LM337

LM337 1.5 A, Adjustable Output, Negative Voltage Regulator The LM337 is an adjustable 3−terminal negative voltage regulator capable of supplying in excess of 1.5 A over an output voltage range of −1.2 V to − 37 V. This voltage regulator is exceptionally easy to use and requires only two external resistors to set the output voltage. Further, it employs internal current limiting, thermal shutdown and safe area compensation, making it essentially blow−out proof. The LM337 serves a wide variety of applications including local, on card regulation. This device can also be used to make a programmable output regulator, or by connecting a fixed resistor between the adjustment and output, the LM337 can be used as a precision current regulator. Features http://onsemi.com THREE−TERMINAL ADJUSTABLE NEGATIVE VOLTAGE REGULATOR MARKING DIAGRAMS • • • • • • • • • Output Current in Excess of 1.5 A Output Adjustable between −1.2 V and −37 V Internal Thermal Overload Protection Internal Short Circuit Current Limiting Constant with Temperature Output Transistor Safe−Area Compensation Floating Operation for High Voltage Applications Eliminates Stocking many Fixed Voltages Available in Surface Mount D2PAK and Standard 3−Lead Transistor Package Pb−Free Packages are Available 1 D2PAK D2T SUFFIX CASE 936 LM 337yyyy AWLYWWG Heatsink surface (shown as terminal 4 in case outline drawing) is connected to Pin 2. Pin 1. Adjust 2. Vin 3. Vout Standard Application IPROG + R2 R1 120 IAdj + TO−220AB T SUFFIX CASE 221AB CO** 1.0 mF Heatsink surface connected to Pin 2. 1 Cin* 1.0 mF LM 337xx AWLYWWG Vin −Vin LM337 Vout −Vout *C in is required if regulator is located more than 4 inches from power supply filter. * A 1.0 mF solid tantalum or 10 mF aluminum electrolytic is recommended. **C O is necessary for stability. A 1.0 mF solid tantalum or 10 mF aluminum electrolytic ** is recommended. R V out + –1.25 V 1 ) 2 R1 xx yyyy A WL Y WW G = BT, T = BD2T, D2T = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2006 1 August, 2006 − Rev. 6 Publication Order Number: LM337/D LM337 MAXIMUM RATINGS (TA = +25°C, unless otherwise noted) Rating Input−Output Voltage Differential Power Dissipation Case 221A TA = +25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 936 (D2PAK) TA = +25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Operating Junction Temperature Range Storage Temperature Range Symbol VI−VO Value 40 Unit Vdc PD qJA qJC PD qJA qJC TJ Tstg Internally Limited 65 5.0 Internally Limited 70 5.0 −40 to +125 −65 to +150 W °C/W °C/W W °C/W °C/W °C °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (|VI−VO| = 5.0 V; IO = 0.5 A for T package; TJ = Tlow to Thigh [Note 1]; Imax and Pmax [Note 2].) Characteristics Line Regulation (Note 3), TA = +25°C, 3.0 V ≤ |VI−VO| ≤ 40 V Load Regulation (Note 3), TA = +25°C, 10 mA ≤ IO ≤ Imax |VO| ≤ 5.0 V |VO| ≥ 5.0 V Thermal Regulation, TA = +25°C (Note 5), 10 ms Pulse Adjustment Pin Current Adjustment Pin Current Change, 2.5 V ≤ |VI−VO| ≤ 40 V, 10 mA ≤ IL ≤ Imax, PD ≤ Pmax, TA = +25°C Reference Voltage, TA = +25°C, 3.0 V ≤ |VI−VO| ≤ 40 V, 10 mA ≤ IO ≤ Imax, PD ≤ Pmax, TJ = Tlow to Thigh Line Regulation (Note 3), 3.0 V ≤ |VI−VO| ≤ 40 V Load Regulation (Note 3), 10 mA ≤ IO ≤ Imax |VO| ≤ 5.0 V |VO| ≥ 5.0 V Temperature Stability (Tlow ≤ TJ ≤ Thigh) Minimum Load Current to Maintain Regulation (|VI−VO| ≤ 10 V) (|VI−VO| ≤ 40 V) Maximum Output Current |VI−VO| ≤ 15 V, PD ≤ Pmax, T Package |VI−VO| ≤ 40 V, PD ≤ Pmax, TJ = +25°C, T