LM2576TV-3.3G

DATA SHEET www.onsemi.com 3.0 A, 15 V, Step-Down Switching Regulator 1 LM2576 5 The LM2576 series of regulators are monolithic integrated circuits ideally suited for easy and convenient design of a step−down switching regulator (buck converter). All circuits of this series are capable of driving a 3.0 A load with excellent line and load regulation. These devices are available in fixed output voltages of 3.3 V, 5.0 V, 12 V, 15 V, and an adjustable output version. These regulators were designed to minimize the number of external components to simplify the power supply design. Standard series of inductors optimized for use with the LM2576 are offered by several different inductor manufacturers. Since the LM2576 converter is a switch−mode power supply, its efficiency is significantly higher in comparison with popular three−terminal linear regulators, especially with higher input voltages. In many cases, the power dissipated is so low that no heatsink is required or its size could be reduced dramatically. A standard series of inductors optimized for use with the LM2576 are available from several different manufacturers. This feature greatly simplifies the design of switch−mode power supplies. The LM2576 features include a guaranteed ±4% tolerance on output voltage within specified input voltages and output load conditions, and ±10% on the oscillator frequency (±2% over 0°C to 125°C). External shutdown is included, featuring 80 mA (typical) standby current. The output switch includes cycle−by−cycle current limiting, as well as thermal shutdown for full protection under fault conditions. Heatsink surface connected to Pin 3 TO−220 T SUFFIX CASE 314D 1 5 Pin 1 5 1.Vin 2.Output 3.Ground 4.Feedback 5.ON/OFF D2PAK D2T SUFFIX CASE 936A Heatsink surface (shown as terminal 6 in case outline drawing) is connected to Pin 3 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 24 of this data sheet. Features • 3.3 V, 5.0 V, 12 V, 15 V, and Adjustable Output Versions • Adjustable Version Output Voltage Range, 1.23 to 37 V ±4% • • • • • • • • • • TO−220 TV SUFFIX CASE 314B Maximum Over Line and Load Conditions Guaranteed 3.0 A Output Current Wide Input Voltage Range Requires Only 4 External Components 52 kHz Fixed Frequency Internal Oscillator TTL Shutdown Capability, Low Power Standby Mode High Efficiency Uses Readily Available Standard Inductors Thermal Shutdown and Current Limit Protection Moisture Sensitivity Level (MSL) Equals 1 Pb−Free Packages are Available DEVICE MARKING INFORMATION See general marking information in the device marking section on page 25 of this data sheet. Applications • • • • Simple High−Efficiency Step−Down (Buck) Regulator Efficient Pre−Regulator for Linear Regulators On−Card Switching Regulators Positive to Negative Converter (Buck−Boost) © Semiconductor Components Industries, LLC, 2006 December, 2022 − Rev. 9 • Negative Step−Up Converters • Power Supply for Battery Chargers 1 Publication Order Number: LM2576/D LM2576 Typical Application (Fixed Output Voltage Versions) Feedback 7.0 V - 40 V Unregulated DC Input +Vin Cin 100 mF 4 LM2576 L1 100 mH Output 1 3 GN D 5 D1 1N5822 2 ON/OFF 5.0 V Regulated Output 3.0 A Load Cout 1000 mF Representative Block Diagram and Typical Application +Vin Unregulated DC Input 3.1 V Internal Regulator 1 ON/OFF ON/OFF 5 Output Voltage Versions R2 (W) 3.3 V 5.0 V 12 V 15 V 1.7 k 3.1 k 8.84 k 11.3 k Cin 4 Feedback R2 R1 1.0 k Current Limit Fixed Gain Error Amplifier Comparator For adjustable version R1 = open, R2 = 0 W Driver Latch Freq Shift 18 kHz 1.235 V Band-Gap Reference L1 Output 1.0 Amp Switch 52 kHz Oscillator Reset Thermal Shutdown 2 GND Regulated Output Vout D1 3 Cout Load This device contains 162 active transistors. Figure 1. Block Diagram and Typical Application MAXIMUM RATINGS Symbol Value Unit Maximum Supply Voltage Rating Vin 45 V ON/OFF Pin Input Voltage − −0.3 V ≤ V ≤ +Vin V Output Voltage to Ground (Steady−State) − −1.0 V Power Dissipation Case 314B and 314D (TO−220, 5−Lead) Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 936A (D2PAK) Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case PD RqJA RqJC PD RqJA RqJC Internally Limited 65 5.0 Internally Limited 70 5.0 W °C/W °C/W W °C/W °C/W Storage Temperature Range Tstg −65 to +150 °C Minimum ESD Rating (Human Body Model: C = 100 pF, R = 1.5 kW) − 2.0 kV Lead Temperature (Soldering, 10 seconds) − 260 °C Maximum Junction Temperature TJ 150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 LM2576 OPERATING RATINGS (Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.) Rating Symbol Value Unit Operating Junction Temperature Range TJ −40 to +125 °C Supply Voltage Vin 40 V SYSTEM PARAMETERS (Note 1 Test Circuit Figure 15) ELECTRICAL CHARACTERISTICS (Unless otherwise specified, Vin = 12 V for the 3.3 V, 5.0 V, and Adjustable version, Vin = 25 V for the 12 V version, and Vin = 30 V for the 15 V version. ILoad = 500 mA. For typical values TJ = 25°C, for min/max values TJ is the operating junction temperature range that applies Note 2, unless otherwise noted.) Characteristics Symbol Min Typ Max Unit Output Voltage (Vin = 12 V, ILoad = 0.5 A, TJ = 25°C) Vout 3.234 3.3 3.366 V Output Voltage (6.0 V ≤ Vin ≤ 40 V, 0.5 A ≤ ILoad ≤ 3.0 A) TJ = 25°C TJ = −40 to +125°C Vout 3.168 3.135 3.3 − 3.432 3.465 η − 75 − % Output Voltage (Vin = 12 V, ILoad = 0.5 A, TJ = 25°C) Vout 4.9 5.0 5.1 V Output Voltage (8.0 V ≤ Vin ≤ 40 V, 0.5 A ≤ ILoad ≤ 3.0 A) TJ = 25°C TJ = −40 to +125°C Vout 4.8 4.75 5.0 − 5.2 5.25 η − 77 − % Output Voltage (Vin = 25 V, ILoad = 0.5 A, TJ = 25°C) Vout 11.76 12 12.24 V Output Voltage (15 V ≤ Vin ≤ 40 V, 0.5 A ≤ ILoad ≤ 3.0 A) TJ = 25°C TJ = −40 to +125°C Vout 11.52 11.4 12 − 12.48 12.6 η − 88 − % Output Voltage (Vin = 30 V, ILoad = 0.5 A, TJ = 25°C) Vout 14.7 15 15.3 V Output Voltage (18 V ≤ Vin ≤ 40 V, 0.5 A ≤ ILoad ≤ 3.0 A) TJ = 25°C TJ = −40 to +125°C Vout 14.4 14.25 15 − 15.6 15.75 η − 88 − % Feedback Voltage (Vin = 12 V, ILoad = 0.5 A, Vout = 5.0 V, TJ = 25°C) Vout 1.217 1.23 1.243 V Feedback Voltage (8.0 V ≤ Vin ≤ 40 V, 0.5 A ≤ ILoad ≤ 3.0 A, Vout = 5.0 V) TJ = 25°C TJ = −40 to +125°C Vout 1.193 1.18 1.23 − 1.267 1.28 − 77 − LM2576−3.3 (Note 1 Test Circuit Figure 15) Efficiency (Vin = 12 V, ILoad = 3.0 A) V LM2576−5 (Note 1 Test Circuit Figure 15) Efficiency (Vin = 12 V, ILoad = 3.0 A) V LM2576−12 (Note 1 Test Circuit Figure 15) Efficiency (Vin = 15 V, ILoad = 3.0 A) V LM2576−15 (Note 1 Test Circuit Figure 15) Efficiency (Vin = 18 V, ILoad = 3.0 A) V LM2576 ADJUSTABLE VERSION (Note 1 Test Circuit Figure 15) Efficiency (Vin = 12 V, ILoad = 3.0 A, Vout = 5.0 V) η V % 1. External components such as the catch diode, inductor, input and output capacitors can affect switching regulator system performance. When the LM2576 is used as shown in the Figure 15 test circuit, system performance will be as shown in system parameters section. Thigh = +125°C 2. Tested junction temperature range for the LM2576: Tlow = −40°C www.onsemi.com 3 LM2576 DEVICE PARAMETERS ELECTRICAL CHARACTERISTICS (Unless otherwise specified, Vin = 12 V for the 3.3 V, 5.0 V, and Adjustable version, Vin = 25 V for the 12 V version, and Vin = 30 V for the 15 V version. ILoad = 500 mA. For typical values TJ = 25°C, for min/max values TJ is the operating junction temperature range that applies [Note 2], unless otherwise noted.) Characteristics Symbol Min Typ Max − − 25 − 100 200 − 47 42 52 − − − 58 63 − − 1.5 − 1.8 2.0 94 98 − 4.2 3.5 5.8 − 6.9 7.5 − − 0.8 6.0 2.0 20 − − 5.0 − 9.0 11 − − 80 − 200 400 Unit ALL OUTPUT VOLTAGE VERSIONS Feedback Bias Current (Vout = 5.0 V Adjustable Version Only) TJ = 25°C TJ = −40 to +125°C Ib Oscillator Frequency Note 3 TJ = 25°C TJ = 0 to +125°C TJ = −40 to +125°C fosc Saturation Voltage (Iout = 3.0 A Note 4) TJ = 25°C TJ = −40 to +125°C Vsat Max Duty Cycle (“on”) Note 5 DC Current Limit (Peak Current Notes 3 and 4) TJ = 25°C TJ = −40 to +125°C ICL Output Leakage Current Notes 6 and 7, TJ = 25°C Output = 0 V Output = −1.0 V IL Quiescent Current Note 6 TJ = 25°C TJ = −40 to +125°C IQ Standby Quiescent Current (ON/OFF Pin = 5.0 V (“off”)) TJ = 25°C TJ = −40 to +125°C Istby ON/OFF Pin Logic Input Level (Test Circuit Figure 15) Vout = 0 V TJ = 25°C TJ = −40 to +125°C Vout = Nominal Output Voltage TJ = 25°C TJ = −40 to +125°C nA kHz V % A mA mA mA V VIH VIL ON/OFF Pin Input Current (Test Circuit Figure 15) ON/OFF Pin = 5.0 V (“off”), TJ = 25°C ON/OFF Pin = 0 V (“on”), TJ = 25°C IIH IIL 2.2 2.4 1.4 − − − − − 1.2 − 1.0 0.8 − − 15 0 30 5.0 mA 3. The oscillator frequency reduces to approximately 18 kHz in the event of an output short or an overload which causes the regulated output voltage to drop approximately 40% from the nominal output voltage. This self protection feature lowers the average dissipation of the IC by lowering the minimum duty cycle from 5% down to approximately 2%. 