DATA SHEET
www.onsemi.com
Single Supply Quad
Comparators
14
14
1
LM339, LM339E, LM239,
LM2901, LM2901E,
LM2901V, NCV2901,
MC3302
Features
•
•
Single Supply Operation: 3.0 V to 36 V
Split Supply Operation: ±1.5 V to ±18 V
Low Input Bias Current: 25 nA (Typ)
Low Input Offset Current: ±5.0 nA (Typ)
Low Input Offset Voltage
Input Common Mode Voltage Range to GND
Low Output Saturation Voltage: 130 mV (Typ) @ 4.0 mA
TTL and CMOS Compatible
ESD Clamps on the Inputs Increase Reliability without Affecting
Device Operation
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
© Semiconductor Components Industries, LLC, 2016
October, 2021 − Rev. 27
TSSOP−14
DTB SUFFIX
CASE 948G
PIN CONNECTIONS
These comparators are designed for use in level detection, low−level
sensing and memory applications in consumer, automotive, and
industrial electronic applications.
•
•
•
•
•
•
•
•
•
1
SOIC−14
D SUFFIX
CASE 751A
1
Output 2
1
14
Output 3
Output 1
2
13
Output 4
VCC
3
12
GND
- Input 1
4
11
+ Input 4
10
- Input 4
9
+ Input 3
8
- Input 3
+ Input 1
5
- Input 2
6
+ Input 2
7
*
1
)
4
*2
)
3
)
*
)
*
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 8 of this data sheet.
Publication Order Number:
LM339/D
LM339, LM339E, LM239, LM2901, LM2901E, LM2901V, NCV2901, MC3302
MAXIMUM RATINGS
Rating
Symbol
Power Supply Voltage
VCC
LM239/LM339, E/LM2901, E, V
MC3302
Input Differential Voltage Range
VIDR
LM239/LM339, E/LM2901, E, V
MC3302
Input Common Mode Voltage Range
Value
Vdc
+36 or ±18
+30 or ±15
Vdc
36
30
VICMR
−0.3 to 36
Output Short Circuit to Ground (Note 1)
ISC
Continuous
Power Dissipation @ TA = 25°C
Plastic Package
Derate above 25°C
PD
Junction Temperature
Operating Ambient Temperature Range
Vdc
1/RqJA
1.0
8.0
W
mW/°C
TJ
150
°C
TA
LM239
MC3302
LM2901, LM2901E
LM2901V, NCV2901
LM339, LM339E
Storage Temperature Range
Unit
Tstg
−25 to +85
−40 to +85
−40 to +105
−40 to +125
0 to +70
−65 to +150
°C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The maximum output current may be as high as 20 mA, independent of the magnitude of VCC. Output short circuits to VCC can cause excessive
heating and eventual destruction.
ESD RATINGS
Rating
ESD Protection at any Pin (Human Body Model − HBM, Machine Model − MM)
NCV2901
LM339E, LM2901E
LM339DG/DR2G, LM2901DG/DR2G
All Other Devices
VCC
- Input
+ Input
GND
NOTE: Diagram shown is for 1 comparator.
