2.5V/3.3V ECL 1:2
Differential Fanout Buffer
MC10LVEP11, MC100LVEP11
Description
The MC10/100LVEP11 is a differential 1:2 fanout buffer. The
device is pin and functionally equivalent to the EP11 device. With AC
performance the same as the EP11 device, the LVEP11 is ideal for
applications requiring lower voltage. Single-ended CLK input
operation is limited to a VCC w 3.0 V in PECL mode, or VEE v
−3.0 V in NECL mode.
The 100 Series contains temperature compensation.
Features
• 240 ps Typical Propagation Delay
• Maximum Frequency > 3.0 GHz Typical
• PECL Mode Operating Range:
8
8
1
1
SOIC−8 NB
D SUFFIX
CASE
751−07
TSSOP−8
DT SUFFIX
CASE
948R−02
DFN−8
MN SUFFIX
CASE 506AA
MARKING DIAGRAMS*
8
8
VCC = 2.375 V to 3.8 V with VEE = 0 V
HVP11
ALYW
G
• NECL Mode Operating Range:
VCC = 0 V with VEE = −2.375 V to −3.8 V
Open Input Default State
♦
•
• Q Output Will Default LOW with Inputs Open or at VEE
• LVDS Input Compatible
• These Devices are Pb-Free, Halogen Free and are RoHS Compliant
1
1
8
8
KVP11
ALYW
G
1
1
H
K
4K
M
A
HU11
ALYWG
G
4K MG
G
♦
www.onsemi.com
1
4
KU11
ALYWG
G
= MC10
L
= MC100
Y
= MC100
W
= Date Code
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
Device
MC10LVEP11DR2G
Package
Shipping†
2500 /
SOIC−8 NB
(Pb-Free) Tape & Reel
100 Units /
TSSOP−8
Tube
(Pb-Free)
98 Units /
SOIC−8 NB
MC100LVEP11DG
Tube
(Pb-Free)
2500 /
MC100LVEP11DR2G
SOIC−8 NB
(Pb-Free) Tape & Reel
100 Units /
MC100LVEP11DTG
TSSOP−8
Tube
(Pb-Free)
MC100LVEP11DTR2G
TSSOP−8
2500 /
(Pb-Free) Tape & Reel
MC100LVEP11MNR4G
DFN−8
1000 /
(Pb-Free) Tape & Reel
MC10LVEP11DTG
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
May, 2021 − Rev. 15
1
Publication Order Number:
MC10LVEP11/D
MC10LVEP11, MC100LVEP11
Table 1. PIN DESCRIPTION
Q0
Q0
Q1
1
2
3
8
7
6
PIN
VCC
D
FUNCTION
D*, D**
ECL Data Inputs
Q0, Q0, Q1, Q1
ECL Data Outputs
VCC
Positive Supply
VEE
Negative Supply
EP
(DFN−8 only) Thermal exposed pad
must be connected to a sufficient thermal conduit. Electrically connect to the
most negative supply (GND) or leave
unconnected, floating open.
D
*Pins will default to 2/3 VCC when left open.
**Pins will default LOW when left open.
Q1
4
5
VEE
Figure 1. 8-Lead Pinout (Top View) and Logic
Diagram
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
37.5 kW
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 4 kV
> 200 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Pb-Free Pkg
SOIC−8 NB
TSSOP−8
DFN−8
Level 1
Level 3
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
110 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
www.onsemi.com
2
MC10LVEP11, MC100LVEP11
Table 3. MAXIMUM RATINGS
Symbol
Rating
Unit
VCC
PECL Mode Power Supply
Parameter
VEE = 0 V
Condition 1
Condition 2
6
V
VEE
NECL Mode Power Supply
VCC = 0 V
−6
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
6
−6
V
Iout
Output Current
Continuous
Surge
50
100
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction-to-Ambient)
0 lfpm
500 lfpm
SOIC−8 NB
190
130
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Standard Board
SOIC−8 NB
41 to 44
°C/W
qJA
Thermal Resistance (Junction-to-Ambient)
0 lfpm
500 lfpm
TSSOP−8
185
140
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Standard Board
TSSOP−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction-to-Ambient)
0 lfpm
500 lfpm
DFN−8
129
84
°C/W
qJC
Thermal Resistance (Junction-to-Case)
(Note 1)
DFN−8
35 to 40
°C/W
Tsol
Wave Solder (Pb-Free)
很抱歉,暂时无法提供与“MC100LVEP11MNR4”相匹配的价格&库存,您可以联系我们找货
免费人工找货