MC14516BFG

MC14516B Binary Up/Down Counter The MC14516B synchronous up/down binary counter is constructed with MOS P−channel and N−channel enhancement mode devices in a monolithic structure. This counter can be preset by applying the desired value, in binary, to the Preset inputs (P0, P1, P2, P3) and then bringing the Preset Enable (PE) high. The direction of counting is controlled by applying a high (for up counting) or a low (for down counting) to the UP/DOWN input. The state of the counter changes on the positive transition of the clock input. Cascading can be accomplished by connecting the Carry Out to the Carry In of the next stage while clocking each counter in parallel. The outputs (Q0, Q1, Q2, Q3) can be reset to a low state by applying a high to the reset (R) pin. This CMOS counter finds primary use in up/down and difference counting. Other applications include: (1) Frequency synthesizer applications where low power dissipation and/or high noise immunity is desired, (2) Analog−to−Digital and Digital−to−Analog conversions, and (3) Magnitude and sign generation. Features • • • • • • • • • Diode Protection on All Inputs Supply Voltage Range = 3.0 Vdc to 18 Vdc Internally Synchronous for High Speed Logic Edge−Clocked Design — Count Occurs on Positive Going Edge of Clock Single Pin Reset Asynchronous Preset Enable Operation Capable of Driving Two Low−Power TTL Loads or One Low−Power Schottky Load Over the Rated Temperature Range These Devices are Pb−Free and are RoHS Compliant NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable http://onsemi.com MARKING DIAGRAM SOIC−16 D SUFFIX CASE 751B 1 A WL Y WW G 16 14516BG AWLYWW 1 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS v (Vin or Vout) v VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. MAXIMUM RATINGS (Voltages Referenced to VSS) Parameter Symbol Value Unit VDD −0.5 to +18.0 V Vin, Vout −0.5 to VDD + 0.5 V Input or Output Current (DC or Transient) per Pin Iin, Iout ± 10 mA Power Dissipation, per Package (Note 1) PD 500 mW Ambient Temperature Range TA −55 to +125 °C Storage Temperature Range Tstg −65 to +150 °C Lead Temperature (8−Second Soldering) TL 260 °C DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Temperature Derating: Plastic “DW” Packages: – 7.0 mW/_C From 65_C To 125_C © Semiconductor Components Industries, LLC, 2014 March, 2014 − Rev. 10 1 Publication Order Number: MC14516B/D MC14516B PIN ASSIGNMENT PE 1 16 VDD Q3 2 15 C P3 3 14 Q2 P0 4 13 P2 CARRY IN 5 12 P1 Q0 6 11 Q1 CARRY OUT 7 10 U/D VSS 8 9 BLOCK DIAGRAM R 1 PE 5 CARRY IN 9 RESET 10 UP/DOWN 15 CLOCK 4 P0 12 P1 13 P2 3 P3 Q0 6 Q1 11 Q2 14 Q3 2 CARRY OUT 7 VDD = PIN 16 VSS = PIN 8 TRUTH TABLE Carry In Up/Down Preset Enable Reset Clock Action 1 X 0 0 X No Count 0 1 0 0 Count Up 0 0 0 0 Count Down X X 1 0 X Preset X X X 1 X Reset X = Don’t Care NOTE: When counting up, the Carry Out signal is normally high and is low only when Q0 through Q3 are high and Carry In is low. When counting down, Carry Out is low only when Q0 through Q3 and Carry In are low. ORDERING INFORMATION Package Shipping† MC14516BDG SOIC−16 (Pb−Free) 48 Units / Rail MC14516BDR2G SOIC−16 (Pb−Free) 2500 / Tape & Reel Device NLV14516BDR2G* †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 2 MC14516B ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) − 55_C 25_C VDD 125_C Symbol Vdc Min Max Min Typ (Note 2) Max Min Max Unit VOL 5.0 10 