LV8702V-MPB-H

LV8702V Bi-CDMOS LSI PWM Current Control High-efficient Stepper Motor Driver www.onsemi.com Overview The LV8702V is a 2-channel Full-bridge driver IC that can drive a stepper motor driver, which is capable of micro-step drive and supports quarter step. Current is controlled according to motor load and rotational speed at half step, half step full-torque and quarter step excitation, thereby highly efficient drive is realized. Consequently, the reduction of power consumption, heat generation, vibration and noise is achieved. Feature SSOP44J (275mil)  Built-in 1ch PWM current control stepper motor driver (bipolar type)  Ron (High-side Ron: 0.3, Low-side Ron: 0.25, total: 0.55, Ta = 25ºC, IO = 2.5A)  Micro-step mode is configurable as follows: full step/half step full-torque/half step/quarter step  Excitation step moves forward only with step signal input  Built-in output short protection circuit (latch method)  Control power supply is unnecessary  Built-in high-efficient drive function (supports half step full-torque/half step/quarter step excitation mode)  Built-in step-out detection function (Step-out detection may not be accurate during high speed rotation)  BiCDMOS process IC  IO max=2.5A  Built-in thermal shut down circuit Typical Applications  Printer  Scanner  Surveillance camera (CCTV)  Textile machine ORDERING INFORMATION See detailed ordering and shipping information on page 27 of this data sheet. © Semiconductor Components Industries, LLC, 2014 December 2014 - Rev. 2 1 Publication Order Number : LV8702V/D LV8702V Specifications Absolute Maximum Ratings at Ta = 25C Parameter Symbol Conditions Power supply voltage VM max VM , VM1 , VM2 Output peak current IO peak tw  10ms , duty 20% , Per 1ch Output current IO max Per 1ch Logic input voltage VIN Ratings Unit 36 GMG1, GMG2 , GAD , FR , STEP , ST , V 3 A 2.5 A 0.3 to +6 V RST , MD1 , MD2 , OE , GST1 , GST2 0.3 to +6 V 5.5 W Topr 40 to +85 C Tstg 55 to +150 C DST1, DST2, MONI, Vdst1, Vdst2, Allowable power dissipation Pd max Operating temperature Storage temperature * * Specified board : 90.0mm  90.0mm  1.6mm, glass epoxy 4-layer board, with backside mounting. . Caution 1) Absolute maximum ratings represent the value which cannot be exceeded for any length of time. Caution 2) Even when the device is used within the range of absolute maximum ratings, as a result of continuous usage under high temperature, high current, high voltage, or drastic temperature change, the reliability of the IC may be degraded. Please contact us for the further details. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Recommended Operating Range at Ta = 25C Parameter Symbol Range of power supply voltage VM Logic input voltage VIN Conditions Ratings Unit VM , VM1 , VM2 9 to 32 V GMG1 , GMG2 , GAD , FR , STEP , ST , 0 to 5.5 V 0 to 3 V RST , MD1 , MD2 , OE , GST1 , GST2 Range of VREF input voltage VREF Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. Electrical Characteristics at Ta = 25°C, VM = 24V, VREF = 1.5V Parameter Consumption current during Symbol Conditions Ratings min typ Unit max IMstn ST = ”L” , I(VM)+I(VM1)+I(VM2) 110 400 A IM ST = ”H”, OE = ”L”, STEP = ”L”, non-load 4.5 6.5 mA standby Consumption current I(VM)+I(VM1)+I(VM2) VREG5 output voltage VREG5 IO = -1mA 4.5 5 5.5 V Thermal shutdown temperature TSD Design certification 150 180 210 C Thermal hysteresis width TSD Design certification 40 Ronu IO = 2.5A, Source-side Ron 0.3 0.4 0.25 0.33  50 A 1.2 1.4 V 4 8 12 A 30 50 70 A C Motor driver Output on resistor Rond IO = 2.5A, Sink-side Ron Output leak current IOleak VM = 32V Forward diode