MBD701, MMBD701LT1
Preferred Device
Silicon Hot-Carrier Diodes
Schottky Barrier Diodes
These devices are designed primarily for high−efficiency UHF and VHF detector applications. They are readily adaptable to many other fast switching RF and digital applications. They are supplied in an inexpensive plastic package for low−cost, high−volume consumer and industrial/commercial requirements. They are also available in a Surface Mount package.
Features
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TO−92 2−Lead CASE 182 STYLE 1 1 2 2 CATHODE 1 ANODE
• • • • •
Extremely Low Minority Carrier Lifetime − 15 ps (Typ) Very Low Capacitance − 1.0 pF @ VR = 20 V High Reverse Voltage − to 70 V Low Reverse Leakage − 200 nA (Max) Pb−Free Packages are Available
MBD 701 AYWW G G
MAXIMUM RATINGS
Rating Reverse Voltage Forward Power Dissipation MBD701 @ TA = 25°C MMBD701LT Derate above 25°C MBD701 MMBD701LT TJ Tstg Symbol VR PF Value 70 280 200 2.8 2.0 −55 to +125 −55 to +150 Unit V mW mW/°C °C °C 1 2 3
SOT−23 (TO−236) CASE 318 STYLE 8
5H M G G 1
3 CATHODE
1 ANODE
Operating Junction Temperature Range Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
A = Assembly Location Y = Year WW = Work Week 5H = Device Code (SOT−23) M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Reverse Breakdown Voltage (IR = 10 mAdc) Total Capacitance (VR = 20 V, f = 1.0 MHz) Figure 1 Reverse Leakage (VR = 35 V) Figure 3 Forward Voltage (IF = 1.0 mAdc) Figure 4 Forward Voltage (IF = 10 mAdc) Figure 4 Symbol V(BR)R CT IR VF VF Min 70 − − − − Typ − 0.5 9.0 0.42 0.7 Max − 1.0 200 0.5 1.0 Unit V pF nAdc Vdc Vdc MBD701
ORDERING INFORMATION
Device MBD701G MMBD701LT1 MMBD701LT1G MMBD701LT3 MMBD701LT3G Package TO−92 TO−92 (Pb−Free) SOT−23 Shipping† 1,000 Units / Box 1,000 Units / Box 3,000 / Tape & Reel
SOT−23 3,000 / Tape & Reel (Pb−Free) SOT−23 10,000/T ape & Reel SOT−23 10,000/T ape & Reel (Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Preferred devices are recommended choices for future use and best overall value.
© Semiconductor Components Industries, LLC, 2009
March, 2009 − Rev. 5
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Publication Order Number: MBD701/D
MBD701, MMBD701LT1
TYPICAL ELECTRICAL CHARACTERISTICS
2.0 t , MINORITY CARRIER LIFETIME (ps) f = 1.0 MHz C T, TOTAL CAPACITANCE (pF) 1.6 500 400 KRAKAUER METHOD 300
1.2
0.8
200
0.4
100
0 0 5.0 10 15 20 25 30 35 VR, REVERSE VOLTAGE (VOLTS) 40 45 50
0 0 10 20 30 40 50 60 70 IF, FORWARD CURRENT (mA) 80 90 100
Figure 1. Total Capacitance
Figure 2. Minority Carrier Lifetime
10 IF, FORWARD CURRENT (mA) TA = 100°C
100
IR, REVERSE LEAKAGE (m A)
1.0
10 TA = 85°C TA = - 40°C
TA = 75°C 0.1
1.0 TA = 25°C
0.01
TA = 25°C
0.001
0.1 0 10 20 30 VR, REVERSE VOLTAGE (VOLTS) 40 50 0 0.2 0.4 0.8 1.2 VF, FORWARD VOLTAGE (VOLTS) 1.6 2.0
Figure 3. Reverse Leakage
Figure 4. Forward Voltage
IF(PEAK)
CAPACITIVE CONDUCTION
IR(PEAK) FORWARD CONDUCTION STORAGE CONDUCTION
SINUSOIDAL GENERATOR
BALLAST NETWORK (PADS)
PADS DUT
SAMPLING OSCILLOSCOPE (50 W INPUT)
Figure 5. Krakauer Method of Measuring Lifetime
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MBD701, MMBD701LT1
PACKAGE DIMENSIONS TO−92 (TO−226AC) CASE 182−06 ISSUE L
A
B
SEATING PLANE
R L K D J
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND ZONE R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.050 BSC 0.100 BSC 0.014 0.016 0.500 --0.250 --0.080 0.105 --0.050 0.115 --0.135 --MILLIMETERS MIN MAX 4.45 5.21 4.32 5.33 3.18 4.19 0.407 0.533 1.27 BSC 2.54 BSC 0.36 0.41 12.70 --6.35 --2.03 2.66 --1.27 2.93 --3.43 ---
P
D
XX G H V C N
SECTION X−X
DIM A B C D G H J K L N P R V
1
2
N
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ÉÉ ÉÉ
STYLE 1: PIN 1. ANODE 2. CATHODE
MBD701, MMBD701LT1
PACKAGE DIMENSIONS
SOT−23 (TO−236) CASE 318−08 ISSUE AN
D
SEE VIEW C 3
E
1 2
HE c e b q 0.25
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08. MILLIMETERS NOM MAX 1.00 1.11 0.06 0.10 0.44 0.50 0.13 0.18 2.90 3.04 1.30 1.40 1.90 2.04 0.20 0.30 0.54 0.69 2.40 2.64 INCHES NOM 0.040 0.002 0.018 0.005 0.114 0.051 0.075 0.008 0.021 0.094
A A1 L L1 VIEW C
DIM A A1 b c D E e L L1 HE
MIN 0.89 0.01 0.37 0.09 2.80 1.20 1.78 0.10 0.35 2.10
MIN 0.035 0.001 0.015 0.003 0.110 0.047 0.070 0.004 0.014 0.083
MAX 0.044 0.004 0.020 0.007 0.120 0.055 0.081 0.012 0.029 0.104
STYLE 8: PIN 1. ANODE 2. NO CONNECTION 3. CATHODE
SOLDERING FOOTPRINT*
0.95 0.037 0.95 0.037
2.0 0.079 0.9 0.035
SCALE 10:1
0.8 0.031
mm inches
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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MBD701/D
