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LC823433TAK-2H

LC823433TAK-2H

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TQFP128

  • 描述:

    ICAUDIOPROCESSORLSI128TQFP

  • 数据手册
  • 价格&库存
LC823433TAK-2H 数据手册
LC823433TA Audio Processing System LSI for MP3 Record and Playback Devices Overview LC823433TA is an audio processing system for MP3 record and playback devices. It integrates DSP for digital signal processing and analog blocks such as audio ADC, audio DAC, and speaker and headphone amplifier in addition to LCD segment driver. www.onsemi.com Features  32-bit LPDSP32 - SRAM (246 KB)  PM 75 KB (40 KB + 35 KB : ISOLATED)  DMA 170 KB (16 KB + 154 KB:ISOLATED) TQFP128 14x14 / TQFP128L  DMB 1 KB (ISOLATED) ISOLATED area : Power ON/OFF control is available by register. - ROM (264.5 KB)  PM 227.5 KB (ISOLATED)  DMA 34 KB (ISOLATED)  DMB 3 KB (ISOLATED) ISOLATED area : Power ON/OFF control is available by the register. - SIO (Clock Serial IO 2 ch)  SIO0 : Ch0 eSIO (Clock speed = Sysclk/1 (max)) program load and execute is possible using Serial Flash (after internal ROM Boot)  SIO1 : Ch1 SIO (Clock speed = Sysclk/8 (max)) - UART (1 ch) - I2C (1 ch Single Master, Full/Standard) - Plain Timer (2 ch)  Timer0 : w/ Watch Dog Timer  Timer1 : w/o Watch Dog Timer and XT1 operation - Multiple Timer (2 ch) PWM output (1 ch) - RTC (Real Time Clock) Operating voltage is independent of internal core operating voltage. Only RTC power supply can be active during all others inactive (ISOLATED). Continued on next page. ORDERING INFORMATION See detailed ordering and shipping information on page 20 of this data sheet. © Semiconductor Components Industries, LLC, 2017 May 2017 - Rev. 2 1 Publication Order Number : LC823433TA/D LC823433TA Continued from preceding page. - SD card IF (2 ch) (w/o CPRM) eSD/eMMC can be connected.  SD ch0 : program load and execute using eSD/eMMC (after internal ROM Boot) is possible.  SD ch1 : SD card - USB2.0 (480M bps/12M bps) Device IF. built-in PHY - 10 bit A/D converter (3 ch) - GPIO (31 ch) (GPIOs share the terminals with other functions. Refer to the terminal list in detail).  LCD controller, LCD Driver. 18SEG * 8COM, 1/8Duty, 1/4Bias - Internal ROM Boot is possible. - Firmware writing function. The firmware reading from SD ch1 and writing to the following devices:  Serial Flash connected SIO0.  eMMC/eSD connected SD ch0. - JTAG (for debugger)  Audio Functions - Record and Playback  Compression method : MP31 (MPEG1/2/2.5 Layer3). Stereo/Mono compatible.  Sampling frequences : 8 kHz, 11.025 kHz, 12 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, and 48 kHz  Bitrate : 8k bps (*1) to 320k bps (for Decoder-VBR) (*1) Encoder supports only Mono (one channel) for 8k bps. - Adjusting the playback speed  Fast playback : 1.0 times to 2.0 times 10 steps.  Slow playback : 0.5 times to 1.0 times 10 steps. - Multipurpose filter - Audio data automatic transfer function  The audio buffer executes the data transfer between internal SRAM (DMA) and the audio block. Wait cycle(s) is inserted to the LPDSP32 access to the SRAM while the audio buffer accesses to internal SRAM(DMA). - Digital volume, digital mute, BEEP, and level meter  The interrupt generation function at the operation completion (e.g. interrupt at mute completion). - Audio timer  LR clock count and the interrupt generation function. - Flexible PCM audio