • • • • • Easy Power Scaling with External MOSFETs Buck Charge to Built-in Battery/Boost Charge to USB Devices Supports Quick Charge 3.0 HVDCP Class A. 5 V up to 12 V Supports USB Type−C Dual Role without External Port Control IC Smart Switch Applies 2.7 V or 2.0 V or DCP Short on USB Data Lines Automatically for Requirement of USB Devices Reference Software Supports Various Combination of USB Port Supports USB BC1.2 Controls an External Boost−IC for 2nd USB Output Battery Level Gauging Status & Battery Level Display with 4 LEDs Boost Auto Start-up Thermistor Sensing Function Over Voltage/Over Current Detection JEITA Compliance Battery Management Safety Timer Low Quiescent Current: 15 mA at Low Power Mode These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant Applications • Power Bank • USB-related Charging Application © Semiconductor Components Industries, LLC, 2017 July, 2019 − Rev. 1 1 1 52 QFN52 6x6, 04P CASE 485BE MARKING DIAGRAM LC709511F A00 ALWLYYWWG LC709511FA00 AL WL YY WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION Device LC709511FQD− A00TWG Package Shipping† QFN52 (Pb−Free/ Halogen Free) 3,000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: LC709511F/D LC709511F GATE1 GATE2 GATE3 TEST3 VCC REGN HDRV AVSSS AVSSP LDRV ISEN REGP VCC_REG 52 51 50 49 48 47 46 45 44 43 42 41 40 PIN ASSIGNMENT 39 COMPU 2 38 TSENSE USB1− 3 37 TSW USB1+ 4 36 TEST2 USB2− 5 35 TEST1 USB2+ 6 34 SENB− REG33 7 33 SENB+ PBT 8 32 VBAT DVSS2 9 31 DVSS1 FGADJ 10 30 XT2 BATSEL 11 29 XT1 ICHSEL/BSTEN 12 28 DVDD IBTSEL 13 27 SENV− 15 16 17 18 19 20 21 22 23 24 25 26 VB3DET CC1A CC2A USB3−/CC1B USB3+/CC2B LED1 LED2 LED3 LED4 SENV1+ SENV2+ SENV3+ VBUS2 14 1 VB2DET VBUS1 Figure 1. Pin Assignment (Top View) PIN FUNCTION Pin No. Pin Name I/O Description 1 VBUS1 I Connect this pin to the VBUS of Micro B (sink) or Type−C 2 VBUS2 I Keep this pin OPEN 3 USB1− I/O USB D− data line input. Connect this pin to USB Host/Charging port to detect USB port (BC1.2, dedicated charger) 4 USB1+ I/O USB D+ data line input. Connect this pin to USB Host/Charging port to detect USB port (BC1.2, dedicated charger) 5 USB2− I/O USB D− data line output. Connect this pin to Portable USB devices Supports Quick Charge 3.0 HVDCP 6 USB2+ I/O USB D+ data line output. Connect this pin to Portable USB devices Supports Quick Charge 3.0 HVDCP 7 REG33 − Connect this pin and a capacitor 8 PBT I Push button input 9 DVSS2 − Connect this pin to GND 10 FGADJ I Sets the design capacity of a battery for Port configuration. Pull down this pin to GND through a resistor. In Software configuration keep this pin OPEN 11 BATSEL − Keep this pin OPEN www.onsemi.com 2 LC709511F PIN FUNCTION (continued) Pin No. Pin Name I/O Description 12 ICHSEL/BSTEN O An external Boost−IC control. This pin is set to “HIGH” when it outputs to VBUS of Type−A (2) 13 IBTSEL − Keep this pin OPEN 14 VB2DET I Detects VBUS voltage and attached and unattached of USB2 port 15 VB3DET I Detects VBUS voltage and attached and unattached of USB3 port 16 CC1A I/O FW05: Configuration Channel (CC1) pin for Type−C. It outputs Rp or Rd, and detects attached and unattached 17 CC2A I/O FW05: Configuration Channel (CC2) pin for Type−C. It outputs Rp or Rd, and detects attached and unattached 18 USB3−/CC1B I/O FW02: USB D− data line output. Supports DCP and Divided mode. This pin switch the output automatically to be optimal for connected device 19 USB3+/CC2B I/O FW02: USB D+ data line output. Supports DCP and Divided mode. This pin switch the output automatically to be optimal for connected device 20 LED1 O Displays battery level. This is an open drain pin 21 LED2 O Displays battery level. This is an open drain pin 22 LED3 O Displays battery level. This is an open drain pin 23 LED4 O Displays battery level. This is an open drain pin 24 SENV1+ I Connect this pin to positive terminal of sense resistor to detect the current when the Reference