MC12095DG

MC12095 2.5 GHz Low Power Prescaler With Stand-By Mode Description http://onsemi.com MARKING DIAGRAMS 8 SO−8 D SUFFIX CASE 751 8 1 1 DFN8 MN SUFFIX CASE 506AA 12095 ALYW G 6C DG G The MC12095 is a single modulus prescaler for low power frequency division of a 2.5 GHz high frequency input signal. MOSAIC V™ technology is utilized to achieve low power dissipation of 24 mW at a minimum supply voltage of 2.7 V. On−chip output termination provides output current to drive a 2.0 pF (typical) high impedance load. If additional drive is required for the prescaler output, an external resistor can be added in parallel from the OUT pin to GND to increase the output power. Care must be taken not to exceed the maximum allowable current through the output. Divide ratio control input (SW) selects the required divide ratio of ÷2 or ÷4. Stand−By mode is available to reduce current drain to 100 mA typical when the standby pin SB is switched LOW disabling the prescaler. 1 4 Features • • • • • • 2.5 GHz Toggle Frequency Supply Voltage 2.7 V to 5.5 Vdc Low Power 8.7 mA Typical Operating Temperature −40°C to 85°C Divide by 2 or 4 Selected by the SW Pin Pb−Free Packages are Available A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) Table 1. FUNCTIONAL TABLE SW Divide Ratio H 2 L 4 PIN CONNECTIONS IN VCC NC OUT 1. SW: H = (VCC − 0.4 V) to VCC; L = OPEN 2. SB: H = 2.0 V to VCC; L = GND to 0.8 V VCC = 2.7 to 5.5 V C3 C1 SB IN C2 7 3 6 4 5 IN SB SW Gnd (Top View) See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. EXTERNAL COMPONENTS C1 = C2 = 1000 pF C3 = 0.1 mF C4 = 2.0 pF SW 50 W 8 2 ORDERING INFORMATION VCC IN 1 OUT GND C4 Figure 1. AC Test Circuit © Semiconductor Components Industries, LLC, 2008 August, 2008 − Rev. 7 1 Publication Order Number: MC12095/D MC12095 Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor N/A Internal Input Pullup Resistor N/A ESD Protection Human Body Model Machine Model Charged Device Model Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) SOIC−8 DFN8 Flammability Rating Oxygen Index: 28 to 34 > 4 kV > 200 V > 2 kV Pb Pkg Pb−Free Pkg Level 1 Level 1 Level 1 Level 1 UL 94 V−0 @ 0.125 in Transistor Count 125 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 3. MAXIMUM RATINGS Symbol Rating Value Unit VCC Power Supply Voltage, Pin 2 −0.5 to 6.0 Vdc TA Operating Temperature Range −40 to 85 °C Tstg Storage Temperature Range −65 to 150 °C IO Maximum Output Current, Pin 4 8.0 mA qJC Thermal Resistance (Junction−to−Case) (Note 2) DFN8 35 to 40 °C/W Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. NOTE: ESD data available upon request. 2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power). For DFN8 only, thermal exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply (GND) or leave unconnected, floating open. Table 4. ELECTRICAL CHARACTERISTICS (VCC = 2.7 to 5.5 V; TA = −40 to 85°C, unless otherwise noted.) Symbol Characteristic Min Typ Max Unit 500 3.0 2.5 GHz − 8.7 14 mA ft Toggle Frequency (Sine Wave) ICC Supply Current ISB Stand−By Current − 100 200 mA VIH1 Stand−By Input HIGH (SB) 2.0 − VCC + 0.5 V V VIL1 Stand−By Input LOW (SB) GND − 0.8 V VIH2 Divide Ratio Control Input HIGH (SW) VCC − 0.4 VCC VCC + 0.5 V V VIL2 Divide Ratio Control Input LOW (SW) OPEN OPEN OPEN VOUT Output Voltage Swing (2pF Load) 800 400 200 − 450 250 − − − mVpp VIN Input Voltage Sensitivity 200 − 1000 mVpp 500−1000 MHz Input 1000−1500 MHz Input 1500−2500 MHz Input http://onsemi.com 2 MC12095 0 Input Power Level (dBm) −10 −20 −30 −40 500 700 900 1100 1300 1500 1700 1900 2100 2300 Input Frequency (MHz) (Divide By 2 Mode, T = 25°C, VCC = 2.7 V) Figure 2. Typical Minimum Input Sensitivity versus Input Frequency http://onsemi.com 3 2500 MC12095 1800 1600 -40°C +25°C +85°C Output Amplitude (mVpp) 1400 1200 1000 800 SPEC 600 400 200 0 500 750 1000 1250 1500 1750 2000 2250 2500 Input Frequency (MHz) (Divide By 2 Mode, VCC = 2.7 V) Figure 3. Typical Output Amplitude versus Frequency Over Temperature 1800 1600 -40°C +25°C +85°C Output Amplitude (mVpp) 1400 1200 1000 800 SPEC 600 400 200 0 500 750 1000 1250 1500 1750 2000 2250 Input Frequency (MHz) (Divide By 4 Mode, VCC = 2.7 V) Figure 4. Typical Output Amplitude versus Frequency Over Temperature http://onsemi.com 4 2500 MC12095 150 125 R (Ohms) 100 75 50 25 0 500 700 900 1100 1300 1500 1700 1900 2100 2300 2500 2100 2300 2500 Input Frequency (MHz) Figure 5. Input Impedance versus Frequency 100 50 jX (Ohms) 0 −50 −100 −150 −200 500 700 900 1100 1300 1500 1700 1900 Input Frequency (MHz) Figure 6. Input Impedance versus Frequency http://onsemi.com 5 MC12095 ORDERING INFORMATION Package Shipping† SOIC−8 98 Units / Rail MC12095DG SOIC−8 (Pb−Free) 98 Units / Rail MC12095DR2 SOIC−8 98 Units / Rail MC12095DR2G SOIC−8 (Pb−Free) 98 Units / Rail MC12095MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb−Free) 1000 / Tape & Reel Device MC12095D MC12095MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 6 MC12095 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AG −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC12095 PACKAGE DIMENSIONS DFN8 CASE 506AA−01 ISSUE C D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B PIN ONE REFERENCE 2X 0.10 C 2X ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ TOP VIEW 0.10 C 0.08 C SEATING PLANE MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 −−− 0.25 0.35 A 0.10 C 8X DIM A A1 A3 b D D2 E E2 e K L E (A3) SIDE VIEW A1 C D2 e e/2 4 1 8X L E2 K 8 5 8X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW MOSAIC V is a trademark of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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