interface (two interfaces)  Master/Slave Mode Selectable  Data Formats : I2S mode etc. - Sample Rate Converters  0.5 times to 64 times conversion range. - Digital microphone IF (2 ch) Continued on next page. 1 MPEG Layer-3 audio coding technology licensed from Fraunhofer IIS and Thomson. Supply of this product does not convey license nor imply any right to distribute content created with this product in revenue-generating broadcast systems (terrestrial, satellite, cable and/or other distribution channels), streaming applications (via Internet, intranets and/or networks), other content distribution systems (pay-audio or audio-on-demand applications and the like) or on physical media (compact discs, digital versatile discs, semiconductor chips, hard drives, memory cards and the like). Supply of this product does not convey license under the relevant intellectual property of Thomson and/or Fraunhofer Gesellschaft nor imply any right to use this product in any finished end user or ready-to-use final product. An independent license for such use is required. For details, please visit http://mp3licensing.com/. www.onsemi.com 2 LC823433TA Continued from preceding page.  Analog function - Microphone amplifier 0 / 18 / 24 / 30 dB (2 ch) - PGA with ALC 12 dB to 35.25 dB in 0.75 dB steps (2 ch) - 16-bit ΔΣADC (2 ch) - Digital filter for 16-bits ΔΣDAC (2 ch) - AB class amplifier The power supply only to AB class amplifier is possible (ISOLATED). Thermal shutdown circuit built-in  Speaker amplifier (1 ch BTL) 1dB to 4.5 dB in 0.5 dB steps Maximum output 300 mW @3.0 V, Speaker = 8[], 1 dB  Headphone amplifier (2 ch) 0 dB to 3 dB in 1 dB steps (Only same gain setting to 2 ch is possible) Maximum output 5 mW @3.0 V, HeadPhone = 16[], Rd (Series) = 33[], 1 dB  Clock - RCOSC : Internal RC oscillation. 1 MHz (TYP) - XT1 : Main XTAL. 32.768 kHz. Used as an original oscillation of the system clock and the audio clock, and a RTC clock. - XT2 : Optional XTAL. 12 MHz (TYP) etc. - PLL1 : For system clock generation (LPDSP32 is included). - PLL2 : For audio clock generation Specification  Supply voltage : 1.3 V (core, etc), 3.15 V (Audio, USB, etc)  Maximum operation frequency : 42 MHz (DSP@1.3 V)  Package : 128 pin TQFP Application  IC Recorder, Audio Player  Radio Recorder, Home Audio (Mini compo) www.onsemi.com 3 LC823433TA Specifications Absolute Maximum Ratings at VSS = 0 V Parameter Supply voltage Symbol Domain of applicability Ratings Unit Input voltage VDD1 VDDRTC AVDDPLL1 AVDDPHY1 VDD2 VDDLCD AVDDPLL2 AVDDADC AVDDAADC AVDDADAC AVDDSPAMP AVDDPHY2 VI 0.3 to *VDD*+0.3 (Max 3.96) V Operating temperature Topr 20 to +75 C Storage temperature Tstg 55 to +125 C 0.3 to +1.8 V 0.3 to +3.96 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Recommended Operating Conditions at Ta = 20C to +75C Parameter Supply voltage Symbol Test Conditions VDD1 typ max Unit 1.15 1.3 1.65 V 0.9 1.5 1.65 V 1.15 1.3 1.65 V VDD2 2.7 3.15 3.3 V VDDLCD 2.7 3.15 3.3 V AVDDPLL2 2.7 3.15 3.3 V AVDDADC 2.7 3.15 3.3 V AVDDAADC 2.7 2.8 3.3 V VDDRTC AVDDPLL1 Input voltage min AVDDADAC 2.7 2.8 3.3 V AVDDSPAMP 1.8 3.15 3.8 V AVDDPHY1 1.35 1.5 1.65 V AVDDPHY2 3.0 3.15 3.6 V 0 *VDD* V 0 3.6 V 0 3.3 V VIN VIN3 (RTC) VIN_ADC (AN0-AN2). I_AN  300 A Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 4 LC823433TA DC Characteristics at Ta = 20C to +75C, VDD1 = 1.15 V to 1.65 V, VDD2 = 2.7 V to 