software is FW05 25 SENV2+ I Connect this pin to positive terminal of sense resistor to detect Type-A (1) output current 26 SENV3+ I Connect this pin to positive terminal of sense resistor to detect Type-A (2) output current 27 SENV− I Connect this pin to negative terminal of sense resistor to detect the current 28 DVDD − Digital power supply. Connect this pin to REGP through a schottky diode 29 XT1 I Keep this pin OPEN 30 XT2 O Keep this pin OPEN 31 DVSS1 − Connects this pin to GND 32 VBAT I Connect this pin to positive pin of a battery 33 SENB+ I Connect this pin to positive terminal of sense resistor to detect battery current 34 SENB− I Connect this pin to negative terminal of sense resistor to detect battery current 35 TEST1 I Connect this pin to GND 36 TEST2 I Keep this pin OPEN 37 TSW O Power supply output for thermistor. This pin is set to “HIGH” when reading the temperature. Resistance value of TSW (for thermistor pull-up) must be the same value as the thermistor at 25_C 38 TSENSE I Thermistor sense input. Use 100 W resistor when connecting this pin to a thermistor 39 COMPU − Connect this pin to a capacitor through a resistor 40 VCC_REG − Power supply. Connect this pin to VCC 41 REGP O 4.7 V LDO output. (for internal use) Connect capacitor to this pin 42 ISEN I Senses buck-boost converter output current. The sense resistor must be placed between DC−DC converter ground and the source of the MOSFET 43 LDRV I PWM output 44 AVSSP − Connect this pin to GND 45 AVSSS − Connect this pin to GND 46 HDRV O PWM output 47 REGN O VCC−4.7 V LDO output. (for internal use) Connect capacitor to this pin 48 VCC − Power supply www.onsemi.com 3 LC709511F PIN FUNCTION (continued) Pin No. Pin Name I/O Description 49 TEST3 I Select PWM frequency with this pin. Connect this pin to GND to select 150 kHz. Connect this pin to REGP to select 300 kHz. (Note 1) 50 GATE3 − Keep this pin open 51 GATE2 O Control the gate of a FET for Type−A (1) 52 GATE1 O Control the gate of a FET for Micro−B (sink) or Type−C 1. The Reference software to select 300 kHz is planning. ABSOLUTE MAXIMUM RATINGS Parameter Input Voltage Symbol Pin/Remarks Max Unit HVIN max VBUS1, VBUS2, GATE1, GATE2, GATE3, HDRV, VCC, VCC_REG Conditions −0.3 Min Typ +14 V VIN max Low voltage pins except for HV pins. −0.3 +6.5 Allowable Power Dissipation Pd max * 1 W °C Storage Ambient Temperature Tstg −40 125 Operating Junction Temperature Tjopr −40 125 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *Thermal resistance evaluation board (size: 120.2 × 59.9 × 1.69 mm, 6 layers) is used. The device is solder-mounted. RECOMMENDED OPERATING CONDITIONS Max Unit Supply Voltage Parameter Symbol VCC VCC, VCC_REG Pin/Conditions Min 2.8 Typ 13.2 V Digital Supply Voltage VDD DVDD 2.8 5.5 V Battery Voltage VVBAT VBAT 3.0 4.35 V Low Power Mode Ambient Temperature Range TASTB Low power mode and displays battery level −40 85 °C Boost Charge Mode Ambient Temperature TABST Boost charge −20 60 °C Buck Charge Mode Ambient Temperature TABUCK Buck charge 0 60 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 4 LC709511F ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Symbol Pin/Conditions Min Typ Max Unit Consumption Current at Low Power Mode ILOW VCC = VCC_REG = 3.7 V ILOW = IVCC + IVCC_REG at Low power mode 15 mA Consumption Current at Operating Mode IOPR VCC = VCC_REG = 5 V IOPR = IVCC + IVCC_REG at Boost charge mode 10 mA HDRV High−side ON Resistance HDRVH HDRV 2 W HDRV Low−side ON Resistance HDRVL HDRV 3 W LDRV High−side ON Resistance LDRVH LDRV 3 W LDRV Low−side ON Resistance LDRVL LDRV 2 W Gate1/2/3 Drive Voltage VGATE GATE1, GATE2, GATE3 Pull up these pins to VCC through 510 kW VCC UVLO UVLO VCC rising 2.72 UVLO hysteresis 0.1 Quiescent Input Current ICHROFF Thermal Shut Down Threshold THD Frequency FBC 0 VBUS1, VBUS2, Charge mode Switching OFF current VBUS = 5 V 0.2 V 2.8 V V 3 mA 105 _C TEST3 = Low 150 kHz TEST3 = High (Note 2) 300 kHz Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. The Reference software to select 300 kHz is planning. ELECTRICAL CHARACTERISTICS (TA = −40 to +85°C, VDD = 2.8 V to 5.5 V, TA = 25°C for typical values.) Parameter LED Sink Current Symbol ILED Pin/Conditions LED1, LED2, LED3, LED4 VBUS Input Detection Voltage VBDET VBUS1, VBUS2 rising High Level Input Voltage VIH(1) PBT Low Level Input Voltage VIL(1) PBT High Level Output Voltage VOH Low Level Output Voltage VOL(1) Pull−up Resistance at Turn On RPU Min TSW,BSTEN IOH = −0.4 mA Typ 10 Unit mA 4 V 0.3 * VDD + 0.7 VDD V VSS 0.15 VDD + 0.4 V VDD − 0.4 V BSTEN IOL = 0.4 mA FGADJ Max 0.4 50 V kW Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 5 LC709511F ELECTRICAL CHARACTERISTICS (TA = −40 to +85°C, VDD = 3.0 V to 5.5 V, TA = 25°C for typical values.) Parameter Symbol Pin/Conditions Min Typ Max Unit BC1.2/HVDCP D− Pull Down Resistance RDM_DWN USB1−, USB2− 19.53 kW D+ Pull Down Resistance RDP_DWN USB1+, USB2+ 19.53 kW D− Source Voltage VDM_SRC USB1−, USB2− 0.6 V D+ Source Voltage VDP_SRC USB1+, USB2+ 0.6 V D− Sink Current IDM_Sink USB1−, USB2− 100 mA D+ Sink Current IDP_Sink USB1+, USB2+ 100 mA Data Line Leakage Resistance HVDCP Resistance Across D+/− RDAT_LKG USB1−, USB1+, USB2−,USB2+ RHVDCP_DAT USB1−, USB1+, USB2−, USB2+ DCP Resistance Across D+/− RDCP_DAT USB3−, USB3+ 2.7 V Output Voltage VD_27 USB3−, USB3+, VDD = 4.0 V to 5.5 V 2.0 V Output Voltage 2.7 V/2.0 V Output Resistance 300 900 1500 kW 45 W 200 W 2.55 2.7 2.85 V VD_20 1.9 2.0 2.1 V RD_30 24 32 40 kW TYPE−C COMMUNICATION CHANNEL Current Source (Detached Source) Rp_80 CC1A, CC2A, CC1B, CC2B 64 80 96 mA Current Source (1.5 A) Rp_180 166 180 194 mA Current Source (3 A) Rp_330 CC1A, CC2A, CC1B, CC2B, VDD = 4.0 V to 5.5 V 304 330 356 mA CC1A, CC2A 4.59 5.1 5.61 kW 2.18 V Rd Pull-Down Resistance Rd Pull-Down Voltage in Dead Battery VDDB Threshold when Source is attached or detached VTSRC Threshold when Sink is attached or detached VTSNK CC1A, CC2A, CC1B, CC2B 0.15 0.2 0.25 V 1.50 1.60 1.70 V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 6 LC709511F BLOCK DIAGRAM DVDD OVP/UVP VBUS detector XT1 XT2 REG33 USB1+ USB1− VBUS1 VBUS2 USB BC1.2 USB2+ USB2− LED DRIVER LED1 QC3.0 HVDCP Controller BATSEL System Controller & Fuel gauge ICHSEL/BSTEN LED2 LED3 LED4 SENV1+ IBTSEL SENV− TEST1 TEST2 SENV2+ TEST3 SENV3+ TSENSE TSW SENB+ PBT SENB− Regulator VCC_REG Port Controller (2) Smart DCP Controller REGP REGN VCC USB3−/CC1B VBAT USB3+/CC2B ISEN CC1A CC2A Port Controller (1) COMPU HDRV PWM Controller FGADJ LDRV GATE1 Parameter detector GATE2 GATE3 VB2DET VB3DET Insertion detector Figure 2. Block Diagram www.onsemi.com 7 LC709511F REFERENCE SOFTWARE • FW05: Writing Tool This device has non-volatile memory, and can implement the function of each USB port by writing software. It is capable of writing on user application board with dedicated writing tool. Figure 3 shows a connection between the application board and the writing tool. Please refer to an application note for the details of the tool. Application Board Power supply or Battery DVDD DVDD TARGET TEST1 100 kW LC709511F The Relationship between the Reference software and the USB port functions is shown in Table 1 and Figures 4, 5 and 6 USB1 port of FW02 is a power sink for Buck charge. And it contains USB Detection functions of BC1.2 and divided mode. USB2 port is a power source for Boost charge. Quick Charge 3.0 are only enabled for USB2 port. Another power source that is USB3 supports DCP and Divided mode. The USB3+/− pins are Smart switch, they will switch to DCP or Divided mode so that connected device can receive maximum power. USB3 port is boosted by an external Boost−IC. This device runs the Boost−IC when it detects the plug insertion to USB3 port. USB1 port of FW05 is capable of controlling USB Type−C and Quick Charge 3.0 and BC1.2. It can be dual-role, source