Figure 1. Circuit Schematic
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2
HBM
MM
Unit
2000
1500
250
1500
200
200
100
200
V
V
V
V
Output
LM339, LM339E, LM239, LM2901, LM2901E, LM2901V, NCV2901, MC3302
ELECTRICAL CHARACTERISTICS (VCC = +5.0 Vdc, TA = +25°C, unless otherwise noted)
LM239/339/339E
LM2901/2901E/2901V
/NCV2901
MC3302
Symbol
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
Input Offset Voltage (Note 3)
VIO
−
±2.0
±5.0
−
±2.0
±7.0
−
±3.0
±20
mVdc
Input Bias Current (Notes 3, 4)
IIB
−
25
250
−
25
250
−
25
500
nA
IIO
−
±5.0
±50
−
±5.0
±50
−
±3.0
±100
nA
VICMR
0
−
VCC
−1.5
0
−
VCC
−1.5
0
−
VCC
−1.5
V
RL = ∞ (For All Comparators)
−
0.8
2.0
−
0.8
2.0
−
0.8
2.0
RL = ∞, VCC = 30 Vdc
−
1.0
2.5
−
1.0
2.5
−
1.0
2.5
AVOL
50
200
−
25
100
−
25
100
−
V/mV
−
−
300
−
−
300
−
−
300
−
ns
−
−
1.3
−
−
1.3
−
−
1.3
−
ms
ISink
6.0
16
−
6.0
16
−
6.0
16
−
mA
Vsat
−
130
400
−
130
400
−
130
500
mV
IOL
−
0.1
−
−
0.1
−
−
0.1
−
nA
Characteristic
(Output in Analog Range)
Input Offset Current (Note 3)
Input Common Mode Voltage Range
(Note 5)
Supply Current
Voltage Gain
ICC
mA
RL ≥ 15 kW, VCC = 15 Vdc
Large Signal Response Time
VI = TTL Logic Swing,
Vref = 1.4 Vdc, VRL = 5.0 Vdc,
RL = 5.1 kW
Response Time (Note 6)
VRL = 5.0 Vdc, RL = 5.1 kW
Output Sink Current
VI (−) ≥ +1.0 Vdc, VI(+) = 0,
VO ≤ 1.5 Vdc
Saturation Voltage
VI(−) ≥ +1.0 Vdc, VI(+) = 0,
Isink ≤ 4.0 mA
Output Leakage Current
VI(+) ≥ +1.0 Vdc, VI(−) = 0,
VO = +5.0 Vdc
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. (LM239) Tlow = −25°C, Thigh = +85°
(LM339, LM339E) Tlow = 0°C, Thigh = +70°C
(MC3302) Tlow = −40°C, Thigh = +85°C
(LM2901), LM2901E Tlow = −40°C, Thigh = +105°
(LM2901V & NCV2901) Tlow = −40°C, Thigh = +125°C
NCV2901 is qualified for automotive use.
3. At the output switch point, VO ] 1.4 Vdc, RS ≤ 100 W 5.0 Vdc ≤ VCC ≤ 30 Vdc, with the inputs over the full common mode range
(0 Vdc to VCC −1.5 Vdc).
4. The bias current flows out of the inputs due to the PNP input stage. This current is virtually constant, independent of the output state.
5. Positive excursions of input voltage may exceed the power supply level. As long as one input voltage remains within the common mode range,
the comparator will provide a proper output state. Refer to the Maximum Ratings table for safe operating area.
6. The response time specified is for a 100 mV input step with 5.0 mV overdrive. For larger signals, 300 ns is typical.
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3
LM339, LM339E, LM239, LM2901, LM2901E, LM2901V, NCV2901, MC3302
PERFORMANCE CHARACTERISTICS (VCC = +5.0 Vdc, TA = Tlow to Thigh [Note 7])
LM2901/2901E/2901V
/NCV2901
LM239/339/339E
MC3302
Symbol
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
Input Offset Voltage (Note 8)
VIO
−
−
±9.0
−
−
±15
−
−
±40
mVdc
Input Bias Current (Notes 8, 9)
IIB
−
−
400
−
−
500
−
−
1000
nA
IIO
−
−
±150
−
−
±200
−
−
±300
nA
VICMR
0
−
VCC
−2.0
0
−
VCC
−2.0
0
−
VCC
−2.0
V
Vsat
−
−
700
−
−
700
−
−
700
mV
IOL
−
−
1.0
−
−
1.0
−
−
1.0
mA
VID
−
−
VCC
−
−
VCC
−
−
VCC
Vdc
Characteristic
(Output in Analog Range)
Input Offset Current (Note 8)
Input Common Mode Voltage Range
Saturation Voltage
VI(−) ≥ +1.0 Vdc, VI(+) = 0,
Isink ≤ 4.0 mA
Output Leakage Current
VI(+) ≥ +1.0 Vdc, VI(−) = 0,
VO = 30 Vdc
Differential Input Voltage
All VI ≥ 0 Vdc
7. (LM239) Tlow = −25°C, Thigh = +85°
(LM339, LM339E) Tlow = 0°C, Thigh = +70°C
(MC3302) Tlow = −40°C, Thigh = +85°C
(LM2901, LM2901E) Tlow = −40°C, Thigh = +105°
(LM2901V & NCV2901) Tlow = −40°C, Thigh = +125°C
NCV2901 is qualified for automotive use.