3.3 V, VDDRTC = 0.9 V to 1.65 V Parameter Input high voltage Symbol VIH Application Test Conditions 3IS, 3ISUD Input low voltage VIL typ Unit V 0.75  VDD2 V 0.7  VDDRTC 0.7  VDDRTC V Schmitt V 3ICUD 3IS, 3ISUD max Schmitt 1IC 1IS min 0.7  VDD2 3ICUD Schmitt 1IC 1IS Schmitt 0.3  VDD2 V 0.25  VDD2 0.2  VDDRTC V 0.2  VDDRTC V 10 A V Input high leakage current IIH 3ICUD, 3IS, 3ISUD 1IC, 1IS VIN = VDD2 Input low leakage current IIL 3IS, 3ISUD VIN = VSS 1IC, 1IS Output high voltage VOH 3T2 VIN = VSSRTC IOH = 2 mA VDD20.4 V 3T4 IOH = 4 mA VDD20.4 V 3T4(8) VDD20.4 V VDD20.4 V 3T2 IOH = 4 mA (IOH = 8 mA) IOH = 6 mA (IOH = 12 mA) IOL = 2 mA 3T4 IOL = 4 mA 3T4(8) IOL = 4 mA (IOL = 8 mA) IOL = 6 mA (IOL = 12 mA) IOL = 0.3 mA 3T6(12) Output low voltage VOL 3T6(12) OD3 Output leakage current IOZ Pull-up resistor Rup Pull-down resistor Rdn VIN = 3.3V 3T2, 3T4, 3T4(8), 3T6(12) 3ICUD, 3ISUD 3ICUD, 3ISUD When it outputs Hi-Z 10 A 10 A 10 A 10 0.4 V 0.4 V 0.4 V 0.4 V 0.3 V 10 A 30 80 190 kΩ 30 80 190 kΩ Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 5 LC823433TA Package Dimensions unit : mm TQFP128 14x14 / TQFP128L CASE 932BA ISSUE A GENERIC MARKING DIAGRAM* XXXXXXXXXXX XXXXXXXXXXX AWLYYWWG A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package *This information is generic. Please refer to device data sheet for actual part marking. www.onsemi.com 6 LC823433TA Pin Assignment (Bonding Option) Direction I Input pin O Output pin B P Attribute 3IS 3 V Schmitt input 1IS 3ICUD 3 V CMOS input pull-up/down 1IC Bidirectional pin 3ISUD 3 V Schmitt input pull-up/down OD3 Power supply pin 3T2 3 V 2 mA tristate output 3T4 3 V 4 mA tristate output X Oscillation amplifier Tristate output with 3 V 4 mA / 8 mA switch function Tristate output with 3 V 6 mA / 12 mA switch function 3A 3 V analog through 1A 1 V analog through 3T4(8) 3T6(12) TQFP128L Pin No. Name Direction 1 AVSSSPAMP P 2 AVDDSPAMP P 1 V Schmitt input (3 V tolerant correspondence) 1 V CMOS input (3 V tolerant correspondence) 1 V 0.3 mA open drain output (3 V tolerant correspondence) Attribute 3 AVREFSP O 3A 4 HPINL/SPKINM I 3A 5 HPINR I 3A 6 AVSSADAC P 7 OUTMR O 3A 8 OUTML/OUTM O 3A 9 AVDDADAC P 10 AVSSAADC P 11 AVREF O 12 AVDDAADC P 3A 13 AINL I 3A 14 AINR I 3A 15 AVDDADC P 16 AN0 I 3A 17 AN1 I 3A 18 AN2 I 3A 19 VSS P 20 VDD2 P 21 VDD1 P 22 TIOCA0/P10 B/B 3ISUD/3T2 23 BMODE0 I 3IS 24 BMODE1 I 3IS 25 BMODE2 I 3IS 26 NRES I 3IS 27 SDCLK1/MCLK1/P00 O/B/B 3ISUD/3T6(12) 28 SDCMD1/LRCK1/P02 B/O/B 3ISUD/3T4(8) 29 SDAT10/BCK1/P03 B/B/B 3ISUD/3T4(8) 30 SDAT11/DIN1/P04 B/I/B 3ICUD/3T4(8) 31 SDAT12/DOUT1/P05 B/O/B 3ICUD/3T4(8) 32 SDAT13/SDO1/P06 B/O/B 3ICUD/3T4(8) 33 SDWP1/SDI1/P01 I/I/B 3ISUD/3T2 34 SDCD1/SCK1/P0A I/B/B 3ISUD/3T2 35 SDCLK0/P14 O/B 3ICUD/3T6(12) 36 VDD2 P 37 VSS P 38 SDCMD0/P15 B/B 3ICUD/3T4(8) Continued on next page. www.onsemi.com 7 LC823433TA Continued from preceding page. TQFP128L Name Pin No. Direction Attribute 39 SDAT03/P16 B/B 3ICUD/3T4(8) 40 SDAT02/P17/SYSCLK B/B/O 3ICUD/3T4(8) 41 SDAT01/P18/AUD0CLK B/B/O 3ICUD/3T4(8) 3ICUD/3T4(8) 42 SDAT00/P19/AUD1CLK B/B/O 43 VSS P 44 XIN2 I X X 45 XOUT2 O 46 AVDDPHY1(+VDD1) P 47 AVSSPHY1 P 48 AVSSPHY1 P 49 RREF B 50 AVSSPHY2 P 51 AVDDPHY2 P 52 AVDDPHY2 P 53 AVSSPHY2 P 54 AVSSPHY2 P 55 AVSSPHY2 P 56 AVDDPHY2 P 57 DP B 3A 3A 3A 58 DM B 59 AVSSPHY2 P 60 AVDDPHY2 P 61 COM0 O 3A 62 COM1 O 3A 63 COM2 O 3A 3A 64 COM3 O 65 VDDLCD P 66 VLCD1 O 3A 67 VLCD2 