voltage VD ID = -2.5A Logic pin input current IINL VIN = 0.8V GMG1, GMG2, GAD, FR, IINH VIN = 5V STEP, ST, RST, MD1, ADIN pin input voltage Vadin Ra2 = 100k: refer to 15-4) Logic input High VINH GMG1 , GMG2 , GAD , FR , STEP , ST , voltage Low VINL RST , MD1 , MD2 , OE , GST1 , GST2  MD2, OE, GST1, GST2 0 12 V 2.0 5.5 V 0.8 V 0 Continued on next page. www.onsemi.com 2 LV8702V Continued from preceding page. Parameter Current quarter step selection reference voltage level half step half step Symbol Conditions Ratings min typ Unit max Vtdac0_W Step0 (initial status, 1ch comparator level) 290 300 310 mV Vtdac1_W Step1 (initial + 1) 264 276 288 mV Vtdac2_W Step2 (initial + 2) 199 210 221 mV Vtdac3_W Step3 (initial + 3) 106 114 122 mV Vtdac0_H Step0 (initial status, 1ch comparator level) 290 300 310 mV Vtdac2_H Step2 (initial + 1) 199 210 221 mV Vtdac0_HF Step0 (initial status, 1ch comparator level) 290 300 310 mV mV (full-torque) Vtdac2’_HF Step2’ (initial + 1) 290 300 310 full step Vtdac2’_F Step2’ (initial status, 1ch comparator level) 290 300 310 mV Chopping frequency Fchop Cchop = 200pF 35 50 65 kHz CHOP pin charge/discharge Ichop 7 10 13 A current Chopping oscillator circuit Vtup 0.8 1 1.2 V threshold voltage Vtdown 0.4 0.5 0.6 V VREF pin input current Iref 400 mV 29.8 V 0.5 mS 160 kHz DST1, DST2, MONI, 0.5 VREF = 1.5V A Idst1 = Idst2 = Imoni = Isst = 1mA SST pin saturation voltage Charge pump VG output voltage VG Rise time tONG 28 28.7 VG = 0.1F , Between CP1-CP2 0.1uF ST=”H” → VG=VM+4V Oscillator frequency Fosc 90 125 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 LV8702V Package Dimensions unit : mm SSOP44J (275mil) Exposed Pad CASE 940AG ISSUE A www.onsemi.com 4 LV8702V 1.00 SOLDERING FOOTPRINT* (Unit: mm) 7.00 (3.6) (7.8) 0.65 0.32 NOTES: 1. The measurements are for reference only, and unable to guarantee. 2. Please take appropriate action to design the actual Exposed Die Pad and Fin portion. 3. After setting, verification on the product must be done. (Although there are no recommended design for Exposed Die Pad and Fin portion Metal mask and shape for Through−Hole pitch (Pitch & Via etc), checking the soldered joint condition and reliability verification of soldered joint will be needed. Void gradient insufficient thickness of soldered joint or bond degradation could lead IC destruction because thermal conduction to substrate becomes poor.) *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. GENERIC MARKING DIAGRAM* XXXXXXXXXX YMDDD XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data Allowable power dissipation, Pd max -- W 6.0 Pd max -- Ta Four-layer circuit board *1 5.5 5.0 4.0 Four-layer circuit board *2 3.8 3.0 2.9 2.0 2.0 1.0 *1 With components mounted on the exposed die-pad board *2 With no components mounted on the exposed die-pad board 0 --40 --20 0 20 40 60 80 Ambient temperature, Ta -- C www.onsemi.com 5 100 LV8702V Substrate specifications (Substrate recommended for operation of LV8702V) Size : 90mm × 90mm × 1.6mm (Four-layer substrate) Material : Glass epoxy Copper wiring density : L1 = 85%, L2 = 90% L1: Copper wiring pattern diagram L2: Copper wiring pattern diagram L3: GND layer L4: Power supply layer Cautions 1) The data for the case with the Exposed Die-Pad substrate mounted shows the values when 90% or more of the Exposed Die-Pad is wet. 2) For the set design, employ the derating design with sufficient margin. Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stress such as vibration, impact, and tension. Accordingly, the design must ensure these stresses to be as low or small as possible. The guideline for ordinary derating is shown below: (1)Maximum value 80% or less for the voltage rating (2)Maximum value 80% or less for the current rating (However this does not apply to high efficiency drive because operating current is lower than the setting current.) (3)Maximum value 80% or less for the temperature rating 3) After the set design, be sure to verify the design with the actual product. Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc. Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal conduction, possibly resulting in thermal destruction of IC. www.onsemi.com 6 LV8702V Pin Assignment SWOUT 1 44 VM CP2 2 43 VG CP1 3 42 PGND1 GMG2 4 41 OUT1A GMG1 5 40 OUT1A GAD 6 39 VM1 FR 7 38 VM1 STEP 8 37 RF1 ST 9 36 RF1 RST 10 35 OUT1B ADIN 11 MD2 12 34 OUT1B LV8702V MD1 13 33 OUT2A 32 OUT2A VREG5 14 31 RF2 DST2 15 30 RF2 DST1 16 29 VM2 MONI 17 28 VM2 OE 18 27 OUT2B SST 19 26 OUT2B CHOP 20 25 PGND2 VREF 21 24 GST1 SGND 22 23 GST2 Top view www.onsemi.com 7 LV8702V Block Diagram RF2 OUT2B OUT2A VM2 VM1 OUT1B OUT1A RF1 VG CP1 CP2 VM Charge pump Pre-output Pre-output regulator VREG5 Pre-output Pre-output PGND Output control logic MONI + VREF CHOP + - + Current (W1-2/1-2/ 1-2Full/2) attenuat Current (W1-2/1-2/ 1-2Full/2) Oscillator SST TSD DST1 LVS Signal processor2 Signal processor1 High-efficient drive ctrl logic DST2 SGND 8 GAD OE RST STEP FR MD2 MD1 GST2 GST1 GMG2 GMG1 SWOUT ADIN ST www.onsemi.com LV8702V Pin Functions Pin No. Pin name Description 1 SWOUT Control signal output pin 2 CP2 Capacitor connection pin for charge pump 3 CP1 Capacitor connection pin for charge pump 4 GMG2 Driving capability margin adjuster pin 5 GMG1 Driving capability margin adjuster pin 6 GAD High-efficient drive switching pin 7 FR Forward/ reverse signal input pin 8 STEP STEP signal input pin Chip enable pin 9 ST 10 RST RESET signal input pin 11 ADIN Control signal input pin 12 MD2 Excitation mode switching pin 13 MD1 Excitation mode switching pin 14 VREG5 Capacitor connection pin for internal power supply 15 DST2 Drive status warning output pin 16 DST1 Drive status warning output pin 17 MONI Position detection monitor pin 18 OE Output enable signal input pin 19 SST Motor stop detection output pin 20 CHOP Capacitor connection pin for chopping frequency setting 21 VREF Constant current control reference voltage input pin 22 SGND Signal GND 23 GST2 Boost-up adjuster pin 24 GST1 Boost-up adjuster pin 2ch power GND 25 PGND2 26, 27 OUT2B 2ch OUTB output pin 28, 29 VM2 2ch motor power supply connection pin 30, 31 RF2 2ch current sense resistor connection pin 32, 33 OUT2A 2ch OUTA output pin 34, 35 OUT1B 1ch OUTB output pin 36, 37 RF1 1ch current sense resistor connection pin 38, 39 VM1 1ch motor power supply connection pin 40, 41 OUT1A 1ch OUTA output pin 42 PGND1 1ch power GND 43 VG Capacitor connection pin for charge pump 44 VM Motor power supply connection pin www.onsemi.com 9 LV8702V Pin Description Pin No. Pin name 4 GMG2 5 GMG1 6 GAD 7 FR 8 STEP 10 RST 12 MD2 13 MD1 18 OE 23 GST2 24 GST1 Equivalent Circuit VREG5 10k 100k GND 9 ST VREG5 20k 10k 80k GND 25 PGND2 26, 27 OUT2B 28, 29 VM2 30, 31 RF2 32, 33 OUT2A 34, 35 OUT1B 36, 37 RF1 38, 39 VM1 40, 41 OUT1A 42 PGND1 38 39 28 29 40 41 34 35 32 33 26 27 10k 500 25 42 500 36 37 30 31 GND Continued on next page. www.onsemi.com 10 LV8702V Continued from preceding page. Pin No. Pin name 2 CP2 3 CP1 43 VG 44 VM Equivalent Circuit 44 3 VREG5 2 43 100 GND 21 VREF VREG5 500 GND 14 VREG5 VM 2k 80k 26k GND 15 DST2 16 DST1 17 MONI 19 SST VREG5 100k GND Continued on next page. www.onsemi.com 11 LV8702V Continued from preceding page. Pin No. 20 Pin name Equivalent Circuit CHOP VREG5 500 500 GND 1 SWOUT VM PGND1 PGND2 11 ADIN VM 2pF 2k 2pF 100k GND 22 SGND www.onsemi.com 12 LV8702V Operation description Input Pin Function Each input terminal has the function to prevent the flow of the current from an input to a power supply. Therefore, even if a power supply(VM) is turned off in the state that applied voltage to an input terminal, the electric current does not flow into the power supply. 