MC74AC139DR2

MC74AC139, MC74ACT139 Dual 1−of−4 Decoder/Demultiplexer The MC74AC139/74ACT139 is a high−speed, dual 1−of−4 decoder/demultiplexer. The device has two independent decoders, each accepting two inputs and providing four mutually−exclusive active−LOW outputs. Each decoder has an active−LOW Enable input which can be used as a data input for a 4−output demultiplexer. Each half of the MC74AC139/74ACT139 can be used as a function generator providing four minterms of two variables. • • • • • w Multifunctional Capability Two Completely Independent 1−of−4 Decoders Active LOW Mutually Exclusive Outputs Outputs Source/Sink 24 mA ′ACT139 Has TTL Compatible Inputs Eb A0b A1b O0b O1b O2b O3b 16 15 14 13 12 11 10 9 DIP−16 N SUFFIX CASE 648 16 1 These devices are available in Pb−free package(s). Specifications herein apply to both standard and Pb−free devices. Please see our website at www.onsemi.com for specific Pb−free orderable part numbers, or contact your local ON Semiconductor sales office or representative. VCC http://onsemi.com 16 16 16 1 Ea 2 A0a 3 A1a 4 O0a 5 O1a 6 O2a 7 O3a 1 8 GND 1 1 SO−16 D SUFFIX CASE 751B TSSOP−16 DT SUFFIX CASE 948F EIAJ−16 M SUFFIX CASE 966 ORDERING INFORMATION Device Package Shipping MC74AC139N PDIP−16 25 Units/Rail MC74ACT139N PDIP−16 25 Units/Rail PIN ASSIGNMENT MC74AC139D SOIC−16 48 Units/Rail PIN FUNCTION MC74ACT139D SOIC−16 48 Units/Rail A0, A1 Address Inputs MC74AC139DR2 SOIC−16 2500 Tape & Reel E Enable Inputs MC74ACT139DR2 SOIC−16 2500 Tape & Reel O0−O3 Outputs MC74AC139DT TSSOP−16 96 Units/Rail MC74ACT139DT TSSOP−16 96 Units/Rail MC74AC139DTR2 TSSOP−16 2500 Tape & Reel Figure 1. Pinout: 16−Lead Packages Conductors (Top View) TRUTH TABLE Inputs Outputs E A0 A1 O0 O1 O2 O3 H L L L L X L H L H X L L H H H L H H H H H L H H H H H L H H H H H L March, 2006 − Rev. 7 EIAJ−16 50 Units/Rail MC74ACT139M EIAJ−16 50 Units/Rail MC74AC139MEL EIAJ−16 2000 Tape & Reel MC74ACT139MEL EIAJ−16 2000 Tape & Reel DEVICE MARKING INFORMATION H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial © Semiconductor Components Industries, LLC, 2006 MC74AC139M See general marking information in the device marking section on page 6 of this data sheet. 1 Publication Order Number: MC74AC139/D MC74AC139, MC74ACT139 E A0 A1 DECODER a O0 O1 O2 O3 E A0 A1 DECODER b O0 O1 O2 O3 Figure 2. Logic Symbol Ea 00a NOTE: A0a 01a 02a A1a Eb 03a A0b 00b 01b 02b A1b 03b This diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Figure 3. Logic Diagram FUNCTIONAL DESCRIPTION E E A0 The MC74AC139/74ACT139 is a high−speed dual 1−of−4 decoder/demultiplexer. The device has two independent decoders, each of which accepts two binary weighted inputs (A0−A1) and provides four mutually exclusive active−LOW outputs (O0−O3). Each decoder has an active−LOW enable (E). When E is HIGH all outputs are forced HIGH. The enable can be used as the data input for a 4−output demultiplexer application. Each half of the MC74AC139/74ACT139 generates all four minterms of two variables. These four minterms are useful in some applications, replacing multiple gate functions as shown in Figure 4, and thereby reducing the number of packages required in a logic network. O0 A1 E A0 O1 A0 2 O2 A1 E O3 A0 A1 Figure 4. Gate Functions (Each Half) http://onsemi.com O1 E O2 E A1 E A0 A1 A1 A0 O0 A1 A1 E A0 A0 O3 MC74AC139, MC74ACT139 MAXIMUM RATINGS* Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V VOUT DC Output Voltage (Referenced to GND) −0.5 to VCC +0.5 V IIN DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC VCC or GND Current per Output Pin ±50 mA Tstg Storage Temperature −65 to +150 °C *Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Min Typ Max Unit ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 − VCC VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − − − 140 °C −40 25 85 °C V V ns/V