15 − − − 0.05 0.05 0.05 − − − 0 0 0 0.05 0.05 0.05 − − − 0.05 0.05 0.05 Vdc VOH 5.0 10 15 4.95 9.95 14.95 − − − 4.95 9.95 14.95 5.0 10 15 − − − 4.95 9.95 14.95 − − − Vdc 5.0 10 15 − − − 1.5 3.0 4.0 − − − 2.25 4.50 6.75 1.5 3.0 4.0 − − − 1.5 3.0 4.0 5.0 10 15 3.5 7.0 11 − − − 3.5 7.0 11 2.75 5.50 8.25 − − − 3.5 7.0 11 − − − 5.0 5.0 10 15 – 3.0 – 0.64 – 1.6 – 4.2 − − − − – 2.4 – 0.51 – 1.3 – 3.4 – 4.2 – 0.88 – 2.25 – 8.8 − − − − – 1.7 – 0.36 – 0.9 – 2.4 − − − − IOL 5.0 10 15 0.64 1.6 4.2 − − − 0.51 1.3 3.4 0.88 2.25 8.8 − − − 0.36 0.9 2.4 − − − mAdc Input Current Iin 15 − ± 0.1 − ± 0.00001 ± 0.1 − ± 1.0 mAdc Input Capacitance (Vin = 0) Cin − − − − 5.0 7.5 − − pF Quiescent Current (Per Package) IDD 5.0 10 15 − − − 5.0 10 20 − − − 0.005 0.010 0.015 5.0 10 20 − − − 150 300 600 mAdc Total Supply Current (Note 3, 4) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) IT 5.0 10 15 Characteristic Output Voltage Vin = VDD or 0 “0” Level “1” Level Vin = 0 or VDD Input Voltage “0” Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) “1” Level (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Source Sink VIL Vdc VIH Vdc IOH mAdc IT = (0.58 mA/kHz) f + IDD IT = (1.20 mA/kHz) f + IDD IT = (1.70 mA/kHz) f + IDD mAdc 2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. 3. The formulas given are for the typical characteristics only at 25_C. 4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL – 50) Vfk where: IT is in mA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001. http://onsemi.com 3 MC14516B ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C) All Types Characteristic Symbol Output Rise and Fall Time tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns tTLH, tTHL Propagation Delay Time Clock to Q tPLH, tPHL = (1.7 ns/pF) CL + 230 ns tPLH, tPHL = (0.66 ns/pF) CL + 97 ns tPLH, tPHL = (0.5 ns/pF) CL + 75 ns tPLH, tPHL Clock to Carry Out tPLH, tPHL = (1.7 ns/pF) CL + 230 ns tPLH, tPHL = (0.66 ns/pF) CL + 97 ns tPLH, tPHL = (0.5 ns/pF) CL + 75 ns tPLH, tPHL Carry In to Carry Out tPLH, tPHL = (1.7 ns/pF) CL + 230 ns tPLH, tPHL = (0.66 ns/pF) CL + 97 ns tPLH, tPHL = (0.5 ns/pF) CL + 75 ns tPLH, tPHL Preset or Reset to Q tPLH, tPHL = (1.7 ns/pF) CL + 230 ns tPLH, tPHL = (0.66 ns/pF) CL + 97 ns tPLH, tPHL = (0.5 ns/pF) CL + 75 ns tPLH, tPHL Preset or Reset to Carry Out tPLH, tPHL = (1.7 ns/pF) CL + 465 ns tPLH, tPHL = (0.66 ns/pF) CL + 192 ns tPLH, tPHL = (0.5 ns/pF) CL + 125 ns tPLH, tPHL VDD Min Typ (Note 6) Max 5.0 10 15 − − − 100 50 40 200 100 80 Unit ns ns 5.0 10 15 − − − 315 130 100 630 260 200 5.0 10 15 − − − 315 130 100 630 260 200 5.0 10 15 − − − 180 80 60 360 160 120 5.0 10 15 − − − 315 130 100 630 360 200 5.0 10 15 − − − 550 225 150 1100 450 300 ns ns ns ns Reset Pulse Width tw 5.0 10 15 380 200 160 190 100 80 − − − ns Clock Pulse Width tWH 5.0 10 15 350 170 140 200 100 75 − − − ns fcl 5.0 10 15 − − − 3.0 6.0 8.0 1.5 3.0 4.0 MHz Preset or Reset Removal Time The Preset or Reset signal must be low prior to a positive−going transition of the clock. trem 5.0 10 15 650 230 180 325 115 90 − ns Clock Rise and Fall Time tTLH, tTHL 5.0 10 15 − − − − − − 15 5 4 ms Setup Time Carry In to Clock tsu 5.0 10 15 260 120 100 130 60 50 − − − ns Hold Time Clock to Carry In th 5.0 10 15 0 20 20 – 60 – 20 0 − − − ns Setup Time Up/Down to Clock tsu 5.0 10 15 500 200 150 250 100 75 − − − ns Hold Time Clock to Up/Down th 5.0 10 15 – 70 – 10 0 – 160 – 60 – 