or sink. The CC1x and CC2x pins will detect the connection and the role. When the role is a sink, the USB1+/− pins will detect source capacity according to BC1.2, Divided mode or Type−C current. When the role is a source, it behaves as Quick Charge 3.0 HVDCP. In the Type−C port Buck charge with Dead battery and Electronically marked cable are supported. P+ P− TEST1 Type−C Sink/Source, Type−A Source, Quick Charge 3.0 HVDCP, USB detection, Smart switch, Boost auto start-up, External Boost−IC. GND Writing tool TEST2 Figure 3. Connection Example to Write Software USB Support Appropriate software enables various functions of USB ports. ON Semiconductor provides some software as reference. It is active to download them from the homepage of ON Semiconductor. The explanation about the functions of two Reference software are as follows. They are distinguished by the type name which is FW02 and FW05. • FW02: Micro−B Sink, Type−A Source × 2-ch, Quick Charge 3.0 HVDCP, USB detection, Smart switch, Boost auto start-up, External Boost−IC. Power Bank Application Figure 7 and 8 show typical Power Bank application with FW02 and FW05 each. • Buck charge mode: Built-in battery charging via USB. • Boost charge mode: Charging the device from built-in battery via USB. Table 1. REFERENCE SOFTWARE VS USB FUNCTIONS Reference software FW02 FW05 Buck Charge Boost Charge Quick Charge 3.0 HVDCP USB Detection Smart Switch Boost Auto Start-up External Boost−IC USB Port USB Type D+/− Pins USB1 Micro-B USB1+ USB1− n − − n − − − USB2 Type-A USB2+ USB2− − n n − − n − USB3 Type-A USB3+ USB3− − n − − n n n USB1 Type-C USB1+ USB1− n n n (Source Mode) n (Sink Mode) − n (Note 3) − USB3 Type-A USB3+ USB3− − n − − n n n 3. Communication channel detects the Sink connection. www.onsemi.com 8 LC709511F USB2 Type−A(1) D+ D− USB1+ USB1− USB2+ USB2− VBUS VBUS1 LC709511F VBUS2 Buck charge Battery in Power bank Boost−IC VBUS USB3 Type−A(2) D+ D− VBUS Power sink USB3+ USB3− BSTEN Boost charge D+ D− Power sink Power source USB1 Micro−B Figure 4. The Function of FW02 Power source USB1 Type−C CC1 CC2 D+ D− CC1A CC2A USB1+ USB1− VBUS VBUS1 LC709511F USB3+ USB3− BSTEN USB3 Type−A(2) Buck charge Boost−IC D+ D− VBUS Power sink Battery in Power bank Figure 5. The Function of FW05 (USB1 Port is Sink) Power sink USB1 Type−C CC1 CC2 D+ D− CC1A CC2A USB1+ USB1− VBUS VBUS1 LC709511F USB3+ USB3− BSTEN USB3 Type−A(2) Boost charge Boost−IC D+ D− VBUS Figure 6. The Function of FW05 (USB1 Port is Source) www.onsemi.com 9 Power sink Battery in Power bank LC709511F Micro−B (Sink: BC1.2) + Type−A (1) (Source: Quick Charge 3.0 HVDCP) + Type−A (2) (Source: DCP and Divided Mode) REG33 TEST1 TEST2 XT1 XT2 BATSEL GND IBTSEL SENV1+ CC1A CC2A DD+ VBUS USB1USB1+ VBUS1 USB1 Micro-B (BC1.2) Adaptor USB2 Type-A (1) (Quick Charge 3.0) USB DEVICE GND DD+ VBUS SENV2+ SENVUSB2USB2+ VBUS2 VB2DET USB3 Type-A (2) (DCP,Divided) SENV3+ USB DEVICE GND DD+ LED1 LED2 LED3 LED4 FGADJ PBT DVDD REGP TEST3 TSW TSENSE VBAT P+ DVSS1 DVSS2 AVSSP AVSSS SENB+ USB3-/CC1B USB3+/CC2B SENB- VBUS 2ND Boost IC VB3DET VOUT EN ISEN ICHSEL/BSTEN GATE1 GATE2 GATE3 VCC_REG VCC COMPU LDRV HDRV REGN Figure 7. Power Bank Application (Reference Software: FW02) www.onsemi.com 10 PLiB protection LC709511F Type−C (Sink:BC1.2, Source:Quick Charge 3.0 HVDCP) + Type−A (Source: DCP and Divided mode) REG33 TEST1 TEST2 XT1 XT2 BATSEL LED1 LED2 LED3 LED4 FGADJ PBT IBTSEL USB1 Type-C (Dual role,QC) GND Adaptor or USB DEVICE DD+ CC1 CC2 VBUS USB3 Type-A (2) (DCP,Divided) SENV1+ SENVUSB1USB1+ CC1A CC2A VBUS1 USB2USB2+ SENV3+ USB DEVICE GND DD+ VBUS USB3-/CC1B USB3+/CC2B VBUS2 DVDD REGP TEST3 TSW TSENSE VBAT P+ DVSS1 DVSS2 AVSSP AVSSS SENB+ VB3DET SENV2+ 2ND Boost IC VOUT EN SENB- VB2DET ICHSEL/BSTEN GATE1 GATE2 ISEN COMPU GATE3 VCC_REG LDRV HDRV VCC REGN Figure 8. Power Bank Application (Reference Software: FW05) www.onsemi.com 11 PLiB protection LC709511F MODE TRANSITION In