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LM337D2T

LM337D2T

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TO263

  • 描述:

    IC REG LINEAR NEG ADJ 1.5A D2PAK

  • 数据手册
  • 价格&库存
LM337D2T 数据手册
DATA SHEET www.onsemi.com Voltage Regulator Adjustable Output, Negative THREE−TERMINAL ADJUSTABLE NEGATIVE VOLTAGE REGULATOR 1.5 A MARKING DIAGRAMS LM337 The LM337 is an adjustable 3−terminal negative voltage regulator capable of supplying in excess of 1.5 A over an output voltage range of −1.2 V to − 37 V. This voltage regulator is exceptionally easy to use and requires only two external resistors to set the output voltage. Further, it employs internal current limiting, thermal shutdown and safe area compensation, making it essentially blow−out proof. The LM337 serves a wide variety of applications including local, on card regulation. This device can also be used to make a programmable output regulator, or by connecting a fixed resistor between the adjustment and output, the LM337 can be used as a precision current regulator. D2PAK D2T SUFFIX CASE 936 Heatsink surface (shown as terminal 4 in case outline drawing) is connected to Pin 2. Pin 1. Adjust 2. Vin 3. Vout Features • • • • • • • • • Output Current in Excess of 1.5 A Output Adjustable between −1.2 V and −37 V Internal Thermal Overload Protection Internal Short Circuit Current Limiting Constant with Temperature Output Transistor Safe−Area Compensation Floating Operation for High Voltage Applications Eliminates Stocking many Fixed Voltages Available in Surface Mount D2PAK and Standard 3−Lead Transistor Package These Devices are Pb−Free and are RoHS Compliant IPROG Cin* 1.0 mF R2 + CO** 1.0 mF R1 120 + LM 337yyyy AWLYWWG TO−220AB T SUFFIX CASE 221AB Heatsink surface connected to Pin 2. LM 337xx AWLYWWG 1 xx yyyy A WL Y WW G = BT, T = BD2T, D2T = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION IAdj See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. Vin Vout LM337 -Vin -Vout *Cin is required if regulator is located more than 4 inches from power supply filter. *A 1.0 mF solid tantalum or 10 mF aluminum electrolytic is recommended. **CO is necessary for stability. A 1.0 mF solid tantalum or 10 mF aluminum electrolytic **is recommended. ǒ Ǔ R V out + –1.25V 1 ) 2 R1 Figure 1. Standard Application © Semiconductor Components Industries, LLC, 2015 October, 2021 − Rev. 11 1 Publication Order Number: LM337/D LM337 MAXIMUM RATINGS (TA = +25°C, unless otherwise noted) Symbol Value Unit VI−VO 40 Vdc PD qJA qJC Internally Limited 65 5.0 W °C/W °C/W PD qJA qJC Internally Limited 70 5.0 W °C/W °C/W Operating Junction Temperature Range TJ −40 to +125 °C Storage Temperature Range Tstg −65 to +150 °C Rating Input−Output Voltage Differential Power Dissipation Case 221A TA = +25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 936 (D2PAK) TA = +25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ELECTRICAL CHARACTERISTICS (|VI−VO| = 5.0 V; IO = 0.5 A for T package; TJ = Tlow to Thigh [Note 1]; Imax and Pmax [Note 2].) Figure Characteristics Symbol Min Typ Max Unit − 0.01 0.04 %/V − − 15 0.3 50 1.0 mV % VO Regtherm − 0.003 0.04 % VO/W Line Regulation (Note 3), TA = +25°C, 3.0 V ≤ |VI−VO| ≤ 40 V 1 Regline Load Regulation (Note 3), TA = +25°C, 10 mA ≤ IO ≤ Imax |VO| ≤ 5.0 V |VO| ≥ 5.0 V 2 Regload Thermal Regulation, TA = +25°C (Note 5), 10 ms Pulse Adjustment Pin Current 3 IAdj − 65 100 mA 1, 2 DIAdj − 2.0 5.0 mA Reference Voltage, TA = +25°C, 3.0 V ≤ |VI−VO| ≤ 40 V, 10 mA ≤ IO ≤ Imax, PD ≤ Pmax, TJ = Tlow to Thigh 3 Vref −1.213 −1.20 −1.250 −1.25 −1.287 −1.30 V Line Regulation (Note 3), 3.0 V ≤ |VI−VO| ≤ 40 V 1 Regline − 0.02 0.07 %/V Load Regulation (Note 3), 10 mA ≤ IO ≤ Imax |VO| ≤ 5.0 V |VO| ≥ 5.0 V 2 Regload − − 20 0.3 70 1.5 mV % VO Temperature Stability (Tlow ≤ TJ ≤ Thigh) 3 TS − 0.6 − % VO Minimum Load Current to Maintain Regulation (|VI−VO| ≤ 10 V) (|VI−VO| ≤ 40 V) 3 ILmin − − 1.5 2.5 6.0 10 Maximum Output Current |VI−VO| ≤ 15 V, PD ≤ Pmax, T Package |VI−VO| ≤ 40 V, PD ≤ Pmax, TJ = +25°C, T Package 3 Imax − − 1.5 0.15 2.2 0.4 − 0.003 − Ripple Rejection, VO = −10 V, f = 120 Hz (Note 4) Without CAdj CAdj = 10 mF 4 RR − 66 60 77 − − Long−Term Stability, TJ = Thigh (Note 6), TA = +25°C for Endpoint Measurements 3 S − 0.3 1.0 %/1.0 k Hrs. RqJC − 4.0 − °C/W Adjustment Pin Current Change, 2.5 V ≤ |VI−VO| ≤ 40 V, 10 mA ≤ IL ≤ Imax, PD ≤ Pmax, TA = +25°C RMS Noise, % of VO, TA = +25°C, 10 Hz ≤ f ≤ 10 kHz N Thermal Resistance, Junction−to−Case, T Package mA A % VO dB Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Tlow to Thigh = 0° to +125°C, for LM337T, D2T. Tlow to Thigh = − 40° to +125°C, for LM337BT, BD2T. 2. Imax = 1.5 A, Pmax = 20 W 3. Load and line regulation are specified at constant junction temperature. Change in VO because of heating effects is covered under the Thermal Regulation specification. Pulse testing with a low duty cycle is used. 4. CAdj, when used, is connected between the adjustment pin and ground. 5. Power dissipation within an IC voltage regulator produces a temperature gradient on the die, affecting individual IC components on the die. These effects can be minimized by proper integrated circuit design and layout techniques. Thermal Regulation is the effect of these temperature gradients on the output voltage and is expressed in percentage of output change per watt of power change in a specified time. 6. Since Long Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average stability from lot to lot. www.onsemi.com 2 LM337 Representative Schematic Diagram Adjust 60 100 2.0k 2.5k 810 21k Vout 10k 800 15pF 25pF 220 5.0k 75 0 60k 100k 2.0k 15pF 800 18k 4.0k 6.0k 100 1.0k 2.2k 3.0k 9.6k 18k 270 240 5.0pF 100pF 30k 2.0 pF 250 20k 5.0k 8.0k 0.2 100k 600 15 2.9k 4.0k 155 2.4k 500 15 0.05 500 Vin This device contains 39 active transistors. R2 1% + Cin 1.0 mF CO IAdj *Pulse testing required. 1% Duty Cycle is suggested. 120 1% R1 Adjust Vin 1.0 mF RL Vout LM337 VIH VIL * VEE VOH VOL LineRegulation(%ńV) + |V –V | OL OH x100 |V | OH Figure 1. Line Regulation and DIAdj/Line Test Circuit www.onsemi.com 3 LM337 *Pulse testing required. 1% Duty Cycle is suggested. 