Package RMS Noise, % of VO, TA = +25°C, 10 Hz ≤ f ≤ 10 kHz Ripple Rejection, VO = −10 V, f = 120 Hz (Note 4) Without CAdj CAdj = 10 mF Long−Term Stability, TJ = Thigh (Note 6), TA = +25°C for Endpoint Measurements Thermal Resistance, Junction−to−Case, T Package 4 3 1, 2 3 Figure 1 2 Symbol Regline Regload − − Regtherm IAdj DIAdj Vref − − − −1.21 3 −1.20 − − − 3 3 TS ILmin − − 3 Imax − − N RR − 66 3 S RqJC − − 60 77 0.3 4.0 − − 1.0 − %/1.0 k Hrs. °C/W − 1.5 0.15 0.003 2.2 0.4 − % VO dB 1.5 2.5 6.0 10 A − 15 0.3 0.003 65 2.0 −1.25 0 −1.25 0.02 20 0.3 0.6 50 1.0 0.04 100 5.0 −1.28 7 −1.30 0.07 70 1.5 − mV % VO % VO/W mA mA V Min − Typ 0.01 Max 0.04 Unit %/V 1 2 Regline Regload %/V mV % VO % VO mA 1. Tlow to Thigh = 0° to +125°C, for LM337T, D2T. Tlow to Thigh = − 40° to +125°C, for LM337BT, BD2T. 2. Imax = 1.5 A, Pmax = 20 W 3. Load and line regulation are specified at constant junction temperature. Change in VO because of heating effects is covered under the Thermal Regulation specification. Pulse testing with a low duty cycle is used. 4. CAdj, when used, is connected between the adjustment pin and ground. 5. Power dissipation within an IC voltage regulator produces a temperature gradient on the die, affecting individual IC components on the die. These effects can be minimized by proper integrated circuit design and layout techniques. Thermal Regulation is the effect of these temperature gradients on the output voltage and is expressed in percentage of output change per watt of power change in a specified time. 6. Since Long Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average stability from lot to lot. http://onsemi.com 2 LM337 Representative Schematic Diagram 100 2.0k 2.5k 810 21k 60 Adjust Vout 10k 15pF 5.0k 75 0 60k 100k 800 15pF 2.0k 800 25pF 220 18k 4.0k 6.0k 1.0k 9.6k 270 100pF 20k 8.0k 600 2.9k 4.0k 500 2.4k 15 500 100k 15 155 0.05 Vin This device contains 39 active transistors. 5.0k 0.2 3.0k 2.2k 18k 240 100 30k 2.0 pF 250 5.0pF R2 1% + Cin 1.0 mF IAdj R1 Vout CO 120 1% 1.0 mF * Pulse testing required. 1% Duty Cycle is suggested. VIH VIL VEE Adjust Vin LM337 RL * VOH VOL Line Regulation (% V) + |V –V | OL OH x 100 |V | OH Figure 1. Line Regulation and DIAdj/Line Test Circuit http://onsemi.com 3 LM337 R2 Cin 1.0 mF 1% CO + IAdj R1 120 * Vout RL (max Load) 1.0 mF * Pulse testing required. 1% Duty Cycle is suggested. Adjust −VI Vin LM337 IL −VO (min Load) −VO (max Load) VO (min Load) − VO (max Load) VO (min Load) x 100 Load Regulation (mV) = VO (min Load) − VO (max Load) Load Regulation (% VO) = Figure 2. Load Regulation and DIAdj/Load Test Circuit R2 1% + 1.0 mF RL IAdj Vref R1 Vout 120 VI Cin 1.0 mF CO VO Adjust Vin VO LM337 IL To Calculate R2: Vref This assumes IAdj is negligible. R2 = −1 R1 * Pulse testing required. * 1% Duty Cycle is suggested. Figure 3. Standard Test Circuit + R2 Cin 1.0 mF Adjust Vin LM337 R1 Vout 120 D1* 1% CAdj 10mF CO 1N4002 + 1.0 mF RL VO Vout = −1.25 V 14.3 V 4.3 V f = 120 Hz * D1 Discharges CAdj if output is shorted to Ground. Figure 4. Ripple Rejection Test Circuit http://onsemi.com 4 LM337 Δ V out , OUTPUT VOLTAGE CHANGE (%) 0.2 0 −0.2 −0.4 −0.6 −0.8 −1.0 −1.2 −1.4 0 −50 −25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) 150 0 10 20 30 Vin−Vout , INPUT−OUTPUT VOLTAGE DIFFERENTIAL (Vdc) 40 Vin = −15 V Vout = −10 V IL = 1.5 A I out , OUTPUT CURRENT (A) IL = 0.5 A 3.0 4.0 2.0 TJ = 25°C 1.0 Figure 5. Load Regulation Figure 6. Current Limit 80 V in − Vout , INPUT−OUTPUT