Unattached.SRC if Rd or Ra is detected on CC1 or CC2 port, it transits into AttachWait.SRC. In AttachWait.SRC if VBUS1 voltage is lower than VSAFE0V, it checks CC1 and CC2 status and transits according to Table 3. When Ra is connected to CC1 or CC2, the other open port keeps toggling. When it becomes to Attached.SRC, it will start Boost charge. In Attached.SRC Rp current becomes to the set value by Software configuration. Refer to Table 11. This device is set to a Low power mode to minimize power consumption when no USB device is connected. If the connection is detected, it transitions into Operating mode. FW02 In Figure 9: FW02 state diagram, when the VBUS1 rise (input) is detected and VBUS1 voltage exceeds the VBDET, it transitions from Low power mode to Operating mode. Buck charge is started when VBUS1 voltage exceeds the VBUVP. If the input plug is removed, it will transition into the Low power mode again. During the Low power mode, if the output plug insertion is detected or the push button is pressed long, it transitions into the Operating mode to start 5 V Boost charge. If the detected port is USB2, at first 5 V is applied to VCC, then it opens GATE2. USB2 port will start as Quick Charge 3.0 HVDCP. 9 V or 12 V or Continuous mode request is received from the portable device, the Boost voltage will automatically change according to the request. If USB3 with External Boost−IC is connected, BSTEN is set to “HIGH” to output 5 V. Boost charge will stop under following conditions of: a) Plug for the output is removed, b) Output current to the connected portable device falls under IBTERM, c) Built-in battery voltage is judged as low, or d) Input plug is connected. If all Boost charge stops and input plug doesn’t be connected, this device will transition into the Low power mode. If both the output−plugs and the input plug are connected, it will transition into Buck charge. Refer to Table 2. Table 2. CONNECTED DEVICE VS CHARGE MODES FW02 Connected Device USB1 Micro−B USB2 Type−A USB3 Type−A Charge Mode Source − − Buck Charge Source Sink − Source − Sink Source Sink Sink − Sink − Boost USB2 − − Sink Boost USB3 − Sink Sink Boost USB2 & USB3 FW05 Connected Device FW05 In Figure 10: FW05 state diagram. Low power mode will transition into the Operating mode under following conditions of: a) CC1 or CC2 ports detect a device is attached, or b) VBUS1 voltage exceeds the VBUVP, or c) Connection to USB3 port is detected by VB3DET, or d) Push button is pressed for long. If this device detects VBUS1 rising or Attached.SNK of USB1 port, it will start Buck Charge. If it detects Attached.SRC of USB1 port or connection to USB3 port, it will start Boost charge. Boost charge can be performed for USB1 and USB3 ports at the same time. If all Boost charge stops and CC ports are Unattached, it will transition into the Low power mode again. Figure 11 shows detailed Type−C port state diagram. When CC ports are in Unattached state, it alternates between Unattached.SRC and Unattached.SNK. It outputs Rp in the Unattached.SRC, and outputs Rd in the Unattached.SNK. The Rp current in Unattaced.SRC and AttachWait.SRC is fixed to the value for default USB. In Unattached.SNK If Rp is detected on CC1 or CC2, it transits into AttachWait.SNK. In addition when VBUS1 voltage exceeds VBUVP, it will transit into Attached.SNK and start Buck charge. USB1 Type−C USB3 Type−A Charge Mode Source − Buck Charge Source Sink Sink − Boost USB1 − Sink Boost USB2 Sink Sink Boost USB1 & USB3 Charge Mode Table 3. CC STATUS TO JUDGE SINK CC1 CC2 State Open Open Nothing Attached Rd Open Enter Attached.SRC Open Rd Open Ra Ra Open Attached CC: Keep AttachWait.SRC Unattached CC: Keep toggling Rd Ra Enter Attached.SRC Ra Rd Rd Rd Ra Ra www.onsemi.com 12 Keep AttachWait.SRC LC709511F All Boost charge is stopped Low power mode VBUS1 is removed PBT is long pressed or Output plug is connected VBUS1 rising is