MAX707, MAX708
mP Supervisory Circuits
The MAX707/708 are cost−effective system supervisor circuits
designed to monitor VCC in digital systems and provide a reset signal
to the host processor when necessary. No external components are
required.
The reset output is driven active within 20 msec of VCC falling
through the reset voltage threshold. Reset is maintained with 200 mS
of delay time after VCC rise above the reset threshold. The
MAX707/708 have a low quiescent current of 12 mA at VCC = 3.3 V,
an active−high RESET and active−low RESET with a push−pull
output. The output is guaranteed valid down to VCC = 1.0 V. The
MAX707/708 have a Manual Reset MR input and a +1.25 V threshold
detector for power−fail input PFI. These devices are available in a
Micro8 and SOIC−8 package.
Features
• Precision Supply−Voltage Monitor
•
•
•
•
•
•
•
•
MAX707: 4.63 V Reset Threshold Voltage
MAX708: Standard Reset Threshold Voltages (Typical):
4.38 V, 3.08 V, 2.93 V, 2.63 V
Reset Threshold Available from 1.6 V to 4.9 V with 100 mV
Increments (Factory Option)
200 mS (Typ) Reset Timeout Delay
12 mA (VCC = 3.3 V) Quiescent Current
Active_High and Active_Low Reset Output
Guaranteed RESET_L and RESET Output Valid to VCC = 1.0 V
Voltage Monitor for Power−Fail or Low−Battery Warning
8 Pin SOIC or Micro8 Package
Pb−Free Packages are Available
http://onsemi.com
MARKING
DIAGRAMS
8
1
xxx
A
Y
W
G
1
= Specific Device Code
= Assembly Location
= Year
= Week
= Pb−Free Package
8
xxxxx
ALYWG
G
SOIC−8
ESA SUFFIX
CASE 751
8
1
1
xxxxx = Specific Device Code
AL
= Assembly Lot Code
Y
= Year
W
= Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONFIGURATION
Micro8
Applications
•
•
•
•
xxx
AYW
G
Micro8t
CUA SUFFIX
CASE 846A
8
Computers
Embedded System
Battery Powered Equipment
Critical mP Power Supply Monitor
RESET 1
8 NC
RESET 2
7 PFO
MR 3
6 PFI
VCC 4
5 GND
(Top View)
SOIC−8
MR 1
8 RESET
VCC 2
7 RESET
GND 3
6 NC
PFI 4
5 PFO
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 4
1
Publication Order Number:
MAX707/D
MAX707, MAX708
VCC
RESET
MR
RESET
GENERATOR
VCC
RESET
+
−
VTH
PFI
+
−
PFO
1.25 V
GND
Figure 1. Representative Block Diagram
MAXIMUM RATINGS (Note 1)
Rating
Symbol
Value
Unit
Supply Voltage
VCC
6.0
V
Output Voltage
Vout
−0.3 to (VCC + 0.3)
V
Output Current (All Outputs)
Iout
20
mA
Input Current (VCC and GND)
Iin
20
mA
Thermal Resistance Junction−to−Air
°C/W
RqJA
Micro8
SOIC−8
248
187
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature Range
Tstg
−40 to +125
°C
LatchUp Performance
ILATCHUP
Positive
Negative
mA
300
280
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015.
Machine Model Method 200 V.
2. The maximum package power dissipation limit must not be exceeded.
TJ(max) * TA
with TJ(max) = 150°C
PD +
RqJA
http://onsemi.com
2
MAX707, MAX708
ELECTRICAL CHARACTERISTICS (VCC = 1.0 V to 5.5 V, TA = −40°C to +85°C, unless otherwise noted. Typical values
are at TA = 25°C, VCC = 3.3 V.)
