MC14514B, MC14515B
4-Bit Transparent Latch /
4-to-16 Line Decoder
The MC14514B and MC14515B are two output options of a 4 to 16
line decoder with latched inputs. The MC14514B (output active high
option) presents a logical “1” at the selected output, whereas the
MC14515B (output active low option) presents a logical “0” at the
selected output. The latches are R−S type flip−flops which hold the
last input data presented prior to the strobe transition from “1” to “0”.
These high and low options of a 4−bit latch / 4 to 16 line decoder are
constructed with N−channel and P−channel enhancement mode
devices in a single monolithic structure. The latches are R−S type
flip−flops and data is admitted upon a signal incident at the strobe
input, decoded, and presented at the output.
These complementary circuits find primary use in decoding
applications where low power dissipation and/or high noise immunity
is desired.
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SOIC−24
DW SUFFIX
CASE 751E
MARKING DIAGRAM
Features
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low−power TTL Loads or One Low−power
24
145xxB
AWLYYWWG
Schottky TTL Load the Rated Temperature Range
1
• These Devices are Pb−Free and are RoHS Compliant
• NLV Prefix for Automotive and Other Applications Requiring
xx
A
WL
YY
WW
G
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
Value
Unit
VDD
−0.5 to +18.0
V
Vin, Vout
−0.5 to VDD
+0.5
V
Input or Output Current (DC or Transient)
per Pin
Iin, Iout
±10
mA
Power Dissipation per Package (Note 1)
PD
500
Parameter
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
= 14 or 15
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
PIN ASSIGNMENT
ST
1
24
VDD
D1
2
23
INH
mW
D2
3
22
D4
4
21
D3
Ambient Temperature Range
TA
−55 to +125
°C
S7
Storage Temperature Range
Tstg
−65 to +150
°C
S6
5
20
S10
Lead Temperature (8−Second Soldering)
TL
260
°C
S5
6
19
S11
S4
7
18
S8
S3
8
17
S9
S1
9
16
S14
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating: Plastic “P and D/DW”
Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 9
1
S2
10
15
S15
S0
11
14
S12
VSS
12
13
S13
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Publication Order Number:
MC14514B/D
MC14514B, MC14515B
BLOCK DIAGRAM
VDD = PIN 24
VSS = PIN 12
DATA 1
DATA 2
DATA 3
DATA 4
STROBE
INHIBIT
2
A
3
B
21
TRANSPARENT
LATCH
22
C
D
1
4 TO 16
DECODER
DECODE TRUTH TABLE (Strobe = 1)*
S0
S1
S2
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
S13
S14
S15
11
9
10
8
7
6
5
4
18
17
20
19
14
13
16
15
ABCD
ABCD
ABCD
ABCD
ABCD
ABCD
ABCD
ABCD
ABCD
ABCD
ABCD
ABCD
ABCD
ABCD
ABCD
ABCD
23
Selected Output
Data Inputs
Inhibit
D
C
B
A
MC14514 = Logic “1”
MC14515 = Logic “0”
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
S0
S1
S2
S3
0
0
0
0
0
0
0
0
1
1
1
1
0
0
1
1
0
1
0
1
S4
S5
S6
S7
0
0
0
0
1
1
1
1
0
0
0
0
0
0
1
1
0
1
0
1
S8
S9
S10
S11
0
0
0
0
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
S12
S13
S14
S15
1
X
X
X
X
All Outputs = 0, MC14514
All Outputs = 1, MC14515
X = Don’t Care
*Strobe = 0, Data is latched
ORDERING INFORMATION
Device
MC14514BDWR2G
NLV14514BDWR2G*
MC14515BDWR2G
NLV14515BDWR2G*
Package
Shipping†
SOIC−24
(Pb−Free)
1000 / Tape & Reel
SOIC−24
(Pb−Free)
1000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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2
MC14514B, MC14515B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
− 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ
(Note 2)
Max
Min
Max
Unit
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
5.0
5.0
10
15
– 1.2
– 0.25
– 0.62
– 1.8
−
−
−
−
– 1.0
– 0.2
– 0.5
– 1.5
– 1.7
– 0.36
– 0.9
– 3.5
−
−
−
−
– 0.7
– 0.14
– 0.35
– 1.1
−
−
−
−
IOL
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current
Iin
15
−
±0.1
−
±0.00001
±0.1
−
±1.0
mAdc
Input Capacitance (Vin = 0)