4. Output (Pin 2) sourcing current. No diode, inductor or capacitor connected to output pin. 5. Feedback (Pin 4) removed from output and connected to 0 V. 6. Feedback (Pin 4) removed from output and connected to +12 V for the Adjustable, 3.3 V, and 5.0 V versions, and +25 V for the 12 V and 15 V versions, to force the output transistor “off”. 7. Vin = 40 V. www.onsemi.com 4 LM2576 TYPICAL PERFORMANCE CHARACTERISTICS (Circuit of Figure 15) 1.4 Vout , OUTPUT VOLTAGE CHANGE (%) Vout , OUTPUT VOLTAGE CHANGE (%) 1.0 Vin = 20 V ILoad = 500 mA Normalized at TJ = 25°C 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1.0 -50 -25 0 25 50 75 100 1.2 0.8 0.4 0.2 -0.2 -0.4 0 5.0 10 15 20 25 30 TJ, JUNCTION TEMPERATURE (°C) Vin, INPUT VOLTAGE (V) Figure 2. Normalized Output Voltage Figure 3. Line Regulation 40 Vin = 25 V I O, OUTPUT CURRENT (A) ILoad = 3.0 A 1.5 1.0 ILoad = 500 mA 0.5 L1 = 150 mH Rind = 0.1 W 0 -50 -25 0 25 50 75 100 4.5 -25 0 25 50 75 Figure 4. Dropout Voltage Figure 5. Current Limit 16 14 ILoad = 3.0 A 12 10 ILoad = 200 mA 6.0 5.0 5.0 TJ, JUNCTION TEMPERATURE (°C) 18 0 5.5 TJ, JUNCTION TEMPERATURE (°C) Vout = 5.0 V Measured at Ground Pin TJ = 25°C 8.0 6.0 4.0 -50 125 20 4.0 35 6.5 I stby , STANDBY QUIESCENT CURRENT (μA) INPUT - OUTPUT DIFFERENTIAL (V) 12 V and 15 V 0 2.0 I Q, QUIESCENT CURRENT (mA) 3.3 V, 5.0 V and ADJ 0.6 -0.6 125 ILoad = 500 mA TJ = 25°C 1.0 10 15 20 25 30 35 40 100 200 180 VON/OFF = 5.0 V 160 140 Vin = 40 V 120 100 80 Vin = 12 V 60 40 20 0 -50 -25 0 25 50 75 100 Vin, INPUT VOLTAGE (V) TJ, JUNCTION TEMPERATURE (°C) Figure 6. Quiescent Current Figure 7. Standby Quiescent Current www.onsemi.com 5 125 125 LM2576 200 1.6 180 Vsat , SATURATION VOLTAGE (V) I stby , STANDBY QUIESCENT CURRENT (μA) TYPICAL PERFORMANCE CHARACTERISTICS (Circuit of Figure 15) 160 TJ = 25°C 140 120 100 80 60 40 20 0 1.4 1.2 -40°C 1.0 0.8 25°C 0.6 125°C 0.4 0.2 0 0 5 10 15 20 25 35 30 40 0 0.5 1.0 Vin, INPUT VOLTAGE (V) 4.5 V in, INPUT VOLTAGE (V) Vin = 12 V Normalized at 25°C 0 -2.0 -4.0 -6.0 -8.0 Adjustable Version Only 4.0 3.5 3.0 2.5 2.0 Vout ' 1.23 V ILoad = 500 mA 1.5 1.0 0.5 -25 0 25 50 75 100 0 -50 125 -25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 10. Oscillator Frequency Figure 11. Minimum Operating Voltage 100 Ib , FEEDBACK PIN CURRENT (nA) NORMALIZED FREQUENCY (%) 5.0 6.0 -10 -50 3.0 Figure 9. Switch Saturation Voltage 8.0 2.0 2.5 2.0 SWITCH CURRENT (A) Figure 8. Standby Quiescent Current 4.0 1.5 80 Adjustable Version Only 60 40 20 0 -20 -40 -60 -80 -100 -50 -25 0 25 50 75 TJ, JUNCTION TEMPERATURE (°C) Figure 12. Feedback Pin Current www.onsemi.com 6 100 125 125 LM2576 TYPICAL PERFORMANCE CHARACTERISTICS (Circuit of Figure 15) A 50 V 100 mV Output 0 Voltage Change - 100 mV 0 4.0 A B 2.0 A 0 C D 4.0 A 3.0 A 2.0 A Load 2.0 A Current 1.0 A 0 0 5 ms/DIV 100 ms/DIV Figure 13. Switching Waveforms Figure 14. Load Transient Response Vout = 15 V A: Output Pin Voltage, 10 V/DIV B: Inductor Current, 2.0 A/DIV C: Inductor Current, 2.0 A/DIV, AC−Coupled D: Output Ripple Voltage, 50 mV/dDIV, AC−Coupled Horizontal Time Base: 5.0 ms/DIV www.onsemi.com 7 LM2576 Fixed Output Voltage Versions Feedback Vin 1 GN D 3 7.0 V - 40 V Unregulated DC Input 4 LM2576 Fixed Output Cin 100 mF L1 100 mH Output 2 ON/OFF 5 D1 MBR360 Cin Cout D1 L1 R1 R2 − − − − − − Vout Cout 1000 mF Load 100 mF, 75 V, Aluminium Electrolytic 1000 mF, 25 V, Aluminium Electrolytic Schottky, MBR360 100 mH, Pulse Eng. PE−92108 2.0 k, 0.1% 6.12 k, 0.1% Adjustable Output Voltage Versions Feedback Vin LM2576 Adjustable 1 3 7.0 V - 40 V Unregulated DC Input Cin 100 mF GN D 5 4 L1 100 mH Output Vout 5,000 V 2 ON/OFF D1 MBR360 Cout 1000 mF R2 Load R1 V out + V ǒ R2 + R1 ǒ1.0 ) R2 Ǔ R1 ref V out V ref Ǔ –1.0 Where Vref = 1.23 V, R1 between 1.0 k and 5.0 k Figure 15. Typical Test Circuit PCB LAYOUT GUIDELINES On the other hand, the PCB area connected to the Pin 2 (emitter of the internal switch) of the LM2576 should be kept to a minimum in order to minimize coupling to sensitive circuitry. Another sensitive part of the circuit is the feedback. It is important to keep the sensitive feedback wiring short. To assure this, physically locate the programming resistors near to the regulator, when using the adjustable version of the LM2576 regulator. As in any switching regulator, the layout of the printed circuit board is very important. Rapidly switching currents associated with wiring inductance, stray capacitance and parasitic inductance of the printed circuit board traces can generate voltage transients which can generate electromagnetic interferences (EMI) and affect the desired operation. As indicated in the Figure 15, to minimize inductance and ground loops, the length of the leads indicated by heavy lines should be kept as short as possible. For best results, single−point grounding (as indicated) or ground plane construction should be used. www.onsemi.com 8 LM2576 PIN FUNCTION DESCRIPTION Pin Symbol 1 Vin This pin is the positive input supply for the LM2576 step−down switching regulator. In order to minimize voltage transients and to supply the switching currents needed by the regulator, a suitable input bypass capacitor must be present (Cin in Figure 1). 2 Output This is the emitter of the internal switch. The saturation voltage Vsat of this output switch is typically 1.5 V. It should be kept in mind that the PCB area connected to this pin should be kept to a minimum in order to minimize coupling to sensitive circuitry. 3 GND 4 Feedback This pin senses regulated output voltage to complete the feedback loop. The signal is divided by the internal resistor divider network R2, R1 and applied to the non−inverting input of the internal error amplifier. In the Adjustable version of the LM2576 switching regulator this pin is the direct input of the error amplifier and the resistor network R2, R1 is connected externally to allow programming of the output voltage. 