LM1117IMPX-ADJNOPB

800 mA Low-Dropout Linear Regulator LM1117, LM1117I The LM1117 is a low dropout voltage regulator with a dropout of 1.2 V at 800 mA of load current. The LM1117 is available in an adjustable version, which can set the output voltage from 1.25 to 13.8 V with only two external resistors. In addition, it is available in five fixed voltages, 1.8 V, 2.5 V, 3.3 V, and 5 V. The LM1117 offers current limiting and thermal shutdown. Its circuit is trimmed to assure output voltage accuracy to within +/−1%. www.onsemi.com Features • • • • • • • • SOT−223 CASE 318H Available in 1.8 V, 2.5 V, 3.3 V, 5.0 V, and Adjustable Versions Space−Saving SOT−223 Package Current Limiting and Thermal Protection Output Current 800 mA Line Regulation 0.2% (Maximum) Load Regulation 0.4% (Maximum) Temperature Range: −40°C to 125°C These are Pb-Free Devices PIN CONFIGURATION Tab 123 SOT−223 (Top View) Applications • • • • • Post Regulator for Switching DC−DC Converter High Efficiency Linear Regulators Battery Chargers Portable Instrumentation Active SCSI Termination Regulation Pin: 1. Adjust/Ground 2. Output 3. Input Heatsink tab is connected to Pin 2. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 11 of this data sheet. TYPICAL APPLICATIONS 110 W Input 10 mF 3 + LM1117 XTXX 2 Output 1 Input 3 10 mF + + 10 mF LM1117 XTA 1 3 2 Output 10 mF + 10 mF 4.75 V to 5.25 V Figure 1. Fixed Output Regulator © Semiconductor Components Industries, LLC, 2020 February, 2021 − Rev. 1 Figure 2. Adjustable Output Regulator + + LM1117 XT285 1 110 W 2 + 22 mF 110 W 18 to 27 Lines 110 W Figure 3. Active SCSI Bus Terminator 1 Publication Order Number: LM1117/D LM1117, LM1117I MAXIMUM RATINGS Rating Symbol Value Unit Vin 20 V − Infinite − PD RqJA RqJC Internally Limited 160 15 W °C/W °C/W Maximum Die Junction Temperature Range TJ −55 to 150 °C Storage Temperature Range Tstg −65 to 150 °C Operating Ambient Temperature Range LM1117 LM1117I TA Input Voltage (Note 1) Output Short Circuit Duration (Notes 2 and 3) Power Dissipation and Thermal Characteristics Case 318H (SOT−223) Power Dissipation (Note 2) Thermal Resistance, Junction−to−Ambient, Minimum Size Pad Thermal Resistance, Junction−to−Case 0 to +125 −40 to +125 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model (HBM), Class 2, 2000 V Machine Model (MM), Class B, 200 V Charge Device Model (CDM), Class IV, 2000 V. 2. Internal thermal shutdown protection limits the die temperature to approximately 175°C. Proper heatsinking is required to prevent activation. The maximum package power dissipation is: TJ(max) * TA PD + RqJA 3. The regulator output current must not exceed 1.0 A with Vin greater than 12 V. www.onsemi.com 2 LM1117, LM1117I ELECTRICAL CHARACTERISTICS (Cin = 10 mF, Cout = 10 mF, for typical value TA = 25°C, for min and max values TA is the operating ambient temperature range that applies unless otherwise noted.) (Note 4) Characteristic Symbol Reference Voltage, Adjustable Output Devices (Vin–Vout = 2.0 V, Iout = 10 mA, TA = 25°C) (Vin–Vout = 1.4 V to 10 V, Iout = 10 mA to 800 mA) (Note 4) Vref Output Voltage, Fixed Output Devices 1.8 V (Vin = 3.8 V, Iout = 10 mA, TA = 25 °C) (Vin = 3.2 V to 11.8 V, Iout = 0 mA to 800 mA) (Note 4) Vout Min Typ Max 1.238 1.225 1.25 − 1.262 1.270 1.782 1.755 1.800 − 1.818 1.845 Unit V V 2.5 V (Vin = 4.5 V, Iout = 10 mA, TA = 25 °C) (Vin = 3.9 V to 10 V, Iout = 0 mA to 800 