Characteristics
Symbol
Min
Typ
Max
Unit
Operating Voltage Range
VCC
1.0
−
5.5
V
Supply Current
VCC = 3.3 V
VCC = 5.5 V
ICC
−
−
12
16
22
28
Reset Threshold
MAX707
TA = +25°C
TA = −40°C to +85°C
MAX708
TA = +25°C
TA = −40°C to +85°C
MAX708T
TA = +25°C
TA = −40°C to +85°C
MAX708S
TA = +25°C
TA = −40°C to +85°C
MAX708R
TA = +25°C
TA = −40°C to +85°C
VTH
Reset Threshold Hysteresis
VHYS
mA
V
4.56
4.50
4.63
4.70
4.75
4.31
4.25
4.38
4.45
4.50
3.03
3.00
3.08
3.13
3.15
2.89
2.85
2.93
2.97
3.00
2.59
2.55
2.63
2.67
2.70
−
0.01 VTH
−
mV
VCC Falling Reset Delay (VCC = VTH + 0.2 V to VTH − 0.2 V)
tPD
−
20
−
mS
Reset Active Timeout Period
tRP
140
200
330
mS
RESET_L, RESET_H Output Low Voltage
VCC w 1.0 V, Iol = 100 mA
VCC u 2.7 V, Iol = 1.2 mA
VCC u 4.5 V, Iol = 3.2 mA
Vol
−
−
−
−
−
−
0.3
0.3
0.3
RESET_L, RESET_H Output High Voltage
VCC w 1.0 V, Ioh = 50 mA
VCC u 2.7 V, Ioh = 500 mA
VCC u 4.5 V, Ioh = 800 mA
Voh
0.8 VCC
0.8 VCC
0.8 VCC
−
−
−
−
−
−
RMRI
50
−
−
KW
tMR
1.0
−
−
mS
−
−
0.1
−
mS
MR_L High_level Input Threshold (VTH (max) t VCC t 5.5 V)
VIH
0.7 VCC
−
−
V
MR_L Low_level Input Threshold (VTH (max) t VCC t 5.5 V)
VIL
−
−
0.3 VCC
V
MR_L to RESET_L and RESET_H Output Delay
(VTH (max) t VCC t 5.5 V)
tMD
−
0.2
−
mS
PFI Input Threshold (VCC = 3.3 V, PFI Falling)
−
1.20
1.25
1.3
V
PFI Input Current
−
−250
0.01
250
nA
PFI to PFO Delay (VCC = 3.3 V, VOVERDRIVE = 15 mV)
−
−
3.0
−
mS
−
−
−
−
0.3
0.3
0.8 VCC
0.8 VCC
−
−
−
−
MR_L Pull−up Resistance
MR_L Pulse Width (VTH (max) t VCC t 5.5 V)
MR_L Glitch Rejection (VTH (max) t VCC t 5.5 V)
PFO_L Output Low Voltage
VCC = 2.7 V, Iol = 1.2 mA
VCC = 4.5 V, Iol = 3.2 mA
Vol
PFO_L Output High Voltage
VCC = 2.7 V, Ioh = 500 mA
VCC = 4.5 V, Ioh = 800 mA
Voh
http://onsemi.com
3
V
V
V
V
MAX707, MAX708
PIN DESCRIPTION (Pin No. with parentheses is for Micro8 package.)
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Symbol
1 (3)
MR
Manual Reset Input. MR can be driven from TTL/CMOS logic or from a manual Reset switch. This input, when
floating, is internally pulled up to VCC with 50 kW resistor.
2 (4)
VCC
Supply Voltage: C = 100 nF is recommended as a bypass capacitor between VCC and GND.
3 (5)
GND
Ground Reference
4 (6)
PFI
Power Fail Voltage Monitor Input. When PFI is less than 1.25 V, PFO goes low. Connect PFI to GND or VCC when
not used.
5 (7)
PFO
Power Fail Monitor Output. When PFI is less than 1.25 V, it goes low and sinks current. Otherwise, it remains high.
6 (8)
NC
7 (1)
RESET
Active Low RESET can be triggered by VCC below the threshold level or by a low signal on MR. It remains low for
200 ms (typ.) after VCC rises above the reset threshold.
8 (2)
RESET
Active high RESET output the inverse of RESET one.
Description
Non−connective Pin
IOUT, OUTPUT SOURCE CURRENT (mA)
IOUT, OUTPUT SINK CURRENT (mA)
Pin No.
