MC74HC165ANG

8-Bit Serial or Parallel-Input/ Serial-Output Shift Register High−Performance Silicon−Gate CMOS MC74HC165A The MC74HC165A is identical in pinout to the LS165. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device is an 8−bit shift register with complementary outputs from the last stage. Data may be loaded into the register either in parallel or in serial form. When the Serial Shift/Parallel Load input is low, the data is loaded asynchronously in parallel. When the Serial Shift/Parallel Load input is high, the data is loaded serially on the rising edge of either Clock or Clock Inhibit (see the Function Table). The 2−input NOR clock may be used either by combining two independent clock sources or by designating one of the clock inputs to act as a clock inhibit. www.onsemi.com MARKING DIAGRAMS 16 1 16 • • • SOIC−16 D SUFFIX CASE 751B 16 1 Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1 mA High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7 A Chip Complexity: 286 FETs or 71.5 Equivalent Gates NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free and are RoHS Compliant MC74HC165AN AWLYYWWG 1 Features • • • • • • PDIP−16 N SUFFIX CASE 648 16 HC165AG AWLYWW 1 16 HC 165A ALYWG G TSSOP−16 DT SUFFIX CASE 948F 16 1 1 1 QFN16 MN SUFFIX CASE 485AW A L, WL Y, YY W, WW G or G 165A ALYWG G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2014 March, 2020 − Rev. 10 1 Publication Order Number: MC74HC165A/D MC74HC165A SERIAL SHIFT/ PARALLEL LOAD 1 CLOCK 2 SERIAL SHIFT/ PARALLEL LOAD CLOCK 1 16 VCC 2 15 CLOCK INHIBIT E 3 14 D E 3 F 4 F 4 13 C G 5 12 B H 6 11 A H 6 QH 7 10 SA QH 7 GND 8 9 VCC 16 15 CLOCK INHIBIT 14 D 13 C GND G 5 12 B 11 A 10 SA 8 9 GND QH QH Figure 1. Pin Assignments A B 13 9 D 14 E 3 7 C PARALLEL DATA INPUTS 11 12 QH QH SERIAL DATA OUTPUTS F 4 G 5 H 6 SERIAL SA 10 DATA INPUT SERIAL SHIFT/ 1 PARALLEL LOAD CLOCK 2 CLOCK INHIBIT PIN 16 = VCC PIN 8 = GND 15 Figure 2. Logic Diagram FUNCTION TABLE Inputs Serial Shift/ Parallel Load L Clock X Clock Inhibit H H SA X A−H a…h QA a QB b QH h Operation Asynchronous Parallel Load L L L H X X L H QAn QAn QGn QGn Serial Shift via Clock L H X X L H QAn QAn QGn QGn Serial Shift via Clock Inhibit X X X X No Change Inhibited Clock X X No Change No Clock L L H H X H H X L L X = don’t care Output X H H H Internal Stages QAn − QGn = Data shifted from the preceding stage www.onsemi.com 2 MC74HC165A MAXIMUM RATINGS Symbol Parameter Value Unit – 0.5 to + 7.0 V DC Input Voltage (Referenced to GND) – 0.5 to VCC + 0.5 V DC Output Voltage (Referenced to GND) – 0.5 to VCC + 0.5 V VCC DC Supply Voltage (Referenced to GND) Vin Vout Iin DC Input Current, per Pin ± 20 mA Iout DC Output Current, per Pin ± 25 mA ICC DC Supply Current, VCC and GND Pins ± 50 mA PD Power Dissipation in Still Air 750 500 450 mW Tstg Storage Temperature – 65 to + 150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC or TSSOP Package) Plastic DIP† SOIC Package† TSSOP Package† This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. _C 260 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. †Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: − 6.1 mW/_C from 65_ to 125_C RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout Parameter Min Max Unit 2.0 6.0 V 0 VCC V – 55 + 125 _C 0 0 0 1000 600 500 400 ns DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figure 1) VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC V Guaranteed