8. At the output switch point, VO ] 1.4 Vdc, RS ≤ 100 W 5.0 Vdc ≤ VCC ≤ 30 Vdc, with the inputs over the full common mode range
(0 Vdc to VCC −1.5 Vdc).
9. The bias current flows out of the inputs due to the PNP input stage. This current is virtually constant, independent of the output state.
+ VCC
+ VCC
R3
10 k
Vin
+ VCC
Rref
Rref
10 k
-
Vref
VO
+
R1
R2
Vref
10k
R1
1.0 M
Vref [
R3
Rref + R1
R1 / / Rref
R1/ / Rref + R2
VO
+
10 k
VCC R1
1.0 M
R3 ] R1 / / Rref / / R2
VH =
R2
Vin
10 k
Vref =
VCC R1
Rref + R1
R2 [ R1 / / Rref
Amount of Hysteresis VH
R2
VH =
[(V
-V
]
R2 + R3 O(max) O(min)
[VO(max) - VO(min)]
R2 ơ Rref / / R1
Figure 2. Inverting Comparator
with Hysteresis
Figure 3. Noninverting Comparator
with Hysteresis
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4
LM339, LM339E, LM239, LM2901, LM2901E, LM2901V, NCV2901, MC3302
Typical Characteristics
(VCC = 15 Vdc, TA = +25°C (each comparator) unless otherwise noted.)
48
42
I IB, INPUT BIAS CURRENT (nA)
1.20
1.00
0.80
TA = -55° C
36
TA = +25° C
30
TA = +125°C
24
18
12
6.0
0
0.60
-50
-25
0
25
50
75
TA, AMBIENT TEMPERATURE (°C)
100
125
0
4.0
8.0
12
16
20
24
VCC, POWER SUPPLY VOLTAGE (Vdc)
Figure 4. Normalized Input Offset Voltage
28
Figure 5. Input Bias Current
8.0
IO, OUTPUT CURRENT (mA)
NORMALIZED OFFSET VOLTAGE
1.40
7.0
TA = +25° C
6.0
TA = -55° C
5.0
TA = +125°C
4.0
3.0
2.0
1.0
0
100
0
200
300
400
500
Vsat, OUTPUT SATURATION VOLTAGE (mV)
Figure 6. Output Sink Current versus
Output Saturation Voltage
VCC
RS
Vin
Vref
VCC ≥ 4.0 V
+
-
VCC
RS = Source Resistance
R1 ] RS
RL
kW
1/4 MC14001
+15
100
1/4 MC7400
+5.0
10
CMOS
TTL
R1
VO
+
R2
R3
330 k
330 k
R4
VCC
(V)
Device
-
+
C
R1
Logic
10 k
100 k
RL
330 k
VCC
T1
T2
T1 = T2 = 0.69 RC
7.2
f[
C(mF)
R2 = R3 = R4
R1 [ R2 // R3 // R4
Figure 7. Driving Logic
Figure 8. Squarewave Oscillator
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5
32
LM339, LM339E, LM239, LM2901, LM2901E, LM2901V, NCV2901, MC3302
APPLICATIONS INFORMATION
addition of positive feedback (< 10 mV) is also
recommended. It is good design practice to ground all
unused input pins.
Differential input voltages may be larger than supply
voltages without damaging the comparator’s inputs.
Voltages more negative than −300 mV should not be used.
These quad comparators feature high gain, wide
bandwidth characteristics. This gives the device oscillation
tendencies if the outputs are capacitively coupled to the
inputs via stray capacitance. This oscillation manifests itself
during output transitions (VOL to VOH). To alleviate this
situation input resistors < 10 kW should be used. The
+15 V
R1
8.2 k
R4
220 k
D1
6.8 k
R2
Vin
R5
220 k
10 k
*
)
Vin(min) ≈ 0.4 V peak for 1% phase distortion (Dq).
VO
Vin
Vin(min)
VCC
15 k
R3
q
10 M
*
Vin
D1 prevents input from going negative by more than 0.6 V.
