MBRS540T3G

MBRS540T3G, NRVBS540T3G Surface Mount Schottky Power Rectifier The MBRS540T3 employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. www.onsemi.com SCHOTTKY BARRIER RECTIFIER 5.0 AMPERES, 40 VOLTS Features • • • • • • • Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction Excellent Ability to Withstand Reverse Avalanche Energy Transients Guard−Ring for Stress Protection NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant SMC 2−LEAD CASE 403AC MARKING DIAGRAM AYWW B540G G Mechanical Characteristics • Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 @ 0.125 in • Weight: 217 mg (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • • • 260°C Max. for 10 Seconds Polarity: Polarity Band on Plastic Body Indicates Cathode Lead ESD Rating: ♦ Machine Model, C (> 400 V) ♦ Human Body Model, 3B (> 8000 V) Device Meets MSL 1 Requirements B540 A Y WW G = Specific Device Code = Assembly Location** = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) **The Assembly Location code (A) is front side optional. In cases where the Assembly Location is stamped in the package, the front side assembly code may be blank. ORDERING INFORMATION Package Shipping† MBRS540T3G SMC (Pb−Free) 2,500 / Tape & Reel NRVBS540T3G* SMC (Pb−Free) 2,500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2013 June, 2017 − Rev. 10 1 Publication Order Number: MBRS540T3/D NRVBS540T3G MAXIMUM RATINGS Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating VRRM VRWM VR 40 V Average Rectified Forward Current (At Rated VR, TC = 105°C) IF(AV) 5 A Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 KHz, TC = 80°C) IFRM 10 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 190 A Storage Temperature Range Tstg −65 to +150 °C TJ −65 to +150 °C dv/dt 10,000 V/ms Operating Junction Temperature (Note 1) Voltage Rate of Change (Rated VR) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (Note 2) Thermal Resistance, Junction−to−Ambient (Note 2) Symbol Value RqJL 12 RqJA 111 Symbol Value Unit °C/W 2. Rating applies when surface mounted on the minimum pad size recommended. ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (Note 3) (iF = 5.0 A, TC= 25°C) VF Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, TC = 25°C) (Rated dc Voltage, TC = 100°C) iR 0.50 0.3 15 Unit V mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%. www.onsemi.com 2 NRVBS540T3G TYPICAL CHARACTERISTICS 10 iF, INSTANTANEOUS FORWARD CURRENT (A) iF, INSTANTANEOUS FORWARD CURRENT (A) 10 TJ = 125°C 1 TJ = −40°C TJ = 100°C TJ = 25°C 0.1 0.10 0.30 0.20 TJ = −55°C 0.40 0.50 TJ = 125°C 1 TJ = 100°C TJ = 25°C TJ = −40°C 0.60 VF, INSTANTANEOUS FORWARD VOLTAGE (V) TJ = 100°C 100E−6 10E−6 TJ = 25°C 1E−6 TJ = −55°C 10E−9 1E−9 100E−12 TJ = 125°C 10E−3 TJ = 100°C 1E−3 TJ = 25°C 100E−6 100E−9 0 10 20 30 VR, REVERSE VOLTAGE (V) 40 TJ = −55°C 10E−6 1E−6 0 10 20 30 VR, REVERSE VOLTAGE (V) Figure 3. Typical Reverse Current 9 PFO, AVERAGE POWER DISSIPATION (W) IO, AVERAGE FORWARD CURRENT (A) 8 7 6 5 4 3 SQUARE WAVE Ipk/IO = p Ipk/IO = 5 2 1 0 25 50 75 100 125 40 Figure 4. Maximum Reverse Current freq = 20 kHz dc 0.70 100E−3 IR, MAXIMUM REVERSE CURRENT (A) IR, REVERSE CURRENT (A) 1E−3 0.60 0.50 0.40 Figure 2. Maximum Forward Voltage TJ = 125°C 10E−3 0.30 0.20 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (V) Figure 1. Typical Forward Voltage 100E−3 TJ = −55°C 0.1 0.10 150 TL, LEAD TEMPERATURE (°C) 4.5 4 SQUARE WAVE 3.5 dc 3 2.5 2 Ipk/IO = p 1.5 Ipk/IO = 5 1 Ipk/IO = 10 0.5 0 Ipk/IO = 20 0 Figure 5. Current Derating 1 2 3 4 5 6 7 8 IO, AVERAGE FORWARD CURRENT (A) Figure 6. Forward Power Dissipation www.onsemi.com 3 9 NRVBS540T3G 1000 TJ, DERATED OPERATING TEMPERATURE (°C) TYPICAL CHARACTERISTICS C, CAPACITANCE (pF) TJ = 25 °C 100 0 5 10 15 20 25 30 VR, REVERSE VOLTAGE (V) 35 40 125 RqJA = 12 °C/W 115 105 RqJA = 47 °C/W 95 RqJA = 81 °C/W 85 RqJA = 111 °C/W 75 RqJA = 136 °C/W 65 55 0 Figure 7. Capacitance 35 10 15 20 25 30 VR, DC REVERSE VOLTAGE (V) 5 40 45 Figure 8. Typical Operating Temperature Derating r(t), TRANSIENT THERMAL RESPONSE (C/W) 1000 100 D = 0.5 10 0.2 0.1 P(pk) 0.05 0.02 1 0.01 Test Type > min pad 1 oz RqJC = min pad 1 oz C/W t1 t2 DUTY CYCLE, D = t1/t2 SINGLE PULSE 0.1 0.00001 0.0001 0.001 0.01 0.1 1 100 10 1000 t, TIME (s) r(t), TRANSIENT THERMAL RESPONSE (C/W) Figure 9. Thermal Response − MBRS540T3G, NRVBS540T3G on min pad 100 D = 0.5 0.2 10 0.1 P(pk) 0.05 1 0.02 0.01 0.1 0.00001 Test Type > min pad 1 oz RqJC = min pad 1 oz C/W t1 t2 DUTY CYCLE, D = t1/t2 SINGLE PULSE 0.0001 0.001 0.1 0.01 1 10 t, TIME (s) Figure 10. Thermal Response − MBRS540T3G, NRVBS540T3G on 1” pad www.onsemi.com 4 100 1000 NRVBS540T3G PACKAGE DIMENSIONS SMC 2−LEAD CASE 403AC ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.254mm PER SIDE. 4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H. 5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA DETERMINED BY DIMENSION L. HE E D A1 c DETAIL A TOP VIEW DETAIL A A2 L MILLIMETERS MIN MAX 1.95 2.61 0.05 0.20 1.90 2.41 2.90 3.20 0.15 0.41 5.55 6.25 6.60 7.15 7.75 8.15 0.75 1.60 DIM A A1 A2 b c D E HE L A INCHES MIN MAX 0.077 0.103 0.002 0.008 0.075 0.095 0.114 0.126 0.060 0.016 0.219 0.246 0.260 0.281 0.305 0.321 0.030 0.063 b END VIEW SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT* 8.750 0.344 2X 3.790 0.149 2X 2.250 0.089 mm Ǔ ǒinches SCALE 4:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ◊ N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MBRS540T3/D