5 ON/OFF It allows the switching regulator circuit to be shut down using logic level signals, thus dropping the total input supply current to approximately 80 mA. The threshold voltage is typically 1.4 V. Applying a voltage above this value (up to +Vin) shuts the regulator off. If the voltage applied to this pin is lower than 1.4 V or if this pin is left open, the regulator will be in the “on” condition. Description (Refer to Figure 1) Circuit ground pin. See the information about the printed circuit board layout. DESIGN PROCEDURE Buck Converter Basics The LM2576 is a “Buck” or Step−Down Converter which is the most elementary forward−mode converter. Its basic schematic can be seen in Figure 16. The operation of this regulator topology has two distinct time periods. The first one occurs when the series switch is on, the input voltage is connected to the input of the inductor. The output of the inductor is the output voltage, and the rectifier (or catch diode) is reverse biased. During this period, since there is a constant voltage source connected across the inductor, the inductor current begins to linearly ramp upwards, as described by the following equation: I L(on) + I For the buck converter with ideal components, the duty cycle can also be described as: V d + out V in L Figure 17 shows the buck converter, idealized waveforms of the catch diode voltage and the inductor current. Von(SW) Cout Diode Voltage L D L t d + on , where T is the period of switching. T During this “on” period, energy is stored within the core material in the form of magnetic flux. If the inductor is properly designed, there is sufficient energy stored to carry the requirements of the load during the “off” period. Vin + This period ends when the power switch is once again turned on. Regulation of the converter is accomplished by varying the duty cycle of the power switch. It is possible to describe the duty cycle as follows: ǒVin – VoutǓ ton Power Switch L(off) ǒVout – VDǓ toff RLoad Power Switch Off VD(FWD) Power Switch On Power Switch Off Power Switch On Time Figure 16. Basic Buck Converter Inductor Current The next period is the “off” period of the power switch. When the power switch turns off, the voltage across the inductor reverses its polarity and is clamped at one diode voltage drop below ground by the catch diode. The current now flows through the catch diode thus maintaining the load current loop. This removes the stored energy from the inductor. The inductor current during this time is: Ipk ILoad(AV) Imin Diode Power Switch Diode Power Switch Time Figure 17. Buck Converter Idealized Waveforms www.onsemi.com 9 LM2576 Procedure (Fixed Output Voltage Version) In order to simplify the switching regulator design, a step−by−step design procedure and some examples are provided. Procedure Example Given Parameters: Vout = Regulated Output Voltage (3.3 V, 5.0 V, 12 V or 15 V) Vin(max) = Maximum Input Voltage ILoad(max) = Maximum Load Current Given Parameters: Vout = 5.0 V Vin(max) = 15 V ILoad(max) = 3.0 A 1. Controller IC Selection According to the required input voltage, output voltage and current, select the appropriate type of the controller IC output voltage version. 1. Controller IC Selection According to the required input voltage, output voltage, current polarity and current value, use the LM2576−5 controller IC 2. Input Capacitor Selection (Cin) To prevent large voltage transients from appearing at the input and for stable operation of the converter, an aluminium or tantalum electrolytic bypass capacitor is needed between the input pin +Vin and ground pin GND. This capacitor should be located close to the IC using short leads. This capacitor should have a low ESR (Equivalent Series Resistance) value. 2. Input Capacitor Selection (Cin) A 100 mF, 25 V aluminium electrolytic capacitor located near to the input and ground pins provides sufficient bypassing. 3. Catch Diode Selection (D1) A. Since the diode maximum peak current exceeds the regulator maximum load current the catch diode current rating must be at least 1.2 times greater than the maximum load current. For a robust design the diode should have a current rating equal to the maximum current limit of the LM2576 to be able to withstand a continuous output short B. The reverse voltage rating of the diode should be at least 1.25 times the maximum input voltage. 3. Catch Diode Selection (D1) A. For this example the current rating of the diode is 3.0 A. 4. Inductor Selection (L1) A. According to the required working conditions, select the correct inductor value using the selection guide from Figures 18 to 22. B. From the appropriate inductor selection guide, identify the inductance region intersected by the Maximum Input Voltage line and the Maximum Load Current line. Each region is identified by an inductance value and an inductor code. C. Select an appropriate inductor from the several different manufacturers part numbers listed in Table 2. The designer must realize that the inductor current rating must be higher than the maximum peak current flowing through the inductor. This maximum peak current can be calculated as follows: 4. Inductor Selection (L1) A. Use the inductor selection guide shown in Figures 19. I p(max) +I Load(max) ) B. Use a 20 V 1N5820 Schottky diode, or any of the suggested fast recovery diodes shown in Table 1. B. From the selection guide, the inductance area intersected by the 15 V line and 3.0 A line is L100. C. Inductor value required is 100 mH. From Table 2, choose an inductor from any of the listed manufacturers. ǒVin–VoutǓ ton 2L where ton is the “on” time of the power switch and V ton + out x 1.0 fosc V in For additional information about the inductor, see the inductor section in the “Application Hints” section of this data sheet. www.onsemi.com 10 LM2576 Procedure (Fixed Output Voltage Version) (continued)In order to simplify the switching regulator design, a step−by−step design procedure and some examples are provided. Procedure Example 5. Output Capacitor Selection (Cout) A. Since the LM2576 is a forward−mode switching regulator with voltage mode control, its open loop 2−pole−1−zero frequency characteristic has the dominant pole−pair determined by the output capacitor and inductor values. For stable operation and an acceptable ripple voltage, (approximately 1% of the output voltage) a value between 680 mF and 2000 mF is recommended. B. Due to the fact that the higher voltage electrolytic capacitors generally have lower ESR (Equivalent Series Resistance) numbers, the output capacitor’s voltage rating should be at least 1.5 times greater than the output voltage. For a 5.0 V regulator, a rating at least 8.0 V is appropriate, and a 10 V or 16 V rating is recommended. 5. Output Capacitor Selection (Cout) A. Cout = 680 mF to 2000 mF standard aluminium electrolytic. B. Capacitor voltage rating = 20 V. Procedure (Adjustable Output Version: LM2576−ADJ) Procedure Example Given Parameters: Vout = Regulated Output Voltage Vin(max) = Maximum DC Input Voltage ILoad(max) = Maximum Load Current Given Parameters: Vout = 8.0 V Vin(max) = 25 V ILoad(max) = 2.5 A 1. Programming Output Voltage To select the right programming resistor R1 and R2 value (see Figure 2) use the following formula: 1. Programming Output Voltage (selecting R1 and R2) Select R1 and R2: ǒ Ǔ R2 1.0 ) V out + V ref R1 ǒ V out + 1.23 1.0 ) ǒ where Vref = 1.23 V R2 + R1 Resistor R1 can be between 1.0 k and 5.0 kW. (For best temperature coefficient and stability with time, use 1% metal film resistors). V out R2 + R1 – 1.0 V ref ǒ V out V ref Ǔ R2 R1 Ǔ * 1.0 Select R1 = 1.8 kW + 1.8 k ǒ Ǔ 8.0 V * 1.0 1.23 V R2 = 9.91 kW, choose a 9.88 k metal film resistor. Ǔ 2. Input Capacitor Selection (Cin) To prevent large voltage transients from appearing at the input and for stable operation of the converter, an aluminium or tantalum electrolytic bypass capacitor is needed between the input pin +Vin and ground pin GND This capacitor should be located close to the IC using short leads. This capacitor should have a low ESR (Equivalent Series Resistance) value. 2. Input Capacitor Selection (Cin) A 100 mF, 150 V aluminium electrolytic capacitor located near the input and ground pin provides sufficient bypassing. For additional information see input capacitor section in the “Application Hints” section of this data sheet. 