Limit – 55 to 25_C v 85_C v 125_C Unit VIH Minimum High−Level Input Voltage Vout = 0.1 V or VCC – 0.1 V |Iout| v 20 mA 2.0 3.0 4.5 6.0 1.5 2.1 3.15 4.2 1.5 2.1 3.15 4.2 1.5 2.1 3.15 4.2 V VIL Maximum Low−Level Input Voltage Vout = 0.1 V or VCC – 0.1 V |Iout| v 20 mA 2.0 3.0 4.5 6.0 0.5 0.9 1.35 1.80 0.5 0.9 1.35 1.80 0.5 0.9 1.35 1.80 V VOH Minimum High−Level Output Voltage Vin = VIH or VIL |Iout| v 20 mA 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V 3.0 4.5 6.0 2.48 3.98 5.48 2.34 3.84 5.34 2.20 3.70 5.20 V Symbol Parameter Test Conditions Vin = VIH or VIL |Iout| v 2.4 mA |Iout| v 4.0 mA |Iout| v 5.2 mA www.onsemi.com 3 MC74HC165A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) Symbol VOL Parameter Test Conditions Maximum Low−Level Output Voltage Vin = VIH or VIL |Iout| v 20 mA Vin = VIH or VIL |Iout| v 2.4 mA |Iout| v 4.0 mA |Iout| v 5.2 mA Guaranteed Limit VCC V – 55 to 25_C v 85_C v 125_C Unit 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V 3.0 4.5 6.0 0.26 0.26 0.26 0.33 0.33 0.33 0.40 0.40 0.40 Iin Maximum Input Leakage Current Vin = VCC or GND 6.0 ± 0.1 ± 1.0 ± 1.0 mA ICC Maximum Quiescent Supply Current (per Package) Vin = VCC or GND Iout = 0 mA 6.0 4 40 160 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) Symbol Parameter Guaranteed Limit VCC V – 55 to 25_C v 85_C v 125_C Unit fmax Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 8) 2.0 3.0 4.5 6.0 6 18 30 35 4.8 17 24 28 4 15 20 24 MHz tPLH, tPHL Maximum Propagation Delay, Clock (or Clock Inhibit) to QH or QH (Figures 1 and 8) 2.0 3.0 4.5 6.0 150 52 30 26 190 63 38 33 225 65 45 38 ns tPLH, tPHL Maximum Propagation Delay, Serial Shift/Parallel Load to QH or QH (Figures 2 and 8) 2.0 3.0 4.5 6.0 175 58 35 30 220 70 44 37 265 72 53 45 ns tPLH, tPHL Maximum Propagation Delay, Input H to QH or QH (Figures 3 and 8) 2.0 3.0 4.5 6.0 150 52 30 26 190 63 38 33 225 65 45 38 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 1 and 8) 2.0 3.0 4.5 6.0 75 27 15 13 95 32 19 16 110 36 22 19 ns − 10 10 10 pF Cin Maximum Input Capacitance Typical @ 25°C, VCC = 5.0 V CPD 40 Power Dissipation Capacitance (Per Package)* * Used to determine the no−load dynamic power consumption: P D = CPD VCC2 f + ICC VCC . www.onsemi.com 4 pF MC74HC165A TIMING REQUIREMENTS (Input tr = tf = 6 ns) VCC V Guaranteed Limit – 55 to 25_C v 85_C v 125_C Unit tsu Minimum Setup Time, Parallel Data Inputs to Serial Shift/Parallel Load (Figure 4) 2.0 3.0 4.5 6.0 75 30 15 13 95 40 19 16 110 55 22 19 ns tsu Minimum Setup Time, Input SA to Clock (or Clock Inhibit) (Figure 5) 2.0 3.0 4.5 6.0 75 30 15 13 95 40 19 16 110 55 22 19 ns tsu Minimum Setup Time, Serial Shift/Parallel Load to Clock (or Clock Inhibit) (Figure 6) 2.0 3.0 4.5 6.0 75 30 15 13 95 40 19 16 110 55 22 19 ns tsu Minimum Setup Time, Clock to Clock Inhibit (Figure 7) 2.0 3.0 4.5 6.0 75 30 15 13 95 40 19 16 110 55 22 19 ns th Minimum Hold Time, Serial Shift/Parallel Load to Parallel Data Inputs (Figure 4) 2.0 3.0 4.5 6.0 5 5 5 5 5 5 5 5 5 5 5 5 ns th Minimum Hold Time, Clock (or Clock Inhibit) to Input SA (Figure 5) 2.0 3.0 4.5 6.0 5 5 5 5 5 5 5 5 5 5 5 5 ns th Minimum Hold Time, Clock (or Clock Inhibit) to Serial Shift/Parallel Load (Figure 6) 2.0 3.0 4.5 6.0 5 5 5 5 5 5 5 5 5 5 5 5 ns trec Minimum Recovery Time, Clock to Clock Inhibit (Figure 7) 2.0 3.0 4.5 6.0 75 30 15 13 95 40 19 16 110 55 22 19 ns tw Minimum Pulse Width, Clock (or Clock Inhibit) (Figure 1) 2.0 3.0 