1. Chip enable function The mode of the IC is switched with ST pin between standby and operation mode. In standby mode, the IC is set to power saving mode and all the logics are reset. During standby mode, the operation of the internal regulator circuit and the charge pump circuit are stopped. ST mode Internal regulator Charge pump “L” or OPEN Standby mode standby standby “H” Operation mode operation operation 2. STEP pin function The excitation step progresses by inputting the step signal to the STP pin. Input Operation mode ST STEP L or OPEN X* Standby mode H Excitation step forward H Excitation step keep * Don’t care 3. Input timing RST Tds1 (RSTSTEP) Tsteph Tstepl STEP Tds1 Tdh1 (MDSTEP) (STEPMD) MD1/ MD2 Tdh1 Tds1 (FRSTEP) (STEPFR) FR Tdh1 Tds1 (OESTEP) (STEPOE) OE Tds2 Tdh2 (GADSTEP) (STEP GAD) GAD Tds2 Tdh2 (GMGSTEP) (STEPGMG) GMG1/ GMG2 Tds2 Tdh2 (GSTSTEP) (STEP GST) GST1/ GST2 TstepH/TstepL : Clock H/L pulse width (min 12.5s) Tds1 : Data set-up time (min 12.5s) Tdh1 : Data hold time (min 12.5s) Tds2 : Data set-up time (min 25s) Tdh2 : Data hold time (min 25s) www.onsemi.com 13 LV8702V 4. Position detection monitor function The MONI position detection monitoring pin is of an open drain type. When the excitation position is in the initial position, the MONI output is placed in the ON state. (Refer to "Examples of current waveforms in each micro-step mode.") 5. Setting constant-current control reference current This IC is designed to automatically exercise PWM constant-current chopping control for the motor current by setting the output current. Based on the voltage input to the VREF pin and the resistance connected between RF and GND, the output current that is subject to the constant-current control is set using the calculation formula below: IOUT = (VREF/5)/RF resistance The above setting is the output current at 100% of each excitation mode. For example, where VREF=1.5V and RF resistance 0.2, we obtain output current as follows. IOUT = 1.5V/5/0.2 = 1.5A When high-efficient drive function is on, IOUT is adjusted automatically within the range of the current value set by VREF. 6. Reset function RST Operation mode L or OPEN Normal operation H RESET status RST RESET STEP MONI 1ch output 0% 2ch output Initial position When RST pin = “H”, the excitation position of the output is set to the initial position forcibly and MONI output is turned on. And then by setting RST = “L”, the excitation position moves forward with the next step signal. www.onsemi.com 14 LV8702V 7. Output enable function OE Operation mode H Output OFF L or OPEN Output ON OE Power save mode STEP MONI 1ch output 0% 2ch output The output is in high-impedance state. When OE pin = “H”, the output is turned off forcibly and becomes a high-impedance output. However, since the internal logic circuit is in operation, an excitation position moves forward if step signal is input to STEP pin. Therefore, by setting back to OE = “L”, the output pin outputs signal based on the excitation position by step signal. 