3. Catch Diode Selection (D1) A. Since the diode maximum peak current exceeds the regulator maximum load current the catch diode current rating must be at least 1.2 times greater than the maximum load current. For a robust design, the diode should have a current rating equal to the maximum current limit of the LM2576 to be able to withstand a continuous output short. B. The reverse voltage rating of the diode should be at least 1.25 times the maximum input voltage. 3. Catch Diode Selection (D1) A. For this example, a 3.0 A current rating is adequate. B. Use a 30 V 1N5821 Schottky diode or any suggested fast recovery diode in the Table 1. www.onsemi.com 11 LM2576 Procedure (Adjustable Output Version: LM2576−ADJ) (continued) Procedure Example 4. Inductor Selection (L1) A. Use the following formula to calculate the inductor Volt x microsecond [V x ms] constant: V out 6 x 10 [V x ms] E x T + V – V out in F[Hz] V in B. Match the calculated E x T value with the corresponding number on the vertical axis of the Inductor Value Selection Guide shown in Figure 22. This E x T constant is a measure of the energy handling capability of an inductor and is dependent upon the type of core, the core area, the number of turns, and the duty cycle. C. Next step is to identify the inductance region intersected by the E x T value and the maximum load current value on the horizontal axis shown in Figure 25. D. From the inductor code, identify the inductor value. Then select an appropriate inductor from Table 2. The inductor chosen must be rated for a switching frequency of 52 kHz and for a current rating of 1.15 x ILoad. The inductor current rating can also be determined by calculating the inductor peak current: V – V out t on in +I ) I p(max) Load(max) 2L ǒ 4. Inductor Selection (L1) A. Calculate E x T [V x ms] constant: Ǔ ǒ E x T + ǒ25 – 8.0Ǔ x 8.0 x 1000 + 80 [V x ms] 52 25 B. E x T = 80 [V x ms] C. ILoad(max) = 2.5 A Inductance Region = H150 D. Proper inductor value = 150 mH Choose the inductor from Table 2. Ǔ where ton is the “on” time of the power switch and V out x 1.0 f osc in For additional information about the inductor, see the inductor section in the “External Components” section of this data sheet. t on + V 5. Output Capacitor Selection (Cout) A. Since the LM2576 is a forward−mode switching regulator with voltage mode control, its open loop 2−pole−1−zero frequency characteristic has the dominant pole−pair determined by the output capacitor and inductor values. 5. Output Capacitor Selection (Cout) A. Cout w 13, 300 x 25 + 332.5 μF 8 x 150 To achieve an acceptable ripple voltage, select Cout = 680 mF electrolytic capacitor. For stable operation, the capacitor must satisfy the following requirement: V in(max) [μF] Cout w 13, 300 V out x L [μH] B. Capacitor values between 10 mF and 2000 mF will satisfy the loop requirements for stable operation. To achieve an acceptable output ripple voltage and transient response, the output capacitor may need to be several times larger than the above formula yields. C. Due to the fact that the higher voltage electrolytic capacitors generally have lower ESR (Equivalent Series Resistance) numbers, the output capacitor’s voltage rating should be at least 1.5 times greater than the output voltage. For a 5.0 V regulator, a rating of at least 8.0 V is appropriate, and a 10 V or 16 V rating is recommended. www.onsemi.com 12 LM2576 LM2576 Series Buck Regulator Design Procedures (continued) 60 40 20 15 L680 60 L470 MAXIMUM INPUT VOLTAGE (V) MAXIMUM INPUT VOLTAGE (V) Indicator Value Selection Guide (For Continuous Mode Operation) L330 10 8.0 L220 L150 7.0 L100 L68 6.0 L47 40 H1000 20 15 H680 H470 H330 H220 H150 L680 L470 12 L330 L220 10 L150 9.0 L100 8.0 L68 L47 0.4 0.5 0.6 1.0 0.8 2.0 1.5 7.0 0.3 2.5 3.0 1.5 2.0 Figure 19. LM2576−5 40 35 30 H680 H470 H330 20 H220 MAXIMUM INPUT VOLTAGE (V) 60 H150 18 L470 0.8 1.0 1.2 0.6 Figure 18. LM2576−3.3 40 35 30 H1500 25 H1000 L680 0.5 IL, MAXIMUM LOAD CURRENT (A) 60 16 0.4 IL, MAXIMUM LOAD CURRENT (A) L330 L220 L150 15 L100 14 0.3 0.4 0.5 0.6 0.8 1.0 1.5 2.0 H1000 25 H680 H470 22 H330 H220 H150 20 19 L680 L470 L330 L220 18 L150 L100 L68 17 0.3 2.5 3.0 0.4 0.5 0.6 0.8 1.0 1.5 IL, MAXIMUM LOAD CURRENT (A) IL, MAXIMUM LOAD CURRENT (A) Figure 20. LM2576−12 Figure 21. LM2576−15 300 250 200 H2000 H1500 H1000 H680 150 100 90 80 70 60 50 45 40 35 30 25 20 0.3 L680 L470 L330 L220 H470 L150 H330 H220 L100 H150 L68 L47 0.4 0.5 2.5 3.0 H1500 L68 ET, VOLTAGE TIME (Vμ s) MAXIMUM INPUT VOLTAGE (V) 5.0 0.3 0.6 0.8 1.0 1.5 IL, MAXIMUM LOAD CURRENT (A) Figure 22. LM2576−ADJ www.onsemi.com 13 2.0 2.5 3.0 2.0 2.5 3.0 LM2576 Table 1. Diode Selection Guide Schottky 3.0 A Fast Recovery 4.0 − 6.0 A 3.0 A Through Hole Surface Mount Through Hole 20 V 1N5820 MBR320P SR302 SK32 1N5823 SR502 SB520 30 V 1N5821 MBR330 SR303 31DQ03 SK33 30WQ03 1N5824 SR503 SB530 50WQ03 1N5822 MBR340 SR304 31DQ04 SK34 30WQ04 MBRS340T3 MBRD340 1N5825 SR504 SB540 MBRD640CT 50WQ04 50 V MBR350 31DQ05 SR305 SK35 30WQ05 SB550 50WQ05 60 V MBR360 DQ06 SR306 MBRS360T3 MBRD360 50SQ080 MBRD660CT VR 40 V Surface Mount 4.0 − 6.0 A Through Hole Surface Mount Through Hole Surface Mount MUR320 31DF1 HER302 MURS320T3 MURD320 30WF10 MUR420 HER602 MURD620CT 50WF10 (all diodes rated to at least 100 V) (all diodes rated to at least 100 V) (all diodes rated to at least 100 V) (all diodes rated to at least 100 V) NOTE: Diodes listed in bold are available from onsemi. Table 2. Inductor Selection by Manufacturer’s Part Number Inductor Code Inductor Value Tech 39 Schott Corp. Pulse Eng. Renco L47 47 mH 77 212 671 26980 PE−53112 RL2442 L68 68 mH 77 262 671 26990 PE−92114 RL2443 L100 100 mH 77 312 671 27000 PE−92108 RL2444 L150 150 mH 77 360 671 27010 PE−53113 RL1954 L220 220 mH 77 408 671 27020 PE−52626 RL1953 L330 330 mH 77 456 671 27030 PE−52627 RL1952 L470 470 mH * 671 27040 PE−53114 RL1951 L680 680 mH 77 506 671 27050 PE−52629 RL1950 H150 150 mH 77 362 671 27060 PE−53115 RL2445 H220 220 mH 77 412 671 27070 PE−53116 RL2446 H330 330 mH 77 462 671 27080 PE−53117 RL2447 H470 470 mH * 671 27090 PE−53118 RL1961 H680 680 mH 77 508 671 27100 PE−53119 RL1960 H1000 1000 mH 77 556 671 27110 PE−53120 RL1959 H1500 1500 mH * 671 27120 PE−53121 RL1958 H2200 2200 mH * 671 27130 PE−53122 RL2448 NOTE: *Contact Manufacturer www.onsemi.com 14 LM2576 Table 3. Example of Several Inductor Manufacturers Phone/Fax Numbers Pulse Engineering, Inc. Phone Fax + 1−619−674−8100 + 1−619−674−8262 Pulse Engineering, Inc. Europe Phone Fax + 353−9324−107 + 353−9324−459 Renco Electronics, Inc. Phone Fax + 1−516−645−5828 + 1−516−586−5562 Tech 39 Phone Fax + 33−1−4115−1681 + 33−1−4709−5051 Schott Corporation Phone Fax + 1−612−475−1173 + 1−612−475−1786 EXTERNAL COMPONENTS Input Capacitor (Cin) The Input Capacitor Should Have a Low ESR Output Capacitor (Cout) For low output ripple voltage and good stability, low ESR output capacitors are recommended. An output capacitor has two main functions: it filters the output and provides regulator loop stability. The ESR of the output capacitor and the peak−to−peak value of the inductor ripple current are the main factors contributing to the output ripple voltage value. Standard aluminium electrolytics could be adequate for some applications but for quality design, low ESR types are recommended. An aluminium electrolytic capacitor’s ESR value is related to many factors such as the capacitance value, the voltage rating, the physical size and the type of construction. In most cases, the higher voltage electrolytic capacitors have lower ESR value. Often capacitors with much higher voltage ratings may be needed to provide low ESR values that, are required for low output ripple voltage. For stable operation of the switch mode converter a low ESR (Equivalent Series