4.5 6.0 70 27 15 13 90 32 19 16 100 36 22 19 ns tw Minimum Pulse width, Serial Shift/Parallel Load (Figure 2) 2.0 3.0 4.5 6.0 70 27 15 13 90 32 19 16 100 36 22 19 ns Maximum Input Rise and Fall Times (Figure 1) 2.0 3.0 4.5 6.0 1000 800 500 400 1000 800 500 400 1000 800 500 400 ns Symbol tr, tf Parameter www.onsemi.com 5 MC74HC165A PIN DESCRIPTIONS INPUTS is applied to this pin, data at the Parallel Data inputs are asynchronously loaded into each of the eight internal stages. A, B, C, D, E, F, G, H (Pins 11, 12, 13, 14, 3, 4, 5, 6) Parallel Data inputs. Data on these inputs are asynchronously entered in parallel into the internal flip−flops when the Serial Shift/Parallel Load input is low. Clock, Clock Inhibit (Pins 2, 15) Clock inputs. These two clock inputs function identically. Either may be used as an active−high clock inhibit. However, to avoid double clocking, the inhibit input should go high only while the clock input is high. The shift register is completely static, allowing Clock rates down to DC in a continuous or intermittent mode. SA (Pin 10) Serial Data input. When the Serial Shift/Parallel Load input is high, data on this pin is serially entered into the first stage of the shift register with the rising edge of the Clock. OUTPUTS CONTROL INPUTS QH, QH (Pins 9, 7) Serial Shift/Parallel Load (Pin 1) Complementary Shift Register outputs. These pins are the noninverted and inverted outputs of the eighth stage of the shift register. Data−entry control input. When a high level is applied to this pin, data at the Serial Data input (SA) are shifted into the register with the rising edge of the Clock. When a low level ORDERING INFORMATION Package Shipping† PDIP−16 (Pb−Free) 500 Units / Rail Device MC74HC165ANG MC74HC165ADG MC74HC165ADR2G NLV74HC165ADR2G* MC74HC165ADTR2G NLV74HC165ADTR2G* MC74HC165AMNTWG MC74HC165AMN2TWG SOIC−16 (Pb−Free) 48 Units / Rail 2500 Units / Reel 2500 Units / Reel TSSOP−16 (Pb−Free) 2500 Units / Reel QFN16 (Pb−Free) 3000 Units / Reel 2500 Units / Reel 3000 Units / Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. www.onsemi.com 6 MC74HC165A SWITCHING WAVEFORMS tr CLOCK OR CLOCK INHIBIT tf VCC 90% 50% 10% tw GND SERIAL SHIFT/ PARALLEL LOAD tw 1/fmax 90% 50% 10% QH OR QH 50% GND tPLH tPHL tPLH VCC 50% QH OR QH tPHL 50% tTHL tTLH Figure 3. Serial−Shirt Mode Figure 4. Parallel−Load Mode VALID tr VCC tf 90% 50% 10% INPUT H INPUTS A-H VCC 50% GND GND tsu tPHL tPLH 90% 50% 10% QH OR QH th VCC SERIAL SHIFT/ PARALLEL LOAD tTLH GND tTHL ASYNCHRONOUS PARALLEL LOAD (LEVEL SENSITIVE) Figure 5. Parallel−Load Mode Figure 6. Parallel−Load Mode VALID SERIAL SHIFT/ PARALLEL LOAD VCC INPUT SA 50% VCC 50% GND GND tsu tsu th VCC CLOCK OR CLOCK INHIBIT VCC CLOCK OR CLOCK INHIBIT 50% th 50% GND GND Figure 7. Serial−Shift Mode Figure 8. Serial−Shift Mode TEST POINT CLOCK 2 INHIBITED CLOCK INHIBIT OUTPUT VCC DEVICE UNDER TEST 50% GND tsu CLOCK CL* trec VCC 50% *Includes all probe and jig capacitance GND Figure 9. Serial−Shift, Clock−Inhibit Mode Figure 10. Test Circuit www.onsemi.com 7 MC74HC165A EXPANDED LOGIC DIAGRAM A B 11 C 12 F 13 G 4 H 5 6 SERIAL SHIFT/ 1 PARALLEL LOAD 9 Q H SERIAL DATA 10 INPUT SA D QA D QB D QC D QF D QG D QH C C C C C C C C C C C C CLOCK 2 CLOCK 15 INHIBIT TIMING DIAGRAM CLOCK CLOCK INHIBIT SA SERIAL SHIFT/ PARALLEL LOAD A H B L C H D L E H F L G H H H PARALLEL DATA INPUTS QH QH H H L H L H L H L L H L H L H L CLOCK INHIBIT MODE SERIAL-SHIFT MODE