tr, tf Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 3 ns/V MC74AC139, MC74ACT139 DC CHARACTERISTICS Symbol Parameter 74AC 74AC TA = +25°C TA = −40°C to +85°C VCC (V) Typ Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 5.5 − ±0.1 5.5 − 5.5 5.5 VOL Maximum Low Level Output Voltage IIN Maximum Input Leakage Current IOLD †Minimum Dynamic Output Current IOHD ICC Maximum Quiescent Supply Current IOUT = −50 mA *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA V IOUT = 50 mA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA ±1.0 mA VI = VCC, GND − 75 mA VOLD = 1.65 V Max − − −75 mA VOHD = 3.85 V Min − 8.0 80 mA VIN = VCC or GND *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Parameter Symbol 74AC 74AC TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF VCC* (V) Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay An to On 3.3 5.0 4.0 3.0 8.0 6.5 11.5 8.5 3.5 2.5 13 9.5 ns 3−6 tPHL Propagation Delay An to On 3.3 5.0 3.0 2.5 7.0 5.5 10 7.5 2.5 2.0 11 8.5 ns 3−6 tPLH Propagation Delay En to On 3.3 5.0 4.5 3.5 9.5 7.0 12 8.5 3.5 3.0 13 10 ns 3−6 tPHL Propagation Delay En to On 3.3 5.0 4.0 2.5 8.0 6.0 10 7.5 3.0 2.5 11 8.5 ns 3−6 *Voltage Range 3.3 V is 3.3 V ±0.3 V. *Voltage Range 5.0 V is 5.0 V ±0.5 V. http://onsemi.com 4 MC74AC139, MC74ACT139 DC CHARACTERISTICS VCC (V) 74ACT 74ACT TA = +25°C TA = −40°C to +85°C Typ Guaranteed Limits VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 − − 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 − − 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA Symbol VOL Parameter Maximum Low Level Output Voltage Unit Conditions IOUT = −50 mA *VIN = VIL or VIH −24 mA IOH −24 mA V IOUT = 50 mA V IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V IOLD †Minimum Dynamic Output Current 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80 mA VIN = VCC or GND IOHD ICC Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Parameter Symbol 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF VCC* (V) Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay An to On 5.0 1.5 6.0 8.5 1.5 9.5 ns 3−6 tPHL Propagation Delay An to On 5.0 1.5 6.0 9.5 1.5 10.5 ns 3−6 tPLH Propagation Delay En to On 5.0 2.5 7.0 10.0 2.0 11.0 ns 3−6 tPHL Propagation Delay En to On 5.0 2.0 7.0 9.5 1.5 10.5 ns 3−6 *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 40 pF VCC = 5.0 V http://onsemi.com 5 MC74AC139, MC74ACT139 MARKING DIAGRAMS DIP−16 SO−16 MC74AC139N AWLYYWW AC139 AWLYWW MC74ACT139N AWLYYWW ACT139 AWLYWW A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 6 TSSOP−16 EIAJ−16 AC 139 ALYW 74AC139 ALYW ACT 139 ALYW 74ACT139 ALYW MC74AC139, MC74ACT139 PACKAGE DIMENSIONS PDIP−16 N SUFFIX 16 PIN PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. B F C DIM A B C D F G H J K L M S L S SEATING PLANE −T− K H G D M J 16 PL 0.25 (0.010) M T A M INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 SO−16 D SUFFIX 16 PIN PLASTIC SOIC PACKAGE CASE 751B−05 ISSUE J −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S http://onsemi.com 7 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74AC139, MC74ACT139 PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX 16 PIN PLASTIC TSSOP PACKAGE CASE948F−01 ISSUE O 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S K ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. 8 1 N 0.15 (0.006) T U S 0.25 (0.010) A −V− M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE D DETAIL E H G EIAJ−16 M SUFFIX 16 PIN PLASTIC EIAJ PACKAGE CASE966−01 ISSUE O 16 LE 9 Q1 E HE 1 M_ L 8 Z DETAIL P D e VIEW P A A1 b 0.13 (0.005) c M 0.10 (0.004) http://onsemi.com 8 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.031 MC74AC139, MC74ACT139 Notes http://onsemi.com 9 MC74AC139, MC74ACT139 Notes http://onsemi.com 10 MC74AC139, MC74ACT139 Notes ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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