Resistance) aluminium or solid tantalum bypass capacitor is needed between the input pin and the ground pin, to prevent large voltage transients from appearing at the input. It must be located near the regulator and use short leads. With most electrolytic capacitors, the capacitance value decreases and the ESR increases with lower temperatures. For reliable operation in temperatures below −25°C larger values of the input capacitor may be needed. Also paralleling a ceramic or solid tantalum capacitor will increase the regulator stability at cold temperatures. RMS Current Rating of Cin The important parameter of the input capacitor is the RMS current rating. Capacitors that are physically large and have large surface area will typically have higher RMS current ratings. For a given capacitor value, a higher voltage electrolytic capacitor will be physically larger than a lower voltage capacitor, and thus be able to dissipate more heat to the surrounding air, and therefore will have a higher RMS current rating. The consequence of operating an electrolytic capacitor beyond the RMS current rating is a shortened operating life. In order to assure maximum capacitor operating lifetime, the capacitor’s RMS ripple current rating should be: The Output Capacitor Requires an ESR Value That Has an Upper and Lower Limit As mentioned above, a low ESR value is needed for low output ripple voltage, typically 1% to 2% of the output voltage. But if the selected capacitor’s ESR is extremely low (below 0.05 W), there is a possibility of an unstable feedback loop, resulting in oscillation at the output. This situation can occur when a tantalum capacitor, that can have a very low ESR, is used as the only output capacitor. At Low Temperatures, Put in Parallel Aluminium Electrolytic Capacitors with Tantalum Capacitors Irms > 1.2 x d x ILoad Electrolytic capacitors are not recommended for temperatures below −25°C. The ESR rises dramatically at cold temperatures and typically rises 3 times at −25°C and as much as 10 times at −40°C. Solid tantalum capacitors have much better ESR spec at cold temperatures and are recommended for temperatures below −25°C. They can be also used in parallel with aluminium electrolytics. The value of the tantalum capacitor should be about 10% or 20% of the total capacitance. The output capacitor should have at least 50% higher RMS ripple current rating at 52 kHz than the peak−to−peak inductor ripple current. where d is the duty cycle, for a buck regulator V t d + on + out V T in |V out| t on and d + + for a buck*boost regulator. T |V out| ) V in www.onsemi.com 15 LM2576 Catch Diode Locate the Catch Diode Close to the LM2576 The LM2576 is a step−down buck converter; it requires a fast diode to provide a return path for the inductor current when the switch turns off. This diode must be located close to the LM2576 using short leads and short printed circuit traces to avoid EMI problems. Use a Schottky or a Soft Switching Ultra−Fast Recovery Diode Since the rectifier diodes are very significant sources of losses within switching power supplies, choosing the rectifier that best fits into the converter design is an important process. Schottky diodes provide the best performance because of their fast switching speed and low forward voltage drop. They provide the best efficiency especially in low output voltage applications (5.0 V and lower). Another choice could be Fast−Recovery, or Ultra−Fast Recovery diodes. It has to be noted, that some types of these diodes with an abrupt turnoff characteristic may cause instability or EMI troubles. A fast−recovery diode with soft recovery characteristics can better fulfill some quality, low noise design requirements. Table 1 provides a list of suitable diodes for the LM2576 regulator. Standard 50/60 Hz rectifier diodes, such as the 1N4001 series or 1N5400 series are NOT suitable. VERTRICAL RESOLUTION 1.0 A/DIV ripple voltage. On the other hand it does require larger inductor values to keep the inductor current flowing continuously, especially at low output load currents and/or high input voltages. To simplify the inductor selection process, an inductor selection guide for the LM2576 regulator was added to this data sheet (Figures 18 through 22). This guide assumes that the regulator is operating in the continuous mode, and selects an inductor that will allow a peak−to−peak inductor ripple current to be a certain percentage of the maximum design load current. This percentage is allowed to change as different design load currents are selected. For light loads (less than approximately 300 mA) it may be desirable to operate the regulator in the discontinuous mode, because the inductor value and size can be kept relatively low. Consequently, the percentage of inductor peak−to−peak current increases. This discontinuous mode of operation is perfectly acceptable for this type of switching converter. Any buck regulator will be forced to enter discontinuous mode if the load current is light enough. 2.0 A Inductor Current Waveform 0A Inductor The magnetic components are the cornerstone of all switching power supply designs. The style of the core and the winding technique used in the magnetic component’s design has a great influence on the reliability of the overall power supply. Using an improper or poorly designed inductor can cause high voltage spikes generated by the rate of transitions in current within the switching power supply, and the possibility of core saturation can arise during an abnormal operational mode. Voltage spikes can cause the semiconductors to enter avalanche breakdown and the part can instantly fail if enough energy is applied. It can also cause significant RFI (Radio Frequency Interference) and EMI (Electro−Magnetic Interference) problems. 2.0 A Power Switch Current Waveform 0A HORIZONTAL TIME BASE: 5.0 ms/DIV Figure 23. Continuous Mode Switching Current Waveforms Selecting the Right Inductor Style Some important considerations when selecting a core type are core material, cost, the output power of the power supply, the physical volume the inductor must fit within, and the amount of EMI (Electro−Magnetic Interference) shielding that the core must provide. The inductor selection guide covers different styles of inductors, such as pot core, E−core, toroid and bobbin core, as well as different core materials such as ferrites and powdered iron from different manufacturers. For high quality design regulators the toroid core seems to be the best choice. Since the magnetic flux is contained within the core, it generates less EMI, reducing noise problems in sensitive circuits. The least expensive is the bobbin core type, which consists of wire wound on a ferrite rod core. This type of inductor generates more EMI due to the fact that its core is open, and the magnetic flux is not contained within the core. Continuous and Discontinuous Mode of Operation The LM2576 step−down converter can operate in both the continuous and the discontinuous modes of operation. The regulator works in the continuous mode when loads are relatively heavy, the current flows through the inductor continuously and never falls to zero. Under light load conditions, the circuit will be forced to the discontinuous mode when inductor current falls to zero for certain period of time (see Figure 23 and Figure 24). Each mode has distinctively different operating characteristics, which can affect the regulator performance and requirements. In many cases the preferred mode of operation is the continuous mode. It offers greater output power, lower peak currents in the switch, inductor and diode, and can have a lower output www.onsemi.com 16 LM2576 When multiple switching regulators are located on the same printed circuit board, open core magnetics can cause interference between two or more of the regulator circuits, especially at high currents due to mutual coupling. A toroid, pot core or E−core (closed magnetic structure) should be used in such applications. Do Not Operate an Inductor Beyond its Maximum Rated Current VERTICAL RESOLUTION 200 mA/DIV inductor and/or the LM2576. Different inductor types have different saturation characteristics, and this should be kept in mind when selecting an inductor. 