PARALLEL LOAD www.onsemi.com 8 7 Q H MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN16, 2.5x3.5, 0.5P CASE 485AW−01 ISSUE O 1 SCALE 2:1 D PIN ONE REFERENCE A B ÉÉÉ ÉÉÉ ÉÉÉ DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS E TOP VIEW MOLD CMPD DETAIL B ALTERNATE CONSTRUCTIONS A DETAIL B (A3) 0.10 C NOTE 4 C SIDE VIEW XXXX ALYWG G SEATING PLANE 0.15 C A B XXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) D2 16X L K 8 10 DETAIL A 0.15 C A B E2 16X 2 15 e MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.50 BSC 0.85 1.15 3.50 BSC 1.85 2.15 0.50 BSC 0.20 --0.35 0.45 --0.15 GENERIC MARKING DIAGRAM* A1 0.08 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L L1 ÇÇÇ ÇÇÇ ÉÉÉ ÉÉÉ EXPOSED Cu 0.15 C 2X L L1 0.15 C 2X 16X L DATE 11 DEC 2008 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. b 0.10 C A B 1 0.05 C NOTE 3 SOLDERING FOOTPRINT* e/2 3.80 BOTTOM VIEW 2.10 0.50 PITCH 2.80 1.10 1 16X 0.60 16X 0.30 PACKAGE OUTLINE DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON36347E QFN16, 2.5X3.5, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−16 CASE 751B−05 ISSUE K DATE 29 DEC 2006 SCALE 1:1 −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 16 PL 0.25 (0.010) M T B S A S STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. COLLECTOR BASE EMITTER NO CONNECTION EMITTER BASE COLLECTOR COLLECTOR BASE EMITTER NO CONNECTION EMITTER BASE COLLECTOR EMITTER COLLECTOR STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. CATHODE ANODE NO CONNECTION CATHODE CATHODE NO CONNECTION ANODE CATHODE CATHODE ANODE NO CONNECTION CATHODE CATHODE NO CONNECTION ANODE CATHODE STYLE 3: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. COLLECTOR, DYE #1 BASE, #1 EMITTER, #1 COLLECTOR, #1 COLLECTOR, #2 BASE, #2 EMITTER, #2 COLLECTOR, #2 COLLECTOR, #3 BASE, #3 EMITTER, #3 COLLECTOR, #3 COLLECTOR, #4 BASE, #4 EMITTER, #4 COLLECTOR, #4 STYLE 4: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. STYLE 5: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. DRAIN, DYE #1 DRAIN, #1 DRAIN, #2 DRAIN, #2 DRAIN, #3 DRAIN, #3 DRAIN, #4 DRAIN, #4 GATE, #4 SOURCE, #4 GATE, #3 SOURCE, #3 GATE, #2 SOURCE, #2 GATE, #1 SOURCE, #1 STYLE 6: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE STYLE 7: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. SOURCE N‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) GATE P‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) SOURCE P‐CH SOURCE P‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) GATE N‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) SOURCE N‐CH COLLECTOR, DYE #1 COLLECTOR, #1 COLLECTOR, #2 COLLECTOR, #2 COLLECTOR, #3 COLLECTOR, #3 COLLECTOR, #4 COLLECTOR, #4 BASE, #4 EMITTER, #4 BASE, #3 EMITTER, #3 BASE, #2 EMITTER, #2 BASE, #1 EMITTER, #1 SOLDERING FOOTPRINT 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: DESCRIPTION: 98ASB42566B SOIC−16 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−16 CASE 948F−01 ISSUE B 16 DATE 19 OCT 2006 1 SCALE 2:1 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S K S ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. N 8 1 0.25 (0.010) M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT 7.06 16 XXXX XXXX ALYW 1 1 0.65 PITCH 16X 0.36 DOCUMENT NUMBER: DESCRIPTION: 16X 1.26 98ASH70247A TSSOP−16 DIMENSIONS: MILLIMETERS XXXX A L Y W G or G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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