1% R2 CO + Cin 1.0 mF IAdj R1 1.0 mF 120 * Adjust -VI Vin Vout LM337 RL (max Load) -VO (min Load) -VO (max Load) IL Load Regulation (mV) = VO (min Load) - VO (max Load) Load Regulation (% VO) = VO (min Load) - VO (max Load) VO (min Load) x 100 Figure 2. Load Regulation and DIAdj/Load Test Circuit 1% R2 VI CO 1.0 mF Cin Vref R1 Adjust Vin LM337 R2 = VO RL IAdj To Calculate R2: + 1.0 mF VO Vref This assumes IAdj is negligible. Vout 120 IL R1 -1 * Pulse testing required. * 1% Duty Cycle is suggested. Figure 3. Standard Test Circuit + R2 Cin CAdj 1% 1.0 mF CO Adjust Vin 10mF LM337 120 R1 D1* + 1.0 mF RL VO 1N4002 Vout Vout = -1.25 V 14.3 V 4.3 V * D1 Discharges CAdj if output is shorted to Ground. f = 120 Hz Figure 4. Ripple Rejection Test Circuit www.onsemi.com 4 0.2 4.0 0 IL = 0.5 A -0.2 I out , OUTPUT CURRENT (A) ΔV out , OUTPUT VOLTAGE CHANGE (%) LM337 -0.4 -0.6 -0.8 Vin = -15 V Vout = -10 V -1.0 IL = 1.5 A 3.0 2.0 TJ = 25°C 1.0 -1.2 -1.4 0 -50 -25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) 150 0 10 20 30 Vin-Vout , INPUT-OUTPUT VOLTAGE DIFFERENTIAL (Vdc) Figure 5. Load Regulation Figure 6. Current Limit 3.0 V in - Vout , INPUT-OUTPUT VOLTAGE DIFFERENTIAL (Vdc) IAdj, ADJUSTMENT CURRENT (μA) 80 75 70 65 60 55 50 45 40 Vout = -5.0 V DVO = 100 mV 2.5 IL = 1.5 A 2.0 1.0 A 500 mA 1.5 200 mA 20 mA 1.0 -50 -25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) 150 -50 Figure 7. Adjustment Pin Current -25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) 150 Figure 8. Dropout Voltage I B , QUIESCENT CURRENT (mA) V ref , REFERENCE VOLTAGE (V) 1.27 1.26 1.25 1.24 1.8 1.6 1.4 1.2 1.0 TJ = 25°C 0.8 0.6 0.4 0.2 1.23 40 -50 -25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) 0 150 0 Figure 9. Temperature Stability 10 20 30 40 Vin-Vout , INPUT-OUTPUT VOLTAGE DIFFERENTIAL (Vdc) Figure 10. Minimum Operating Current www.onsemi.com 5 LM337 100 CAdj = 10 mF 80 60 RR, RIPPLE REJECTION (dB) RR, RIPPLE REJECTION (dB) 100 Without CAdj 40 Vin - Vout = 5.0 V IL = 500 mA f = 120 Hz TJ = 25°C 20 -5.0 -10 -15 -20 -25 Vout, OUTPUT VOLTAGE (V) -30 -35 40 0 0.01 -40 10 101 CAdj =10 mF Z O , OUTPUT IMPEDANCE () Ω Vin = -15 V Vout = -10 V IL = 500 mA TJ = 25°C 80 60 40 Without CAdj 20 10 100 1.0 k 10 k 100 k 1.0 M 10-1 Without CAdj CAdj = 10 mF 10-2 10-3 10 M Vin = -15 V Vout = -10 V IL = 500 mA CL = 1.0 mF TJ = 25°C 100 f, FREQUENCY (Hz) 1.0 k 10 k f, FREQUENCY (Hz) Figure 13. Ripple Rejection versus Frequency Figure 14. Output Impedance ΔV out , OUTPUT VOLTAGE DEVIATION (V) RR, RIPPLE REJECTION (dB) 0.8 0.6 0.4 0.2 0 Without CAdj CAdj = 10 mF -0.2 -0.4 I L , LOAD CURRENT (A) ΔV in, INPUT ΔV out , OUTPUT VOLTAGE CHANGE (V) VOLTAGE DEVIATION (V) 0.1 1.0 IO, OUTPUT CURRENT (A) Figure 12. Ripple Rejection versus Output Current 100 Vout = -10 V IL = 50 mA TJ = 25°C CL = 1.0 mF 0 -0.5 -1.0 Vin = -15 V Vout = -10 V f = 120 Hz TJ = 25°C 20 Figure 11. Ripple Rejection versus Output Voltage 0 Without CAdj 60 0 0 CAdj = 10 mF 80 0 10 20 30 10 100 100 k 0.6 0.4 Without CAdj 0.2 0 CAdj = 10 mF -0.2 -0.4 -0.6 Vin = -15 V Vout = -10 V IL = 50 mA TJ = 25°C CL = 1.0 mF 0 -0.5 -1.0 -1.5 40 0 10 20 30 t, TIME (ms) t, TIME (ms) Figure 15. Line Transient Response Figure 16. Load Transient Response www.onsemi.com 6 1.0 M 40 LM337 APPLICATIONS INFORMATION Basic Circuit Operation External Capacitors The LM337 is a 3−terminal floating regulator. In operation, the LM337 develops