LM339

LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 Single Supply Quad Comparators These comparators are designed for use in level detection, low−level sensing and memory applications in consumer, automotive, and industrial electronic applications. Features 14 1 http://onsemi.com • • • • • • • • • • SOIC−14 D SUFFIX CASE 751A Single or Split Supply Operation Low Input Bias Current: 25 nA (Typ) Low Input Offset Current: ±5.0 nA (Typ) Low Input Offset Voltage Input Common Mode Voltage Range to GND Low Output Saturation Voltage: 130 mV (Typ) @ 4.0 mA TTL and CMOS Compatible ESD Clamps on the Inputs Increase Reliability without Affecting Device Operation NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes Pb−Free Packages are Available PDIP−14 N, P SUFFIX CASE 646 14 1 14 1 TSSOP−14 DTB SUFFIX CASE 948G PIN CONNECTIONS Output 2 Output 1 VCC − Input 1 + Input 1 − Input 2 + Input 2 1 2 3 4 5 6 7 14 13 12 Output 3 Output 4 GND + Input 4 − Input 4 + Input 3 − Input 3 * 1 ) *2 ) 4 ) * ) * 11 10 9 8 3 (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2007 1 February, 2007 − Rev. 18 Publication Order Number: LM339/D LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 MAXIMUM RATINGS Rating Power Supply Voltage LM239/LM339/LM2901, V MC3302 Input Differential Voltage Range LM239/LM339/LM2901, V MC3302 Input Common Mode Voltage Range Output Short Circuit to Ground (Note 1) Power Dissipation @ TA = 25°C Plastic Package Derate above 25°C Junction Temperature Operating Ambient Temperature Range LM239 MC3302 LM2901 LM2901V, NCV2901 LM339 Storage Temperature Range ESD Protection at any Pin (Note 2) Human Body Model Machine Model Tstg VESD 1500 200 VICMR ISC PD 1/RqJA TJ TA −25 to +85 −40 to +85 −40 to +105 −40 to +125 0 to +70 −65 to +150 °C V 1.0 8.0 150 W mW/°C °C °C VIDR 36 30 −0.3 to VCC Continuous Vdc Symbol VCC Value +36 or ±18 +30 or ±15 Vdc Unit Vdc Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The maximum output current may be as high as 20 mA, independent of the magnitude of VCC. Output short circuits to VCC can cause excessive heating and eventual destruction. 2. VESD rating for NCV/SC devices is: Human Body Model − 2000 V; Machine Model − 200 V. VCC + Input − Input Output GND NOTE: Diagram shown is for 1 comparator. Figure 1. Circuit Schematic http://onsemi.com 2 LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 ELECTRICAL CHARACTERISTICS (VCC = +5.0 Vdc, TA = +25°C, unless otherwise noted) LM239/339 Characteristic Input Offset Voltage (Note 4) Input Bias Current (Notes 4, 5) (Output in Analog Range) Input Offset Current (Note 4) Input Common Mode Voltage Range Supply Current RL = ∞ (For All Comparators) RL = ∞, VCC = 30 Vdc Voltage Gain RL ≥ 15 kW, VCC = 15 Vdc Large Signal Response Time VI = TTL Logic Swing, Vref = 1.4 Vdc, VRL = 5.0 Vdc, RL = 5.1 kW Response Time (Note 6) VRL = 5.0 Vdc, RL = 5.1 kW Output Sink Current VI (−) ≥ +1.0 Vdc, VI(+) = 0, VO ≤ 1.5 Vdc Saturation Voltage VI(−) ≥ +1.0 Vdc, VI(+) = 0, Isink ≤ 4.0 mA Output Leakage Current VI(+) ≥ +1.0 Vdc, VI(−) = 0, VO = +5.0 Vdc 3. (LM239) Tlow = −25°C, Thigh = +85° (LM339) Tlow = 0°C, Thigh = +70°C (MC3302) Tlow = −40°C, Thigh = +85°C (LM2901) Tlow = −40°C, Thigh = +105° (LM2901V & NCV2901) Tlow = −40°C, Thigh = +125°C NCV2901 is qualified for automotive use. 4. At the output switch point, VO ] 1.4 Vdc, RS ≤ 100 W 5.0 Vdc ≤ VCC ≤ 30 Vdc, with the inputs over the full common mode range (0 Vdc to VCC −1.5 Vdc). 5. The bias current flows out of the inputs due to the PNP input stage. This current is virtually constant, independent of the output state. 