LV56081GP-TE-L-E

UPDATE CHANGE NOTIFICATION #20324-D Generic Copy Issue Date: 09-Sep-2014 TITLE: Update Change Notification to FPCN20324-D for Assembly and Test site transfer from Kanto Sanyo Semiconductors Co., Ltd to ON Semiconductor SSMP Philippines Corporation (Group 01-D) PROPOSED FIRST SHIP DATE: 24-Oct-2014 or earlier upon approval due to shortage of product AFFECTED CHANGE CATEGORY(S): Assembly and Test site FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or SAMPLES: Contact your local ON Semiconductor Sales Office or ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or NOTIFICATION TYPE: Update Change Notification to FPCN. DESCRIPTION AND PURPOSE: FPCN20324-D announced on 23-Jul-2014 that the products and the equipments will be transferred from Hanyu plant of Kanto Sanyo Semiconductors Co., Ltd to ON Semiconductor SSMP Philippines Corporation because Hanyu plant of Kanto Sanyo Semiconductors Co., Ltd was closed at the end of June, 2014. FPCN20324-DA also showed the reliability result of 168hr because reliability test was still in process at that time. This update notification is to announce that the reliability evaluation result of 1000hr for the transferred products was completed and has no problem. The materials and package outline of these products remain identical. Qualification tests are designed to show that the reliability of transferred devices continue to meet or exceed ON Semiconductor standards. Issue Date: 09-Sep-2014 Rev. 06-Jan-2010 Page 1 of 4 UPDATE CHANGE NOTIFICATION #20324-D RELIABILITY DATA SUMMARY: Package name : VCT16 Test Items Test Condition Test Time Results Temperature Humidity Bias * Ta=85degC,RH=85%, Vcc=Recommended 1000hrs Pass Temperature Humidity Storage * Ta=85degC,RH=85% 1000hrs Pass Temperature Cycle * Ta=-65degC(30min) ⇔ Ta=150degC (30min) 100cycles Pass Pressure Cooker * Ta=121degC,RH=100% ,205kPa 100hrs Pass High Temperature Storage Resistance to Soldering heat (Reflow Soldering ) Ta=150degC 1000hrs Pass 255degC,10s (Peak260degC) 2times Pass 245degC,3s(with Flux) Soldering area,95% over(Sn-3.0Ag-0.5Cu) 1time Pass Solderability Notes: The test items with * mark are put into operation after the reflow soldering (at 255degC for 10seconds) -> SMD Temperature Humidity Bias Test: PD>=0.1W -> Intermittent power application consists of 1h ON and 3h OFF. Judgment Criteria： Judgment Criteria are due to the limits of the electrical characteristics in the detail specification. (Except for Solderability) Package name : VCT20 Test Items Test Condition Test Time Results Temperature Humidity Bias * Ta=85degC,RH=85%, Vcc=Recommended 1000hrs Pass Temperature Humidity Storage * Ta=85degC,RH=85% 1000hrs Pass Temperature Cycle * Ta=-65degC(30min) ⇔ Ta=150degC (30min) 100cycles Pass Pressure Cooker * Ta=121degC,RH=100% ,205kPa 100hrs Pass High Temperature Storage Resistance to Soldering heat (Reflow Soldering ) Ta=150degC 1000hrs Pass 255degC,10s (Peak260degC) 2times Pass 245degC,3s(with Flux) Soldering area,95% over(Sn-3.0Ag-0.5Cu) 1time Pass Solderability Notes: The test items with * mark are put into operation after the reflow soldering (at 255degC for 10seconds) -> SMD Temperature Humidity Bias Test: PD>=0.1W -> Intermittent power application consists of 1h ON and 3h OFF. Judgment Criteria： Judgment Criteria are due to the limits of the electrical characteristics in the detail specification. (Except for Solderability) Package name : VCT24 Test Items Test Condition Test Time Results Temperature Humidity Bias * Ta=85degC,RH=85%, Vcc=Recommended 1000hrs Pass Temperature Humidity Storage * Ta=85degC,RH=85% 1000hrs Pass Temperature Cycle * Ta=-65degC(30min) ⇔ Ta=150degC (30min) 100cycles Pass Pressure Cooker * Ta=121degC,RH=100% ,205kPa 100hrs Pass High Temperature Storage Resistance to Soldering heat (Reflow Soldering ) Ta=150degC 1000hrs Pass 255degC,10s (Peak260degC) 2times Pass 245degC,3s(with Flux) Soldering area,95% over(Sn-3.0Ag-0.5Cu) 1time Pass Solderability Notes: The test items with * mark are put into operation after the reflow soldering (at 255degC for 10seconds) -> SMD Temperature Humidity Bias Test: PD>=0.1W -> Intermittent power application consists of 1h ON and 3h OFF. Judgment Criteria： Judgment Criteria are due to the limits of the electrical characteristics in the detail specification. (Except for Solderability) Issue Date: 09-Sep-2014 Rev. 06-Jan-2010 Page 2 of 4 UPDATE CHANGE NOTIFICATION #20324-D Package name : VCT28 Test Items Test Condition Test Time Results Temperature Humidity Bias * Ta=85degC,RH=85%, Vcc=Recommended 1000hrs Pass Temperature