mA,) (Note 4) 2.475 2.450 2.500 − 2.525 2.550 3.3 V (Vin = 5.3 V, Iout = 10 mA, TA = 25 °C) (Vin = 4.75 V to 10 V, Iout = 0 mA to 800 mA) (Note 4) 3.267 3.235 3.300 − 3.333 3.365 5.0 V (Vin = 7.0 V, Iout = 10 mA, TA = 25 °C) (Vin = 6.5 V to 12 V, Iout = 0 mA to 800 mA) (Note 4) 4.950 4.900 5.000 − 5.050 5.100 − 0.04 0.1 % − − − − 0.4 0.5 0.8 0.9 1.0 2.5 4.5 6.0 mV − 0.2 0.4 % − − − − 2.6 3.3 4.3 6.7 6.0 7.5 10 15 mV − − − 0.95 1.01 1.07 1.10 1.15 1.20 Iout 1000 1500 2200 mA IL(min) − 0.8 5.0 mA − − − − 4.2 5.2 6.0 6.0 10 10 10 10 − 0.01 0.1 67 66 62 60 57 73 70 68 64 61 − − − − − Line Regulation (Note 5) 1.8 V 2.5 V 3.3 V 5.0 V Regline (Vin = 3.2 V to 11.8 V, Iout = 0 mA) (Vin = 3.9 V to 10 V, Iout = 0 mA) (Vin = 4.75 V to 15 V, Iout = 0 mA) (Vin = 6.5 V to 15 V, Iout = 0 mA) Load Regulation (Note 5) 1.8 V 2.5 V 3.3 V 5.0 V Adjustable (Vin = 2.75 V to 16.25 V, Iout = 10 mA) Adjustable (Iout = 10 mA to 800 mA, Vin = 4.25 V) Regline (Iout = 0 mA to 800 mA, Vin = 3.2 V) (Iout = 0 mA to 800 mA, Vin = 3.9 V) (Iout = 0 mA to 800 mA, Vin = 4.75 V) (Iout = 0 mA to 800 mA, Vin = 6.5 V) Dropout Voltage (Measured at Vout − 100 mV) (Iout = 100 mA) (Iout = 500 mA) (Iout = 800 mA) Vin−Vout Output Current Limit (Vin−Vout = 5.0 V, TA = 25°C, Note 6) Minimum Required Load Current for Regulation, Adjustable Output Devices (Vin = 15 V) Quiescent Current 1.8 V (Vin = 11.8 V) 2.5 V (Vin = 10 V) 3.3 V (Vin = 15 V) 5.0 V (Vin = 15 V) IQ Thermal Regulation (TA = 25°C, 30 ms Pulse) V mA %/W Ripple Rejection (Vin−Vout = 6.4 V, Iout = 500 mA, 10 Vpp 120 Hz Sinewave) Adjustable 1.8 V 2.5 V 3.3 V 5.0 V RR Adjustment Pin Current (Vin = 11.25 V, Iout = 800 mA) Iadj − 52 120 mA DIadj − 0.4 5.0 mA Temperature Stability ST − 0.5 − % Long Term Stability (TA = 25°C, 1000 Hrs End Point Measurement) St − 0.3 − % RMS Output Noise (f = 10 Hz to 10 kHz) N − 0.003 − %Vout Adjust Pin Current Change (Vin−Vout = 1.4 V to 10 V, Iout = 10 mA to 800 mA) dB Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. Thigh = 125°C 4. LM1117: Tlow = 0°C, LM1117I: Tlow = −40°C, Thigh = 125°C 5. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 6. The regulator output current must not exceed 1.0 A with Vin greater than 12 V. www.onsemi.com 3 1.4 2.0 Vin = Vout + 3.0 V Iout = 10 mA 1.5 Vin − Vout, DROPOUT VOLTAGE (V) Vout, OUTPUT VOLTAGE CHANGE (%) LM1117, LM1117I Adj, 1.5 V, 1.8 V, 2.0 V, 2.5 V 1.0 0.5 0 −0.5 2.85 V, 3.3 V, 5.0 V, 12.0 V −1.0 −1.5 −2.0 −50 −25 0 25 50 75 100 0.2 Load pulsed at 1.0% duty cycle 0 200 400 600 800 1.0 0.5 4 6 8 10 12 14 16 18 1000 2.0 Iout, OUTPUT CURRENT (A) Iout, OUTPUT CURRENT (A) 0.4 Figure 5. Dropout Voltage vs. Output Current Load pulsed at 1.0% duty cycle 1.8 1.6 1.4 1.2 1.0 −50 20 Vin = 5.0 V Load pulsed at 1.0% duty cycle −25 0 25 50 75 100 125 Vin − Vout, VOLTAGE DIFFERENTIAL (V) TA, AMBIENT TEMPERATURE (°C) Figure 6. Output Short Circuit Current vs. Differential Voltage Figure 7. Output Short Circuit Current vs. Temperature IQ, QUIESCENT CURRENT CHANGE (%) 100 Iadj, ADJUST PIN CURRENT (mA) 0.6 Figure 4. Output Voltage Change vs. Temperature 1.5 2 TJ = 125°C Iout, OUTPUT CURRENT (mA) TJ = 25°C 0 0.8 TA, AMBIENT TEMPERATURE (°C) 2.0 0 TJ = −40°C 1.0 0 150 125 TJ = 25°C 1.2 80 60 150 10 5.0 0 −5.0 40 20 0 −50 Iout = 10 mA −25 0 25 50 75 100 125 150 −10 −15 −20 −50 −25 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 8. Adjust Pin Current vs. Temperature