O 3A 68 VLCD3 O 3A 69 VSS P 70 VDD1 P 71 SEG0 O 3A 72 SEG1 O 3A 73 SEG2 O 3A 74 SEG3 O 3A 75 SEG4 O 3A 76 SEG5 O 3A 77 SEG6 O 3A 78 SEG7 O 3A 79 SEG8 O 3A 80 SEG9 O 3A 81 SEG10 O 3A 82 SEG11 O 3A 83 SEG12 O 3A 84 SEG13 O 3A 85 SEG14 O 3A 86 SEG15 O 3A 87 SEG16 O 3A 88 SEG17 O 3A 89 COM4 O 3A 90 COM5 O 3A Continued on next page. www.onsemi.com 8 LC823433TA Continued from preceding page. TQFP128L Name Pin No. Direction Attribute 91 COM6 O 92 COM7 O 3A 93 HPDET/SDI1/SCL/P1A I/I/O/B 3ISUD/3T2 94 HPMUTE/SDO1/SDA/P1B O/O/B/B 3ISUD/3T2 95 JTDO/P1C O/B 3ICUD/3T2 96 JTDI/P1D I/B 3ICUD/3T2 97 JTMS/P1E I/B 3ICUD/3T2 98 JTCK/P1F I/B 3ICUD/3T2 99 VDD1 P 100 VDD2 P SFMODE (Internal Signal) I 101 3A 3IS 102 VSS TXD/SCL/P12 O/O/B P 3ISUD/3T2 103 RXD/SDA/P13 I/B/B 3ISUD/3T2 104 SCK0/P07 B/B 3ISUD/3T4 105 SDO0/P08 O/B 3ISUD/3T4 106 SDI0/P09 I/B 3ISUD/3T2 107 MCLK0/DMCKO/SCK1/P0B B/O/B/B 3ISUD/3T2 108 DIN0/DMDIN/P0F I/I/B 3ISUD/3T2 109 DOUT0/P0E/NCS O/B/O 3ISUD/3T2 110 KEYINT1 I 1IS 111 KEYINT0 I 1IS 112 RTCRSTB I 1IC 113 PWRON O OD3 114 LINEFIXB I 1IS 115 XOUT32K O X X 116 XIN32K I 117 VDDRTC P RTCMODE (Internal Signal) I 118 VSSRTC P 119 AVDDPLL1 P 120 VCNT1 O 121 VSS P 122 AVDDPLL2 P 123 VCNT2 O 124 AVSSPLL2 P 125 HPOUTR O 3A 126 HPOUTL O 3A 127 SPOUTP O 3A 128 SPOUTN O 3A 1IS 1A 3A www.onsemi.com 9 LC823433TA Block Diagram JTAG RCOSC OSCCON System Clock (System) XT1 PLL1 Peripheral1 Clock Peripheral2 Clock System Clock DMA DMB OSCCON FUNCCLK0 (FUNC) FUNCCLK1 XT1 XT2 System Clock XT2 PLL2 BCK0, BCK1 Audio Clock1 DMIO 32 DMB OSCCON Audio Clock0 (Audio) XT1 64 PDM DMA ISOLATED Dig MIC SRAM (154KB) + (16KB) PGA(ALC) MIC 0/18/24/30dB -12 to 35.25dB 0/18/24/30dB Plain Timer0 64 -12 to 35.25dB Plain Timer1 FUNCCLK1 MUX DF + ALC P/S Audio Buffer 16bit D/A (2ch/BTL) PWM “Lch” or “+” “Rch” LPF AVDDADAC ISOLATED “+” “-” AUDIO functions (SRC, VOLUME, etc) LPF Speaker ISOLATED ISOLATED 16bit A/D PCM0 OUT ROM (227.5KB) PGA(ALC) MIC AMP AVDDAADC SRAM (35KB) + (40KB) ROM (34KB) 16bit A/D MIC PM ISOLATED S/P MIC AMP 40 ISOLATED Arbiter Digital MIC IF PRG SRAM (1KB) ROM (3KB) MCLK0, MCLK1 PCM0 IN 32 IRQ 15ch (Write To, Read From DMA) Multiple Timer 1 eSIO (SIO0) SIO S-Flash Boot Ch0 etc UART “Lch” 0 to 3dB(Lch, Rch common) PCM1 OUT 10bit A/D Peripheral2 “Rch” AVDDSPAMP VDDRTC Peripheral0 VDD1 VDD2 AVDDADC VDDLCD AVDDPLL1 AVDDPLL2 Logic I/O 10bit A/D LCDCTL PLL1 PLL2 18seg × 8com or 36seg × 4com(TBD) LCD eMMC/eSD Boot Ch0 eSD eMMC Ch1 SD I/F Firmware DL etc USB2.0 HS Device ISOLATED 3 LCD CTL FUNCCLK1 S/P Boot monitor etc GPIO P/S PCM1 IN USB2.0 PHY XT2 or XT2/2 RTC LCD I2C 1 to 4.5dB HeadPhone PWM SIO Ch1 eSIO (SIO1) Peripheral1 XT2 ON Semiconductor Sanyo 32bit32bit DSP DSP LPDSP32 LPDSP32 Peripheral0 Clock XT2 AVDDPHY2 AVDDPHY1 XT1 32.768kHz Note - Refer to the pin assignment for port share - ISOLATED SRAMs and ROMs described in this figure can be power off by a register, in addition to the tiny SRAMs (not described in this figure) in the SD I/F, USB2.0, SRC, 16bit D/A, DF. www.onsemi.com 10 LC823433TA Pin Functions  JTAG Pin name Pol. Type Description JTDO/ P1C JTDI/ P1D -/ -/ - O/ B I/ B JTAG test data output/ General purpose port JTAG test data input/ General purpose port. The input level of the terminal JTDI is taken by rising edge of the terminal NRES. The value can be read as a register, and can be used as the operation mode setting. JTAG test mode selection/ General purpose port The input level of the terminal JTMS is taken by rising edge of the terminal NRES. The value can be read as a register, and can be used as the operation mode setting. JTAG test clock/ General purpose port JTMS/ P1E -/ - JTCK/ P1F Pos/ - I/ B I/ B Num. 1 1 1 1 Total 4  RTC Pin name Pol. Type Description XIN32K Pos I 32.768 kHz oscillation amplifier input (XT1) Num. 1 XOUT32K - O 32.768 kHz oscillation amplifier output (XT1) 1 RTCRSTB Neg I RTC reset input (VDET) Neg I PWRON - O There is an optional bonding as Power supply watch comparison input. Main power supply ON/OFF control (RTCINT) LINEFIXB Neg Neg O I There is an optional bonding as RTC interrupt output. RTC isolator cutting and the connection (BACKUPB) VDDRTC Neg - I P There is an optional bonding as RTC operation mode selection. RTC block power supply. 1 VSSRTC - P RTC ground pin. 1 1 1 1 Total 7 www.onsemi.com 11 LC823433TA  SIO (synchronous serial) interface Ch0 (eSIO)/Timer PWM output/General purpose port Pin name Pol. Type Description Num. SCK0/ Pos/ B/ Serial I/F Ch0 clock/ P07 - B General purpose port 1 (It is possible to use it as an external interrupt input.) SDO0/ -/ O/ Serial I/F Ch0 data output/ P08 - B General purpose port (It is possible to use it as an external interrupt input). 1 There is an optional bonding as serial I/F Ch0 data output (SDO0(SIO0)) -(-) O(B) SDI0/ -/ I/ Serial I/F Ch0 data input/ P09 - B General purpose port (Data I/O 0 when at high speed operating). (It is possible to use it as an external interrupt input). (SDI0(SIO3)) -(-) I(B) There is an optional bonding as serial I/F Ch0 data input TIOCA0/ -/ B/ MTM Ch0 A input capture and output capture/ P10 - B General purpose port - P There is an optional bonding as VSS. 1 (Data I/O 3 when at high speed operating). (VSS) 1 Total 4  UART (asynchronization serial) interface/I2C interface/General purpose port Pin name Pol. Type Description Num. TXD/ SCL/ P12 -/ -/ - O/ O/ B RXD/ SDA/ P13 -/ -/ - I/ B/ B UART transmitted serial data output/ 2 I C clock output (open drain output)/ General purpose port (It is possible to use it as an external interrupt input). UART received serial data input/ 2 I C data (open drain output)/ General purpose port (It is possible to use it as an external interrupt input). 1 1 Total 2  Headphone control/SIO (synchronous serial) interface Ch1 (SDI, SDO)/I2C interface/General purpose port Pin name Pol. Type Description HPDET/ SDI1/ SCL/ P1A Pos/ -/ -/ - I/ I/ O/ B HPMUTE/ SDO1/ SDA/ P1B Pos/ -/ -/ - O/ O/ B/ B Headphone insertion detection/ Serial I/F Ch1 data input/ 2 I C clock output (open drain output)/ General purpose port (It is possible to use it as an external interrupt input). Headphone mute/ Serial I/F Ch1 data output/ 2 I C data (open drain output)/ General purpose port Num. Total 1 1 2 www.onsemi.com 12 LC823433TA  PCM interface Ch0/Digital mic interface/ SIO (synchronous serial) interface Ch1 (SCK)/General purpose port/RTC (KeyInt RTC model) Pin name Pol. Type Description MCLK0/ DMCKO/ SCK1/ P0B Pos/ -/ -/ - B/ O/ B/ B KEYINT1 - I PCM Ch0 master clock/ Digital mic clock output/ Serial I/F Ch1 clock/ General purpose port (It is possible to use it as an external interrupt input). KEY interrupt1 (Notes: Operate in VDDRTC and the VSSRTC power supply). (NHOLD(SIO1)) - O(B) There is an optional bonding as serial I/F Ch0 hold output (Data I/O 1 when