0.4 A Inductor Current Waveform 0A Exceeding an inductor’s maximum current rating may cause the inductor to overheat because of the copper wire losses, or the core may saturate. Core saturation occurs when the flux density is too high and consequently the cross sectional area of the core can no longer support additional lines of magnetic flux. This causes the permeability of the core to drop, the inductance value decreases rapidly and the inductor begins to look mainly resistive. It has only the DC resistance of the winding. This can cause the switch current to rise very rapidly and force the LM2576 internal switch into cycle−by−cycle current limit, thus reducing the DC output load current. This can also result in overheating of the 0.4 A Power Switch Current Waveform 0A HORIZONTAL TIME BASE: 5.0 ms/DIV Figure 24. Discontinuous Mode Switching Current Waveforms GENERAL RECOMMENDATIONS Output Voltage Ripple and Transients Source of the Output Ripple Minimizing the Output Ripple In order to minimize the output ripple voltage it is possible to enlarge the inductance value of the inductor L1 and/or to use a larger value output capacitor. There is also another way to smooth the output by means of an additional LC filter (20 mH, 100 mF), that can be added to the output (see Figure 34) to further reduce the amount of output ripple and transients. With such a filter it is possible to reduce the output ripple voltage transients 10 times or more. Figure 25 shows the difference between filtered and unfiltered output waveforms of the regulator shown in Figure 34. The lower waveform is from the normal unfiltered output of the converter, while the upper waveform shows the output ripple voltage filtered by an additional LC filter. Since the LM2576 is a switch mode power supply regulator, its output voltage, if left unfiltered, will contain a sawtooth ripple voltage at the switching frequency. The output ripple voltage value ranges from 0.5% to 3% of the output voltage. It is caused mainly by the inductor sawtooth ripple current multiplied by the ESR of the output capacitor. Short Voltage Spikes and How to Reduce Them The regulator output voltage may also contain short voltage spikes at the peaks of the sawtooth waveform (see Figure 25). These voltage spikes are present because of the fast switching action of the output switch, and the parasitic inductance of the output filter capacitor. There are some other important factors such as wiring inductance, stray capacitance, as well as the scope probe used to evaluate these transients, all these contribute to the amplitude of these spikes. To minimize these voltage spikes, low inductance capacitors should be used, and their lead lengths must be kept short. The importance of quality printed circuit board layout design should also be highlighted. Heatsinking and Thermal Considerations The Through−Hole Package TO−220 The LM2576 is available in two packages, a 5−pin TO−220(T, TV) and a 5−pin surface mount D2PAK(D2T). Although the TO−220(T) package needs a heatsink under most conditions, there are some applications that require no heatsink to keep the LM2576 junction temperature within the allowed operating range. Higher ambient temperatures require some heat sinking, either to the printed circuit (PC) board or an external heatsink. Voltage spikes caused by switching action of the output switch and the parasitic inductance of the output capacitor The Surface Mount Package D 2PAK and its Heatsinking The other type of package, the surface mount D2PAK, is designed to be soldered to the copper on the PC board. The copper and the board are the heatsink for this package and the other heat producing components, such as the catch diode and inductor. The PC board copper area that the package is soldered to should be at least 0.4 in2 (or 260 mm2) and ideally should have 2 or more square inches (1300 mm2) of 0.0028 inch copper. Additional increases of copper area VERTRICAL RESOLUTION 20 mV/DIV Filtered Output Voltage Unfiltered Output Voltage HORIZONTAL TIME BASE: 5.0 ms/DIV Figure 25. Output Ripple Voltage Waveforms www.onsemi.com 17 LM2576 beyond approximately 6.0 in2 (4000 mm2) will not improve heat dissipation significantly. If further thermal improvements are needed, double sided or multilayer PC boards with large copper areas should be considered. In order to achieve the best thermal performance, it is highly recommended to use wide copper traces as well as large areas of copper in the printed circuit board layout. The only exception to this is the OUTPUT (switch) pin, which should not have large areas of copper (see page 8 ‘PCB Layout Guideline’). Packages on a Heatsink If the actual operating junction temperature is greater than the selected safe operating junction temperature determined in step 3, than a heatsink is required. The junction temperature will be calculated as follows: TJ = PD (RqJA + RqCS + RqSA) + TA where RqJC is the thermal resistance junction−case, RqCS is the thermal resistance case−heatsink, RqSA is the thermal resistance heatsink−ambient. If the actual operating temperature is greater than the selected safe operating junction temperature, then a larger heatsink is required. Thermal Analysis and Design The following procedure must be performed to determine whether or not a heatsink will be required. First determine: 1. PD(max) maximum regulator power dissipation in the application. 2. TA(max) maximum ambient temperature in the application. 3. TJ(max) maximum allowed junction temperature (125°C for the LM2576). For a conservative design, the maximum junction temperature should not exceed 110°C to assure safe operation. For every additional +10°C temperature rise that the junction must withstand, the estimated operating lifetime of the component is halved. 4. RqJC package thermal resistance junction−case. package thermal resistance junction−ambient. 5. RqJA (Refer to Maximum Ratings on page 2 of this data sheet or RqJC and RqJA values). Some Aspects That can Influence Thermal Design It should be noted that the package thermal resistance and the junction temperature rise numbers are all approximate, and there are many factors that will affect these numbers, such as PC board size, shape, thickness, physical position, location, board temperature, as well as whether the surrounding air is moving or still. Other factors are trace width, total printed circuit copper area, copper thickness, single− or double−sided, multilayer board, the amount of solder on the board or even color of the traces. The size, quantity and spacing of other components on the board can also influence its effectiveness to dissipate the heat. 12 to 40 V Unregulated DC Input The following formula is to calculate the approximate total power dissipated by the LM2576: Cin 100 mF PD = (Vin x IQ) + d x ILoad x Vsat Feedback +Vin LM2576−12 1 3 GN D 5 4 Output 2 ON/OFF where d is the duty cycle and for buck converter L1 68 mH D1 1N5822 Cout 2200 mF -12 V @ 0.7 A Regulated Output V t d + on + O , V T in Figure 26. Inverting Buck−Boost Develops −12 V IQ (quiescent current) and Vsat can be found in the LM2576 data sheet, Vin is minimum input voltage applied, VO is the regulator output voltage, ILoad