MC74AC157DR2

MC74AC157, MC74ACT157 Quad 2-Input Multiplexer The MC74AC157/74ACT157 is a high-speed quad 2-input multiplexer. Four bits of data from two sources can be selected using the common Select and Enable inputs. The four outputs present the selected data in the true (non-inverted) form. The MC74AC157/74ACT157 can also be used as a function generator. http://onsemi.com Features •Outputs Source/Sink 24 mA •′ACT157 Has TTL Compatible Inputs •Pb-Free Packages are Available PDIP-16 N SUFFIX CASE 648 16 1 VCC E I0c I1c Zc I0d I1d Zd 16 15 14 13 12 11 10 9 SOIC-16 D SUFFIX CASE 751B 16 1 1 2 3 4 5 6 7 S I0a I1a Za I0b I1b Zb TSSOP-16 DT SUFFIX CASE 948F 16 8 GND 1 Figure 1. Pinout: 16-Lead Packages Conductors (Top View) SOEIAJ-16 M SUFFIX CASE 966 16 TRUTH TABLE Inputs 1 Outputs E S I0 I1 Z H L L L L X H H L L X X X L H X L H X X L L H L H PIN NAMES PIN H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial FUNCTION I0a-I0d Source 0 Data Inputs I1a-I1d Source 0 Data Inputs E Enable Input S Select Input Za-Zd Outputs DEVICE MARKING INFORMATION See general marking information in the device marking section on page 3 of this data sheet. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2007 July, 2007 - Rev. 7 1 Publication Order Number: MC74AC157/D MC74AC157, MC74ACT157 E I0a I1a I0b I1b I0c I1c I0d I1d S Za Zb Zc Zd Figure 2. Logic Symbol FUNCTIONAL DESCRIPTION Za = E•(I1a•S+I0a•S) Zb = E•(I1b•S+I0b•S) Zc = E•(I1c•S+I0c•S) Zd = E•(I1d•S+I0d•S) A common use of the MC74AC157/74ACT157 is the moving of data from two groups of registers to four common output busses. The particular register from which the data comes is determined by the state of the Select input. A less obvious use is as a function generator. The MC74AC157/74ACT157 can generate any four of the sixteen different functions of two variables with one variable common. This is useful for implementing gating functions. The MC74AC157/74ACT157 is a quad 2-input multiplexer. It selects four bits of data from two sources under the control of a common Select input (S). The Enable input (E) is active-LOW. When E is HIGH, all of the outputs (Z) are forced LOW regardless of all other inputs. The MC74AC157/74ACT157 is the logic implementation of a 4-pole, 2-position switch where the position of the switch is determined by the logic levels supplied to the Select input. The logic equations for the outputs are shown below: I0a I1a I0b I1b Zb Za NOTE: I0c I1c Zc I0d I1d E Zd This diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Figure 3. Logic Diagram http://onsemi.com 2 S MC74AC157, MC74ACT157 MARKING DIAGRAMS PDIP-16 16 SOIC-16 TSSOP-16 16 MC74AC157N AWLYYWWG 1 16 16 MC74ACT157N AWLYYWWG 74AC157 ALYWG 1 1 16 16 ACT 157 ALYWG G ACT157G AWLYWW 1 1 16 AC 157 ALYWG G AC157G AWLYWW 1 SOEIAJ-16 16 74ACT157 ALYWG 1 1 A WL, L YY, Y WW, W G G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package = Pb-Free Package (Note: Microdot may be in either location) MAXIMUM RATINGS Symbol Parameter Value Unit -0.5 to +7.0 V DC Input Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) VCC DC Supply Voltage (Referenced to GND) VIN VOUT -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC VCC or GND Current per Output Pin ±50 mA Tstg Storage Temperature -65 to +150 °C IIN Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT tr, tf Parameter Supply Voltage Min Typ Max ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 - VCC VCC @ 3.0 V - 150 - VCC @ 4.5 V - 40 - VCC @ 5.5 V - 25 - VCC @ 4.5 V - 10 - VCC @ 5.5 V - 8.0 - - - 140 °C -40 25 85 °C DC Input Voltage, Output Voltage (Ref. to GND) Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Unit V V ns/V tr, tf Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH Output Current - High - - -24 mA IOL Output Current - Low - - 24 mA 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 3 ns/V MC74AC157, MC74ACT157 DC CHARACTERISTICS Symbol Parameter VCC (V) 74AC 74AC TA = +25°C TA = -40°C to +85°C Typ VIH VIL VOH VOL IIN IOLD IOHD ICC Unit Conditions Guaranteed Limits Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC - 0.1 V Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC - 0.1 V Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 - 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 - 0.36 0.36 0.36 0.44 0.44 0.44 5.5 - ±0.1 5.5 - 5.5 - 5.5 - Maximum Low Level Output Voltage Maximum Input Leakage Current †Minimum Dynamic Output Current Maximum Quiescent Supply Current IOUT = -50 mA *VIN = VIL or VIH -12 mA IOH -24 mA -24 mA V IOUT = 50 mA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA ±1.0 mA VI = VCC, GND - 75 mA VOLD = 1.65 V Max - -75 mA VOHD = 3.85 V Min 