VOLTAGE DIFFERENTIAL (Vdc) IAdj, ADJUSTMENT CURRENT (μA) 75 70 65 60 55 50 45 40 −50 −25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) 150 3.0 Vout = −5.0 V DVO = 100 mV 2.5 IL = 1.5 A 2.0 1.0 A 1.5 500 mA 200 mA 20 mA 1.0 −50 −25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) 150 Figure 7. Adjustment Pin Current Figure 8. Dropout Voltage 1.27 V ref , REFERENCE VOLTAGE (V) I B , QUIESCENT CURRENT (mA) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 1.23 −50 −25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) 150 0 0 10 20 30 40 Vin−Vout , INPUT−OUTPUT VOLTAGE DIFFERENTIAL (Vdc) TJ = 25°C 1.26 1.25 1.24 Figure 9. Temperature Stability Figure 10. Minimum Operating Current http://onsemi.com 5 LM337 100 RR, RIPPLE REJECTION (dB) 80 60 40 20 0 Vin − Vout = 5.0 V IL = 500 mA f = 120 Hz TJ = 25°C 0 −5.0 −10 −15 −20 −25 Vout, OUTPUT VOLTAGE (V) −30 −35 −40 RR, RIPPLE REJECTION (dB) CAdj = 10 mF 100 80 CAdj = 10 mF Without CAdj Without CAdj 60 40 20 0 0.01 Vin = −15 V Vout = −10 V f = 120 Hz TJ = 25°C 0.1 1.0 IO, OUTPUT CURRENT (A) 10 Figure 11. Ripple Rejection versus Output Voltage Figure 12. Ripple Rejection versus Output Current 100 RR, RIPPLE REJECTION (dB) 80 CAdj =10 mF 60 40 20 0 10 Z O , OUTPUT IMPEDANCE ( Ω ) Vin = −15 V Vout = −10 V IL = 500 mA TJ = 25°C 101 Vin = −15 V Vout = −10 V IL = 500 mA CL = 1.0 mF TJ = 25°C Without CAdj CAdj = 10 mF 100 10−1 Without CAdj 10−2 100 1.0 k 10 k 100 k 1.0 M 10 M 10−3 10 100 f, FREQUENCY (Hz) 1.0 k 10 k f, FREQUENCY (Hz) 100 k 1.0 M Figure 13. Ripple Rejection versus Frequency Figure 14. Output Impedance ΔV in, INPUT ΔV out , OUTPUT VOLTAGE CHANGE (V) VOLTAGE DEVIATION (V) ΔV out , OUTPUT VOLTAGE DEVIATION (V) 0.6 0.4 0.2 0 −0.2 −0.4 −0.6 0 −0.5 −1.0 −1.5 0 10 Vin = −15 V Vout = −10 V IL = 50 mA TJ = 25°C CL = 1.0 mF 20 t, TIME (ms) 30 40 CAdj = 10 mF Without CAdj 0.8 0.6 0.4 0.2 0 −0.2 −0.4 0 −0.5 −1.0 0 Vout = −10 V IL = 50 mA TJ = 25°C CL = 1.0 mF 10 20 t, TIME (ms) 30 40 Without CAdj CAdj = 10 mF Figure 15. Line Transient Response I L , LOAD CURRENT (A) Figure 16. Load Transient Response http://onsemi.com 6 LM337 APPLICATIONS INFORMATION Basic Circuit Operation The LM337 is a 3−terminal floating regulator. In operation, the LM337 develops and maintains a nominal −1.25 V reference (Vref) between its output and adjustment terminals. This reference voltage is converted to a programming current (IPROG) by R1 (see Figure 17), and this constant current flows through R2 from ground. The regulated output voltage is given by: V out + V ref R 1) 2 R1 )I R Adj 2 degrading regulation. The ground end of R2 can be returned near the load ground to provide remote ground sensing and improve load regulation. External Capacitors Since the current into the adjustment terminal (IAdj) represents an error term in the equation, the LM337 was designed to control IAdj to less than 100 mA and keep it constant. To do this, all quiescent operating current is returned to the output terminal. This imposes the requirement for a minimum load current. If the load current is less than this minimum, the output voltage will rise. Since the LM337 is a floating regulator, it is only the voltage differential across the circuit which is important to performance, and operation at high voltages with respect to ground is possible. + Vout IAdj R2 IPROG + CO Adjust Vin LM337 Vref R1 − Vout A 1.0 mF tantalum input bypass capacitor (Cin) is recommended to reduce the sensitivity to input line impedance. The