is the load current. The dynamic switching losses during turn−on and turn−off can be neglected if proper type catch diode is used. ADDITIONAL APPLICATIONS Inverting Regulator An inverting buck−boost regulator using the LM2576−12 is shown in Figure 26. This circuit converts a positive input voltage to a negative output voltage with a common ground by bootstrapping the regulators ground to the negative output voltage. By grounding the feedback pin, the regulator senses the inverted output voltage and regulates it. In this example the LM2576−12 is used to generate a −12 V output. The maximum input voltage in this case cannot exceed +28 V because the maximum voltage appearing across the regulator is the absolute sum of the input and output voltages and this must be limited to a maximum of 40 V. Packages Not on a Heatsink (Free−Standing) For a free−standing application when no heatsink is used, the junction temperature can be determined by the following expression: TJ = (RqJA) (PD) + TA where (RqJA)(PD) represents the junction temperature rise caused by the dissipated power and TA is the maximum ambient temperature. www.onsemi.com 18 LM2576 This circuit configuration is able to deliver approximately 0.7 A to the output when the input voltage is 12 V or higher. At lighter loads the minimum input voltage required drops to approximately 4.7 V, because the buck−boost regulator topology can produce an output voltage that, in its absolute value, is either greater or less than the input voltage. Since the switch currents in this buck−boost configuration are higher than in the standard buck converter topology, the available output current is lower. This type of buck−boost inverting regulator can also require a larger amount of startup input current, even for light loads. This may overload an input power source with a current limit less than 5.0 A. Such an amount of input startup current is needed for at least 2.0 ms or more. The actual time depends on the output voltage and size of the output capacitor. Because of the relatively high startup currents required by this inverting regulator topology, the use of a delayed startup or an undervoltage lockout circuit is recommended. Using a delayed startup arrangement, the input capacitor can charge up to a higher voltage before the switch−mode regulator begins to operate. The high input current needed for startup is now partially supplied by the input capacitor Cin. It has been already mentioned above, that in some situations, the delayed startup or the undervoltage lockout features could be very useful. A delayed startup circuit applied to a buck−boost converter is shown in Figure 27, Figure 33 in the “Undervoltage Lockout” section describes an undervoltage lockout feature for the same converter topology. I (V ) |V |) O ) V in x t on [ Load in 2L 1 V in |V | O where t on + x 1.0 , and f osc + 52 kHz. V ) |V | f osc in O I peak Under normal continuous inductor current operating conditions, the worst case occurs when Vin is minimal. 12 V to 25 V Unregulated DC Input Feedback +Vin LM2576−12 1 Cin 100 mF /50 V C1 0.1 mF 5 R1 47 k ON/OFF 3 4 Output 2 GN D L1 68 mH D1 1N5822 R2 47 k Cout 2200 mF /16 V -12 V @ 700 m A Regulated Output Figure 27. Inverting Buck−Boost Regulator with Delayed startup +Vin +Vin LM2576−XX 1 Shutdown Input 5.0 V 0 Design Recommendations: The inverting regulator operates in a different manner than the buck converter and so a different design procedure has to be used to select the inductor L1 or the output capacitor Cout. The output capacitor values must be larger than what is normally required for buck converter designs. Low input voltages or high output currents require a large value output capacitor (in the range of thousands of mF). The recommended range of inductor values for the inverting converter design is between 68 mH and 220 mH. To select an inductor with an appropriate current rating, the inductor peak current has to be calculated. The following formula is used to obtain the peak inductor current: Cin R1 100 mF 47 k 5 ON/OFF 3 GN D Off On R3 470 R2 47 k -Vout MOC8101 NOTE: This picture does not show the complete circuit. Figure 28. Inverting Buck−Boost Regulator Shutdown Circuit Using an Optocoupler With the inverting configuration, the use of the ON/OFF pin requires some level shifting techniques. This is caused by the fact, that the ground pin of the converter IC is no longer at ground. Now, the ON/OFF pin threshold voltage (1.3 V approximately) has to be related to the negative output voltage level. There are many different possible shut down methods, two of them are shown in Figures 28 and 29. www.onsemi.com 19 LM2576 +V 0 Another important point is that these negative boost converters cannot provide current limiting load protection in the event of a short in the output so some other means, such as a fuse, may be necessary to provide the load protection. Shutdown Input Off On R2 5.6 k +Vin +Vin Delayed Startup 1 Q1 2N3906 There are some applications, like the inverting regulator already mentioned above, which require a higher amount of startup current. In such cases, if the input power source is limited, this delayed startup feature becomes very useful. To provide a time delay between the time when the input voltage is applied and the time when the output voltage comes up, the circuit in Figure 31 can be used. As the input voltage is applied, the capacitor C1 charges up, and the voltage across the resistor R2 falls down. When the voltage on the ON/OFF pin falls below the threshold value 1.3 V, the regulator starts up. Resistor R1 is included to limit the maximum voltage applied to the ON/OFF pin. It reduces the power supply noise sensitivity, and also limits the capacitor C1 discharge current, but its use is not mandatory. When a high 50 Hz or 60 Hz (100 Hz or 120 Hz respectively) ripple voltage exists, a long delay time can cause some problems by coupling the ripple into the ON/OFF pin, the regulator could be switched periodically on and off with the line (or double) frequency. LM2576−XX Cin 100 mF 5 ON/OFF 3 GN D R1 12 k -Vout NOTE: This picture does not show the complete circuit. Figure 29. Inverting Buck−Boost Regulator Shutdown Circuit Using a PNP Transistor Negative Boost Regulator This example is a variation of the buck−boost topology and it is called negative boost regulator. This regulator experiences relatively high switch current, especially at low input voltages. The internal switch current limiting results in lower output load current capability. The circuit in Figure 30 shows the negative boost configuration. The input voltage in this application ranges from −5.0 V to −12 V and provides a regulated −12 V output. If the input voltage is greater than −12 V, the output will rise above −12 V accordingly, but will not damage the regulator. +Vin +Vin C1 0.1 mF LM2576−12 1 Cin 100 mF Cin 100 mF Cout 2200 mF Low Esr 4 Vin Feedback R1 47 k 5 ON/OFF 3 GN D R2 47 k Output 3 GND 5 2 ON/OFF 1N5820 NOTE: This picture does not show the complete circuit. Vout = -12 V Vin LM2576−XX 1 100 mH Figure 31. Delayed Startup Circuitry Typical Load Current 400 mA for Vin = -5.2 V 750 mA for Vin = -7.0 V Undervoltage Lockout Some applications require the regulator to remain off until the input voltage reaches a certain threshold level. Figure 32 shows an undervoltage lockout circuit applied to a buck regulator. A version of this circuit for buck−boost converter is shown in Figure 33. Resistor R3 pulls the ON/OFF pin high and keeps the regulator off until the input voltage reaches a predetermined threshold level with respect to the ground Pin 3, which is determined by the following expression: -5.0 V to -12 V Figure 30. Negative Boost