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current (Per Package)
IDD
5.0
10
15
−
−
−
5.0
10
20
−
−
−
0.005
0.010
0.015
5.0
10
20
−
−
−
150
300
600
mAdc
Total Supply Current (Note 3, 4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
ITL
5.0
10
15
Symbol
Characteristic
Output Voltage
Vin = VDD or 0
Vin = 0 or VDD
“0” Level
“1” Level
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
“1” Level
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Source
Sink
VIL
VIH
IOH
IT = (1.35 mA/kHz) f + IDD
IT = (2.70 mA/kHz) f + IDD
IT = (4.05 mA/kHz) f + IDD
Vdc
Vdc
mAdc
mAdc
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL – 50) Vfk where: IT is in mA (per package), CL in pF,
V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
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3
MC14514B, MC14515B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C)
All Types
Symbol
Characteristic
Output Rise Time
tTLH = (3.0 ns/pF) CL + 30 ns
tTLH = (1.5 ns/pF) CL + 15 ns
tTLH = (1.1 ns/pF) CL + 10 ns
tTLH
Output Fall Time
tTHL = (1.5 ns/pF) CL + 25 ns
tTHL = (0.75 ns/pF) CL + 12.5 ns
tTHL = (0.55 ns/pF) CL + 9.5 ns
tTHL
Propagation Delay Time; Data, Strobe to S
tPLH, tPHL = (1.7 ns/pF) CL + 465 ns
tPLH, tPHL = (0.86 ns/pF) CL + 192 ns
tPLH, tPHL = (0.5 ns/pF) CL + 125 ns
tPLH,
tPHL
Inhibit Propagation Delay Times
tPLH, tPHL = (1.7 ns/pF) CL + 315 ns
tPLH, tPHL = (0.66 ns/pF) CL + 117 ns
tPLH, tPHL = (0.5 ns/pF) CL + 75 ns
tPLH,
tPHL
Setup Time Data to Strobe
tsu
Hold Time Strobe to Data
th
Strobe Pulse Width
tWH
VDD
Min
Typ
(Note 6)
Max
5.0
10
15
−
−
−
180
90
65
360
180
130
5.0
10
15
−
−
−
100
50
40
200
100
80
5.0
10
15
−
−
−
550
225
150
1100
450
300
5.0
10
15
−
−
−
400
150
100
800
300
200
5.0
10
15
250
100
75
125
50
38
−
−
−
5.0
10
15
– 20
0
10
– 100
– 40
– 30
−
−
−
5.0
10
15
350
100
75
175
50
38
−
−
−
Unit
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
VDD
VDS
STROBE
INHIBIT
For MC14514B
1. For P−channel: Inhibit = VSS
1. and D1−D4 constitute
1. binary code for “output
1. under test.”
2. For N−channel: Inhibit = VDD
D1
D2
D3
D4
S0
S1
S2
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
S13
S14
S15
For MC14515B
1. For P−channel: Inhibit = VDD
2. For N−channel: Inhibit = VSS
2. and D1−D4 constitute binary
2. code for “output under test.”
ID
EXTERNAL
POWER SUPPLY
VSS
Figure 1. Drain Characteristics Test Circuit
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4
ns
ns
ns
ns
ns
ns
ns
MC14514B, MC14515B
VDD
0.01 mF
CERAMIC
ID
24
VDD
500
mF
20 ns
20 ns
PULSE
GENERATOR
D1
S0
D2
D3
D4
STROBE
INHIBIT S15
12
CL
VDD
90%
Vin
10%
VSS
CL
VSS
Figure 2. Dynamic Power Dissipation Test Circuit and Waveform
VDD
STROBE
OUTPUT S0
OUTPUT S1
S0
S1
INHIBIT
PROGRAMMABLE
PULSE
GENERATOR
tTLH
tTHL
20 ns
CL
CL
INPUT
D1
10%
VSS
tPHL
VDD
tPLH
D2
90%
50%
10%
OUTPUT
D3
D4
VDD
90%
50%
OUTPUT S15
S15
VSS
CL
Figure 3. Switching Time Test Circuit and Waveforms
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5
tTLH
VSS
tTHL
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6
INHIBIT 23
STROBE 1
DATA 4 22
DATA 3 21
DATA 2 3
DATA 1 2
Q
Q
R
Q
R
S
Q
Q
R
S
Q
Q
R
S
Q
S
D
C
B
A
LOGIC DIAGRAM
IN MC14515B ONLY
AB CD
AB CD
AB CD
AB CD
AB CD
AB CD
AB CD
AB CD
AB CD
AB CD
AB CD
AB CD
AB CD
AB CD
AB CD
AB CD
15 S15
16 S14
13 S13
14 S12
19 S11
20 S10
17 S9
18 S8
4 S7
5 S6
6 S5
7 S4
8 S3
10 S2
9 S1
11 S0
MC14514B, MC14515B
MC14514B, MC14515B
COMPLEX DATA ROUTING
times faster then the shift frequency of the input registers,
the most significant bit (MSB) from each register could be
selected for transfer to the data bus. Therefore, all of the
most significant bits from all of the registers can be
transferred to the data bus before the next most significant
bit is presented for transfer by the input registers.
