MC74AC245MG

MC74AC245, MC74ACT245 Octal Bidirectional Transceiver with 3-State Inputs/Outputs The MC74AC245/74ACT245 contains eight non−inverting bidirectional buffers with 3−state outputs and is intended for bus−oriented applications. Current sinking capability is 24 mA at both the A and B ports. The Transmit/Receive (T/R) input determines the direction of data flow through the bidirectional transceiver. Transmit (active−HIGH) enables data from A ports to B ports; Receive (active−LOW) enables data from B ports to A ports. The Output Enable input, when HIGH, disables both A and B ports by placing them in a High Z condition. www.onsemi.com SOIC−20W DW SUFFIX CASE 751D 1 Features • • • • • Noninverting Buffers Bidirectional Data Path A and B Outputs Source/Sink 24 mA ′ACT245 has TTL Compatible Inputs These are Pb−Free Devices TSSOP−20 DT SUFFIX CASE 948E 1 ORDERING INFORMATION PIN ASSIGNMENT See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. PIN FUNCTION OE Output Enable Input T/R Transmit/Receive Input DEVICE MARKING INFORMATION A0−A7 Side A 3−State Inputs or 3−State Outputs B0−B7 Side B 3−State Inputs or 3−State Outputs See general marking information in the device marking section on page 7 of this data sheet. TRUTH TABLES Inputs OE T/R L L H L H X Outputs Bus B Data to Bus A Bus A Data to Bus B High Z State H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial VCC OE B0 B1 B2 B3 B4 B5 B6 B7 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 T/R A0 A1 A2 A3 A4 A5 A6 A7 GND Figure 1. © Semiconductor Components Industries, LLC, 2015 February, 2015 − Rev. 8 1 Publication Order Number: MC74AC245/D MC74AC245, MC74ACT245 MAXIMUM RATINGS Symbol Parameter Value Unit −0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) (Note 1) −0.5 to VCC +0.5 V VOUT IIK DC Input Diode Current ±20 mA IOK DC Output Diode Current ±50 mA IOUT DC Output Sink/Source Current ±50 mA ICC DC Supply Current, per Output Pin ±50 mA IGND DC Ground Current, per Output Pin ±100 mA TSTG Storage Temperature Range *65 to )150 _C TL Lead temperature, 1 mm from Case for 10 Seconds 260 _C TJ Junction Temperature Under Bias 140 _C qJA Thermal Resistance (Note 2) 65.8 110.7 _C/W MSL Moisture Sensitivity FR Flammability Rating VESD ILatchup SOIC TSSOP Level 1 Oxygen Index: 30% − 35% ESD Withstand Voltage Latchup Performance UL 94 V−0 @ 0.125 in Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) Above VCC and Below GND at 85_C (Note 6) > 2000 > 200 > 1000 V ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IOUT absolute maximum rating must be observed. 2. The package thermal impedance is calculated in accordance with JESD 51−7. 3. Tested to EIA/JESD22−A114−A. 4. Tested to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT tr, tf Parameter Supply Voltage Min Typ Max ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 − VCC VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − −40 25 85 °C DC Input Voltage, Output Voltage (Ref. to GND) Input Rise and Fall Time (Note 7) ′AC Devices except Schmitt Inputs Unit V V ns/V tr, tf Input Rise and Fall Time (Note 8) ′ACT Devices except Schmitt Inputs TA Operating Ambient Temperature Range IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 7. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 8. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. www.onsemi.com 2 MC74AC245, MC74ACT245 DC CHARACTERISTICS Symbol Parameter 74AC 74AC TA = +25°C −40°C to +85°C TA = VCC (V) Typ VIH VIL VOH VOL IIN IOZT IOLD IOHD ICC Unit Conditions Guaranteed Limits Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 Maximum Input Leakage Current 5.5 − ±0.1 Maximum 3-State Current 5.5 − 5.5 Maximum Low Level Output Voltage †Minimum Dynamic Output Current Maximum Quiescent Supply Current IOUT = −50 mA V *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA IOUT = 50 mA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA ±1.0 mA VI = VCC, GND ±0.6 ±6.