MC74ACT241DWR2G

MC74ACT241 Octal Buffer/Line Driver with 3-State Outputs The MC74ACT241 is an octal buffer and line driver designed to be employed as a memory address driver, clock driver and bus oriented transmitter or receiver which provides improved PC board density. www.onsemi.com Features • 3−State Outputs Drive Bus Lines or Buffer Memory Address • • • Registers Outputs Source/Sink 24 mA TTL Compatible Inputs These are Pb−Free Devices MARKING DIAGRAMS 20 1 VCC OE2 YA1 DB4 YA2 DB3 YA3 DB2 YA4 DB1 20 19 18 17 16 15 14 13 12 11 SOIC−20W DW SUFFIX CASE 751D ACT241 AWLYYWWG 1 20 ACT 241 ALYWG G 1 1 2 3 4 5 6 7 8 9 10 OE1 DA1 YB4 DA2 YB3 DA3 YB2 DA4 YB1 GND TSSOP−20 DT SUFFIX CASE 948E A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) Figure 1. Pinout: 20−Lead Packages Conductors (Top View) TRUTH TABLE Inputs 1 Outputs OE1 D (Pins 12, 14, 16, 18) L L L L H H H X Z ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance TRUTH TABLE Inputs Outputs OE2 D (Pins 3, 5, 7, 9) H L L H H H L X Z H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance © Semiconductor Components Industries, LLC, 2015 February, 2015 − Rev. 6 1 Publication Order Number: MC74ACT241/D MC74ACT241 MAXIMUM RATINGS Symbol Parameter Value Unit −0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) (Note 1) −0.5 to VCC +0.5 V VOUT IIK DC Input Diode Current ±20 mA IOK DC Output Diode Current ±50 mA IOUT DC Output Sink/Source Current ±50 mA ICC DC Supply Current, per Output Pin ±50 mA IGND DC Ground Current, per Output Pin ±100 mA TSTG Storage Temperature Range *65 to )150 _C TL Lead temperature, 1 mm from Case for 10 Seconds 260 _C TJ Junction Temperature Under Bias 140 _C qJA Thermal Resistance (Note 2) 65.8 110.7 _C/W MSL Moisture Sensitivity FR Flammability Rating VESD ILatchup SOIC TSSOP Level 1 Oxygen Index: 30% − 35% ESD Withstand Voltage Latchup Performance UL 94 V−0 @ 0.125 in Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) Above VCC and Below GND at 85_C (Note 6) > 2000 > 200 > 1000 V ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IOUT absolute maximum rating must be observed. 2. The package thermal impedance is calculated in accordance with JESD 51−7. 3. Tested to EIA/JESD22−A114−A. 4. Tested to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT Parameter Min DC Input Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Max Unit 4.5 Typ 5.5 V 0 VCC V −40 25 +85 °C 0 0 10 8.0 10 8.0 ns/V Output Current − High − − −24 mA Output Current − Low − − 24 mA TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Note 8) IOH IOL VCC = 4.5 V VCC = 5.5 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 7. Unused Inputs may not be left open. All inputs must be tied to a high voltage level or low logic voltage level. 8. Vin from 0.8 V to 2.0 V; refer to individual Data Sheets for devices that differ from the typical input rise and fall times. www.onsemi.com 2 MC74ACT241 DC CHARACTERISTICS Symbol Parameter TA = +255C VCC (V) Typ TA = −405C to +855C Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V V IOUT = −50 mA 4.5 5.5 − 3.86 4.86 3.76 4.76 V V *VIN = VIL or VIH IOH 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 V V IOUT = 50 mA 4.5 5.5 − 0.36 0.36 0.44 0.44 V V *VIN = VIL or VIH IOL Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND Additional Maximum ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V Maximum 3−State Current 5.5 − ±0.5 ±5.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND IOLD IOHD †Minimum Dynamic Output Current 5.5 5.5 − − 75 −75 mA mA VOLD = 1.65 V Max VOHD = 3.85 V Min ICC Maximum Quiescent Supply Current 5.5 − 8.0 80 mA VIN = VCC or GND VOL IIN DICCT IOZ Maximum Low Level Output Voltage −24 mA −24 mA 24 mA 24 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS tr = tf = 3.0 ns (For Figures and Waveforms, See Figures 2, 3, and 4.) Parameter Symbol TA = +255C CL = 50 pF TA = −405C to +855C CL = 50 pF VCC* (V) Min Typ Max Min Max Unit tPLH Propagation Delay Data to Output 5.0 1.5 6.5 9.0 1.5 10.0 ns tPHL Propagation Delay Data to Output 5.0 1.5 7.0 9.0 1.5 10.0 ns tPZH Output Enable Time 5.0 1.5 6.0 9.0 1.0 10.0 ns tPZL Output Enable Time 5.0 1.5 7.0 10.0 1.5 11.0 ns tPHZ Output Disable Time 5.0 1.5 8.0 10.5 1.5 11.5 ns tPLZ Output Disable Time 5.0 2.0 7.0 10.5 1.5 11.5 ns *Voltage Range 5.0 V is 5.0 V ±0.5 V CAPACITANCE Symbol Value Typ Unit Test Conditions CIN Input Capacitance Parameter 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 45 pF VCC = 5.0 V www.onsemi.com 3 MC74ACT241 SWITCHING WAVEFORMS tf tr 3.0 V 50% INPUT DATA GND tw 1/fmax tPHL tPLH OUTPUT 50% Figure 2. 3.0 V OE1 1.3 V GND 3.0 V OE2 1.3 V GND tPZL tPLZ OUTPUT Y (12, 14, 16, 18) HIGH IMPEDANCE 1.3 V 10% VOL 90% VOH tPZH tPHZ OUTPUT Y (3, 5, 7, 9) 1.3 V HIGH IMPEDANCE Figure 3. 450 W INPUT OUTPUT DEVICE UNDER TEST 50 W SCOPE TEST POINT CL * *Includes all probe and jig capacitance Figure 4. Test Circuit www.onsemi.com 4 MC74ACT241 ORDERING INFORMATION Package Shipping† MC74ACT241DWG SOIC−20 (Pb−Free) 38 Units / Rail MC74ACT241DWR2G SOIC−20 (Pb−Free) 1000 / Tape & Reel MC74ACT241DTR2G TSSOP−20 (Pb−Free) 2500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−20 WB CASE 751D−05 ISSUE H DATE 22 APR 2015 SCALE 1:1 A 20 q X 45 _ M E h 0.25 H NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 1 10 20X B b 0.25 M T A S B DIM A A1 b c D E e H h L q S L A 18X e SEATING PLANE A1 c T GENERIC MARKING DIAGRAM* RECOMMENDED SOLDERING FOOTPRINT* 20 20X 20X 1.30 0.52 20 XXXXXXXXXXX XXXXXXXXXXX AWLYYWWG 11 1 11.00 1 XXXXX A WL YY WW G 10 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ 98ASB42343B SOIC−20 WB = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−20 WB CASE 948E ISSUE D DATE 17 FEB 2016 SCALE 2:1 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ K K1 S J J1 11 B SECTION N−N −U− PIN 1 IDENT 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C G D H DETAIL E 0.100 (0.004) −T− SEATING PLANE DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT 7.06 XXXX XXXX ALYWG G 1 0.65 PITCH 16X 0.36 16X 1.26 DOCUMENT NUMBER: 98ASH70169A DESCRIPTION: TSSOP−20 WB A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DIMENSIONS: MILLIMETERS Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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