Figure 9. Quiescent Current Change vs. Temperature www.onsemi.com 4 150 LM1117, LM1117I 100 80 60 fripple = 20 kHz Vripple v 0.5 VP−P 40 Vout = 5.0 V Vin − Vout = 3.0 V Cout = 10 mF Cadj = 25 mF TA = 25°C 20 0 RR, RIPPLE REJECTION (dB) fripple = 120 Hz Vripple v 3.0 VP−P 0 200 400 600 800 60 Vout = 5.0 V Vin − Vout = 3.0 V Iout = 0.5 A Cout = 10 mF Cadj = 25 mF, f > 60 Hz Cadj = 200 mF, f v 60 Hz TA = 25°C 40 20 10 100 Vin − Vout w Vdropout 1.0 k 10 k Figure 10. LM1117XTA Ripple Rejection vs. Output Current Figure 11. LM1117XTA Ripple Rejection vs. Frequency Vin = 3.0 V Vout = 1.25 V Iload = 5 mA − 1 A Cin = 10 mF MLCC TJ = 25°C 10 Region of Instability 0.01 0.1 1 10 Region of Stability 1 0.01 0 Region of Instability 100 200 300 400 500 600 700 800 900 1000 Iout, OUTPUT CURRENT (mA) Figure 13. Typical ESR vs. Output Current 350E−9 1A Cin = 10 mF Tantalum Cout = 10 mF Tantalum Vin − Vout = 3.0 V 0.5 A 250E−9 200E−9 0.1 A 150E−9 100E−9 50E−9 0 10 100 Vin = 3.0 V Vout = 1.25 V Cin = 10 mF MLCC Cout = 10 mF TJ = 25°C 0.1 Figure 12. Output Capacitance vs. ESR 300E−9 100 k 10 ESR, EQUIVALENT SERIES RESISTANCE (W) V/sqrt (Hz) OUTPUT CAPACITANCE (mF) Vin − Vout w 3.0 V fripple, RIPPLE FREQUENCY (Hz) Region of Stability 0.1 0.001 Vripple v 0.5 VP−P Iout, OUTPUT CURRENT (mA) 100 1 Vripple v 3.0 VP−P 80 0 1000 ESR, EQUIVALENT SERIES RESISTANCE (W) RR, RIPPLE REJECTION (dB) 100 1.0 k 10 k 100 k FREQUENCY (Hz) Figure 14. Output Spectral Noise Density vs. Frequency, Vout = 1V5 www.onsemi.com 5 5.25 0 20 0 −20 40 80 120 0.5 0 200 160 Cin = 10 mF Cout = 10 mF Vin = 4.5 V Preload = 0.1 A TA = 25°C −0.1 0 40 Figure 16. LM1117XT285 Load Transient Response 7.5 20 0 −20 80 120 0 Cin = 10 mF Cout = 10 mF Vin = 6.5 V Preload = 0.1 A TA = 25°C 0.5 0 200 160 0 40 80 120 OUTPUT VOLTAGE DEVIATION (V) 0.1 0 Cin = 10 mF Cout = 10 mF Vin = 13.5 V Preload = 0.1 A TA = 25°C −0.1 LOAD CURRENT CHANGE (A) 13.5 20 0 −20 40 80 120 200 Figure 18. LM1117XT50 Load Transient Response Cin = 1.0 mF Cout = 10 mF Iout = 0.1 A TA = 25°C 0 160 t, TIME (ms) Figure 17. LM1117XT50 Line Transient Response 14.5 200 0.1 −0.1 6.5 40 160 Figure 15. LM1117XT285 Line Transient Response t, TIME (ms) INPUT VOLTAGE (V) 120 t, TIME (ms) Cin = 1.0 mF Cout = 10 mF Iout = 0.1 A TA = 25°C 0 OUTPUT VOLTAGE DEVIATION (mV) 80 t, TIME (ms) LOAD CURRENT CHANGE (A) INPUT VOLTAGE (V) 0.1 LOAD CURRENT CHANGE (A) 4.25 0 OUTPUT VOLTAGE DEVIATION (mV) OUTPUT VOLTAGE DEVIATION (V) Cin = 1.0 mF Cout = 10 mF Iout = 0.1 A TA = 25°C OUTPUT VOLTAGE DEVIATION (V) OUTPUT VOLTAGE DEVIATION (mV) INPUT VOLTAGE (V) LM1117, LM1117I 160 0.5 0 200 t, TIME (ms) 0 40 80 120 160 t, TIME (ms) Figure 20. LM1117XT12 Load Transient Response Figure 19. LM1117XT12 Line Transient Response www.onsemi.com 6 200 RqJA, THERMAL RESISTANCE, JUNCTION−TO−AIR (°CW) 180 1.6 160 1.4 PD(max) for TA = 50°C 140 ÎÎÎ ÎÎÎ ÎÎÎ 2.0 oz. Copper L Minimum Size Pad 120 L 100 80 60 RqJA 0 5.0 10 15 20 25 L, LENGTH OF COPPER (mm) 1.2 1.0 0.8 0.6 0.4 30 PD, MAXIMUM POWER DISSIPATION (W) LM1117, LM1117I RqJA, THERMAL RESISTANCE, JUNCTION−TO−AIR (°CW) 100 1.6 PD(max) for TA = 50°C 1.4 90 ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 2.0 oz. Copper L 80 Minimum Size Pad 70 1.0 L 0.8 60 50 0.6 RqJA 40 1.2 0 5.0 10 15 20 25 0.4 30 L, LENGTH OF COPPER (mm) Figure 22. DPAK Thermal Resistance and Maximum Power Dissipation vs. P.C.B. Copper Length www.onsemi.com 7 