MC100EP14
3.3V / 5V 1:5 Differential
ECL/PECL/HSTL Clock Driver
Description
The MC100EP14 is a low skew 1−to−5 differential driver, designed with
clock distribution in mind, accepting two clock sources into an input
multiplexer. The ECL/PECL input signals can be either differential or
single−ended (if the VBB output is used). HSTL inputs can be used when
the LVEP14 is operating under PECL conditions.
The EP14 specifically guarantees low output−to−output skew. Optimal
design, layout, and processing minimize skew within a device and from
device to device.
To ensure that the tight skew specification is realized, both sides of
any differential output need to be terminated even if only one output is
being used. If an output pair is unused, both outputs may be left open
(unterminated) without affecting skew.
The common enable (EN) is synchronous, outputs are enabled/
disabled in the LOW state. This avoids a runt clock pulse when the
device is enabled/disabled as can happen with an asynchronous
control. The internal flip flop is clocked on the falling edge of the input
clock, therefore all associated specification limits are referenced to the
negative edge of the clock input.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single−ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB
and VCC via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB should be left open.
Features
•
•
•
•
•
•
•
•
•
400 ps Typical Propagation Delay
100 ps Device−to−Device Skew
25 ps Within Device Skew
Maximum Frequency > 2 GHz Typical
The 100 Series Contains Temperature Compensation
PECL and HSTL Mode:
VCC = 3.0 V to 5.5 V with VEE = 0 V
NECL Mode:
VCC = 0 V with VEE = −3.0 V to −5.5 V
Open Input Default State
These are Pb−Free Devices
© Semiconductor Components Industries, LLC, 2014
April, 2014 − Rev. 7
http://onsemi.com
TSSOP−20
DT SUFFIX
CASE 948E
MARKING DIAGRAM*
20
100
EP14
ALYWG
G
1
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
1
Publication Order Number:
MC100EP14/D
MC100EP14
VCC
EN
VCC
CLK1
CLK1
VBB
CLK0
CLK0
CLK_SEL
VEE
20
19
18
17
16
15
14
13
12
11
1
0
D
Q
1
2
3
4
5
6
7
8
9
10
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
Q4
Q4
WARNING: All VCC and VEE pins must be externally connected
to Power Supply to guarantee proper operation.
Figure 1. TSSOP−20 (Top View) and Logic Diagram
Table 1. PIN DESCRIPTION
Pin
Table 2. FUNCTION TABLE
Function
CLK0*, CLK0**
ECL/PECL/HSTL CLK Input
CLK1*, CLK1**
ECL/PECL/HSTL CLK Input
Q0:4, Q0:4
ECL/PECL Outputs
CLK_SEL*
ECL/PECL Active Clock Select Input
EN*
ECL Sync Enable
VBB
Reference Voltage Output
VCC
Positive Supply
VEE
Negative Supply
CLK0
CLK1
CLK_SEL
EN
Q
L
H
X
X
X
X
X
L
H
X
L
L
H
H
X
L
L
L
L
H
L
H
L
H
L*
* On next negative transition of CLK0 or CLK1
* Pins will default low when left open.
** Pins will default to VCC/2 when left open.
http://onsemi.com
2
MC100EP14
Table 3. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
ESD Protection
37.5 kW
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
TSSOP−8
Flammability Rating
Oxygen Index: 28 to 34
> 4 kV
> 200 V
> 2 kV
Pb Pkg
Pb−Free Pkg
Level 1
Level 1
UL 94 V−0 @ 0.125 in
Transistor Count
357 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
6
V
VEE
NECL Mode Power Supply
VCC = 0 V
−6
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−20
TSSOP−20
140
100
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−20
23 to 41
°C/W
Tsol
Wave Solder
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