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subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi
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regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/
or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for
implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,
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associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative
Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.
MBRS4201P
200V, 4A Schottky
Fast Soft-Recovery
Power Rectifier
SMC Power Surface Mount Package
www.onsemi.com
Features
• Lower Forward Voltage than any Ultrafast Rectifier:
•
•
•
•
VF < 0.61 V at 150°C
Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns
Soft Recovery Characteristics: Softness Factor (tb/ta) ≥ 1
Highly Stable Over Temperature
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
SCHOTTKY RECTIFIER
4 AMPS, 200 VOLTS
SMC 2−LEAD
CASE 403AC
Benefits
•
•
•
•
Significantly Reduced EMI
Eliminates the Need of Snubber Circuits
Low Switching and Heat Losses
Improved Thermal Management
MARKING DIAGRAM
Applications
• Engine and Convenience Control Systems
• Motor Controls
• Battery Chargers and Switching Power Supplies
AYWW
B421G
G
Mechanical Characteristics
•
•
•
•
•
•
•
Small Compact Surface Mount Package with J–Bend Leads
Rectangular Package for Automated Handling
Weight: 217 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
ESD Ratings:
♦ Machine Model = A
♦ Human Body Model = 1C
Cathode Polarity Band
B421
A
Y
WW
G
= Specific Device Code
= Assembly Location*
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
ORDERING INFORMATION
Device
MBRS4201PT3G
Package
Shipping†
SMC 2−Lead
(Pb−Free)
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
August, 2017 − Rev. 2
1
Publication Order Number:
MBRS4201P/D
MBRS4201P
MAXIMUM RATINGS
Symbol
Value
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Characteristic
VRRM
VRWM
VR
200
Average Rectified Forward Current
(Rated VR, TL = 70°C)
IF(AV)
Nonrepetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
Operating Junction Temperature
TJ
4
100
−55 to +150
Unit
V
A
A
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead
Symbol
Value
Unit
RqJL
11
°C/W
Symbol
Value
Unit
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage
(IF = 4 A, TJ = 25°C)
(IF = 4 A, TJ = 150°C)
VF
Maximum Instantaneous Reverse Current (Rated VR)
(Rated DC Voltage, TJ = 25°C)
(Rated DC Voltage, TJ = 150°C)
IR
Maximum Reverse Recovery Time
(IF = 1.0 A, di/dt = 100 A/ms, VR = 30 V)
trr
0.86
0.62
V
1.0
5.0
mA
mA
35
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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2
MBRS4201P
TYPICAL CHARACTERISTICS
100
IF, FORWARD CURRENT (A)
IF, FORWARD CURRENT (A)
100
10
150°C
25°C
100°C
1
0.1
150°C
1
25°C
100°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
VF, INSTANTANEOUS VOLTAGE (V)
VF, INSTANTANEOUS VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.2
1.0E−01
IR, MAXIMUM REVERSE CURRENT (A)
1E−2
1.0E−02
150°C
1E−3
1E−4
TC = 150°C
1.0E−03
100°C
1E−5
TC = 25°C
1.0E−04
1E−6
1E−7
1.0E−05
25°C
1E−8
0
20
40
60
80
1.0E−06
0
100 120 140 160 180200
20
40
60
80
1000
100
10
0
20
40
60
120 140 160 180 200
Figure 4. Maximum Reverse Current
Figure 3. Typical Reverse Current
1
100
VR, REVERSE VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
C, CAPACITANCE (pF)
1E−9
0.2
1.1 1.2
1E−1
IR, REVERSE CURRENT (A)
10
80
100 120 140 160 180 200
VR, REVERSE VOLTAGE (V)
Figure 5. Typical Capacitance
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3
MBRS4201P
6
5
DC
4
SQUAREWAVE
3
2
1
0
0
20
40
60
80
100
120
140
160
PFO, AVERAGE POWER DISSIPATION (W)
7
5.0
4.5
4.0
3.5
3.0
2.5
SQUAREWAVE
2.0
DC
1.5
1.0
0.5
0
0
1
2
3
4
5
TL, LEAD TEMPERATURE (°C)
IO, AVERAGE FORWARD CURRENT
Figure 6. Derating Curve
Figure 7. Power Dissipation
2.5
2.0
1.5
I, CURRENT (A)
IF, AVERAGE FORWARD CURRENT (A)
TYPICAL CHARACTERISTICS
1.0
200 V Ultrafast
MBRS4201
0.5
ON Semiconductor MBRS4201
eliminates reverse recovery
oscillations present in Ultrafast
devices in the market, particularly at
hot temperatures.
*Test Conditions:
IF = 1 A, dI/dT = 100 A/ms,
VR = 30 V
0
−0.5
−1.0
−1.5
−2.0
−2.5
T, TIME (10 ns/div)
Figure 8. Reverse Recovery Time* (tRR) at 1255C
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4
6
MBRS4201P
PACKAGE DIMENSIONS
SMC 2−LEAD
CASE 403AC
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD
FLASH SHALL NOT EXCEED 0.254mm PER SIDE.
4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H.
5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA
DETERMINED BY DIMENSION L.
HE
E
D
A1
DIM
A
A1
A2
b
c
D
E
HE
L
c J
DETAIL A
TOP VIEW
DETAIL A
A2
L
A
MILLIMETERS
MIN
MAX
1.95
2.61
0.05
0.20
1.90
2.41
2.90
3.20
0.15
0.41
5.55
6.25
6.60
7.15
7.75
8.15
0.75
1.60
INCHES
MIN
MAX
0.077
0.103
0.002
0.008
0.075
0.095
0.114
0.126
0.006
0.016
0.219
0.246
0.260
0.281
0.305
0.321
0.030
0.063
b
END VIEW
SIDE VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
8.750
0.344
J
2X
3.790
0.149
2X
2.250
0.089
mm Ǔ
ǒinches
SCALE 4:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage
may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer
is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of
any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and
do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices
intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and
hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was
negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright
laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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◊
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
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5
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For additional information, please contact your local
Sales Representative
MBRS4201P/D