PD, MAXIMUM POWER DISSIPATION (W) Figure 21. SOT−223 Thermal Resistance and Maximum Power Dissipation vs. P.C.B. Copper Length LM1117, LM1117I APPLICATIONS INFORMATION Introduction Frequency compensation for the regulator is provided by capacitor Cout and its use is mandatory to ensure output stability. A minimum capacitance value of 4.7 mF with an equivalent series resistance (ESR) that is within the limits of 33 mW (typ) to 2.2 W is required. See Figures 12 and 13. The capacitor type can be ceramic, tantalum, or aluminum electrolytic as long as it meets the minimum capacitance value and ESR limits over the circuit’s entire operating temperature range. Higher values of output capacitance can be used to enhance loop stability and transient response with the additional benefit of reducing output noise. The LM1117 features a significant reduction in dropout voltage along with enhanced output voltage accuracy and temperature stability when compared to older industry standard three−terminal adjustable regulators. These devices contain output current limiting, safe operating area compensation and thermal shutdown protection making them designer friendly for powering numerous consumer and industrial products. The LM1117 series is pin compatible with the older LM317 and its derivative device types. Output Voltage Input The typical application circuits for the fixed and adjustable output regulators are shown in Figures 23 and 24. The adjustable devices are floating voltage regulators. They develop and maintain the nominal 1.25 V reference voltage between the output and adjust pins. The reference voltage is programmed to a constant current source by resistor R1, and this current flows through R2 to ground to set the output voltage. The programmed current level is usually selected to be greater than the specified 5.0 mA minimum that is required for regulation. Since the adjust pin current, Iadj, is significantly lower and constant with respect to the programmed load current, it generates a small output voltage error that can usually be ignored. For the fixed output devices R1 and R2 are included within the device and the ground current Ignd, ranges from 3.0 mA to 5.0 mA depending upon the output voltage. Cin Cin + LM1117 XTXX 1 + + + Cout Cadj Ǔ Vout + Vref 1 ) R2 ) Iadj R2 R1 Figure 24. Adjustable Output Regulator The output ripple will increase linearly for fixed and adjustable devices as the ratio of output voltage to the reference voltage increases. For example, with a 12 V regulator, the output ripple will increase by 12 V/1.25 V or 9.6 and the ripple rejection will decrease by 20 log of this ratio or 19.6 dB. The loss of ripple rejection can be restored to the values shown with the addition of bypass capacitor Cadj, shown in Figure 24. The reactance of Cadj at the ripple frequency must be less than the resistance of R1. The value of R1 can be selected to provide the minimum required load current to maintain regulation and is usually in the range of 100 W to 200 W. Cadj u 1 2 p fripple R1 The minimum required capacitance can be calculated from the above formula. When using the device in an application that is powered from the AC line via a transformer and a full wave bridge, the value for Cadj is: Output 2 R1 Vref 1 ǒ Output 2 R2 Input bypass capacitor Cin may be required for regulator stability if the device is located more than a few inches from the power source. This capacitor will reduce the circuit’s sensitivity when powered from a complex source impedance and significantly enhance the output transient response. The input bypass capacitor should be mounted with the shortest possible track length directly across the regulator’s input and ground terminals. A 10 mF ceramic or tantalum capacitor should be adequate for most applications. 