3.0
TA = 25°C
Vin = 1.5 V
2.5
2.0
1.5
1.0
0.5
Vin = 1.0 V
0
0.5
1.0
1.5
Vout = Vin − 2.0 V
16
Vin − 1.5 V
14
12
10
8
Vin − 1.0 V
6
4
Vin − 0.5 V
2
0
0
1.0
2.0
3.0
4.0
5.0
Vout, OUTPUT VOLTAGE (V)
Vin, INPUT VOLTAGE (V)
Figure 2. MAX707/708 Series 1.60 V Reset
Output Sink Current vs. Output Voltage
Figure 3. MAX707/708 Series 1.60 V Reset
Output Source Current vs. Input Voltage
12
TA = 25°C
Vin = 2.5 V
10
8
Vin = 2.0 V
6
4
Vin = 1.5 V
2
0
0
TA = 25°C
18
2.0
Iout, OUTPUT SOURCE CURRENT (mA)
IOUT, OUTPUT SINK CURRENT (mA)
0
20
0.5
1.0
1.5
2.0
2.5
3.0
20
18
TA = 25°C
Vout = Vin − 2.0 V
16
Vin −1.5 V
14
12
10
8
Vin − 1.0 V
6
4
Vin − 0.5 V
2
0
0.0
1.0
2.0
3.0
4.0
5.0
Vout, OUTPUT VOLTAGE (V)
Vin, INPUT VOLTAGE (V)
Figure 4. MAX707/708 Series 2.93 V Reset
Output Sink Current vs. Output Voltage
Figure 5. MAX707/708 Series 2.93 V Reset
Output Source Current vs. Input Voltage
http://onsemi.com
4
6.0
6.0
MAX707, MAX708
Iout, OUTPUT SOURCE CURRENT (mA)
Vin = 4.0 V
TA = 25°C
25
20
Vin = 3.0 V
15
10
Vin = 2.0 V
5
VDET, DETECTOR THRESHOLD VOLTAGE (VOLTS)
0
0.0
1.0
2.0
3.0
4.0
5.0
18
12
Vin − 1.5 V
10
Vin − 1.0 V
8
6
4
Vin − 0.5 V
2
0
0.0
1.0
2.0
3.0
4.0
5.0
Figure 7. MAX707/708 Series 4.90 V Reset
Output Source Current vs. Input Voltage
VDET+
1615
1610
1605
1600
VDET−
1595
1590
−25
0
25
50
75
100
TA, AMBIENT TEMPERATURE (°C)
3110
3100
3090
3080
4980
4960
4940
4920
VDET−
−25
0
25
50
75
VDET−
3070
3060
−50
TPD, VCC, FALLING RESET DELAY (ms)
VDET+
4900
VDET+
−25
0
25
50
75
100
TA, AMBIENT TEMPERATURE (°C)
Figure 10. MAX707/708 Series 2.93 V Detector
Threshold Voltage vs. Temperature
5020
5000
6.0
3120
Figure 8. MAX707/708 Series 1.60 V Detector
Threshold Voltage vs. Temperature
VDET, DETECTOR THRESHOLD VOLTAGE (VOLTS)
Vout = Vin − 2.0 V
14
Figure 6. MAX707/708 Series 4.90 V Reset
Output Sink Current vs. Output Voltage
1620
4880
−50
TA = 25°C
16
Vin, INPUT VOLTAGE (V)
1625
1585
−50
20
Vout, OUTPUT VOLTAGE (V)
VDET, DETECTOR THRESHOLD VOLTAGE (VOLTS)
Iout, OUTPUT SINK CURRENT (mA)
30
100
45
40
VTH = 4.90 V
35
30
VTH = 2.93 V
25
20
VTH = 1.60 V
15
10
5
0
−40
−20
0
20
40
60
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 9. MAX707/708 Series 4.90 V Detector
Threshold Voltage vs. Temperature
Figure 11. MAX707/708 Series VCC Falling
Reset Delay vs. Temperature
http://onsemi.com
5
80
MAX707, MAX708
APPLICATIONS INFORMATION
one of these. It is effectively debounced by the 1.0 ms
minimum reset pulse width. As MR is TTL/CMOS logic
compatible, it can be driven by an external logic line.
Microprocessor Reset
To generate a processor reset, the manual Reset input
allows different reset sources. A pushbutton switch can be
VCC
VTH
VTH
tRP
RESET
tRP
MR
tMD
tMR
Figure 12. RESET and MR Timing
VCC Transient Rejection
(overdrive) for glitch rejection. For a given overdrive, the
point of the curve is the maximum width of the glitch
allowed before the device generates a reset signal. Transient
immunity can be improved by adding a capacitor (100 nF for
example) in close proximity to the VCC pin of the
MAX707/708.