and maintains a nominal −1.25 V reference (Vref) between its output and adjustment terminals. This reference voltage is converted to a programming current (IPROG) by R1 (see Figure 17), and this constant current flows through R2 from ground. The regulated output voltage is given by: ǒ A 1.0 mF tantalum input bypass capacitor (Cin) is recommended to reduce the sensitivity to input line impedance. The adjustment terminal may be bypassed to ground to improve ripple rejection. This capacitor (CAdj) prevents ripple from being amplified as the output voltage is increased. A 10 mF capacitor should improve ripple rejection about 15 dB at 120 Hz in a 10 V application. An output capacitance (CO) in the form of a 1.0 mF tantalum or 10 mF aluminum electrolytic capacitor is required for stability. Using the classical tantalum or aluminum electrolytic capacitor types with non−reduced ESR (Equivalent Series Resistance) value is necessary. Low−ESR or similar capacitor types with reduced ESR value and ceramic capacitors can cause instability or continuous oscillations in the application. Ǔ R V out + V  1 ) 2  ) I R 2 ref Adj R1 Since the current into the adjustment terminal (IAdj) represents an error term in the equation, the LM337 was designed to control IAdj to less than 100 mA and keep it constant. To do this, all quiescent operating current is returned to the output terminal. This imposes the requirement for a minimum load current. If the load current is less than this minimum, the output voltage will rise. Since the LM337 is a floating regulator, it is only the voltage differential across the circuit which is important to performance, and operation at high voltages with respect to ground is possible. Protection Diodes When external capacitors are used with any IC regulator it is sometimes necessary to add protection diodes to prevent the capacitors from discharging through low current points into the regulator. Figure 18 shows the LM337 with the recommended protection diodes for output voltages in excess of −25 V or high capacitance values (CO > 25 mF, CAdj > 10 mF). Diode D1 prevents CO from discharging thru the IC during an input short circuit. Diode D2 protects against capacitor CAdj discharging through the IC during an output short circuit. The combination of diodes D1 and D2 prevents CAdj from the discharging through the IC during an input short circuit. + Vout R2 IPROG IAdj + CO Adjust Vin LM337 Vref R1 Vout - Vout Vref = -1.25 V Typical Figure 17. Basic Circuit Configuration + Vout + R2 CAdj + + CO Cin Load Regulation Adjust The LM337 is capable of providing extremely good load regulation, but a few precautions are needed to obtain maximum performance. For best performance, the programming resistor (R1) should be connected as close to the regulator as possible to minimize line drops which effectively appear in series with the reference, thereby degrading regulation. The ground end of R2 can be returned near the load ground to provide remote ground sensing and improve load regulation. -Vin R1 LM337 Vin Vout D2 1N4002 - Vout D1 1N4002 Figure 18. Voltage Regulator with Protection Diodes www.onsemi.com 7 3.5 PD(max) for TA = +50°C