at high speed operating). (BCK0/ P0C) KEYINT0 -/ - B/ B I There is an optional bonding as PCM Ch0 bit clock/ General purpose port KEY interrupt0 (Notes: Operate in VDDRTC and the VSSRTC power supply). O(B) There is an optional bonding as serial I/F Ch0 write protect output (Data I/O 2 when high speed operating). (NWP(SIO2)) (LRCK0/ P0D) B/ B DIN0/ DMDIN/ P0F -/ -/ -/ - DOUT0/ P0E/ -/ -/ O/ B/ NCS Neg O Neg O (NCS) I/ I/ B Num. There is an optional bonding as PCM Ch0 LR clock/ General purpose port (It is possible to use it as an external interrupt input). PCM Ch0 data input/ Digital mic data input/ General purpose port (It is possible to use it as an external interrupt input). PCM Ch0 data output/ General purpose port (It is possible to use it as an external interrupt input)/ CS for serial I/F Ch0 (When it boots from internal ROM and the program from SerialFlash connected to serial I/F Ch0 is loaded, it is used as CS control terminal of SerialFlash). 1 1 1 1 1 There is an optional bonding as CS for serial I/F Ch0. Total 5 www.onsemi.com 13 LC823433TA  SD interface Ch0/General purpose port Pin name Pol. Type Description Num. SDCLK0/ P14 SDCMD0/ P15 SDAT03/ P16 SDAT02/ P17/ SYSCLK SDAT01/ P18/ AUD0CLK SDAT00/ P19/ AUD1CLK Pos/ -/ -/ -/ -/ -/ -/ -/ -/ - O/ B B/ B B/ B B/ B/ O B/ B/ O B/ B/ O SD card I/F Ch0 clock output/ General purpose port SD card I/F Ch0 command line/ General purpose port SD card I/F Ch0 data 3/ General purpose port SD card I/F Ch0 data 2/ General purpose port/ System Clock output (for evaluation) SD card I/F Ch0 data 1/ General purpose port/ Audio0 Clock output (for evaluation) SD card I/F Ch0 data 0/ General purpose port/ Audio1 Clock output (for evaluation) 1 1 1 1 1 1 Total 6  SD interface Ch1/PCM interface Ch1/SIO (synchronous serial) interface Ch1/General purpose port Pin name Pol. Type Description SDCLK1/ MCLK1/ P00 SDCMD1/ LRCK1/ P02 SDAT13/ SDO1/ P06 SDAT12/ DOUT1/ P05 SDAT11/ DIN1/ P04 SDAT10/ BCK1/ P03 SDWP1/ SDI1/ P01 Pos/ Pos/ -/ -/ -/ -/ -/ -/ -/ -/ -/ -/ -/ -/ - O/ O/ B B/ B/ B B/ O/ B B/ O/ B B/ I/ B B/ B/ B I/ I/ B SDCD1/ SCK1/ P0A -/ -/ - I/ B/ B SD card I/F Ch1 clock output/ PCM Ch1 master clock/ General purpose port SD card I/F Ch1 command line/ PCM Ch1 LR clock/ General purpose port SD card I/F Ch1 data 3/ Serial I/F Ch1 data output/ General purpose port SD card I/F Ch1 data 2/ PCM Ch1 data output/ General purpose port SD card I/F Ch1 data 1/ PCM Ch1 data input/ General purpose port SD card I/F Ch1 data 0/ PCM Ch1 bit clock/ General purpose port SD card I/F Ch1 write protect/ Serial I/F Ch1 data input/ General purpose port (It is possible to use it as an external interrupt input). SD card I/F Ch1 card detect/ Serial I/F Ch1 clock/ General purpose port (It is possible to use it as an external interrupt input). Num. Total 1 1 1 1 1 1 1 1 8 www.onsemi.com 14 LC823433TA  Oscillation amplifier and PLL Pin name Pol. Type Description Num. XIN2 Pos I Oscillation amplifier input for audio (XT2) 1 XOUT2 - O Oscillation amplifier output for audio (XT2) 1 VCNT1 - O VCO control for PLL1 1 AVDDPLL1 - P Analog power supply for PLL1 1 AVSSPLL1 - P Analog ground for PLL1 1 VCNT2 - O VCO control for PLL2 1 AVDDPLL2 - P Analog power supply for PLL2 1 AVSSPLL2 - P Analog ground for PLL2 1 Total 8  10-bit A/D Pin name Pol. Type Description AN[2:0] - I ADC input Num. 3 AVDDADC - P Power supply for ADC 1 VSS - P Ground for ADC. It connects VSS in LSI (terminal sharing). 