MBRS320T3G, SBRS8320T3G,
MBRS330T3G, NRVBS330T3G,
MBRS340T3G, SBRS8340T3G
Surface Mount
Schottky Power Rectifier
These devices employ the Schottky Barrier principle in a large area
metal-to-silicon power diode. State-of-the-art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the system.
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SCHOTTKY BARRIER
RECTIFIERS
3.0 AMPERES
20, 30, 40 VOLTS
Features
•
•
•
•
•
•
•
•
•
Small Compact Surface Mountable Package with J-Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
(0.5 V Max @ 3.0 A, TJ = 25°C)
Excellent Ability to Withstand Reverse Avalanche Energy Transients
Guard-Ring for Stress Protection
Device Passes ISO 7637 Pulse #1
SBRS8 and NRVB Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements;
AEC−Q101 Qualified and PPAP Capable*
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 217 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
•
•
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Polarity Band on Plastic Body Indicates Cathode Lead
Device Meets MSL 1 Requirements
ESD Ratings:
♦ Machine Model = C (> 400 V)
♦ Human Body Model = 3B (> 8000 V)
SMC 2−LEAD
CASE 403AC
MARKING DIAGRAM
AYWW
B3xG
G
B3x
x
A
Y
WW
G
= Device Code
= 2, 3 or 4
= Assembly Location**
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
**The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly code
may be blank.
ORDERING INFORMATION
Package
Shipping†
MBRS320T3G
SMC
(Pb−Free)
2,500 /
Tape & Reel
MBRS330T3G
SMC
(Pb−Free)
2,500 /
Tape & Reel
MBRS340T3G
SMC
(Pb−Free)
2,500 /
Tape & Reel
NRVBS330T3G
SMC
(Pb−Free)
2,500 /
Tape & Reel
SBRS8320T3G*
SMC
(Pb−Free)
2,500 /
Tape & Reel
SBRS8340T3G*
SMC
(Pb−Free)
2,500 /
Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
August, 2017 − Rev. 14
1
Publication Order Number:
MBRS340T3/D
MBRS320T3G, SBRS8320T3G, MBRS330T3G, NRVBS330T3G, MBRS340T3G,
SBRS8340T3G
MAXIMUM RATINGS
Rating
Symbol
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
Average Rectified Forward Current
IF(AV)
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave,
single phase, 60 Hz)
IFSM
Operating Junction Temperature
MBRS320T3G,
SBRS8320T3G
MBRS330T3G,
NRVBRS330T3G
MBRS340T3G,
SBRS8340T3G
Unit
20
30
40
V
3.0 @ TL = 110°C
4.0 @ TL = 105°C
A
A
80
TJ
− 65 to +150
ISO 7637 Pulse #1
(100 V, 10W)
°C
Pulses
5000
ESD Ratings:
Machine Model = C
Human Body Model = 3B
V
> 400
> 8000
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Thermal Resistance, Junction−to−Lead
11
RqJL
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 1)
(iF = 3.0 A, TJ = 25°C)
VF
Maximum Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 100°C)
iR
V
0.50
mA
2.0
20
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
TYPICAL ELECTRICAL CHARACTERISTICS
10
TJ = 100°C
TJ = 125°C
1
0.1
iF, INSTANTANEOUS FORWARD
CURRENT (AMPS)
iF, INSTANTANEOUS FORWARD
CURRENT (AMPS)
10
TJ = 25°C
TJ = −40°C
TJ = −65°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.0
TJ = 25°C
TJ = −40°C
TJ = −65°C
0.1
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
TJ = 100°C
TJ = 125°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9 1.0
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
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2
MBRS320T3G, SBRS8320T3G, MBRS330T3G, NRVBS330T3G, MBRS340T3G,
SBRS8340T3G
1.E−01
IR, REVERSE CURRENT (AMPS)
1.E−01
TJ = 125°C
1.E−02
1.E−02 TJ = 125°C
1.E−03
1.E−03
TJ = 100°C
TJ = 100°C
1.E−04
1.E−04
1.E−05
1.E−06
IR, MAXIMUM REVERSE CURRENT (AMPS)
TYPICAL ELECTRICAL CHARACTERISTICS (continued)
TJ = 25°C
0
5
TJ = 25°C
1.E−05
10
15
20
25
30
35
40
1.E−06
5
0
10
VR, REVERSE VOLTAGE (V)
PFO, AVERAGE POWER DISSIPATION (W)
Freq = 20 kHz
RqJL = 11°C/W
dc
4
3.5
3
2.5
SQUARE WAVE
2
1.5
1
0.5
0
90
100
110
130
120
140
150
1.8
1.6
IPK/IO = p
1.4
SQUARE
WAVE
dc
0.8
0.6
0.4
0.2
0
0
1
0.5
2
1.5
2.5
3
3.5
4
4.5
IO, AVERAGE FORWARD CURRENT (A)
Figure 6. Forward Power Dissipation
TYPICAL CAPACITANCE AT 0 V = 658 pF
TJ = 25°C
500
400
300
200
100
4
40
1
600
0
35
30
IPK/IO = 5
1.2
Figure 5. Current Derating
0
25
2
TL, LEAD TEMPERATURE (°C)
700
20
Figure 4. Maximum Reverse Current
5
C, CAPACITANCE (pF)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 3. Typical Reverse Current
4.5
15
VR, REVERSE VOLTAGE (V)
8
12
16
20
24
28
32
VR, REVERSE VOLTAGE (V)
Figure 7. Typical Capacitance
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3
36
40
5
MBRS320T3G, SBRS8320T3G, MBRS330T3G, NRVBS330T3G, MBRS340T3G,
SBRS8340T3G
PACKAGE DIMENSIONS
SMC 2−LEAD
CASE 403AC
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD
FLASH SHALL NOT EXCEED 0.254mm PER SIDE.
4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H.
5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA
DETERMINED BY DIMENSION L.
HE
E
D
A1
DIM
A
A1
A2
b
c
D
E
HE
L
c J
DETAIL A
TOP VIEW
DETAIL A
A2
L
A
MILLIMETERS
MIN
MAX
1.95
2.61
0.05
0.20
1.90
2.41
2.90
3.20
0.15
0.41
5.55
6.25
6.60
7.15
7.75
8.15
0.75
1.60
INCHES
MIN
MAX
0.077
0.103
0.002
0.008
0.075
0.095
0.114
0.126
0.006
0.016
0.219
0.246
0.260
0.281
0.305
0.321
0.030
0.063
b
END VIEW
SIDE VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
8.750
0.344
J
2X
3.790
0.149
2X
2.250
0.089
mm Ǔ
ǒinches
SCALE 4:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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4
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MBRS340T3/D
