MC100LVEL30DWR2G

3.3 V ECL Triple D Flip‐Flop with Set and Reset MC100LVEL30 Description The MC100LVEL30 is a triple master-slave D flip-flop with differential outputs. Data enters the master latch when the clock input is LOW and transfers to the slave upon a positive transition on the clock input. In addition to a common Set input individual Reset inputs are provided for each flip-flop. Both the Set and Reset inputs function asynchronous and overriding with respect to the clock inputs. www.onsemi.com Features • • • • • • SOIC−20 WB DW SUFFIX CASE 751D−05 1200 MHz Minimum Toggle Frequency 450 ps Typical Propagation Delays ESD Protection: > 2 kV Human Body Model MARKING DIAGRAM* The 100 Series Contains Temperature Compensation. PECL Mode Operating Range: VCC = 3.0 V to 3.8 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −3.0 V to −3.8 V Internal Input 75 kW Pulldown Resistors 20 100LVEL30 AWLYYWWG • • Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test • Moisture Sensitivity: Level 3 (Pb-Free) • (For Additional Information, see Application Note AND8003/D) Flammability Rating: UL 94 V−0 @ 0.125 in, Oxygen Index: 28 to 34 Transistor Count = 347 Devices • • These Devices are Pb-Free, Halogen Free and are RoHS Compliant 1 A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION Device Package Shipping† MC100LVEL30DWR2G SOIC−20 WB (Pb-Free) 1000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2016 March, 2021 − Rev. 9 1 Publication Order Number: MC100LVEL30/D MC100LVEL30 VCC Q0 Q0 VCC Q1 Q1 VCC Q2 Q2 VEE 20 19 18 16 15 14 13 12 11 Q Q Q Q Q Q S 17 R S D 1 S012 2 R S D 3 D0 CLK0 4 5 R0 D1 R D 6 7 8 CLK1 R1 9 D2 10 CLK2 R2 Warning: All VCC and VEE pins must be externally connected to Power Supply to guarantee proper operation. Figure 1. Logic Diagram and Pinout: 20-Lead SOIC (Top View) Table 2. PIN DESCRIPTION Table 1. TRUTH TABLE PIN FUNCTION D0−D2 R0−R2 CLK0−CLK2 S012 Q0−Q2; Q0−Q2 VCC VEE ECL Data Inputs ECL Reset Inputs ECL Clock Inputs ECL Common Set Input ECL Differential Data Outputs Positive Supply Negative Supply R S D CLK Q Q L L H L H L L L H H L H X X X Z Z X X X L H L H Undef H L H L Undef Z = LOW to HIGH Transition X = Don’t Care Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 8 to 0 V VEE NECL Mode Power Supply VCC = 0 V −8 to 0 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 to 0 −6 to 0 V Iout Output Current Continuous Surge 50 100 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm SOIC−20 WB SOIC−20 WB 90 60 °C/W qJC Thermal Resistance (Junction-to-Case) Standard Board SOIC−20 WB 30 to 35 °C/W Tsol Wave Solder < 2 to 3 sec @ 248°C 265 °C VI ≤ VCC VI ≥ VEE Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 MC100LVEL30 Table 4. LVPECL DC CHARACTERISTICS (VCC = 3.3 V; VEE = 0.0 V (Note 1)) −40°C Symbol Characteristic Min 25°C Typ Max 55 62 Min 85°C Typ Max 55 62 Min Typ Max Unit 55 64 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 2215 2295 2420 2275 2345 2420 2275 2345 2420 mV VOL Output LOW Voltage (Note 2) 1470 1605 1745 1490 1595 1680 1490 1595 1680 mV VIH Input HIGH Voltage 2135 2420 2135 2420 2135 2420 mV VIL Input LOW Voltage 1490 1825 1490 1825 1490 1825 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 150 0.5 0.5 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. 1. Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V. 2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 5. LVNECL DC CHARACTERISTICS (VCC = 0.0 V; VEE = −3.3 V (Note 1)) −40°C Symbol Characteristic Min 25°C Typ Max 55 62 Min 85°C Typ Max 55 62 Min Typ Max Unit 55 64 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) −1085 −1005 −880 −1025 −955 −880 −1025 −955 −880 mV VOL Output LOW Voltage (Note 2) −1830 −1695 −1555 −1810 −1705 −1620 −1810 −1705 −1620 mV VIH Input HIGH Voltage −1165 −880 −1165 −880 −1165 −880 mV VIL Input LOW Voltage −1810 −1475 −1810 −1475 −1810 −1475 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 150 0.5 0.5 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. 1. Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V. 2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 6. AC CHARACTERISTICS (VCC = 3.3 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −3.3 V (Note 1)) −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 85°C Max Typ Max 1.2 tPLH tPHL Propagation Delay to Output CLK, S, R 550 tS tH Setup Time Hold Time 150 200 0 100 150 200 0 100 150 200 0 100 ps tRR Set/Reset Recovery 400 200 400 200 400 200 ps tPW Minimum Pulse Width CLK Set, Reset 400 650 tr tf Cycle-to-Cycle Jitter Output Rise/Fall Times Q (20%−80%) 800 1.2 Unit Maximum Toggle Frequency tJITTER 1.2 Min fmax 570 820 400 650 9.5 590 550 280 840 450 10.8 550 280 ps ps 400 650 10.5 280 GHz ps 550 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. 1. VEE can vary ±0.3 V. www.onsemi.com 3 MC100LVEL30 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices) Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPS I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 4 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−20 WB CASE 751D−05 ISSUE H DATE 22 APR 2015 SCALE 1:1 A 20 q X 45 _ M E h 0.25 H NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 1 10 20X B b 0.25 M T A S B DIM A A1 b c D E e H h L q S L A 18X e SEATING PLANE A1 c T GENERIC MARKING DIAGRAM* RECOMMENDED SOLDERING FOOTPRINT* 20 20X 20X 1.30 0.52 20 XXXXXXXXXXX XXXXXXXXXXX AWLYYWWG 11 1 11.00 1 XXXXX A WL YY WW G 10 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ 98ASB42343B SOIC−20 WB = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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