adjustment terminal may be bypassed to ground to improve ripple rejection. This capacitor (CAdj) prevents ripple from being amplified as the output voltage is increased. A 10 mF capacitor should improve ripple rejection about 15 dB at 120 Hz in a 10 V application. An output capacitance (CO) in the form of a 1.0 mF tantalum or 10 mF aluminum electrolytic capacitor is required for stability. Protection Diodes When external capacitors are used with any IC regulator it is sometimes necessary to add protection diodes to prevent the capacitors from discharging through low current points into the regulator. Figure 18 shows the LM337 with the recommended protection diodes for output voltages in excess of −25 V or high capacitance values (CO > 25 mF, CAdj > 10 mF). Diode D1 prevents CO from discharging thru the IC during an input short circuit. Diode D2 protects against capacitor CAdj discharging through the IC during an output short circuit. The combination of diodes D1 and D2 prevents CAdj from the discharging through the IC during an input short circuit. R2 + Cin Adjust R1 Vout LM337 CO D2 1N4002 + CAdj + + Vout Vout Vref = −1.25 V Typical Figure 17. Basic Circuit Configuration Load Regulation The LM337 is capable of providing extremely good load regulation, but a few precautions are needed to obtain maximum performance. For best performance, the programming resistor (R1) should be connected as close to the regulator as possible to minimize line drops which effectively appear in series with the reference, thereby 80 R θ JA, THERMAL RESISTANCE −Vin Vin − Vout D1 1N4002 Figure 18. Voltage Regulator with Protection Diodes PD(max) for TA = +50°C PD, MAXIMUM POWER DISSIPATION (W) 3.5 JUNCTION-TO-AIR (°C/W) 70 60 50 40 Free Air Mounted Vertically 3.0 2.0 oz. Copper L Minimum Size Pad L 2.5 2.0 1.5 1.0 RqJA 30 0 5.0 10 15 20 L, LENGTH OF COPPER (mm) Figure 19. D2PAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length http://onsemi.com 7 ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 25 30 LM337 ORDERING INFORMATION Device LM337BD2T LM337BD2TG LM337BD2TR4 LM337BD2TR4G LM337BT LM337BTG LM337D2T LM337D2TG LM337D2TR4 LM337D2TR4G LM337T LM337TG TJ = 0° to +125°C TJ = − 40° to +125°C Operating Temperature Range Package D2PAK D2PAK (Pb−Free) D2PAK D2PAK (Pb−Free) TO−220AB TO−220AB (Pb−Free) D2PAK D2PAK (Pb−Free) D2PAK D2PAK (Pb−Free) TO−220AB TO−220AB (Pb−Free) 50 Units / Rail 800 / Tape & Reel 50 Units / Rail 800 / Tape & Reel 50 Units / Rail Shipping† †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 8 LM337 PACKAGE DIMENSIONS D2T SUFFIX CASE 936−03 (D2PAK) ISSUE B OPTIONAL CHAMFER A E −T − TERMINAL 4 U K B S V H F 1 2 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN M J D 0.010 (0.254) M L P N T G R C DIM A B C D E F G H J K L M N P R S U V SOLDERING FOOTPRINT* 8.38 0.33 10.66 0.42 1.016 0.04 5.08 0.20 3.05 0.12 17.02 0.67 SCALE 3:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 LM337 PACKAGE DIMENSIONS TO−220, SINGLE GAUGE T SUFFIX CASE 221AB−01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM A B C D F G H J K L N Q R S T U V Z INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.020 0.055 0.235 0.255 0.000 0.050 0.045 −−− −−− 0.080 MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 0.508 1.39 5.97 6.47 0.00 1.27 1.15 −−− −−− 2.04 −T− B 4 SEATING PLANE F T S C Q 123 A U K H Z L V G D N R J ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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