40 − − − ns Setup Time Pn to PE tsu 5.0 10 15 – 40 – 30 – 25 – 120 – 70 – 50 − − − ns Hold Time PE to Pn th 5.0 10 15 480 420 420 240 210 210 − − − ns tWH 5.0 10 15 200 100 80 100 50 40 − − − ns Clock Pulse Frequency Preset Enable Pulse Width − 5. The formulas given are for the typical characteristics only at 25_C. 6. Data labelled “Typ” is not to be used for design purposes but is intended as an Indication of the IC’s potential performance. http://onsemi.com 4 MC14516B VDD 500 pF ID PE 0.01 mF CERAMIC Q0 CARRY IN R Q1 UP/DOWN PULSE GENERATOR CLOCK 20 ns 20 ns CL Q2 Q3 P3 CARRY OUT 10% VARIABLE WIDTH CL P0 P1 P2 VDD 90% 50% CLOCK CL CL CL Figure 1. Power Dissipation Test Circuit and Waveform LOGIC DIAGRAM P0 4 RESET 9 PRESET ENABLE 1 Q0 6 P1 Q1 12 11 P2 13 Q2 14 P3 3 CLOCK 15 PE P PE Q C CARRY OUT Q C PE P Q C PE P Q C 7 T CARRY IN P Q T Q 5 UP/DOWN 10 http://onsemi.com 5 T Q T Q Q3 2 VSS MC14516B TOGGLE FLIP−FLOP FLIP−FLOP FUNCTIONAL TRUTH TABLE PARALLEL IN PE P Preset Enable Clock T Qn+1 1 X X Parallel In 0 0 Qn 0 1 Qn 0 X Qn Q C T Q X = Don’t Care tsu trem 1 fcl th CARRY IN OR UP/DOWN VDD 50% VSS VDD 50% CLOCK VSS tw(H) tw(H) VDD PRESET ENABLE VSS tTLH CARRY OUT ONLY Q0 OR CARRY OUT VOH 90% 10% 90% 10% VOL tPHL tTHL tPLH tPLH trem VDD 50% RESET VSS tw Figure 2. Switching Time Waveforms PIN DESCRIPTIONS INPUTS CONTROLS P0, P1, P2, P3, Preset Inputs (Pins 4, 12, 13, 3) — Data on these inputs is loaded into the counter when PE is taken high. Carry In, (Pin 5) — This active−low input is used when Cascading stages. Carry In is usually connected to Carry Out of the previous stage. While high, Clock is inhibited. Clock, (Pin 15) — Binary data is incremented or decremented, depending on the direction of count, on the positive transition of this input. PE, Preset Enable, (Pin 1) — Asynchronously loads data on the Preset Inputs. This pin is active high and inhibits the clock when high. R, Reset, (Pin 9) — Asynchronously resets the Q out− puts to a low state. This pin is active high and inhibits the clock when high. Up/Down, (Pin 10) — Controls the direction of count, high for up count, low for down count. OUTPUTS VSS, Negative Supply Voltage, (Pin 8) — This pin is usually connected to ground. VDD, Positive Supply Voltage, (Pin 16) — This pin is connected to a positive supply voltage ranging from 3.0 V to 18 V. SUPPLY PINS Q0, Q1, Q2, Q3, Binary outputs (Pins 6, 11, 14, 2) — Binary data is present on these outputs with Q0 corresponding to the least significant bit. Carry Out, (Pin 7) — Used when cascading stages, Carry Out is usually connected to Carry In of the next stage. This synchronous output is active low and may also be used to indicate terminal count. http://onsemi.com 6 MC14516B Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q0 PE Q1 Q2 Q3 Q0 PE Q1 Q2 Q3 Cout Cin PRESET ENABLE 0 = COUNT 1 = PRESET Cin CLOCK 1 = UP 0 = DOWN L.S.D. MC14516B U/D R P0 P1 P2 P0 P1 P2 CLOCK P3 U/D R P0 P1 P2 P3 P3 P4 P5 P6 P7 +VDD CLOCK +VDD Cout M.S.D. MC14516B TERMINAL COUNT INDICATOR +VDD THUMBWHEEL SWITCHES (OPEN FOR “0") RESISTORS = 10 kW RESET OPEN = COUNT NOTE: The Least Significant Digit (L.S.D.) counts from a preset value once Preset Enable (PE) goes low. The Most Significant Digit (M.S.D.) is disabled while Cin is high. When the count of the L.S.D. reaches 0 (count down mode) or reaches 15 (count up mode), Cout goes low for one complete clock cycle, thus