detected Operating mode Displays battery level & USB detection ↓ Buck charge VBUS1 rising is detected 5V mode 9V mode 12V mode Continuous mode Error is detected or Battery current < ITERM Stop Buck charge Displays battery level ↓ 5V Boost charge ↓ HVDCP PBT is long pressed or Output plug is connected Plug is removed or IOUT VBDET TSBUCK TLDELAY TBKF_L TLDELAY TBKF_H VBUS1 LED1 LED2 LED3 LED4 Figure 19. LED Display Timing Chart at Buck Charge Start (Battery Level: 51−75%) TLBOT TLSTA TBTF_H TBTF_L PBT LED1 LED2 LED3 LED4 Figure 20. LED Display Timing Chart at Boost Charge Start by a Long-press www.onsemi.com 20 LC709511F TSENSE > THOT TSENSE LED1 LED2 TSENSE < TCOLD TTSDET TFLS2_L TFLS3_H LED3 LED4 TFLS_INT Figure 21. LED Display Timing Chart when Over Temperature is Detected in Buck Charge TSENSE > THOT2 TSENSE LED1 LED2 TSENSE < TCOLD2 TTSDET TFLS2_L TFLS3_H LED3 LED4 TFLS_INT Figure 22. LED Display Timing Chart when Over Temperature is Detected in Boost Charge Thermistor > THD Thermistor LED1 LED2 TTSDET TFLS2_L TFLS3_H LED3 LED4 TFLS_INT Figure 23. LED Display Timing Chart when Thermal Shutdown Occurs www.onsemi.com 21 LC709511F Disconnect TSENSE LED1 TTSDET LED2 TFLS2_L TFLS3_H LED3 LED4 TFLS_INT Figure 24. LED Display Timing Chart when the Disconnection of Thermistor is Detected BOOST EFFICIENCY Appropriate components of the converter for the maximum boost and buck charge power can be selected. Table 10 shows an example of components for High power. Figures 25, 26 and 27 show the Boost Efficiency of the evaluation board using these components. Refer to an application note for the detail of the evaluation board and the result of the other components. Table 10. COMPONENTS EXAMPLE AROUND CONVERTER Inductor L PWM Freq. Switching FET Panasonic 4.6 mH 150 kHz ECH8310 x 2 NTTFS4H05N x 2 Figure 26. Boost Efficiency (VOUT = 9 V) Figure 27. Boost Efficiency (VOUT = 12 V) Figure 25. Boost Efficiency (VOUT = 5 V) www.onsemi.com 22 LC709511F ADJUSTABLE PARAMETERS Port configuration follow to the default value of Software configuration. This device can adjust the parameters with Port configuration or Software configuration. Adjustable parameters with Port configuration are limited. Software configuration can adjust more parameters than Port configuration. Software Configuration Software configuration changes the Reference software to adjust parameters. Refer to Table 13 about adjustable parameters. When Software configuration is implemented, FGADJ port resistor for Port configuration is invalid. Please contact ON Semiconductor about how to use Software configuration. Port Configuration Port configuration can adjust parameters according to the resistance that is connected to FGADJ port. Refer to Table 11 and Table 12. The parameters which can’t set in Table 11. PORT CONFIGURATION Parameter Symbol Unit Parameter Range Design Capacity DC mAh 2000−24400 Constant Charge Current ICHG mA 2000−6000 Pre−charge Current IPRE mA 200−500 Pre−charge current is equal to 0.07C current of set Design capacity. If the current exceeds the range, the lower or upper value is set. (ex. Design capacity = 4,000 mAh −> Pre-charge current = 280 mA, Design capacity = 2,000 mAh −> Pre-charge current = 200 mA) Termination Current ITERM mA 200−800 Termination current is equal to 0.05C current of set Design capacity. If the current exceeds the range, the lower or upper value is set. (ex. Design capacity = 4,000 mAh −> Termination current = 200 mA, Design capacity = 20,000 mAh −> Termination current = 800 mA) NOTE: Description Sets the Design capacity of battery. It follows the resistance of connected resistor to the FGADJ port. Refer to Table 12. It is used for Battery level gauging. Constant charge current is equal to 1C current of set Design capacity. If the current exceeds the range, the lower or upper value is set. (ex. Design capacity = 4,000 mAh −> Constant charge current = 4,000 