8. Excitation mode setting function MD1 and MD2 pin set excitation mode of the stepper motor as follows. Initial position MD1 MD2 L or OPEN L or OPEN full step excitation half step excitation 100% 0% quarter step excitation 100% 0% half step excitation 100% 0% H L or OPEN L or OPEN H H H Excitation mode 1ch 2ch 100% -100% (full-torque) The position of excitation mode is set to the initial position when: 1) a power is supplied and 2) counter is reset in each excitation mode. During full step excitation mode, high-efficient drive function is turned off even when GAD = “H”. www.onsemi.com 15 LV8702V 9. Forward/reverse switching function FR Operation mode L or OPEN CW H CCW FR CW mode CCW mode CW mode STEP Excitation position (1) (2) (3) (4) (5) (6) (5) (4) (3) (4) (5) 1ch output 2ch output The built-in DA converter moves forward by 1bit with the rise of step signal that is input to STEP pin. Also a mode is switched between CW and CCW by setting FR pin. In CW mode, the phase of 2ch current delays by 90° compared to that of 1ch current. In CCW mode the phase of 2ch current moves forward by 90° compared to 1ch current. 10. Chopping frequency setting When you control constant current of this IC, chopping is performed using the frequency defined in the capacitor (Cchop) connected between CHOP pin and GND. The calculation for the value of chopping frequency is: Fchop = Ichop/ (Cchop×Vtchop×2) (Hz) Ichop: Capacitor charge and discharge current typ: 10A Vtchop: Charge and discharge hysteresis voltage (Vtup-Vtdown) typ: 0.5V For example, where Cchop = 200pF, we obtain Fchop as follows: Fchop = 10A/ (200pF×0.5V×2) = 50kHz 11. Blanking time If you attempt to control PWM constant current chopping of the motor current, when the mode shifts from DECAY to CHARGE, noise is generated in sense resistor pin due to the recovery current of parasitic diode flowing into current sense resistor, and this may cause error detection. The blanking time avoids noise at mode switch. During the blanking time, even if noise is generated in sense resistor, a mode does not switch from CHARGE to DECAY. In this IC, the blanking time is fixed to approximately 1s. www.onsemi.com 16 LV8702V 12. Output current vector locus (1step is normalized to 90) 100 , θ2 (full step, half step full-torque) θ0 θ1 80 1ch phase current ratio (%) θ2 60 40 θ3 20 0 θ4 0 40 20 80 60 100 2ch phase current ratio (%) Setting current ration in each excitation mode STEP quarter step (%) 1ch half step (%) 2ch 1ch 0 100 0 1 92 38 2 70 70 3 38 92 4 0 100 half step full-torque (%) 2ch 1ch full step (%) 2ch 1ch 100 0 100 0 70 70 100 100 0 100 0 100 www.onsemi.com 17 2ch 100 100 LV8702V 13. The example of current waveform in each micro-step mode full step (CW mode) STEP MONI (%) 100 l1 0 -100 (%) 100 I2 0 -100 half step full-torque (CW mode) STEP MONI (%) 100 I1 0 -100 (%) 100 I2 0 -100 www.onsemi.com 18 LV8702V half step (CW mode) STEP MONI (%) 100 I1 0 -100 (%) 100 I2 0 -100 quarter step (CW mode) STEP MONI (%) 100 I1 0 -100 (%) 100 I2 0 -100 www.onsemi.com 19 LV8702V 14. Current control operation specification (Sine wave increase) STEP Setting current Setting current Coil current Forced CHARGE fchop Current mode CHARGE SLOW FAST CHARGE SLOW FAST (Sine wave decrease) STEP Setting current Coil current Forced CHARGE Setting current fchop Current mode CHARGE SLOW FAST Forced CHARGE FAST CHARGE SLOW Each current mode is operated according to the following sequence.  At rise of chopping frequency, the CHARGE mode begins. (In the time defined as the “blanking time,” the CHARGE mode is forced regardless of the magnitude of the coil current (ICOIL) and set current (IREF).)  The coil current (ICOIL) and set current (IREF) are compared in this blanking time. When (ICOIL