allowing the next counter to decrement/increment one count. (See Timing Diagram) The L.S.D. now counts through another cycle (15 clock pulses) and the above cycle is repeated. Figure 3. Presettable Cascaded 8−Bit Up/Down Counter http://onsemi.com 7 8 http://onsemi.com COUNT RESET CARRY OUT (LSD) Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 CARRY OUT (MSD) P0 P1 P2 P3 P4 P5 P6 P7 PE CARRY IN (MSD) UP/DOWN CLOCK 13 15 16 UP COUNT PRESET ENABLE 14 17 18 19 18 17 15 DOWN COUNT 16 14 13 PRESET ENABLE 251 252 UP COUNT 253 254 255 0 1 2 3 1 DOWN COUNT 2 0 1 RESET UP COUNT 2 MC14516B TIMING DIAGRAM FOR THE PRESETTABLE CASCADED 8−BIT UP/DOWN COUNTER MC14516B fout BUFFER Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q0 PE Q1 Q2 Q3 Q0 PE Q1 Q2 Q3 Cout Cin Cin CLOCK L.S.D. MC14516B U/D R P0 P1 P2 P0 P1 P2 Cout M.S.D. MC14516B CLOCK P3 U/D R P0 P1 P2 P3 P3 P4 P5 P6 P7 +VDD +VDD CLOCK (fin) +VDD THUMBWHEEL SWITCHES (OPEN FOR “0") RESISTORS = 10 kW RESET fout = fin n OPEN = COUNT NOTE: The programmable frequency divider can be set by applying the desired divide ratio, in binary, to the preset inputs. For example, the maximum divide ratio of 255 may be obtained by applying a 1111 1111 to the preset inputs P0 to P7. For this divide operation, both counters should be configured in the count down mode. The divide ratio of zero is an undefined state and should be avoided. Figure 4. Programmable Cascaded Frequency Divider http://onsemi.com 9 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−16 CASE 751B−05 ISSUE K DATE 29 DEC 2006 SCALE 1:1 −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 16 PL 0.25 (0.010) M T B S A S STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. COLLECTOR BASE EMITTER NO CONNECTION EMITTER BASE COLLECTOR COLLECTOR BASE EMITTER NO CONNECTION EMITTER BASE COLLECTOR EMITTER COLLECTOR STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. CATHODE ANODE NO CONNECTION CATHODE CATHODE NO CONNECTION ANODE CATHODE CATHODE ANODE NO CONNECTION CATHODE CATHODE NO CONNECTION ANODE CATHODE STYLE 3: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. COLLECTOR, DYE #1 BASE, #1 EMITTER, #1 COLLECTOR, #1 COLLECTOR, #2 BASE, #2 EMITTER, #2 COLLECTOR, #2 COLLECTOR, #3 BASE, #3 EMITTER, #3 COLLECTOR, #3 COLLECTOR, #4 BASE, #4 EMITTER, #4 COLLECTOR, #4 STYLE 4: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. STYLE 5: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. DRAIN, DYE #1 DRAIN, #1 DRAIN, #2 DRAIN, #2 DRAIN, #3 DRAIN, #3 DRAIN, #4 DRAIN, #4 GATE, #4 SOURCE, #4 GATE, #3 SOURCE, #3 GATE, #2 SOURCE, #2 GATE, #1 SOURCE, #1 STYLE 6: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE STYLE 7: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. SOURCE N‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) GATE P‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) SOURCE P‐CH SOURCE P‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) GATE N‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) SOURCE N‐CH COLLECTOR, DYE #1 COLLECTOR, #1 COLLECTOR, #2 COLLECTOR, #2 COLLECTOR, #3 COLLECTOR, #3 COLLECTOR, #4 COLLECTOR, #4 BASE, #4 EMITTER, #4 BASE, #3 EMITTER, #3 BASE, #2 EMITTER, #2 BASE, #1 EMITTER, #1 SOLDERING FOOTPRINT 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: DESCRIPTION: 98ASB42566B SOIC−16 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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