8.0 80 mA VIN = VCC or GND *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. AC CHARACTERISTICS (For Figures and Waveforms - See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol VCC* (V) Parameter 74AC 74AC TA = +25°C CL = 50 pF TA = -40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay S to Zn 3.3 5.0 1.5 1.5 7.0 5.5 11.5 9.0 1.5 1.5 13.0 10.0 ns 3-6 tPHL Propagation Delay S to Zn 3.3 5.0 1.5 1.5 6.5 5.0 11.0 8.5 1.5 1.0 12.0 9.5 ns 3-6 tPLH Propagation Delay E to Zn 3.3 5.0 1.5 1.5 7.0 5.5 11.5 9.0 1.5 1.5 13.0 10.0 ns 3-6 tPHL Propagation Delay En to Zn 3.3 5.0 1.5 1.5 6.5 5.5 11.0 9.0 1.5 1.0 12 9.5 ns 3-6 tPLH Propagation Delay In to Zn 3.3 5.0 1.5 1.5 5.0 4.0 8.5 6.5 1.0 1.0 9.0 7.0 ns 3-5 3.3 5.0 1.5 1.5 5.0 4.0 8.0 6.5 1.0 1.0 9.0 7.0 ns 3-5 Propagation Delay In to Zn *Voltage Range 3.3 V is 3.3 V ±0.3 V. *Voltage Range 5.0 V is 5.0 V ±0.5 V. tPHL http://onsemi.com 4 MC74AC157, MC74ACT157 DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = -40°C to +85°C Typ Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC - 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC - 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 - 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 - 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA Maximum Input Leakage Current 5.5 - ±0.1 ±1.0 mA VI = VCC, GND Additional Max. ICC/Input 5.5 0.6 - 1.5 mA VI = VCC -2.1 V †Minimum Dynamic Output Current 5.5 - - 75 mA VOLD = 1.65 V Max 5.5 - - -75 mA VOHD = 3.85 V Min 5.5 - 8.0 80 mA VIN = VCC or GND VOL IIN DICCT IOLD IOHD ICC Maximum Low Level Output Voltage Maximum Quiescent Supply Current IOUT = -50 mA *VIN = VIL or VIH -24 mA IOH -24 mA V IOUT = 50 mA V *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS (For Figures and Waveforms - See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol VCC* (V) Parameter 74ACT 74ACT TA = +25°C CL = 50 pF TA = -40°C to +85°C CL = 50 pF Unit Fig. No. Min Typ Max Min Max 5.0 2.0 - 9.0 1.5 10.0 ns 3-6 Propagation Delay S to Zn 5.0 2.0 - 9.5 2.0 10.5 ns 3-6 tPLH Propagation Delay En to Zn 5.0 1.5 - 10 1.5 11.5 ns 3-6 tPHL Propagation Delay En to Zn 5.0 1.5 - 8.5 1.0 9.0 ns 3-6 tPLH Propagation Delay In to Zn 5.0 1.5 - 7.0 1.0 8.5 ns 3-5 5.0 1.5 - 7.5 1.0 8.5 ns 3-5 tPLH Propagation Delay S to Zn tPHL Propagation Delay In to Zn *Voltage Range 5.0 V is 5.0 V ±0.5 V. tPHL http://onsemi.com 5 MC74AC157, MC74ACT157 CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 50 pF VCC = 5.0 V ORDERING INFORMATION Device Order Number Package MC74AC157N PDIP-16 MC74AC157NG PDIP-16 (Pb-Free) MC74ACT157NG PDIP-16 (Pb-Free) MC74AC157D SOIC-16 MC74AC157DG SOIC-16 (Pb-Free) MC74ACT157D SOIC-16 MC74ACT157DG SOIC-16 (Pb-Free) MC74AC157DR2 SOIC-16 MC74AC157DR2G SOIC-16 (Pb-Free) MC74ACT157DR2 SOIC-16 MC74ACT157DR2G SOIC-16 (Pb-Free) MC74AC157DTR2 TSSOP-16* MC74AC157DTR2G TSSOP-16* MC74ACT157DTR2 TSSOP-16* MC74ACT157DTR2G TSSOP-16* MC74ACT157M SOEIAJ-16 MC74AC157MELG SOEIAJ-16 (Pb-Free) MC74ACT157MELG SOEIAJ-16 (Pb-Free) Shipping† 25 Units / Rail 48 Units / Rail 2500 Tape & Reel 50 Units / Rail 2000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free. http://onsemi.com 6 MC74AC157, MC74ACT157 PACKAGE DIMENSIONS PDIP-16 N SUFFIX CASE 648-08 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. -A16 9 1 8 B F C L S -T- SEATING PLANE K H D M J G 16 PL 0.25 (0.010) M T A M http://onsemi.com 7 DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MC74AC157, MC74ACT157 PACKAGE DIMENSIONS SOIC-16 D SUFFIX CASE 751B-05 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. -A- 16 9 1 8 -B- P 8 PL 0.25 (0.010) B M S G R K F X 45 _ C -T- SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT* 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74AC157, MC74ACT157 PACKAGE DIMENSIONS TSSOP-16 DT SUFFIX CASE 948F-01 ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U T U M S V S S K ÇÇÇ ÉÉ ÇÇÇ ÉÉ K1 2X L/2 16 9 J1 B -U- L SECTION N-N J PIN 1 IDENT. N 0.25 (0.010) 8 1 M 0.15 (0.006) T U S A -V- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. N F DETAIL E -W- C 0.10 (0.004) -T- SEATING PLANE H D DETAIL E G DIM A B C D F G H J J1 K K1 L M SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74AC157, MC74ACT157 PACKAGE DIMENSIONS SOEIAJ-16 M SUFFIX CASE 966-01 ISSUE A 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 9 Q1 M_ E HE 1 L 8 DETAIL P Z D e VIEW P A A1 b 0.13 (0.005) c M 0.10 (0.004) DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --0.78 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 0_ 10 _ 0.028 0.035 --0.031 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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