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80.0 mA VIN = VCC or GND *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. www.onsemi.com 3 MC74AC245, MC74ACT245 AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com) 74AC Parameter Symbol VCC* TA = +25°C (V) CL = 50 pF 74AC TA = −40°C to +85°C Unit CL = 50 pF Min Typ Max Min Max Fig. No. tPLH Propagation Delay An to Bn or Bn to An 3.3 5.0 1.5 1.5 5.0 3.5 8.5 6.5 1.0 1.0 9.0 7.0 ns 3−5 tPHL Propagation Delay An to Bn or Bn to An 3.3 5.0 1.5 1.5 5.0 3.5 8.5 6.0 1.0 1.0 9.0 7.0 ns 3−5 tPZH Output Enable Time 3.3 5.0 2.5 1.5 7.0 5.0 11.5 8.5 2.0 1.0 12.5 9.0 ns 3−7 tPZL Output Enable Time 3.3 5.0 2.5 1.5 7.5 5.5 12.0 9.0 2.0 1.0 13.5 9.5 ns 3−8 tPHZ Output Disable Time 3.3 5.0 2.0 1.5 6.5 5.5 12.0 9.0 1.0 1.0 12.5 10.0 ns 3−7 tPLZ Output Disable Time 3.3 5.0 2.0 1.5 7.0 5.5 11.5 9.0 1.5 1.0 13.0 10.0 ns 3−8 *Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS Symbol Parameter 74ACT 74ACT TA = +25°C −40°C to +85°C TA = VCC (V) Unit Conditions Typ Guaranteed Limits VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 − − 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 − − 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V Maximum 3−State Current 5.5 − ±0.6 ±6.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80.0 mA VIN = VCC or GND VOL IIN DICCT IOZT IOLD IOHD ICC Maximum Low Level Output Voltage †Minimum Dynamic Output Current Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. www.onsemi.com 4 V V IOUT = −50 mA *VIN = VIL or VIH IOH −24 mA −24 mA IOUT = 50 mA MC74AC245, MC74ACT245 AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com) 74ACT Parameter Symbol 74ACT VCC* TA = +25°C (V) CL = 50 pF TA = −40°C to +85°C Unit CL = 50 pF Fig. No. Min Typ Max Min Max 8.0 ns 3−5 tPLH Propagation Delay, An to Bn or Bn to An 5.0 1.5 4.0 7.5 1.5 tPHL Propagation Delay, An to Bn or Bn to An 5.0 1.5 4.0 8.0 1.0 9.0 ns 3−5 tPZH Output Enable Time 5.0 1.5 5.0 10 1.5 11.0 ns 3−7 tPZL Output Enable Time 5.0 1.5 5.5 10 1.5 12.0 ns 3−8 tPHZ Output Disable Time 5.0 1.5 5.5 10 1.0 11.0 ns 3−7 tPLZ Output Disable Time 5.0 2.0 5.0 10 1.5 11.0 ns 3−8 *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Value Parameter Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CI/O Input/Output Capacitance 15 pF VCC = 5.0 V CPD Power Dissipation Capacitance 45 pF VCC = 5.0 V www.onsemi.com 5 MC74AC245, MC74ACT245 ORDERING INFORMATION Package Shipping† MC74AC245DWG SOIC−20 (Pb−Free) 38 Units / Rail MC74AC245DWR2G SOIC−20 (Pb−Free) 1000 / Tape & Reel MC74ACT245DWG SOIC−20 (Pb−Free) 38 Units / Rail MC74ACT245DWR2G SOIC−20 (Pb−Free) 1000 / Tape & Reel MC74AC245DTG TSSOP−20 (Pb−Free) 75 Units / Rail MC74AC245DTR2G TSSOP−20 (Pb−Free) 2500 / Tape & Reel MC74ACT245DTG TSSOP−20 (Pb−Free) 75 Units / Rail MC74ACT245DTR2G TSSOP−20 (Pb−Free) 2500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MARKING DIAGRAMS SOIC−20W TSSOP−20 20 20 AC 245 ALYWG G AC245 AWLYYWWG 1 1 20 20 ACT 245 ALYWG G ACT245 AWLYYWWG 1 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) www.onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−20 WB CASE 751D−05 ISSUE H DATE 22 APR 2015 SCALE 1:1 A 20 q X 45 _ M E h 0.25 H NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 1 10 20X B b 0.25 M T A S B DIM A A1 b c D E e H h L q S L A 18X e SEATING PLANE A1 c T GENERIC MARKING DIAGRAM* RECOMMENDED SOLDERING FOOTPRINT* 20 20X 20X 1.30 0.52 20 XXXXXXXXXXX XXXXXXXXXXX AWLYYWWG 11 1 11.00 1 XXXXX A WL YY WW G 10 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ 98ASB42343B SOIC−20 WB = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−20 WB CASE 948E ISSUE D DATE 17 FEB 2016 SCALE 2:1 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ K K1 S J J1 11 B SECTION N−N −U− PIN 1 IDENT 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C G D H DETAIL E 0.100 (0.004) −T− SEATING PLANE DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT 7.06 XXXX XXXX ALYWG G 1 0.65 PITCH 16X 0.36 16X 1.26 DOCUMENT NUMBER: 98ASH70169A DESCRIPTION: TSSOP−20 WB A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DIMENSIONS: MILLIMETERS Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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