MC74AC08, MC74ACT08
Quad 2-Input AND Gate
High−Performance Silicon−Gate CMOS
Features
• Outputs Source/Sink 24 mA
• ′ACT08 Has TTL Compatible Inputs
• These are Pb−Free Devices
www.onsemi.com
MARKING
DIAGRAMS
14
VCC
14
13
12
11
10
9
SOIC−14
D SUFFIX
CASE 751A
8
14
xxx08G
AWLYWW
1
1
14
1
2
3
4
5
6
7
Figure 1. Pinout: 14−Lead Packages Conductors
(Top View)
xxx
08
ALYWG
G
TSSOP−14
DT SUFFIX
CASE 948G
GND
1
14
1
xxx
= AC or ACT
A
= Assembly Location
WL or L = Wafer Lot
Y
= Year
WW or W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 10
1
Publication Order Number:
MC74AC08/D
MC74AC08, MC74ACT08
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
*0.5 to )7.0
V
*0.5 v VI v VCC )0.5
V
*0.5 v VO v VCC )0.5
V
DC Input Diode Current
$20
mA
IOK
DC Output Diode Current
$50
mA
IO
DC Output Sink/Source Current
$50
mA
ICC
DC Supply Current per Output Pin
$50
mA
IGND
DC Ground Current per Output Pin
$50
mA
TSTG
Storage Temperature Range
*65 to )150
°C
TL
Lead temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction temperature under Bias
)150
°C
qJA
Thermal Resistance (Note 2)
SOIC
TSSOP
125
170
°C/W
PD
Power Dissipation in Still Air at 85°C
SOIC
TSSOP
125
170
mW
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
> 2000
> 200
> 1000
V
ILatch−Up
Latch−Up Performance
Above VCC and Below GND at 85°C (Note 6)
$100
mA
VCC
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
(Note 1)
Level 1
Oxygen Index: 30% − 35%
UL 94 V−0 @ 0.125 in
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
2. The package thermal impedance is calculated in accordance with JESD51−7.
3. Tested to EIA/JESD22−A114−A.
4. Tested to EIA/JESD22−A115−A.
5. Tested to JESD22−C101−A.
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
Vin, Vout
DC Input Voltage, Output Voltage (Ref. to GND)
tr, tf
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
Min
Typ
Max
′AC
2.0
5.0
6.0
Unit
′ACT
4.5
5.0
5.5
0
−
VCC
V
VCC @ 3.0 V
−
150
−
ns/V
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
−
−
140
V
tr, tf
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
TJ
Junction Temperature (PDIP)
TA
Operating Ambient Temperature Range
−40
25
85
°C
IOH
Output Current − High
−
−
−24
mA
IOL
Output Current − Low
−
−
24
mA
ns/V
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
www.onsemi.com
2
MC74AC08, MC74ACT08
DC CHARACTERISTICS
Symbol
Parameter
Conditions
74AC
74AC
TA = +25°C
TA =
−40°C to
+85°C
VCC
(V)
Typ
Guaranteed Limits
Unit
VIH
Minimum High Level
Input Voltage
VOUT = 0.1 V
or VCC − 0.1 V
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
VIL
Maximum Low Level
Input Voltage
VOUT = 0.1 V
or VCC − 0.1 V
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
VOH
Minimum High Level
Output Voltage
IOUT = −50 mA
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
V
VIN = VIL or VIH (Note 3)
−12 mA
−24 mA
IOH
−24 mA
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
VIN = VIL or VIH(Note 3)
12 mA
24 mA
IOL
24 mA
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
VI = VCC, GND
5.5
−
±0.1
±1.0
mA
VOLD = 1.65 V Max
5.5
−
−
75
mA
VOHD = 3.85 V Min
5.5
−
−
−75
mA
VIN = VCC or GND
5.5
−
4.0
40
mA
VOL
Maximum Low Level
Output Voltage
IIN
Maximum Input
Leakage Current
IOLD
Minimum Dynamic (Note 4)
Output Current
IOHD
ICC
Maximum Quiescent
Supply Current
V
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
3. All outputs loaded; thresholds on input associated with output under test.
4. Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS
74AC
74AC
TA = −40°C
Symbol
Parameter
TA = +25°C
to +85°C
CL = 50 pF
CL = 50 pF
Fig.
VCC (V)
(Note5 )
Min
Typ
Max
Min
Max
Unit
No.