3 + LM1117 XTA Iadj External Capacitors Input 3 fripple + 120 Hz, R1 + 120 W, then Cadj u 11.1 mF The value for Cadj is significantly reduced in applications where the input ripple frequency is high. If used as a post regulator in a switching converter under the following conditions: Cout Ignd fripple + 50 kHz, R1 + 120 W, then Cadj u 0.027 mF Figure 23. Fixed Output Regulator Figures 10 and 11 shows the level of ripple rejection that is obtainable with the adjust pin properly bypassed. www.onsemi.com 8 LM1117, LM1117I Protection Diodes The second condition is that the ground end of R2 should be connected directly to the load. This allows true Kelvin sensing where the regulator compensates for the voltage drop caused by wiring resistance RW −. The LM1117 family has two internal low impedance diode paths that normally do not require protection when used in the typical regulator applications. The first path connects between Vout and Vin, and it can withstand a peak surge current of about 15 A. Normal cycling of Vin cannot generate a current surge of this magnitude. Only when Vin is shorted or crowbarred to ground and Cout is greater than 50 mF, it becomes possible for device damage to occur. Under these conditions, diode D1 is required to protect the device. The second path connects between Cadj and Vout, and it can withstand a peak surge current of about 150 mA. Protection diode D2 is required if the output is shorted or crowbarred to ground and Cadj is greater than 1.0 mF. Input Cin Cin + RW+ 2 + R1 1 Cout R2 Output Remote Load Figure 26. Load Sensing Thermal Considerations 1N4001 3 + LM1117 XTA RW− D1 Input 3 LM1117 XTA 1 R2 This series contains an internal thermal limiting circuit that is designed to protect the regulator in the event that the maximum junction temperature is exceeded. When activated, typically at 175°C, the regulator output switches off and then back on as the die cools. As a result, if the device is continuously operated in an overheated condition, the output will appear to be oscillating. This feature provides protection from a catastrophic device failure due to accidental overheating. It is not intended to be used as a substitute for proper heatsinking. The maximum device power dissipation can be calculated by: Output 2 R1 + D2 1N4001 + Cout Cadj Figure 25. Protection Diode Placement A combination of protection diodes D1 and D2 may be required in the event that Vin is shorted to ground and Cadj is greater than 50 mF. The peak current capability stated for the internal diodes are for a time of 100 ms with a junction temperature of 25°C. These values may vary and are to be used as a general guide. PD + TJ(max) * TA RqJA The devices are available in surface mount SOT−223 and DPAK packages. Each package has an exposed metal tab that is specifically designed to reduce the junction to air thermal resistance, RqJA, by utilizing the printed circuit board copper as a heat dissipater. Figures 21 and 22 show typical RqJA values that can be