mA, Design capacity = 10,000 mAh −> Constant charge current = 6,000 mA) Reference software operates this IC according to the values set in this table. There are typical values. Table 12. FGADJ PORT RESISTOR VS DESIGN CAPACITY IN PORT CONFIGURATION Resistance (kW) Design Capacity (mAh) Resistance (kW) Design Capacity (mAh) Resistance (kW) Design Capacity (mAh) Resistance (kW) Design Capacity (mAh) 4.7 2000 18 4100 68 8600 270 17800 5.6 2200 22 4600 82 9500 330 19800 6.8 2400 27 5100 100 10600 390 22000 8.2 2700 33 5600 120 11700 470 24400 10 3000 39 6300 150 13000 − − 12 3300 47 6900 180 14500 − − 15 3700 56 7700 220 16100 − − NOTE: The tolerance level of the resistor should be less than 1%. www.onsemi.com 23 LC709511F Table 13. SOFTWARE CONFIGURATION Symbol Pin Unit Parameter Range Default Value Design capacity DC − mAh 2000−24400 9600 Pre−charge current IPRE mA 200−500 400 Constant charge current ICHG SENB+ SENB− 1000−6000 3000 Termination current ITERM 200−800 288 Termination Battery Voltage VCHG VBAT mV 4200 or 4350 4200 Continuous battery charging time TCMAX − min 120−1440 900 Hot temperature to stop Buck charge THOT − 0.1K 2732−3532 > TWARM 3332 (60_C) Parameter Buck Charge Conditions (Note 4) Boost Charge Conditions (Note 4) Protection (Note 4) Description Battery capacity range Set 4.2 V or 4.35 V. It selects Termination battery voltage and battery profile to gauge battery level. Warm temperature to weak Buck charge TWARM 2732−3532 > TCOOL 3182 (45_C) Cool temperature to weak Buck charge TCOOL 2732−3532 > TCOLD 2832 (10_C) Cold temperature to stop Buck charge TCOLD 2732−3532 2732 (0_C) Boost termination current IBTERM SENV1+ SENV2+ SENV3+ SENV− mA 30−1000 200 Hot temperature to stop Boost charge THOT2 − 0.1K 2532−3532 > TCOLD2 3332 (60_C) Cold temperature to stop Boost charge TCOLD2 2532−3532 2532 (−20_C) Buck VBUS under voltage threshold VBUVP VBUS1 4400−4600 4400 USB1 Buck VBUS over voltage threshold VBOVP VBUS1 5250−6500 5600 USB1 Boost VBUS under voltage threshold VBUVP VBUS1 VB2DET 4400−4750 4400 USB1 USB2 VB3DET 4400−4750 4400 USB3 For External Boost IC VBUS1 VB2DET 5200−5600 5600 5 V mode 9800−13500 10200 9 V mode 13100−1350 0 13500 12 V mode 13100−1350 0 13500 Continuous mode 5200−5600 5600 USB3 For External Boost IC Boost VBUS over voltage threshold VBOVP mV VB3DET Boost over current threshold IOUTOCP SENV1+ SENV2+ SENV− mA SENV3+ SENV− www.onsemi.com 24 1500−3000 3000 Vout ≤ 7.5 V 1500−3000 2300 7.5 V < Vout ≤ 10.5 V 1500−2500 1800 10.5 V < Vout 1500−3000 2400 USB3 For External Boost IC LC709511F Table 13. SOFTWARE CONFIGURATION (continued) Parameter Symbol Pin Unit Parameter Range Default Value CB − K 2600−4700 3300 Description Thermistor (Note x4) Constant B Smart DCP Divided Mode (Note 5) USB3+/− initial voltage VD_27 VD_20 USB3+ USB3− − 0 or 1 or 2 2 Initial USB3+/− voltage after connection 0: 2.7 V/2.0 V for 2.1 A 1: 2.0 V/2.7 V for 1 A 2: 2.7 V/2.7 V for 2.4 A Type−C (Note 5) CC1A and CC2A current source in Attached.SRC Rp_80 Rp_180 Rp_330 CC1A CC2A − 1 or 2 or 3 3 1: Rp for default (80 mA) 2: Rp for 1.5 A (180 mA) 3: Rp for 3 A (330 mA) 4. Reference software operates this IC according to the values set in this table. There are typical values. 5. Refer to the Electrical Characteristics table. www.onsemi.com 25 Set the B−constant of NTC thermistor. Refer to the specification of thermistor to fix the value. LC709511F BILL OF MATERIAL REG33 TEST1 C27 TEST2 XT1 XT2 BATSEL IBTSEL CC1A CC2A USB1 Micro-B (BC1.2) R45 LED1 LED2 LED3 LED4 R46 R47 R48 R18 FGADJ PBT R22 C39 DVDD C35 Adaptor GND SENV1+ DD+ VBUS USB1USB1+ VBUS1 R11 D1 REGP C19 TEST3 C26 C17 USB2 Type-A (1) (Quick Charge 3.0) R24 C37 USB DEVICE GND R59 DD+ VBUS SENV2+ SENVUSB2USB2+ VBUS2 TSW TSENSE VBAT R29 DVSS1 DVSS2 AVSSP AVSSS C32 VB2DET R42 R25 USB DEVICE GND DD+ VBUS R61 T1 P- R31 SENB+ SENB- SENV3+ S2 R34 R36 USB3-/CC1B USB3+/CC2B VB3DET C29 S2 C30 S1 R35 R10 LDRV HDRV