MAXIMUM TRANSIENT DURATION (ms)
The MAX707/708 provides accurate VCC monitoring and
reset timing during power−up, power−down, and
brownout/sag conditions, and rejects negative glitches on
the power supply line. Figure 13 shows the maximum
transient duration vs. maximum negative excursion
300
250
VCC
200
VTH
VTH = 4.90 V
150
Overdrive
VTH = 3.08 V
100
VTH = 1.60 V
50
0
10
Duration
30
50
70
90
110
130
150
RESET COMPARATOR OVERDRIVE (mV)
Figure 13. Maximum Transient Duration vs.
Overdrive for Glitch Rejection at 255C
http://onsemi.com
6
MAX707, MAX708
components are required to follow the reset I/O of the mP, the
buffer should be connected as shown with the solid line.
RESET Signal Integrity During Power−Down
The MAX707/708 RESET output is valid until VCC falls
below 1.0 V. Then, the output becomes an open circuit and
no longer sinks current. This means CMOS logic inputs of
the mP will be floating at an undetermined voltage. Most
digital systems are completely shutdown well above this
voltage. However, in the case RESET must be maintained
valid to VCC = 0 V, a pull down resistor must be connected
from RESET to ground to discharge stray capacitances and
hold the output low (Figure 14). This resistor value, though
not critical, should be chosen large enough not to load
RESET and small enough to pull it to ground. R = 100 kW
will be suitable for most applications.
BUFFERED
RESET TO
OTHER SYSTEM
COMPONENTS
BUFFER
VCC
VCC
mP
MAX707/708
4.7 k
RESET
RESET
GND
GND
VCC
MAX707/708
Figure 15. Interfacing to Bidirectional Reset I/O
RESET
GND
R
Monitoring Additional Supply Levels
100 k
When connecting a voltage divider to PFI and adjusting it
properly, you can monitor a voltage different than the
unregulated DC one. As shown in Figure 16, to increase
noise immunity, hysteresis may be added to the power−fail
comparator just by a resistor between PFO and PFI. Not to
unbalance the potential divider network, R3 should be 10
times the sum of the two resistors R1 and R2. If required, a
capacitor between PFI and GND will reduce the sensitivity
of the circuit to high−frequency noise on the line being
monitored. The PFO output may be connected to MR input
to generate a low level on the RESET when VCC_1 drops out
of tolerance. Thus a RESET is generated when one of the
two voltages is below its threshold level.
Figure 14. Ensuring RESET Valid to VCC = 0 V
Interfacing with mPs with Bidirectional I/O Pins
Some mPs have bidirectional reset pins. If, for example,
the RESET output is driven high and the mP wants to put it
low, indeterminate logic level may result. This can be
avoided by adding a 4.7 kW resistor in series with the output
of the MAX707/708 (Figure 15). If there are other
components in the system that require a reset signal, they
should be buffered so as not to load the reset line. If the other
VCC_1
VCC_2
VCC_3
VCC
VCC
R1
RESET
MAX707/708
VCC_2
PFO
RESET
mP
0V
0V
MR
PFI
VH
VCC_1
PFO
GND
VL
GND
R2
VL + 1.25 ) R1
R3
VH + 1.25
1.25 * Vcc_2
ǒ1.25
Ǔ
)
R3
R2
(1 ) R1
VHYS + VH * VL +
Figure 16. Monitoring Additional Supply Levels
http://onsemi.com
7
R1
) R3Ǔ )
ǒR2
R2 R3
Vcc_2
R3
MAX707, MAX708
ORDERING INFORMATION
Marking
Reset VCC Threshold
(V)
Package
Shipping †
MAX707ESA−T
S707
4.63
SOIC−8
2500 Tape & Reel
MAX707ESA−TG
S707
4.63
SOIC−8
(Pb−Free)
2500 Tape & Reel
MAX708ESA−T
S708
4.38
SOIC−8
2500 Tape & Reel
MAX708ESA−TG
S708
4.38
SOIC−8
(Pb−Free)
2500 Tape & Reel
MAX708RESA−T
S708R
2.63
SOIC−8
2500 Tape & Reel
MAX708RESA−TG
S708R
2.63
SOIC−8
(Pb−Free)
2500 Tape & Reel
MAX708SESA−T
S708S
2.93
SOIC−8
2500 Tape & Reel
MAX708SESA−TG
S708S
2.93
SOIC−8
(Pb−Free)
2500 Tape & Reel
MAX708TESA−T
S708T
3.08
SOIC−8
2500 Tape & Reel
MAX708TESA−TG
S708T
3.08
SOIC−8
(Pb−Free)
2500 Tape & Reel
MAX707CUA−T
SAC
4.63
Micro8
4000 Tape & Reel
MAX707CUA−TG
SAC
4.63
Micro8
(Pb−Free)
4000 Tape & Reel
MAX708CUA−T
SAD
4.38
Micro8
4000 Tape & Reel
MAX708CUA−TG
SAD
4.38
Micro8
(Pb−Free)
4000 Tape & Reel
MAX708RCUA−T
SAG
2.63
Micro8
4000 Tape & Reel
MAX708RCUA−TG
SAG
2.63
Micro8
(Pb−Free)
4000 Tape & Reel
MAX708SCUA−T
SAF
2.93
Micro8
4000 Tape & Reel
MAX708SCUA−TG
SAF
2.93
Micro8
(Pb−Free)
4000 Tape & Reel
MAX708TCUA−T
SAE
3.08
Micro8
4000 Tape & Reel
MAX708TCUA−TG
SAE
3.08
Micro8
(Pb−Free)
4000 Tape & Reel
Device
†For information on tape and reel specifications,including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Micro8 is a trademark of International Rectifier.
