MBRA140, NRVBA140
Surface Mount
Schottky Power Rectifier
SMA Power Surface Mount Package
This device employs the Schottky Barrier principle in a large area
metal−to−silicon power diode. State of the art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity diodes in surface mount applications
where compact size and weight are critical to the system.
Features
•
•
•
•
•
•
•
Small Compact Surface Mountable Package with J−Bent Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
Guardring for Stress Protection
NRVBA & SBRA Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements;
AEC−Q101 Qualified and PPAP Capable*
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
40 VOLTS
SMA
CASE 403D
MARKING DIAGRAM
B14
AYWW G
Mechanical Characteristics
• Case: Epoxy, Molded
• Weight: 70 mg (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
•
•
260°C Max. for 10 Seconds
Shipped in 12 mm tape, 5000 units per 13 inch reel
Polarity: Cathode Lead Indicated by Either Notch in Plastic Body
or Polarity Band
B14
= Specific Device Code
A
= Assembly Location**
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
**The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package bottom (molding ejecter pin),
the front side assembly code may be blank.
ORDERING INFORMATION
Device
Package
Shipping†
MBRA140T3G
SMA
(Pb−Free)
5,000 /
Tape & Reel
NRVBA140T3G*
SMA
(Pb−Free)
5,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
April, 2017 − Rev. 11
1
Publication Order Number:
MBRA140T3/D
MBRA140, NRVBA140
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(At Rated VR, TC = 95°C)
Symbol
Value
Unit
VRRM
VRWM
VR
40
V
IO
1.0
A
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 20 kHz, TC = 100°C)
IFRM
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
Storage Temperature
Tstg
−55 to +150
°C
Operating Junction Temperature
TJ
−55 to +125
°C
Voltage Rate of Change
(Rated VR, TJ = 25°C)
2.0
30
dv/dt
10,000
ESD Ratings:
Machine Model = C
Human Body Model = 3B
> 400
> 8000
A
A
V/ms
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 1)
Symbol
Value
Unit
RqJL
RqJA
35
86
°C/W
1. Mounted on 2″ Square PC Board with 1″ Square Total Pad Size, PC Board FR4.
ELECTRICAL CHARACTERISTICS
Symbol
Characteristic
Maximum Instantaneous Forward Voltage (Note 2)
see Figure 2 for other Values
Maximum Instantaneous Reverse Current
see Figure 4 for other Values
VF
(IF = 1.0 A)
(IF = 2.0 A)
IR
(VR = 40 V)
(VR = 20 V)
Value
Unit
TJ = 25°C
TJ = 100°C
0.55
0.71
0.505
0.74
TJ = 25°C
TJ = 100°C
0.5
0.1
10
4.0
V
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%.
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2
I F, INSTANTANEOUS FORWARD CURRENT (AMPS)
i F , INSTANTANEOUS FORWARD CURRENT (AMPS)
MBRA140, NRVBA140
10
TJ = 85°C
1.0
TJ = 125°C
TJ = 25°C
TJ = -40°C
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.0
TJ = 85°C
TJ = 25°C
TJ = 125°C
0.1
0
0.4
0.2
0.6
1.0
0.8
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
100E-3
1.2
100E-3
10E-3
TJ = 125°C
1.0E-3
TJ = 85°C
I R , MAXIMUM REVERSE CURRENT (AMPS)
I R , REVERSE CURRENT (AMPS)
10
100E-6
10E-3
TJ = 85°C
1.0E-3
TJ = 25°C
100E-6
TJ = 25°C
10E-6
1.0E-6
0
10
20
30
40
10E-6
1.0E-6
0
10
20
30
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
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3
40
MBRA140, NRVBA140
1.2
SQUARE WAVE
1.0
Ipk/Io = p
Ipk/Io = 5
0.6
Ipk/Io = 10
0.4
Ipk/Io = 20
0.2
0
0
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
FREQ = 20 kHz
1.4
0.8
PFO , AVERAGE POWER DISSIPATION (WATTS)
dc
20
40
60
80
100
120
1.0
0.9
SQUARE WAVE
0.8
dc
Ipk/Io = p
0.7
Ipk/Io = 5
0.6
Ipk/Io = 10
0.5
0.4
Ipk/Io = 20
0.3
0.2
0.1
0
140
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
TL, LEAD TEMPERATURE (°C)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
1.6
T, TIME (s)
1.0E+0
100E-3
10E-3
1.0E-3
100E-6
10E-6
1.0E-3
100E-6
10E-3
1.0E+0
100E-3
10E+0
T, TIME (s)
Figure 7. Thermal Response
1000
C, CAPACITANCE (pF)
IO , AVERAGE FORWARD CURRENT (AMPS)
1.6
100
TJ = 25°C
10
1.0
0
5.0
10
15
20
25
30
VR, REVERSE VOLTAGE (VOLTS)
Figure 8. Capacitance
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4
35
40
100E+0
1.0E+3
MBRA140, NRVBA140
PACKAGE DIMENSIONS
SMA
CASE 403D
ISSUE H
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L.
E
b
DIM
A
A1
b
c
D
E
HE
L
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
MIN
1.97
0.05
1.27
0.15
2.29
4.06
4.83
0.76
MILLIMETERS
NOM
MAX
2.10
2.20
0.10
0.20
1.45
1.63
0.28
0.41
2.60
2.92
4.32
4.57
5.21
5.59
1.14
1.52
MIN
0.078
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.083
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.087
0.008
0.064
0.016
0.115
0.180
0.220
0.060
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
A
L
c
A1
SOLDERING FOOTPRINT*
4.0
0.157
2.0
0.0787
2.0
0.0787
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
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MBRA140T3/D