1 There is an optional bonding as dedicated ground AVSSADC . (AVSSADC) Total 5  Audio CODEC Pin name Pol. Type Description Num. AINL - I AINR - I Analog voice input Lch (stereo) Analog voice input (monaural). Analog voice input Rch (stereo) AVREF - O Audio ADC reference output 1 AVDDAADC - P Power supply for audio ADC 1 AVSSAADC - P Ground for audio ADC 1 OUTML/ OUTM OUTMR -/ - O/ O O Audio DAC PWM output (Lch for HP)/ Audio DAC PWM output (monaural for speaker) Audio DAC PWM output (Rch for HP) AVDDADAC - P Power supply for audio DAC 1 AVSSADAC - P Ground for audio DAC 1 HPINL/ SPKINM HPINR - I/ I I Headphone amplifier input (Lch) / Speaker amplifier input (monaural) Headphone amplifier input (Rch) SPOUTP - O AB class speaker amplifier output (+) 1 SPOUTN - O AB class speaker amplifier output () 1 HPOUTL - O Headphone amplifier output (Lch) 1 HPOUTR - O Headphone amplifier output (Rch) 1 AVREFSP - O AB class amplifier reference output 1 AVDDSPAMP - P Analog power supply for AB class amplifier 1 AVSSSPAMP - P Analog ground for AB class amplifier 1 Total 1 1 1 1 1 1 18 www.onsemi.com 15 LC823433TA  LCD Driver (4COM/8COM bonding switch) Pin name Pol. Type Description Num. SEG[17:0] - O Segment output for LCD COM[7:4] - O COM [7:4], Common driver output for LCD (when 8COM is used). (SEG[21:18]) - O COM[3:0] - O VLCD1 - O There is an optional bonding as segment outputs, SEG[21:18], for the LCD(when 4COM is used). Common driver output for LCD. •Both 8COM and 4COM ··· COM[3:0]. LCD drive voltage output 1 •When 1/3 bias is used ··· 2 * VDDLCD /3. •When 1/4 bias is used ··· 3 * VDDLCD /4. LCD drive voltage output 2 •When 1/3 bias is used ··· 1 * VDDLCD /3. •When 1/4 bias is used ··· 2 * VDDLCD /4. LCD drive voltage output 3 •When 1/3 bias is used ··· 1 * VDDLCD /3. •When 1/4 bias is used ··· 1 * VDDLCD /4. 3 V power supply for LCD driver 18 4 VLCD2 - VLCD3 - VDDLCD - O O P Total 4 1 1 1 1 30 www.onsemi.com 16 LC823433TA  USB 2.0 HS Device/LCD Driver (bonding switch when 4COM is used) Pin name Pol. Type Description Num. DP - B USB D+ (Device) (SEG32) DM - O B There is an optional bonding as segment output 32 for LCD. USB D (Device) (SEG33) RREF - O B There is an optional bonding as segment output 33 for LCD. Reference resistance for USB PHY. (SEG24) AVDDPHY1 - O P AVSSPHY1 - P There is an optional bonding as segment output 24 for LCD. Analog 1.5 V power supply for USB PHY. It connects VDD1 in LSI (terminal sharing). Analog ground for USB PHY. (SEG22) AVSSPHY1 - O P There is an optional bonding as segment output 22 for LCD. Analog ground for USB PHY. (SEG23) AVDDPHY2 - O P There is an optional bonding as segment output 23 for LCD. Analog 3.3 V power supply for USB PHY. (SEG26) AVDDPHY2 - O P There is an optional bonding as segment output 26 for LCD. Analog 3.3 V power supply for USB PHY. (SEG27) AVDDPHY2 - O P There is an optional bonding as segment output 27 for LCD. Analog 3.3 V power supply for USB PHY. (SEG31) AVDDPHY2 - O P There is an optional bonding as segment output 31 for LCD. Analog 3.3 V power supply for USB PHY. (SEG35) AVSSPHY2 - O P There is an optional bonding as segment output 35 for LCD. Analog ground for USB PHY. (SEG25) AVSSPHY2 - O P There is an optional bonding as segment output 25 for LCD. Analog ground for USB PHY. (SEG28) AVSSPHY2 - O P There is an optional bonding as segment output 28 for LCD. Analog ground for USB PHY. (SEG29) AVSSPHY2 - O P There is an optional bonding as segment output 29 for LCD. Analog ground for USB PHY. (SEG30) AVSSPHY2 - O P There is an optional bonding as segment output 30 for LCD. Analog ground for USB PHY. (SEG34) - O There is an optional bonding as segment output 34 for LCD. 