MC74AC10DG

ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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Other names and brands may be claimed as the property of others. MC74AC10, MC74ACT10 Triple 3-Input NAND Gate High−Performance Silicon−Gate CMOS Features • Outputs Source/Sink 24 mA • ′ACT10 Has TTL Compatible Inputs • These are Pb−Free Devices www.onsemi.com MARKING DIAGRAMS 14 VCC 14 13 12 11 10 9 SOIC−14 D SUFFIX CASE 751A 8 14 xxx10G AWLYWW 1 1 14 1 2 3 4 5 6 7 GND 1 Figure 1. Pinout: 14−Lead Packages Conductors (Top View) xxx 10 ALYWG G TSSOP−14 DT SUFFIX CASE 948G 14 1 xxx = AC or ACT A = Assembly Location WL or L = Wafer Lot Y = Year WW or W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2015 January, 2015 − Rev. 9 1 Publication Order Number: MC74AC10/D MC74AC10, MC74ACT10 MAXIMUM RATINGS Symbol Parameter Value Unit *0.5 to )7.0 V *0.5 v VI v VCC )0.5 V *0.5 v VO v VCC )0.5 V DC Input Diode Current $20 mA IOK DC Output Diode Current $50 mA IO DC Output Sink/Source Current $50 mA ICC DC Supply Current per Output Pin $50 mA IGND DC Ground Current per Output Pin $50 mA TSTG Storage Temperature Range *65 to )150 °C TL Lead temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction temperature under Bias )150 °C qJA Thermal Resistance (Note 2) SOIC TSSOP 125 170 °C/W PD Power Dissipation in Still Air at 85°C SOIC TSSOP 125 170 mW MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) > 2000 > 200 > 1000 V ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 6) $100 mA VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK (Note 1) Level 1 Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. The package thermal impedance is calculated in accordance with JESD51−7. 3. Tested to EIA/JESD22−A114−A. 4. Tested to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Min Typ Max ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 − VCC VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − − − 140 Unit V V ns/V tr, tf Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range −40 25 85 °C IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA ns/V °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. www.onsemi.com 2 MC74AC10, MC74ACT10 DC CHARACTERISTICS Symbol Parameter VCC (V) 74AC 74AC TA = +25°C TA = −40°C to +85°C Typ VIH VIL VOH VOL Guaranteed Limits 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 5.5 − ±0.1 5.5 − 5.5 5.5 Maximum Low Level Output Voltage Maximum Input Leakage Current IOLD †Minimum Dynamic Output Current ICC Conditions Minimum High Level Input Voltage IIN IOHD Unit Maximum Quiescent Supply Current IOUT = −50 mA *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA V IOUT = 50 mA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA ±1.0 mA VI = VCC, GND − 75 mA VOLD = 1.65 V Max − − −75 mA VOHD = 3.85 V Min − 4.0 40 mA VIN = VCC or GND Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. AC CHARACTERISTICS Symbol VCC* (V) Parameter 74AC 74AC TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay 3.3 5.0 1.5 1.5 6.0 4.5 9.5 7.0 1.0 1.0 10.5 8.0 ns 3−5 tPHL Propagation Delay 3.3 5.0 1.5 1.5 5.5 4.0 8.5 6.0 1.0 1.0 10.0 6.5 ns 3−5 *Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. www.onsemi.com 3 MC74AC10, MC74ACT10 DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = −40°C to +85°C Typ Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 − − 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 − − 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA VOL Maximum Low Level Output Voltage IOUT = −50 mA *VIN = VIL or VIH −24 mA IOH −24 mA V IOUT = 50 mA V IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V IOLD †Minimum Dynamic Output Current 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 4.0 40 mA VIN = VCC or GND IOHD ICC Maximum Quiescent Supply Current Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS Symbol VCC* (V) Parameter 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Unit Fig. No. Min Typ Max Min Max tPLH Propagation Delay 5.0 1.0 − 9.0 1.0 10.0 ns 3−5 tPHL Propagation Delay 5.0 1.0 − 9.0 1.0 9.5 ns 3−5 *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 25 pF VCC = 5.0 V www.onsemi.com 4 MC74AC10, MC74ACT10 ORDERING INFORMATION Package Shipping† MC74AC10DG SOIC−14 (Pb−Free) 55 Units/Rail MC74AC10DR2G SOIC−14 (Pb−Free) 2500/Tape & Reel MC74ACT10DR2G SOIC−14 (Pb−Free) 2500/Tape & Reel MC74ACT10DTR2G TSSOP−14 (Pb−Free) 2500/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 MC74AC10, MC74ACT10 PACKAGE DIMENSIONS SOIC−14 NB CASE 751A−03 ISSUE K D A B 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 8 A3 E H L 1 0.25 M DETAIL A 7 B 13X M b 0.25 M C A S B S X 45 _ M A1 e DETAIL A h A C SEATING PLANE DIM A A1 A3 b D E e H h L M SOLDERING FOOTPRINT* 6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.19 0.25 0.35 0.49 8.55 8.75 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ INCHES MIN MAX 0.054 0.068 0.004 0.010 0.008 0.010 0.014 0.019 0.337 0.344 0.150 0.157 0.050 BSC 0.228 0.244 0.010 0.019 0.016 0.049 0_ 7_ MC74AC10, MC74ACT10 PACKAGE DIMENSIONS TSSOP−14 CASE 948G ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 J J1 DIM A B C D F G H J J1 K K1 L M SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74AC10, MC74ACT10 ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 8 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC74AC10/D