Humidity Storage * Ta=85degC,RH=85% 1000hrs Pass Temperature Cycle * Ta=-65degC(30min) ⇔ Ta=150degC (30min) 100cycles Pass Pressure Cooker * Ta=121degC,RH=100% ,205kPa 100hrs Pass High Temperature Storage Resistance to Soldering heat (Reflow Soldering ) Ta=150degC 1000hrs Pass 255degC,10s (Peak260degC) 2times Pass 245degC,3s(with Flux) Soldering area,95% over(Sn-3.0Ag-0.5Cu) 1time Pass Solderability Notes: The test items with * mark are put into operation after the reflow soldering (at 255degC for 10seconds) -> SMD Temperature Humidity Bias Test: PD>=0.1W -> Intermittent power application consists of 1h ON and 3h OFF. Judgment Criteria： Judgment Criteria are due to the limits of the electrical characteristics in the detail specification. (Except for Solderability) Package name : FLGA24 Test Items Test Condition Test Time Results Temperature Humidity Bias * Ta=85degC,RH=85%, Vcc=Recommended 1000hrs Pass Temperature Humidity Storage * Ta=85degC,RH=85% 1000hrs Pass Temperature Cycle * Ta=-65degC(30min) ⇔ Ta=150degC (30min) 100cycles Pass Pressure Cooker * Ta=121degC,RH=100% ,205kPa 100hrs Pass High Temperature Storage Resistance to Soldering heat (Reflow Soldering ) Ta=150degC 1000hrs Pass 255degC,10s (Peak260degC) 2times Pass 245degC,3s(with Flux) Soldering area,95% over(Sn-3.0Ag-0.5Cu) 1time Pass Solderability Notes: The test items with * mark are put into operation after the reflow soldering (at 255degC for 10seconds) -> SMD Temperature Humidity Bias Test: PD>=0.1W -> Intermittent power application consists of 1h ON and 3h OFF. Judgment Criteria： Judgment Criteria are due to the limits of the electrical characteristics in the detail specification. (Except for Solderability) Package name : FLGA49 Test Items Test Condition Test Time Results Temperature Humidity Bias * Ta=85degC,RH=85%, Vcc=Recommended 1000hrs Pass Temperature Humidity Storage * Ta=85degC,RH=85% 1000hrs Pass Temperature Cycle * Ta=-65degC(30min) ⇔ Ta=150degC (30min) 100cycles Pass Pressure Cooker * Ta=121degC,RH=100% ,205kPa 100hrs Pass High Temperature Storage Resistance to Soldering heat (Reflow Soldering ) Ta=150degC 1000hrs Pass 255degC,10s (Peak260degC) 2times Pass 245degC,3s(with Flux) Soldering area,95% over(Sn-3.0Ag-0.5Cu) 1time Pass Solderability Notes: The test items with * mark are put into operation after the reflow soldering (at 255degC for 10seconds) -> SMD Temperature Humidity Bias Test: PD>=0.1W -> Intermittent power application consists of 1h ON and 3h OFF. Judgment Criteria： Judgment Criteria are due to the limits of the electrical characteristics in the detail specification. (Except for Solderability) Issue Date: 09-Sep-2014 Rev. 06-Jan-2010 Page 3 of 4 UPDATE CHANGE NOTIFICATION #20324-D Package name : FLGA68K Test Items Test Condition Test Time Results Temperature Humidity Bias * Ta=85degC,RH=85%, Vcc=Recommended 1000hrs Pass Temperature Humidity Storage * Ta=85degC,RH=85% 1000hrs Pass Temperature Cycle * Ta=-65degC(30min) ⇔ Ta=150degC (30min) 100cycles Pass Pressure Cooker * Ta=121degC,RH=100% ,205kPa 100hrs Pass High Temperature Storage Resistance to Soldering heat (Reflow Soldering ) Ta=150degC 1000hrs Pass 255degC,10s (Peak260degC) 2times Pass 245degC,3s(with Flux) Soldering area,95% over(Sn-3.0Ag-0.5Cu) 1time Pass Solderability Notes: The test items with * mark are put into operation after the reflow soldering (at 255degC for 10seconds) -> SMD Temperature Humidity Bias Test: PD>=0.1W -> Intermittent power application consists of 1h ON and 3h OFF. Judgment Criteria： Judgment Criteria are due to the limits of the electrical characteristics in the detail specification. (Except for Solderability) ELECTRICAL CHARACTERISTIC SUMMARY: There is no change in the electrical performance. Datasheet specifications remain unchanged. CHANGED PART IDENTIFICATION: Products manufactured at SSMP will be marked with ‘L7’ preceding the Serial No. on shipping label. List of affected General Parts: LB11620GP-H LB11620GP-TE-L-H LC709201F01RD-TE-L-H LC709201F02RD-TE-L-H LC709202FRD-01-2H LC709202FRD-01-MH LC709202FRD-02-2H LC709202FRD-02-MH LC717A00AR-NH LC717A00ARZ-NH LC717A10AR-NH LC87FBG08AURE-TE-L-H LC898113-TBM-H LC898220A-TE-B-H Issue Date: 09-Sep-2014 LC898221RA-NH LV5207LP-E LV5207LP-TE-L-E LV5217GP-E LV5217GP-TE-L-E LV5254LG-MPB-E LV5254LG-TLM-E LV5256GP-E LV5256GP-TE-L-E LV56081GP-E LV56081GP-TE-L-E LV5609LP-E LV5609LP-TE-L-E LV5710GP-TE-L-H Rev. 06-Jan-2010 LV8075LP-E LV8075LP-TE-L-E LV8080LP-E LV8080LP-TE-L-E LV8402GP-H LV8402GP-TE-L-H LV8411GR-E LV8411GR-TE-L-E LV8413GP-E LV8413GP-H LV8413GP-TE-L-E SS30-E SS30-TE-L-E Page 4 of 4