R1 + R2 = R3
R5
R3 ≤
for small error in zero crossing
10
+
VEE
10 k
VO
VCC
VEE
Figure 9. Zero Crossing Detector
(Single Supply)
q
VO
Dq
Figure 10. Zero Crossing Detector
(Split Supplies)
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6
LM339, LM339E, LM239, LM2901, LM2901E, LM2901V, NCV2901, MC3302
ORDERING INFORMATION
Device
LM239DR2G
LM239DTBR2G
LM339DR2G
LM339EDR2G
LM339DTBR2G
LM2901DR2G
LM2901EDR2G
Package
Shipping†
SOIC−14 (Pb−Free)
2500 / Tape & Reel
TSSOP−14 (Pb−Free)
2500 / Tape & Reel
SOIC−14 (Pb−Free)
2500 / Tape & Reel
SOIC−14 (Pb−Free)
2500 / Tape & Reel
TSSOP−14 (Pb−Free)
2500 / Tape & Reel
SOIC−14 (Pb−Free)
2500 / Tape & Reel
SOIC−14 (Pb−Free)
2500 / Tape & Reel
TSSOP−14 (Pb−Free)
2500 / Tape & Reel
SOIC−14 (Pb−Free)
2500 / Tape & Reel
TSSOP−14 (Pb−Free)
2500 / Tape & Reel
SOIC−14 (Pb−Free)
2500 / Tape & Reel
TSSOP−14 (Pb−Free)
2500 / Tape & Reel
NCV2901CTR*
Bare Die
6000 / Tape & Reel
MC3302DR2G
SOIC−14 (Pb−Free)
2500 / Tape & Reel
LM2901DTBR2G
LM2901VDR2G
LM2901VDTBR2G
NCV2901DR2G*
NCV2901DTBR2G*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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7
LM339, LM339E, LM239, LM2901, LM2901E, LM2901V, NCV2901, MC3302
MARKING DIAGRAMS
SOIC−14
D SUFFIX
CASE 751A
14
14
LM339DG
AWLYWW
14
LM239DG
AWLYWW
1
14
LM2901DG
AWLYWW
1
LM2901VDG
AWLYWW
1
14
14
*
1
MC3302DG
AWLYWW
1
14
LM339EG
AWLYWW
LM2901EG
AWLYWW
1
1
TSSOP−14
DTB SUFFIX
CASE 948G
14
14
14
2901
ALYW G
G
339
ALYW G
G
239
ALYW G
G
1
14
1
1
A
= Assembly Location
WL, L = Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
*This marking diagram also applies to NCV2901.
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8
1
*
2901
V
ALYW G
G
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE S
1
SCALE 1:1
D
A
14
8
E
H
E1
1
NOTE 8
7
b2
c
B
TOP VIEW
END VIEW
WITH LEADS CONSTRAINED
NOTE 5
A2
A
NOTE 3
L
SEATING
PLANE
A1
C
D1
e
M
eB
END VIEW
14X b
SIDE VIEW
0.010
M
C A
M
B
M
NOTE 6
DATE 22 APR 2015
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
DIM
A
A1
A2
b
b2
C
D
D1
E
E1
e
eB
L
M
INCHES
MIN
MAX
−−−−
0.210
0.015
−−−−
0.115 0.195
0.014 0.022
0.060 TYP
0.008 0.014
0.735 0.775
0.005
−−−−
0.300 0.325
0.240 0.280
0.100 BSC
−−−−
0.430
0.115 0.150
−−−−
10 °
MILLIMETERS
MIN
MAX
−−−
5.33
0.38
−−−
2.92
4.95
0.35
0.56
1.52 TYP
0.20
0.36
18.67 19.69
0.13
−−−
7.62
8.26
6.10
7.11
2.54 BSC
−−−
10.92
2.92
3.81
−−−
10 °
GENERIC
MARKING DIAGRAM*
14
XXXXXXXXXXXX
XXXXXXXXXXXX
AWLYYWWG
STYLES ON PAGE 2
1
XXXXX
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42428B
PDIP−14
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
PDIP−14
CASE 646−06
ISSUE S
DATE 22 APR 2015
STYLE 1:
PIN 1. COLLECTOR
2. BASE
3. EMITTER
4. NO
CONNECTION
5. EMITTER
6. BASE
7. COLLECTOR
8. COLLECTOR
9. BASE
10. EMITTER
11. NO
CONNECTION
12. EMITTER
13. BASE
14. COLLECTOR
STYLE 2:
CANCELLED
STYLE 3:
CANCELLED
STYLE 4:
PIN 1. DRAIN
2. SOURCE
3. GATE
4. NO
CONNECTION
5. GATE
6. SOURCE
7. DRAIN
8. DRAIN
9. SOURCE
10. GATE
11. NO
CONNECTION
12. GATE
13. SOURCE
14. DRAIN
STYLE 5:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. NO CONNECTION
5. SOURCE
6. DRAIN
7. GATE
8. GATE
9. DRAIN
10. SOURCE
11. NO CONNECTION
12. SOURCE
13. DRAIN
14. GATE
STYLE 6:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. NO CONNECTION
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. NO CONNECTION
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 7:
PIN 1. NO CONNECTION
2. ANODE
3. ANODE
4. NO CONNECTION
5. ANODE
6. NO CONNECTION
7. ANODE
8. ANODE
9. ANODE