Information from the 3−state bus is redistributed by the
MC14514B four−bit latch/decoder. Using the four−bit
address, D1 thru D4, the information on the inhibit line can
be transferred to the addressed output line to the desired
output registers, A thru P. This distribution of data bits to the
output registers can be made in many complex patterns. For
example, all of the most significant bits from the input
registers can be routed into output register A, all of the next
most significant bits into register B, etc. In this way
horizontal, vertical, or other methods of data slicing can be
implemented.
Two MC14512 eight−channel data selectors are used here
with the MC14514B four−bit latch/decoder to effect a
complex data routing system. A total of 16 inputs from data
registers are selected and transferred via a 3−state data bus
to a data distributor for rearrangement and entry into 16
output registers. In this way sequential data can be re−routed
or intermixed according to patterns determined by data
select and distribution inputs.
Data is placed into the routing scheme via the eight inputs
on both MC14512 data selectors. One register is assigned to
each input. The signals on A0, A1, and A2 choose one of
eight inputs for transfer out to the 3−state data bus. A fourth
signal, labelled Dis, disables one of the MC14512 selectors,
assuring transfer of data from only one register.
In addition to a choice of input registers, 1 thru 16, the rate
of transfer of the sequential information can also be varied.
That is, if the MC14512 were addressed at a rate that is eight
DATA ROUTING SYSTEM
REGISTER 1
D0
D1
D2
D3
D4
D5
D6
DIS
3-STATE
DATA BUS
DATA
DISTRIBUTION
OUTPUT
REGISTERS
Q
D1 D2 D3 D4
S0
STROBE
S1
S2
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
S13
INHIBIT
S14
S15
D7
A0 A1 A2
REGISTER A
MC14514B
REGISTER 8
DATA
TRANSFER
MC14512
INPUT
REGISTERS
DATA
SELECT
A0 A1 A2
D0
Q
D1
D2
D3
D4
D5
D6
D7
DIS
MC14512
REGISTER 9
REGISTER 16
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7
REGISTER P
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−24 WB
CASE 751E−04
ISSUE F
DATE 03 JUL 2012
SCALE 1:1
D
24
E
H
A
B
0.25 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD AND ARE MEASURED BETWEEN 0.10 AND 0.25 FROM THE LEAD TIP.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 mm PER SIDE. INTERLEAD
FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H.
5. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
13
E1
1
L
12
C
DETAIL A
24X b
PIN 1
INDICATOR
0.25
TOP VIEW
M
C A
S
B
S
h
x 45 _
A
e
A1
NOTE 5
DIM
A
A1
b
c
D
E
E1
e
h
L
M
NOTE 3
C
c
SEATING
PLANE
NOTE 3
M
DETAIL A
END VIEW
SIDE VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
GENERIC
MARKING DIAGRAM*
24X
24X
MILLIMETERS
MIN
MAX
2.35
2.65
0.13
0.29
0.35
0.49
0.23
0.32
15.25
15.54
10.30 BSC
7.40
7.60
1.27 BSC
0.25
0.75
0.41
0.90
0_
8_
1.62
0.52
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
AWLYYWWG
11.00
1
1
XXXXX
A
WL
YY
WW
G
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42344B
SOIC−24 WB
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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