tPLH
Propagation Delay
3.3
5.0
1.5
1.5
7.5
5.5
9.5
7.5
1.0
1.0
10.0
8.5
ns
3−5
tPHL
Propagation Delay
3.3
5.0
1.5
1.5
7.0
5.5
8.5
7.0
1.0
1.0
9.0
7.5
ns
3−5
5. Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
www.onsemi.com
3
MC74AC08, MC74ACT08
DC CHARACTERISTICS
74ACT
74ACT
TA = +25°C
−40°C to
+85°C
TA =
Symbol
VIH
VIL
VOH
Parameter
Conditions
VCC
(V)
Typ
Guaranteed Limits
Minimum High Level
Input Voltage
VOUT = 0.1 V
4.5
1.5
2.0
2.0
or VCC − 0.1 V
5.5
1.5
2.0
2.0
Maximum Low Level
Input Voltage
VOUT = 0.1 V
4.5
1.5
0.8
0.8
or VCC − 0.1 V
5.5
1.5
0.8
0.8
Minimum High Level
Output Voltage
IOUT = −50 mA
4.5
4.49
4.4
4.4
5.5
5.49
5.4
5.4
Unit
V
V
V
V
VIN = VIL or VIH (Note 6)
VOL
−24 mA
4.5
−
3.86
3.76
−24 mA
5.5
−
4.86
4.76
4.5
0.001
0.1
0.1
5.5
0.001
0.1
0.1
IOUT = 50 mA
Maximum Low Level
Output Voltage
V
V
VIN = VIL or VIH (Note 6)
24 mA
4.5
−
0.36
0.44
24 mA
5.5
−
0.36
0.44
IIN
Maximum Input
Leakage Current
VI = VCC, GND
5.5
−
±0.1
±1.0
mA
DICCT
Additional Max. ICC/Input
VI = VCC − 2.1 V
5.5
0.6
−
1.5
mA
IOLD
Minimum Dynamic (Note 7)
Output Current
VOLD = 1.65 V Max
5.5
−
−
75
mA
VOHD = 3.85 V Min
5.5
−
−
−75
mA
VIN = VCC or GND
5.5
−
4.0
40
mA
IOHD
ICC
Maximum Quiescent
Supply Current
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. All outputs loaded; thresholds on input associated with output under test.
7. Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS
74ACT
74ACT
TA = −40°C
Symbol
Parameter
TA = +25°C
to +85°C
CL = 50 pF
CL = 50 pF
Fig.
VCC (V)
(Note 8)
Min
Typ
Max
Min
Max
Unit
No.
tPLH
Propagation Delay
5.0
1.0
−
9.0
1.0
10.0
ns
3−5
tPHL
Propagation Delay
5.0
1.0
−
9.0
1.0
10.0
ns
3−5
8. Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Value
Symbol
Parameter
Test Conditions
Typ
Unit
CIN
Input Capacitance
VCC = 5.0 V
4.5
pF
CPD
Power Dissipation Capacitance
VCC = 5.0 V
20
pF
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4
MC74AC08, MC74ACT08
ORDERING INFORMATION
Package
Shipping†
MC74AC08DG
SOIC−14
(Pb−Free)
55 Units / Rail
MC74AC08DR2G
SOIC−14
(Pb−Free)
2500 / Tape & Reel
MC74AC08DTR2G
TSSOP−14
(Pb−Free)
2500 / Tape & Reel
MC74ACT08DG
SOIC−14
(Pb−Free)
55 Units / Rail
MC74ACT08DR2G
SOIC−14
(Pb−Free)
2500 / Tape & Reel
MC74ACT08DTR2G
TSSOP−14
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE L
14
1
SCALE 1:1
D
DATE 03 FEB 2016
A
B
14
8
A3
E
H
L
1
0.25
B
M
DETAIL A
7
13X
M
b
0.25
M
C A
S
B
S
0.10
X 45 _
M
A1
e
DETAIL A
h
A
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
6.50
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
14
14X
1.18
XXXXXXXXXG
AWLYWW
1
1
1.27
PITCH
XXXXX
A
WL
Y
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOIC−14
CASE 751A−03
ISSUE L
DATE 03 FEB 2016
STYLE 1:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. NO CONNECTION
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. NO CONNECTION
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 2:
CANCELLED
STYLE 3:
PIN 1. NO CONNECTION
2. ANODE
3. ANODE
4. NO CONNECTION
5. ANODE
6. NO CONNECTION
7. ANODE
8. ANODE
9. ANODE
10. NO CONNECTION
11. ANODE
12. ANODE
13. NO CONNECTION
14. COMMON CATHODE
STYLE 4:
PIN 1. NO CONNECTION
2. CATHODE
3. CATHODE
4. NO CONNECTION
5. CATHODE
6. NO CONNECTION
7. CATHODE
8. CATHODE
9. CATHODE
10. NO CONNECTION
11. CATHODE
12. CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 5:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. NO CONNECTION
7. COMMON ANODE
8. COMMON CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 6:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. ANODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
STYLE 7:
PIN 1. ANODE/CATHODE
2. COMMON ANODE
3. COMMON CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. ANODE/CATHODE
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. COMMON CATHODE
12. COMMON ANODE
13. ANODE/CATHODE
14. ANODE/CATHODE
STYLE 8:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. ANODE/CATHODE
7. COMMON ANODE
8. COMMON ANODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. NO CONNECTION
12. ANODE/CATHODE
13. ANODE/CATHODE
14. COMMON CATHODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−14 WB
CASE 948G
ISSUE C
14
DATE 17 FEB 2016
1
SCALE 2:1
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
DETAIL E
K
A
−V−
K1
J J1
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
H
G
D
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
GENERIC
MARKING DIAGRAM*
14
SOLDERING FOOTPRINT
XXXX
XXXX
ALYWG
G
7.06
1
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
98ASH70246A
DESCRIPTION:
TSSOP−14 WB
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
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Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
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TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
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