10. NO CONNECTION
11. ANODE
12. ANODE
13. NO CONNECTION
14. COMMON
CATHODE
STYLE 8:
PIN 1. NO CONNECTION
2. CATHODE
3. CATHODE
4. NO CONNECTION
5. CATHODE
6. NO CONNECTION
7. CATHODE
8. CATHODE
9. CATHODE
10. NO CONNECTION
11. CATHODE
12. CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 9:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. ANODE/CATHODE
7. COMMON ANODE
8. COMMON ANODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. NO CONNECTION
12. ANODE/CATHODE
13. ANODE/CATHODE
14. COMMON CATHODE
STYLE 10:
PIN 1. COMMON
CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. NO CONNECTION
7. COMMON ANODE
8. COMMON
CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 11:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. ANODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
STYLE 12:
PIN 1. COMMON CATHODE
2. COMMON ANODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. COMMON ANODE
7. COMMON CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. ANODE/CATHODE
14. ANODE/CATHODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42428B
PDIP−14
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE L
14
1
SCALE 1:1
D
DATE 03 FEB 2016
A
B
14
8
A3
E
H
L
1
0.25
B
M
DETAIL A
7
13X
M
b
0.25
M
C A
S
B
S
0.10
X 45 _
M
A1
e
DETAIL A
h
A
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
6.50
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
14
14X
1.18
XXXXXXXXXG
AWLYWW
1
1
1.27
PITCH
XXXXX
A
WL
Y
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOIC−14
CASE 751A−03
ISSUE L
DATE 03 FEB 2016
STYLE 1:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. NO CONNECTION
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. NO CONNECTION
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 2:
CANCELLED
STYLE 3:
PIN 1. NO CONNECTION
2. ANODE
3. ANODE
4. NO CONNECTION
5. ANODE
6. NO CONNECTION
7. ANODE
8. ANODE
9. ANODE
10. NO CONNECTION
11. ANODE
12. ANODE
13. NO CONNECTION
14. COMMON CATHODE
STYLE 4:
PIN 1. NO CONNECTION
2. CATHODE
3. CATHODE
4. NO CONNECTION
5. CATHODE
6. NO CONNECTION
7. CATHODE
8. CATHODE
9. CATHODE
10. NO CONNECTION
11. CATHODE
12. CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 5:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. NO CONNECTION
7. COMMON ANODE
8. COMMON CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 6:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. ANODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
STYLE 7:
PIN 1. ANODE/CATHODE
2. COMMON ANODE
3. COMMON CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. ANODE/CATHODE
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. COMMON CATHODE
12. COMMON ANODE
13. ANODE/CATHODE
14. ANODE/CATHODE
STYLE 8:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. ANODE/CATHODE
7. COMMON ANODE
8. COMMON ANODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. NO CONNECTION
12. ANODE/CATHODE
13. ANODE/CATHODE
14. COMMON CATHODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−14 WB
CASE 948G
ISSUE C
14
DATE 17 FEB 2016
1
SCALE 2:1
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
DETAIL E
K
A
−V−
K1
J J1
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
H
G
D
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
GENERIC
MARKING DIAGRAM*
14
SOLDERING FOOTPRINT
XXXX
XXXX
ALYWG
G
7.06
1
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
98ASH70246A
DESCRIPTION:
TSSOP−14 WB
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
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