http://onsemi.com
8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
8
1
SCALE 1:1
−X−
DATE 16 FEB 2011
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
M
D
0.25 (0.010)
M
Z Y
S
X
J
S
8
8
1
1
IC
4.0
0.155
XXXXX
A
L
Y
W
G
IC
(Pb−Free)
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
XXXXXX
AYWW
1
1
Discrete
XXXXXX
AYWW
G
Discrete
(Pb−Free)
XXXXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
1.270
0.050
SCALE 6:1
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
8
8
XXXXX
ALYWX
G
XXXXX
ALYWX
1.52
0.060
0.6
0.024
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
7.0
0.275
DIM
A
B
C
D
G
H
J
K
M
N
S
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42564B
SOIC−8 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOIC−8 NB
CASE 751−07
ISSUE AK
DATE 16 FEB 2011
STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. COLLECTOR
4. EMITTER
5. EMITTER
6. BASE
7. BASE
8. EMITTER
STYLE 2:
PIN 1. COLLECTOR, DIE, #1
2. COLLECTOR, #1
3. COLLECTOR, #2
4. COLLECTOR, #2
5. BASE, #2
6. EMITTER, #2
7. BASE, #1
8. EMITTER, #1
STYLE 3:
PIN 1. DRAIN, DIE #1
2. DRAIN, #1
3. DRAIN, #2
4. DRAIN, #2
5. GATE, #2
6. SOURCE, #2
7. GATE, #1
8. SOURCE, #1
STYLE 4:
PIN 1. ANODE
2. ANODE
3. ANODE
4. ANODE
5. ANODE
6. ANODE
7. ANODE
8. COMMON CATHODE
STYLE 5:
PIN 1. DRAIN
2. DRAIN
3. DRAIN
4. DRAIN
5. GATE
6. GATE
7. SOURCE
8. SOURCE
STYLE 6:
PIN 1. SOURCE
2. DRAIN
3. DRAIN
4. SOURCE
5. SOURCE
6. GATE
7. GATE
8. SOURCE
STYLE 7:
PIN 1. INPUT
2. EXTERNAL BYPASS
3. THIRD STAGE SOURCE
4. GROUND
5. DRAIN
6. GATE 3
7. SECOND STAGE Vd
8. FIRST STAGE Vd
STYLE 8:
PIN 1. COLLECTOR, DIE #1
2. BASE, #1
3. BASE, #2
4. COLLECTOR, #2
5. COLLECTOR, #2
6. EMITTER, #2
7. EMITTER, #1
8. COLLECTOR, #1
STYLE 9:
PIN 1. EMITTER, COMMON
2. COLLECTOR, DIE #1
3. COLLECTOR, DIE #2
4. EMITTER, COMMON
5. EMITTER, COMMON
6. BASE, DIE #2
7. BASE, DIE #1
8. EMITTER, COMMON
STYLE 10:
PIN 1. GROUND
2. BIAS 1
3. OUTPUT
4. GROUND
5. GROUND
6. BIAS 2
7. INPUT
8. GROUND
STYLE 11:
PIN 1. SOURCE 1
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. DRAIN 2
7. DRAIN 1
8. DRAIN 1
STYLE 12:
PIN 1. SOURCE
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 13:
PIN 1. N.C.