GATE3 VCC_REG VCC EN IC2 R27 COMPU GATE1 GATE2 R44 R57 R37 CS VCC TST VSS REGN IC3 IC1 R6 C20 Q5 L4 Q4 R3 C21 Q2 C1-6 R1 R2 C12 C11 R5 L1 L3 C10 D2 Q1 C23 ISEN ICHSEL/BSTEN C16 CS VCC TST VSS R56 2ND Boost IC S1 R30 C31 C38 R43 VOUT R32 P+ R41 C15 USB3 Type-A (2) (DCP,Divided) R28 Q7 Q6 C9 R55 R54 R4 C22 Figure 28. Reference Software: FW02 Parts Example www.onsemi.com 26 C7,8 C24 LC709511F USB Type−C LC709511F VBUS VBUS VBUS1 CC1 CC1 CC1A CC2 CC2 C40 CC2A C41 SENV1+ SENV− GND R58 IC1 Figure 29. Reference Software: FW05 Parts Example around CC Table 14. BILL OF MATERIALS Designator Description Value Tolerance Manufacturer Manufacturer Part Number IC1 Charge control LSI − − ON Semiconductor LC709511F IC2, 3 Lib Protection − − ON Semiconductor LC06111TMT Q6, 7 Nch FET − − ON Semiconductor NTTFS4H05N Q1, 2, 4, 5 Pch FET − − ON Semiconductor ECH8310 D1 Schottky diode (Note 6) − − ON Semiconductor BAT54CL D2 Schottky diode (Note 6) − − ON Semiconductor BAT54AL L1 INDUCTOR COIL 4.6 mH − Panasonic ETQP6F4R6HFA L3, 4 Ferrite Bead 30 W − MURATA BLM21PG300SN1 T1 NTC Thermistor 10 kW SEMITEC 103JT−025 C21, 22 Ceramic Capacitor 16 V 1 pF C40, 41 Ceramic Capacitor 10 V 390 pF C39 Ceramic Capacitor 10 V 1000 pF C29 Ceramic Capacitor 16 V 1000 pF C30 Ceramic Capacitor 16 V 22000 pF C36−38 Ceramic Capacitor 10 V 0.01 mF C23, 24, 31 Ceramic Capacitor 10 V 0.1 mF C10,12, 15, 16 Ceramic Capacitor 16 V 0.1 mF C19, 26, 27, 32, 35, 42 Ceramic Capacitor 10 V 1 mF − C17, 20 Ceramic Capacitor 16 V 1 mF − C1−6, 9, 11 Ceramic Capacitor 16 V 22 mF MURATA GRM32EB31C226ME16 C7, 8 Ceramic Capacitor 10 V 47 mF MURATA GRM32ER61C476KE15 R11, 23−25, 28, 30−32 Chip resistor 100 W +5% R45−48 Chip resistor 330 W +5% R36, 37 Chip resistor 1 kW 5% R27 Chip resistor 2.2 kW +5% R8, 29 Chip resistor 10 kW +5% R22 Chip resistor 51 kW 5% − − www.onsemi.com 27 LC709511F Table 14. BILL OF MATERIALS (continued) Manufacturer Manufacturer Part Number +1% Panasonic ERJ8BWFR010V +1% Panasonic ERJ8BWFR020V Designator Description Value Tolerance R3, 4 Chip resistor 100 kW +5% R1, 2 Chip resistor 150 kW +5% R44 Chip resistor 180 kW +1% R5, 6 Chip resistor 510 kW 5% R41, 43 Chip resistor 910 kW +1% R18 Chip resistor 4.7 kW − 470 kW +1% R54−57 Chip resistor 1 W 10 mW R58, 59, 61 Chip resistor 1 W 20 mW 6. Forward voltage of Schottky diode must be under 0.3 V with 5 mA at 25_C. Caution: This device is made for power applications. Please execute appropriate test and take safety measures on your board. Quick Charge is a trademark of Qualcomm Technologies, Inc., www.onsemi.com 28 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN52 6x6, 0.4P CASE 485BE ISSUE B DATE 23 JUN 2010 1 52 SCALE 2:1 PIN ONE LOCATION ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ L1 DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C EXPOSED Cu TOP VIEW 0.10 C A (A3) DETAIL B 0.10 C L L A B D MOLD CMPD DETAIL B ALTERNATE CONSTRUCTION 0.08 C A1 NOTE 4 SIDE VIEW C D2 DETAIL C DIM A A1 A3 b D D2 E E2 e K L L1 L2 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.15 0.25 6.00 BSC 4.60 4.80 6.00 BSC 4.60 4.80 0.40 BSC 0.30 REF 0.25 0.45 0.00 0.15 0.15 REF GENERIC MARKING DIAGRAM* SEATING PLANE K 14 DETAIL A L2 27 L2 DETAIL C XXXXXXXXX XXXXXXXXX AWLYYWWG 8 PLACES E2 52X XXX = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package L 1 40 52 52X e BOTTOM VIEW b 0.07 C A B 0.05 C NOTE 3 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. SOLDERING FOOTPRINT* 6.40 4.80 52X 0.63 4.80 6.40 0.11 PKG OUTLINE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSIONS: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM TERMINAL TIP 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 0.49 DETAIL D 0.40 PITCH 52X DETAIL D 8 PLACES 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON47515E QFN52, 6x6, 0.4MM PITCH Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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