6. The response time specified is for a 100 mV input step with 5.0 mV overdrive. For larger signals, 300 ns is typical. IOL − 0.1 − − 0.1 − − 0.1 − nA Vsat − 130 400 − 130 400 − 130 500 mV ISink 6.0 16 − 6.0 16 − 6.0 16 − mA − − 1.3 − − 1.3 − − 1.3 − ms − − 300 − − 300 − − 300 − ns AVOL IIO VICMR ICC − − 50 0.8 1.0 200 2.0 2.5 − − − 25 0.8 1.0 100 2.0 2.5 − − − 25 0.8 1.0 100 2.0 2.5 − V/mV − 0 ±5.0 − ±50 VCC −1.5 − 0 ±5.0 − ±50 VCC −1.5 − 0 ±3.0 − ±100 VCC −1.5 nA V mA Symbol VIO IIB Min − − Typ ±2.0 25 Max ±5.0 250 LM2901/2901V/ NCV2901 Min − − Typ ±2.0 25 Max ±7.0 250 Min − − MC3302 Typ ±3.0 25 Max ±20 500 Unit mVdc nA http://onsemi.com 3 LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 PERFORMANCE CHARACTERISTICS (VCC = +5.0 Vdc, TA = Tlow to Thigh [Note 7]) LM239/339 Characteristic Input Offset Voltage (Note 8) Input Bias Current (Notes 8, 9) (Output in Analog Range) Input Offset Current (Note 8) Input Common Mode Voltage Range Saturation Voltage VI(−) ≥ +1.0 Vdc, VI(+) = 0, Isink ≤ 4.0 mA Output Leakage Current VI(+) ≥ +1.0 Vdc, VI(−) = 0, VO = 30 Vdc Differential Input Voltage All VI ≥ 0 Vdc 7. (LM239) Tlow = −25°C, Thigh = +85° (LM339) Tlow = 0°C, Thigh = +70°C (MC3302) Tlow = −40°C, Thigh = +85°C (LM2901) Tlow = −40°C, Thigh = +105° (LM2901V & NCV2901) Tlow = −40°C, Thigh = +125°C NCV2901 is qualified for automotive use. 8. At the output switch point, VO ] 1.4 Vdc, RS ≤ 100 W 5.0 Vdc ≤ VCC ≤ 30 Vdc, with the inputs over the full common mode range (0 Vdc to VCC −1.5 Vdc). 9. The bias current flows out of the inputs due to the PNP input stage. This current is virtually constant, independent of the output state. 10. The response time specified is for a 100 mV input step with 5.0 mV overdrive. For larger signals, 300 ns is typical. VID − − VCC − − VCC − − VCC Vdc IOL − − 1.0 − − 1.0 − − 1.0 mA IIO VICMR Vsat − 0 − − − − ±150 VCC −2.0 700 − 0 − − − − ±200 VCC −2.0 700 − 0 − − − − ±300 VCC −2.0 700 nA V mV Symbol VIO IIB Min − − Typ − − Max ±9.0 400 LM2901/2901V/ NCV2901 Min − − Typ − − Max ±15 500 Min − − MC3302 Typ − − Max ±40 1000 Unit mVdc nA + VCC R3 10 k Vin + VCC Rref − + R2 R1 1.0 M Vref [ VCC R1 Rref + R1 + VCC 10 k VO Rref Vref R1 − R2 10 k R3 1.0 M Vref = VCC R1 Rref + R1 + VO 10 k Vref 10k Vin R3 ] R1 / / Rref / / R2 VH = R2 R1 / / Rref R1/ / Rref + R2 Rref / / R1 [VO(max) − VO(min)] R2 [ R1 / / Rref Amount of Hysteresis VH R2 VH = [(V −V ] R2 + R3 O(max) O(min) Figure 2. Inverting Comparator with Hysteresis Figure 3. Noninverting Comparator with Hysteresis http://onsemi.com 4 LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 Typical Characteristics (VCC = 15 Vdc, TA = +25°C (each comparator) unless otherwise noted.) 1.40 NORMALIZED OFFSET VOLTAGE I IB, INPUT BIAS CURRENT (nA) 48 42 36 30 24 18 12 6.0 0 −50 −25 0 25 50 75 TA, AMBIENT TEMPERATURE (°C) 100 125 0 4.0 8.0 12 16 20 24 VCC, POWER SUPPLY VOLTAGE (Vdc) 28 32 TA = +125°C TA = −55° C TA = +25° C 1.20 1.00 0.80 0.60 Figure 4. Normalized Input Offset Voltage Figure 5. Input Bias Current 8.0 IO, OUTPUT CURRENT (mA) 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 0 100 200 300 400 500 Vsat, OUTPUT SATURATION VOLTAGE (mV) TA = −55° C TA = +125°C TA = +25° C Figure 6. Output Sink Current versus Output Saturation Voltage VCC VCC ≥ 4.0 V 10 k R1 VO R3 330 k R4 RL kW 100 10 330 k VCC T1 Vin Vref RS + − RL + C R2 VCC 100 k − + R1 RS = Source Resistance R1 ] RS Logic CMOS TTL Device 1/4 MC14001 1/4 MC7400 VCC (V) +15 +5.0 330 k T2 T1 = T2 = 0.69 RC 7.2 f[ C(mF) R2 = R3 = R4 R1 [ R2 // R3 // R4 Figure 7. Driving Logic Figure 8. Squarewave Oscillator http://onsemi.com 5 LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 APPLICATIONS INFORMATION These quad comparators feature high gain, wide bandwidth characteristics. This gives the device oscillation tendencies if the outputs are capacitively coupled to the inputs via stray capacitance. This oscillation manifests itself during output transitions (VOL to VOH). To alleviate this situation input resistors < 10 kW should be used. The addition of positive feedback (< 10 mV) is also recommended. It is good design practice to ground all unused input pins. Differential input voltages may be larger than supply voltages without damaging