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 14:
PIN 1. N−SOURCE
2. N−GATE
3. P−SOURCE
4. P−GATE
5. P−DRAIN
6. P−DRAIN
7. N−DRAIN
8. N−DRAIN
STYLE 15:
PIN 1. ANODE 1
2. ANODE 1
3. ANODE 1
4. ANODE 1
5. CATHODE, COMMON
6. CATHODE, COMMON
7. CATHODE, COMMON
8. CATHODE, COMMON
STYLE 16:
PIN 1. EMITTER, DIE #1
2. BASE, DIE #1
3. EMITTER, DIE #2
4. BASE, DIE #2
5. COLLECTOR, DIE #2
6. COLLECTOR, DIE #2
7. COLLECTOR, DIE #1
8. COLLECTOR, DIE #1
STYLE 17:
PIN 1. VCC
2. V2OUT
3. V1OUT
4. TXE
5. RXE
6. VEE
7. GND
8. ACC
STYLE 18:
PIN 1. ANODE
2. ANODE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. CATHODE
8. CATHODE
STYLE 19:
PIN 1. SOURCE 1
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. MIRROR 2
7. DRAIN 1
8. MIRROR 1
STYLE 20:
PIN 1. SOURCE (N)
2. GATE (N)
3. SOURCE (P)
4. GATE (P)
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 21:
PIN 1. CATHODE 1
2. CATHODE 2
3. CATHODE 3
4. CATHODE 4
5. CATHODE 5
6. COMMON ANODE
7. COMMON ANODE
8. CATHODE 6
STYLE 22:
PIN 1. I/O LINE 1
2. COMMON CATHODE/VCC
3. COMMON CATHODE/VCC
4. I/O LINE 3
5. COMMON ANODE/GND
6. I/O LINE 4
7. I/O LINE 5
8. COMMON ANODE/GND
STYLE 23:
PIN 1. LINE 1 IN
2. COMMON ANODE/GND
3. COMMON ANODE/GND
4. LINE 2 IN
5. LINE 2 OUT
6. COMMON ANODE/GND
7. COMMON ANODE/GND
8. LINE 1 OUT
STYLE 24:
PIN 1. BASE
2. EMITTER
3. COLLECTOR/ANODE
4. COLLECTOR/ANODE
5. CATHODE
6. CATHODE
7. COLLECTOR/ANODE
8. COLLECTOR/ANODE
STYLE 25:
PIN 1. VIN
2. N/C
3. REXT
4. GND
5. IOUT
6. IOUT
7. IOUT
8. IOUT
STYLE 26:
PIN 1. GND
2. dv/dt
3. ENABLE
4. ILIMIT
5. SOURCE
6. SOURCE
7. SOURCE
8. VCC
STYLE 29:
PIN 1. BASE, DIE #1
2. EMITTER, #1
3. BASE, #2
4. EMITTER, #2
5. COLLECTOR, #2
6. COLLECTOR, #2
7. COLLECTOR, #1
8. COLLECTOR, #1
STYLE 30:
PIN 1. DRAIN 1
2. DRAIN 1
3. GATE 2
4. SOURCE 2
5. SOURCE 1/DRAIN 2
6. SOURCE 1/DRAIN 2
7. SOURCE 1/DRAIN 2
8. GATE 1
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42564B
SOIC−8 NB
STYLE 27:
PIN 1. ILIMIT
2. OVLO
3. UVLO
4. INPUT+
5. SOURCE
6. SOURCE
7. SOURCE
8. DRAIN
STYLE 28:
PIN 1. SW_TO_GND
2. DASIC_OFF
3. DASIC_SW_DET
4. GND
5. V_MON
6. VBULK
7. VBULK
8. VIN
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
Micro8
CASE 846A−02
ISSUE K
DATE 16 JUL 2020
SCALE 2:1
GENERIC
MARKING DIAGRAM*
8
XXXX
AYWG
G
1
XXXX
A
Y
W
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB14087C
MICRO8
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
SOURCE
SOURCE
SOURCE
GATE
DRAIN
DRAIN
DRAIN
DRAIN
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
SOURCE 1
GATE 1
SOURCE 2
GATE 2
DRAIN 2
DRAIN 2
DRAIN 1
DRAIN 1
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
N-SOURCE
N-GATE
P-SOURCE
P-GATE
P-DRAIN
P-DRAIN
N-DRAIN
N-DRAIN
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
工商网监
湘ICP备2023018690号