Regulator Design Recommendations: The same design rules as for the previous inverting buck−boost converter can be applied. The output capacitor Cout must be chosen larger than would be required for a what standard buck converter. Low input voltages or high output currents require a large value output capacitor (in the range of thousands of mF). The recommended range of inductor values for the negative boost regulator is the same as for inverting converter design. V www.onsemi.com 20 th [V Z1 ǒ Ǔ (Q1) ) 1.0 ) R2 V R1 BE LM2576 +Vin Under normal continuous inductor current operating conditions, the worst case occurs when Vin is minimal. +Vin LM2576−XX 1 R2 10 k Cin 100 mF 5 R3 47 k ON/OFF 3 1 R2 15 k Z1 1N5242B Q1 2N3904 R1 10 k +Vin +Vin GN D Cin 100 mF 5 R3 47 k LM2576−XX ON/OFF 3 GN D Z1 1N5242B Vth ≈ 13 V Vth ≈ 13 V Q1 2N3904 R1 15 k NOTE: This picture does not show the complete circuit. Figure 32. Undervoltage Lockout Circuit for Buck Converter NOTE: This picture does not show the complete circuit. The following formula is used to obtain the peak inductor current: Figure 33. Undervoltage Lockout Circuit for Buck−Boost Converter I (V ) |V |) O ) V in x t on [ Load in peak 2L 1 V in |V | O where t on + x 1.0 , and f osc + 52 kHz. V ) |V | f osc in O I 40 V Max Unregulated DC Input Adjustable Output, Low−Ripple Power Supply A 3.0 A output current capability power supply that features an adjustable output voltage is shown in Figure 34. This regulator delivers 3.0 A into 1.2 V to 35 V output. The input voltage ranges from roughly 3.0 V to 40 V. In order to achieve a 10 or more times reduction of output ripple, an additional L−C filter is included in this circuit. Feedback 4 +Vin LM2574−Adj 1 Cin 100 mF Vout Output 3 GN D 5 L1 150 mH L2 20 mH 2 ON/OFF 1.2 to 35 V @ 3.0 A R2 50 k Cout 2200 mF D1 1N5822 R1 1.21 k C1 100 mF Optional Output Ripple Filter Figure 34. 1.2 to 35 V Adjustable 3.0 A Power Supply with Low Output Ripple www.onsemi.com 21 Output Voltage LM2576 THE LM2576−5 STEP−DOWN VOLTAGE REGULATOR WITH 5.0 V @ 3.0 A OUTPUT POWER CAPABILITY. TYPICAL APPLICATION WITH THROUGH−HOLE PC BOARD LAYOUT Feedback 4 +Vin Unregulated DC Input +Vin = 7.0 to 40 V LM2576−5 1 Output 3 GN D 5 C1 100 mF /50 V L1 150 mH Regulated Output Vout1 = 5.0 V @ 3.0 A 2 ON/OFF ON/OFF D1 1N5822 GNDin Cout 1000 mF /16 V GNDout C1 C2 D1 L1 − − − − 100 mF, 50 V, Aluminium Electrolytic 1000 mF, 16 V, Aluminium Electrolytic 3.0 A, 40 V, Schottky Rectifier, 1N5822 150 mH, RL2444, Renco Electronics Figure 35. Schematic Diagram of the LM2576−5 Step−Down Converter 00060_00 LM2576 U1 D1 + C2 C1 Vou­ t + ON/OFF +Vin L1 GNDi­ GNDout n NOTE: Not to scale. NOTE: Not to scale. Figure 36. Printed Circuit Board Layout Component Side Figure 37. Printed Circuit Board Layout Copper Side www.onsemi.com 22 LM2576 THE LM2576−ADJ STEP−DOWN VOLTAGE REGULATOR WITH 8.0 V @ 1.0 A OUTPUT POWER CAPABILITY. TYPICAL APPLICATION WITH THROUGH−HOLE PC BOARD LAYOUT 4 Unregulated DC Input +Vin 1 +Vin = 10 V to 40 V Feedback L1 150 mH LM2576−ADJ Output 3 GN D Regulated Output Filtered 2 ON/OFF 5 R2 10 k C1 100 mF /50 V D1 1N5822 ON/OFF C2 1000 mF /16 V R1 1.8 k V C1 C2 D1 L1 R1 R2 − − − − − − 100 mF, 50 V, Aluminium Electrolytic 1000 mF, 16 V, Aluminium Electrolytic 3.0 A, 40 V, Schottky Rectifier, 1N5822 150 mH, RL2444, Renco Electronics 1.8 kW, 0.25 W 10 kW, 0.25 W Vout2 = 8.0 V @ 3.0 A ǒ Ǔ R2 out + V ref ) 1.0 ) R1 Vref = 1.23 V R1 is between 1.0 k and 5.0 k 00059_00 Figure 38. Schematic Diagram of the 8.0 V @ 3.0 A Step−Down Converter Using the LM2576−ADJ LM2576 U1 D1 R1 R2 ON/OFF C1 + + C2 Vout +Vin L1 GNDin GNDout NOTE: Not to scale. NOTE: Not to scale. Figure 39. Printed Circuit Board Layout Component Side Figure 40. Printed Circuit Board Layout Copper Side References • • • • National Semiconductor LM2576 Data Sheet and Application Note National Semiconductor LM2595 Data Sheet and Application Note Marty Brown “Practical Switching Power Supply Design”, Academic Press, Inc., San Diego 1990 Ray Ridley “High Frequency Magnetics Design”, Ridley Engineering, Inc. 1995 www.onsemi.com 23 LM2576 ORDERING INFORMATION Device LM2576TV−ADJG Nominal Output Voltage Operating Temperature Range 1.23 V to 37 V TJ = −40° to +125°C Shipping† Package TO−220 (Vertical Mount) (Pb−Free) 50 Units/Tube LM2576T−ADJG TO−220 (Straight Lead) (Pb−Free) LM2576D2T−ADJG D2PAK (Surface Mount) (Pb−Free) LM2576D2T−ADJR4G D2PAK (Surface Mount) (Pb−Free) 800 Tape & Reel TO−220 (Vertical Mount) (Pb−Free) 50 Units/Tube LM2576TV−3.3G 3.3 V TJ = −40° to +125°C LM2576T−3.3G TO−220 (Straight Lead) (Pb−Free) LM2576D2TR4−3.3G D2PAK (Surface Mount) (Pb−Free) 800 Tape & Reel TO−220 (Vertical Mount) (Pb−Free) 50 Units/Tube LM2576TV−5G 5.0 V TJ = −40° to +125°C LM2576T−005G TO−220 (Straight Lead) (Pb−Free) LM2576D2T−005G D2PAK (Surface Mount) (Pb−Free) LM2576D2TR4−5G D2PAK (Surface Mount) (Pb−Free) 800 Tape & Reel TO−220 (Vertical Mount) (Pb−Free) 50 Units/Tube LM2576TV−012G 12 V TJ = −40° to +125°C LM2576T−012G TO−220 (Straight Lead) (Pb−Free) LM2576D2TR4−012G D2PAK (Surface Mount) (Pb−Free) 800 Tape & Reel TO−220 (Vertical Mount) (Pb−Free) 50 Units/Tube LM2576TV−015G 15 V TJ = −40° to +125°C LM2576T−15G TO−220 (Straight Lead) (Pb−Free) LM2576D2T−15G D2PAK (Surface Mount) (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 24 LM2576 MARKING DIAGRAMS TO−220 TV SUFFIX CASE 314B TO−220 T SUFFIX CASE 314D LM 2576T−xxx AWLYWWG LM 2576T−xxx AWLYWWG D2PAK D2T SUFFIX CASE 936A LM 2576−xxx AWLYWWG 1 1 5 5 1 xxx A WL Y WW G 5 = 005, 012, 015, 3.3, 5, 15, or ADJ = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package www.onsemi.com 25 LM 2576D2T−xxx AWLYWWG 1 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−220 5 LEAD OFFSET CASE 314B−05 ISSUE L DATE 01/07/1994 SCALE 1:1 Q OPTIONAL CHAMFER E A U K L S W F 5X G 5X D 0.10 (0.254) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. C B −P− M T P 0.24 (0.610) J M H T N M −T− STYLE 1 THRU 4: CANCELLED DOCUMENT NUMBER: DESCRIPTION: V 98ASB42218B TO−220 5 LEAD OFFSET SEATING PLANE STYLE 5: PIN 1. 2. 3. 4. 5. DIM A B C D E F G H J K L N Q S U V W INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.850 0.935 0.067 BSC 0.166 BSC 0.015 0.025 0.900 1.100 0.320 0.365 0.320 BSC 0.140 0.153 --0.620 0.468 0.505 --0.735 0.090 0.110 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 21.590 23.749 1.702 BSC 4.216 BSC 0.381 0.635 22.860 27.940 8.128 9.271 8.128 BSC 3.556 3.886 --- 15.748 11.888 12.827 --- 18.669 2.286 2.794 GATE MIRROR DRAIN KELVIN SOURCE Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−220 5−LEAD CASE 314D−04 ISSUE H −T− B −Q− B1 DETAIL A-A A U SCALE 1:1 SEATING PLANE C L 1234 5 K D E DATE 29 JAN 2010 J H G 5 PL 0.356 (0.014) M T Q M B B1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. INCHES MIN MAX 0.572 0.613 0.390 0.415 0.375 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.067 BSC 0.087 0.112 0.015 0.025 0.977 1.045 0.320 0.365 0.140 0.153 0.105 0.117 DIM A B B1 C D E G H J K L Q U MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 9.525 10.541 4.318 4.572 0.635 0.965 1.219 1.397 1.702 BSC 2.210 2.845 0.381 0.635 24.810 26.543 8.128 9.271 3.556 3.886 2.667 2.972 STYLE 1 THRU 4: 1. OBSOLETE GENERIC MARKING DIAGRAM* DETAIL A−A XX XXXXXXXXX AWLYWWG 1 A WL Y WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DOCUMENT NUMBER: DESCRIPTION: 98ASB42220B TO−220 5−LEAD Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS D2PAK 5−LEAD CASE 936A−02 ISSUE E DATE 28 JUL 2021 SCALE 1:1 GENERIC MARKING DIAGRAM* xx xxxxxxxxx AWLYWWG xxxxxx A WL Y WW G = Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98ASH01006A D2PAK 5−LEAD Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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