the comparator’s inputs. Voltages more negative than −300 mV should not be used. +15 V R4 220 k 6.8 k R2 R5 220 k * ) R1 8.2 k Vin D1 10 k VO Vin(min) ≈ 0.4 V peak for 1% phase distortion (Dq). Vin VCC Vin(min) q 10 k VO 15 k R3 10 M * Vin D1 prevents input from going negative by more than 0.6 V. R1 + R2 = R3 R5 R3 ≤ for small error in zero crossing 10 + VEE VCC VO VEE Dq q Figure 9. Zero Crossing Detector (Single Supply) Figure 10. Zero Crossing Detector (Split Supplies) ORDERING INFORMATION Device LM239D LM239DG LM239DR2 LM239DR2G LM239DTBR2 LM239DTBR2G LM239N LM239NG LM339D LM339DG LM339DR2 LM339DR2G LM339DTBR2 LM339DTBR2G Package SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) TSSOP−14* TSSOP−14* PDIP−14 PDIP−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) TSSOP−14* TSSOP−14* 2500 / Tape & Reel 55 Units/Tube 25 Units/Rail 2500 / Tape & Reel 55 Units/Tube Shipping† †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 6 LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 ORDERING INFORMATION Device LM339N LM339NG LM2901D LM2901DG LM2901DR2 LM2901DR2G LM2901DTBR2 LM2901DTBR2G LM2901N LM2901NG LM2901VD LM2901VDG LM2901VDR2 LM2901VDR2G LM2901VDTBR2 LM2901VDTBR2G LM2901VN LM2901VNG NCV2901DR2 NCV2901DR2G NCV2901DTBR2G NCV2901CTR MC3302D MC3302DG MC3302DR2 MC3302DR2G MC3302DTBR2 MC3302DTBR2G MC3302P MC3302PG Package PDIP−14 PDIP−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) TSSOP−14* TSSOP−14* PDIP−14 PDIP−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) TSSOP−14* TSSOP−14* PDIP−14 PDIP−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) TSSOP−14* Bare Die SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) TSSOP−14* TSSOP−14* PDIP−14 PDIP−14 (Pb−Free) 25 Units/Rail 2500 / Tape & Reel 55 Units/Tube 6000 / Tape & Reel 2500 / Tape & Reel 25 Units/Rail 2500 / Tape & Reel 55 Units/Tube 25 Units/Rail 2500 / Tape & Reel 55 Units/Rail 25 Units/Rail Shipping† †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 7 LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 MARKING DIAGRAMS PDIP−14 N, P SUFFIX CASE 646 14 LM339N AWLYYWWG 1 1 14 LM239N AWLYYWWG 1 14 LM2901N AWLYYWWG 1 14 LM2901VN AWLYYWWG 1 14 MC3302P AWLYYWWG SOIC−14 D SUFFIX CASE 751A 14 LM339DG AWLYWW 1 1 14 LM239DG AWLYWW 1 14 LM2901DG AWLYWW 1 14 LM2901VDG AWLYWW 14 * 1 MC3302DG AWLYWW TSSOP−14 DTB SUFFIX CASE 948G 14 239 ALYW G G 1 14 339 ALYW G G 1 14 2901 ALYW G G 1 14 2901 V ALYW G G 1 14 * 3302 ALYW G G 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) *This marking diagram also applies to NCV2901. http://onsemi.com 8 LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE P 14 8 B 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 −−− 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 −−− 10 _ 0.38 1.01 A F N −T− SEATING PLANE L C K H G D 14 PL 0.13 (0.005) M J M DIM A B C D F G H J K L M N http://onsemi.com 9 LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE H −A− 14 8 −B− P 7 PL 0.25 (0.010) M B M 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. G C R X 45 _ F DIM A B C D F G J K M P R −T− SEATING PLANE D 14 PL 0.25 (0.010) M K TB S M A S J MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 SOLDERING FOOTPRINT* 7X 7.04 1 14X 14X 1.52 0.58 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U S M TU S V S N 2X L/2 14 8 0.25 (0.010) M L PIN 1 IDENT. 1 7 B −U− N F DETAIL E K K1 J J1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. DIM A B C D F G H J J1 K K1 L M MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 −−− 1.20 −−− 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ 0.15 (0.006) T U S A −V− SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D G H DETAIL E SOLDERING FOOTPRINT* 7.06 1 14X 0.36 14X 1.26 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ 0.65 PITCH DIMENSIONS: MILLIMETERS LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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