obtained from a square pattern using economical single sided 2.0 ounce copper board material. The final product thermal limits should be tested and quantified in order to insure acceptable performance and reliability. The actual RqJA can vary considerably from the graphs shown. This will be due to any changes made in the copper aspect ratio of the final layout, adjacent heat sources, and air flow. Load Regulation The LM1117 series is capable of providing excellent load regulation; but since these are three terminal devices, only partial remote load sensing is possible. There are two conditions that must be met to achieve the maximum available load regulation performance. The first is that the top side of programming resistor R1 should be connected as close to the regulator case as practicable. This will minimize the voltage drop caused by wiring resistance RW + from appearing in series with reference voltage that is across R1. www.onsemi.com 9 LM1117, LM1117I Input LM1117 XTA 3 + 10 mF Constant Current Output R 2 + 1 Input + 10 mF 10 mF LM1117 XTA 3 Output 2 + R1 1 R2 50 k 2N2907 Figure 28. Slow Turn−On Regulator Input Input 3 10 mF + On + Output 2 R1 1 + 10 120 2N2222 LM1117 XTA 3 10 mF Output 2 1 1.0 k Output Control LM1117 XTA 10 mF 10 mF V Iout + ref ) Iadj R Figure 27. Constant Current Regulator 1N4001 + 10 mF R2 mF 2N2222 360 1.0 k Off Output Voltage Control Resistor R2 sets the maximum output voltage. Each transistor reduces the output voltage when turned on. Vout(Off) + Vref Figure 29. Regulator with Shutdown Input 3 10 mF + LM1117 XT50 2 mF − 10 mF Input 5.3 V AC Line 5.0 V Battery 3 + Output + 10 1 50 W RCHG 6.6 V Figure 30. Digitally Controlled Regulator + LM1117 XT50 10 mF 2 3 + LM1117 XT50 mF 1 2.0 k 1 Output 5.0 V to 12 V + 10 2 + 10 mF The 50 W resistor that is in series with the ground pin of the upper regulator level shifts its output 300 mV higher than the lower regulator. This keeps the lower regulator off until the input source is removed. Figure 31. Battery Backed−Up Power Supply Figure 32. Adjusting Output of Fixed Voltage Regulators www.onsemi.com 10 LM1117, LM1117I ORDERING INFORMATION − (LM1117) Device Package Shipping† SOT−223 (Pb−Free) 4000 / Tape & Reel Nominal Output Voltage LM1117MPX−ADJNOPB Adjustable LM1117MPX−18NOPB 1.8 LM1117MPX−25NOPB 2.5 LM1117MPX−33NOPB 3.3 LM1117MPX−50NOPB 5.0 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ORDERING INFORMATION − (LM1117I) Device Nominal Output Voltage Package Shipping† Adjustable SOT−223 (Pb−Free) 4000 / Tape & Reel LM1117IMPX−ADJNOPB †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MARKING DIAGRAMS − LM1117 SOT−223 CASE 318H AYW 117−AG G 1 2 AYW 17−18G G 3 Adjustable 1 2 AYW 17−33G G AYW 17−25G G 3 1 1.8 V 2 3 2.5 V A Y W G 2 1 3.3 V = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) MARKING DIAGRAMS − LM1117I SOT−223 CASE 318H AYW 117ATG G 1 2 3 Adjustable A Y W G = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) www.onsemi.com 11 AYW 117−5G G 3 1 2 5.0 V 3 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−223 CASE 318H ISSUE B DATE 13 MAY 2020 SCALE 2:1 GENERIC MARKING DIAGRAM* AYW XXXXXG G 1 A = Assembly Location Y = Year W = Work Week XXXXX = Specific Device Code G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98ASH70634A SOT−223 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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