JUNCTION‐TO‐AIR (°C/W) R θ JA, THERMAL RESISTANCE 80 70 3.0 Free Air Mounted Vertically 60 ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 2.0 oz. Copper L Minimum Size Pad 50 2.5 2.0 L 40 1.5 RqJA PD, MAXIMUM POWER DISSIPATION (W) LM337 1.0 30 0 5.0 10 15 20 L, LENGTH OF COPPER (mm) 25 30 Figure 19. D2PAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length ORDERING INFORMATION Device LM337BD2TR4G Operating Temperature Range Package Shipping† TJ = − 40° to +125°C D2PAK (Pb−Free) 800 / Tape & Reel TO−220AB (Pb−Free) 50 Units / Rail D2PAK (Pb−Free) 800 / Tape & Reel TO−220AB (Pb−Free) 50 Units / Rail LM337BTG LM337D2TR4G TJ = 0° to +125°C LM337TG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−220, SINGLE GAUGE CASE 221AB−01 ISSUE A −T− B F T SCALE 1:1 SEATING PLANE C S DATE 16 NOV 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. 4. PRODUCT SHIPPED PRIOR TO 2008 HAD DIMENSIONS S = 0.045 - 0.055 INCHES (1.143 - 1.397 MM) 4 DIM A B C D F G H J K L N Q R S T U V Z A Q U 1 2 3 H K Z L R V J G D N INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.020 0.024 0.235 0.255 0.000 0.050 0.045 ----0.080 MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 0.508 0.61 5.97 6.47 0.00 1.27 1.15 ----2.04 STYLE 1: PIN 1. 2. 3. 4. BASE COLLECTOR EMITTER COLLECTOR STYLE 2: PIN 1. 2. 3. 4. BASE EMITTER COLLECTOR EMITTER STYLE 3: PIN 1. 2. 3. 4. CATHODE ANODE GATE ANODE STYLE 4: PIN 1. 2. 3. 4. MAIN TERMINAL 1 MAIN TERMINAL 2 GATE MAIN TERMINAL 2 STYLE 5: PIN 1. 2. 3. 4. GATE DRAIN SOURCE DRAIN STYLE 6: PIN 1. 2. 3. 4. ANODE CATHODE ANODE CATHODE STYLE 7: PIN 1. 2. 3. 4. CATHODE ANODE CATHODE ANODE STYLE 8: PIN 1. 2. 3. 4. CATHODE ANODE EXTERNAL TRIP/DELAY ANODE STYLE 9: PIN 1. 2. 3. 4. GATE COLLECTOR EMITTER COLLECTOR STYLE 10: PIN 1. 2. 3. 4. GATE SOURCE DRAIN SOURCE STYLE 11: PIN 1. 2. 3. 4. DRAIN SOURCE GATE SOURCE DOCUMENT NUMBER: DESCRIPTION: 98AON23085D TO−220, SINGLE GAUGE Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS D2PAK CASE 936−03 ISSUE E DATE 29 SEP 2015 SCALE 1:1 T C A K B J C ES OPTIONAL CHAMFER DETAIL C DETAIL C 3 F G SIDE VIEW 2X TOP VIEW D 0.010 (0.254) N DUAL GAUGE CONSTRUCTION P BOTTOM VIEW SIDE VIEW SINGLE GAUGE CONSTRUCTION T M M R T V H 2 U ED OPTIONAL CHAMFER S 1 TERMINAL 4 T SEATING PLANE L BOTTOM VIEW DETAIL C OPTIONAL CONSTRUCTIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCHES. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. 6. SINGLE GAUGE DESIGN WILL BE SHIPPED AF­ TER FPCN EXPIRATION IN OCTOBER 2011. DIM A B C D ED ES F G H J K L M N P R S U V INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.018 0.026 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 0_ 8_ 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 0.457 0.660 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 0_ 8_ 2.946 REF 5.080 MIN 6.350 MIN GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 10.490 XXXXXXG ALYWW 8.380 16.155 XXXXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year WW = Work Week G = Pb−Free Package 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ASH01005A D2PAK *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
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