LV0222CS-TLM-H

Initial Product/Process Change Notification Document # : IPCN21204X Issue Date: 2 February 2016 Title of Change: Optical Device Chip Scale Package (ODCSP) site change from Gunma, Japan to Niigata, Japan and Dicing site change from Shenzhen, China to Tarlac, Philippines Proposed first ship date: 19 September 2016 Contact information: Contact your local ON Semiconductor Sales Office or Samples: Contact your local ON Semiconductor Sales Office. Type of notification: This is an Initial Product/Process Change Notification (IPCN) sent to customers. IPCNs are issued at least 120 days prior to implementation of the change. An IPCN is advance notification about an upcoming change and contains general information regarding the change details and devices affected. It also contains the preliminary reliability qualification plan. The completed qualification and characterization data will be included in the Final Product/Process Change Notification (FPCN). This IPCN notification will be followed by a Final Product/Process Change Notification (FPCN) at least 90 days prior to implementation of the change. In case of questions, contact . Change Part Identification: Product lots will be identified through a date code marked on the parts. Change category: ☐ Wafer Fab Change ☒ Assembly Change ☒ Test Change Change Sub-Category(s): ☐ Other _______________ ☒ Manufacturing Site Change/Addition ☐ Manufacturing Process Change ☐ Material Change ☐ Product specific change ☐ Datasheet/Product Doc change ☐ Shipping/Packaging/Marking ☐ Other: _______________________ Sites Affected: ☒ ON Semiconductor site(s) : ☐ External Foundry/Subcon site(s) ☐ All site(s) ☐ not applicable ON Niigata, Japan ON Gunma, Japan ON Tarlac, Philippines ON Shenzhen, China Description and Purpose: This is an Initial Notification to announce the continuous supply of products and increase supply capacity to support increased demand. The Optical Device Chip Scale Package (ODCSP) location will move from Gunma, Japan to Niigata, Japan and dicing site location will move from Shenzhen, China to Tarlac city, Philippines. All equipment and most personnel will be transferred from Gunma to Niigata site and most equipment will be transferred from Shenzhen to Tarlac site. The Niigata and Tarlac site are ISO/TS16949 certified. Qualification Plan: QV DEVICE NAME : LV0318XP PACKAGE: ODCSP16 Test Specification HTOL EIAJ ED-4701/100 Ta=70°C, Vcc = operating max 1008 hrs HTSL EIAJ ED-4701/200 Ta= 100°C 1008 hrs TC EIAJ ED-4701/100 Ta= -40°C to +100°C 100 cyc THB EIAJ ED-4701/100 60°C, 90% RH, Vcc = recommended 1008 hrs TEM001091 Rev. F Condition Interval Page 1 of 2 Initial Product/Process Change Notification Document # : IPCN21204X Issue Date: 2 February 2016 IQV DEVICE NAME : LV0222CS PACKAGE: ODCSP8 Test Specification Condition Interval HTOL EIAJ ED-4701/100 Ta=60°C, Vcc = operating max 1008 hrs HTSL EIAJ ED-4701/200 Ta= 100°C 1008 hrs TC EIAJ ED-4701/100 Ta= -40°C to +100°C 100 cyc THB EIAJ ED-4701/100 60°C, 90% RH, Vcc = recommended 1008 hrs Estimated date for qualification completion: 17 June 2016 List of Affected Standard Parts: Part Number Qualification Vehicle LV0104CS-TLM-H LV0318XA-NH LA0151CS-TLM-E LV0318XA-NH LV0111CF-TLM-H LV0318XA-NH LV0222CS-TLM-H LV0222CS-TLM-H LV0229XA-NH LV0318XA-NH LV0221CS-TLM-H LV0318XA-NH List of Affected Customer Specific Parts: NOTE: Please be informed that parts impacted by this PDN/PCN are Special/Customer specific parts, thus MPN & CPN info will be available to affected customers only by clicking the “Custom PCN for Selected Company Button” in the Document Analysis page of PCMS/PCN Alert. TEM001091 Rev. F Page 2 of 2