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Total 15 www.onsemi.com 17 LC823433TA  Power supply etc. Pin name Pol. Type Description BMODE[2:0] - I Operation mode selection NRES Neg I External reset and GPIO•LCD driver output force input •When it is active (L input), the state of the GPIO•LCD driver is forced, and LED lighting and the LCD display is controlled until reset depends on LSI. When Low is input : GPIO = Hiz, LCD = Low Fixed (PIOFIXB). •The state of JTDI and JTMS of JTAG is taken into the internal register by rising edge of NRES (for operation mode setting). Digital internal power supply There is one VDD1 which is also connected with AVDDPHY1. Digital IO power supply VDD1 - P VDD2 - P VSS - P Num. Digital ground There is one VSS which is also connected with AVSSADC. 3 1 3 3 4 Total 14 Total 128 Notes : Do not open an unused digital input terminal or a digital bidirectional terminal of input state, and set Pull-up/Pull-down register in ON (only terminals with this function) or connect to digital IO power supply or digital ground. Left open AINL, AINR, HPINL/SPKINM, and HPINR terminals if they are not used (do not fix to L or H). Operational mode Various boot modes etc. can be selected by switching BMODE[2:0] terminal. BMODE2 BMODE1 BMODE0 0 0 0 Internal ROM boot (eMMC Physical Boot - SD interface Ch0) Operational mode 0 0 1 Internal ROM boot (IPL Boot - SD interface Ch0) 0 1 0 Internal ROM boot (Partition Boot - SD interface Ch0) 0 1 1 1 0 0 1 0 1 1 1 0 Internal ROM boot (External Serial Flash Boot - SIO (synchronous serial) interface Ch0) Liberation of the terminal for SD interface Ch0 and SIO Ch0 (SDCLK0, SDCMD0, SDAT03, SDAT02, SDAT01, SDAT00, SCK0, SDO0, SDI0, and DOUT0 (NCS) are output Hiz). Internal ROM boot (Deletion Partition area and IPL user area – SD interface Ch0 and SIO external Serial Flash Ch0) LSI test mode (Do not set to this mode when working actually). 1 1 1 LSI test mode (Do not set to this mode when working actually). www.onsemi.com 18 LC823433TA Pin Type EN EN3 A PAD CTU Y 3ICUD/ 3T2 CTD EN3 = 0: PAD is configured as input & Pull_up OFF, Pull_down OFF, EN3 = 1 normal EN EN3 A PAD CTU 3ISUD/ 3T2 Y 3ISUD/ 3T4 CTD EN3 = 0: PAD is configured as input & Pull_up OFF, Pull_down OFF, EN3 = 1 normal EN3 EN CTI CTU 3ICUD/ 3T4(8) PAD A Y 3ICUD/ 3T6(12) CTD CTI current ability switch terminal 0: 4 mA 1: 8 mA / 0: 6 mA 1: 12 mA EN3 = 0:PAD is configured as input & Pull_up OFF, Pull_down OFF, EN3 = 1 normal EN3 3ISUD/ 3T4(8) 3ISUD/ 3T6(12) EN A PAD CTI CTU Y CTD CTI current ability switch terminal 0: 4 mA 1: 8 mA / 0: 6 mA 1: 12 mA EN3 = 0: PAD is configured as input & Pull_up OFF, Pull_down OFF, EN3 = 1 normal Continued on next page. www.onsemi.com 19 LC823433TA Continued from preceding page. 1IC 1IS PAD Y PAD Y 3IS PAD OD3 EN ORDERING INFORMATION Device LC823433TA-2H Package Shipping (Qty / Packing) TQFP128 14x14 / TQFP128L (Pb-Free / Halogen Free) 450 / Tray JEDEC 2 * I C Bus is a trademark of Philips Corporation. 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