MBRS4201T3

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Other names and brands may be claimed as the property of others. MBRS4201T3G, NRVBS4201T3G Schottky Power Rectifier, Surface Mount, Fast SoftRecovery 4.0 A, 200 V, SMC Package www.onsemi.com Features • Lower Forward Voltage than any Ultrafast Rectifier: • • • • • • VF < 0.61 V at 150°C Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns Soft Recovery Characteristics: Softness Factor (tb/ta) ≥ 1 Highly Stable Over Temperature AEC−Q101 Qualified and PPAP Capable NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Benefits • • • • MARKING DIAGRAM AYWW B421G G B421 A Y WW G • Engine and Convenience Control Systems • Motor Controls • Battery Chargers and Switching Power Supplies Mechanical Characteristics • • • SMC 2−LEAD CASE 403AC Significantly Reduced EMI Eliminates the Need of Snubber Circuits Low Switching and Heat Losses Improved Thermal Management Applications • • • • SCHOTTKY RECTIFIER 4 AMPS, 200 VOLTS = Specific Device Code = Assembly Location** = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) Small Compact Surface Mount Package with J–Bend Leads Rectangular Package for Automated Handling Weight: 217 mg (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Maximum for 10 Seconds ESD Ratings: ♦ Machine Model = A ♦ Human Body Model = 1C Polarity: Polarity Band on Plastic Body Indicates Cathode Lead **The Assembly Location code (A) is front side optional. In cases where the Assembly Location is stamped in the package, the front side assembly code may be blank. ORDERING INFORMATION Package Shipping† MBRS4201T3G SMC (Pb−Free) 2,500 / Tape & Reel NRVBS4201T3G* SMC (Pb−Free) 2,500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 August, 2017 − Rev. 8 1 Publication Order Number: MBRS4201T3/D MBRS4201T3G, NRVBS4201T3G MAXIMUM RATINGS Symbol Value Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Characteristic VRRM VRWM VR 200 Average Rectified Forward Current (Rated VR, TL = 70°C) IF(AV) Nonrepetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Operating Junction Temperature TJ 4 100 −55 to +150 Unit V A A °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead Symbol Value Unit RqJL 11 °C/W Symbol Value Unit ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (IF = 4 A, TJ = 25°C) (IF = 4 A, TJ = 150°C) VF Maximum Instantaneous Reverse Current (Rated VR) (Rated DC Voltage, TJ = 25°C) (Rated DC Voltage, TJ = 150°C) IR Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 100 A/ms, VR = 30 V) trr 0.86 0.61 V 1.0 5.0 mA mA 35 ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 2 MBRS4201T3G, NRVBS4201T3G TYPICAL ELECTRICAL CHARACTERISTICS 100 IF, FORWARD CURRENT (A) IF, FORWARD CURRENT (A) 100 10 150°C 25°C 100°C 1 0.1 150°C 1 25°C 100°C 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 VF, INSTANTANEOUS VOLTAGE (V) VF, INSTANTANEOUS VOLTAGE (V) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 1.2 1.0E−01 IR, MAXIMUM REVERSE CURRENT (A) 1E−2 1.0E−02 150°C 1E−3 1E−4 TC = 150°C 1.0E−03 100°C 1E−5 TC = 25°C 1.0E−04 1E−6 1E−7 1.0E−05 25°C 1E−8 0 20 40 60 80 1.0E−06 0 100 120 140 160 180200 20 40 60 80 VR, REVERSE VOLTAGE (V) 100 10 0 20 40 60 120 140 160 180 200 Figure 4. Maximum Reverse Current 1000 1 100 VR, REVERSE VOLTAGE (V) Figure 3. Typical Reverse Current C, CAPACITANCE (pF) 1E−9 0.2 1.1 1.2 1E−1 IR, REVERSE CURRENT (A) 10 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (V) Figure 5. Typical Capacitance www.onsemi.com 3 6 5 DC 4 SQUAREWAVE 3 2 1 0 0 20 40 60 80 100 120 140 160 PFO, AVERAGE POWER DISSIPATION (W) 7 5.0 4.5 4.0 3.5 3.0 2.5 SQUAREWAVE 2.0 DC 1.5 1.0 0.5 0 0 1 2 3 4 5 TL, LEAD TEMPERATURE (°C) IO, AVERAGE FORWARD CURRENT Figure 6. Derating Curve Figure 7. Power Dissipation 2.5 2.0 1.5 I, CURRENT (A) IF, AVERAGE FORWARD CURRENT (A) MBRS4201T3G, NRVBS4201T3G 1.0 200 V Ultrafast MBRS4201 0.5 ON Semiconductor MBRS4201 eliminates reverse recovery oscillations present in Ultrafast devices in the market, particularly at hot temperatures. *Test Conditions: IF = 1 A, dI/dT = 100 A/ms, VR = 30 V 0 −0.5 −1.0 −1.5 −2.0 −2.5 T, TIME (10 ns/div) Figure 8. Reverse Recovery Time* (tRR) at 1255C www.onsemi.com 4 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SMC 2−LEAD CASE 403AC ISSUE B DATE 27 JUL 2017 SCALE 1:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.254mm PER SIDE. 4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H. 5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA DETERMINED BY DIMENSION L. HE E D A1 DIM A A1 A2 b c D E HE L c DETAIL A TOP VIEW DETAIL A A2 L A b END VIEW SIDE VIEW INCHES MIN MAX 0.077 0.103 0.002 0.008 0.075 0.095 0.114 0.126 0.006 0.016 0.219 0.246 0.260 0.281 0.305 0.321 0.030 0.063 GENERIC MARKING DIAGRAM* AYWW XXXXG G RECOMMENDED SOLDERING FOOTPRINT* 8.750 0.344 2X MILLIMETERS MIN MAX 1.95 2.61 0.05 0.20 1.90 2.41 2.90 3.20 0.15 0.41 5.55 6.25 6.60 7.15 7.75 8.15 0.75 1.60 XXXX A Y WW G 3.790 0.149 = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) 2X 2.250 0.089 mm Ǔ ǒinches SCALE 4:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON97675F SMC 2−LEAD *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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