DATA SHEET
www.onsemi.com
Single Inverter with
Schmitt-Trigger Input
MARKING
DIAGRAMS
5
MC74HC1G14
The MC74HC1G14 is a high speed CMOS inverter with Schmitt−
Trigger input fabricated with silicon gate CMOS technology.
The internal circuit is composed of multiple stages, including a
buffer output which provides high noise immunity and stable output.
The MC74HC1G14 output drive current is 1/2 compared to
MC74HC series.
Features
•
•
•
•
•
•
•
•
High Speed: tPD = 7 ns (Typ) at VCC = 5 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
High Noise Immunity
Balanced Propagation Delays (tpLH = tpHL)
Symmetrical Output Impedance (IOH = IOL = 2 mA)
Chip Complexity: < 100 FETs
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
NC
1
A
2
GND
3
5
XX MG
G
1
5
TSOP−5
DT SUFFIX
CASE 483
5
XXXAYWG
G
XX MG
G
1
1
XX = Device Code
M
= Date Code*
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
5
1
SC−74A
DBV SUFFIX
CASE 318BQ
XXX
M
G
VCC
M
SC−88A
DF SUFFIX
CASE 419A
XXX MG
G
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
4
FUNCTION TABLE
Y
Figure 1. Pinout
A
1
Y
Input
Output
A
Y
L
H
H
L
Figure 2. Logic Symbol
PIN ASSIGNMENT
1
2
A
3
GND
4
Y
5
VCC
© Semiconductor Components Industries, LLC, 2014
March, 2022 − Rev. 17
ORDERING INFORMATION
N/C
See detailed ordering, marking and shipping information in
the package dimensions section on page 6 of this data
sheet.
1
Publication Order Number:
MC74HC1G14/D
MC74HC1G14
MAXIMUM RATINGS
Symbol
Parameter
Unit
−0.5 to +7.0
−0.5 to +6.5
V
VCC
DC Supply Voltage
VIN
DC Input Voltage
−0.5 to VCC +0.5
V
DC Output Voltage
−0.5 to VCC +0.5
V
VOUT
SC−88A (NLV), TSOP−5
SC−88A, SC−74A
Value
IIK
DC Input Diode Current
±20
mA
IOK
DC Output Diode Current
±20
mA
IOUT
DC Output Source/Sink Current
±12.5
mA
ICC or IGND
TSTG
DC Supply Current per Supply Pin or Ground Pin
Storage Temperature Range
±25
mA
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
qJA
Thermal Resistance (Note 1)
SC−88A
SC−74A
377
320
°C/W
PD
Power Dissipation in Still Air
SC−88A
SC−74A
332
390
mW
MSL
Moisture Sensitivity
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
ESD Withstand Voltage (Note 2)
Human Body Model
Charged Device Model
2000
1000
V
SC−88A (NLV), TSOP−5
SC−88A, SC−74A
±500
±100
mA
VESD
ILATCHUP
Level 1
Latchup Performance (Note 3)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 20 ounce copper trace with no air flow per JESD51−7.
2. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115A (Machine Model) be discontinued per JEDEC/JEP172A.
3. Tested to EIA/JESD78 Class II.
www.onsemi.com
2
MC74HC1G14
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage
2.0
6.0
V
VIN
DC Input Voltage
0.0
VCC
V
DC Output Voltage
0.0
VCC
V
Operating Temperature Range
−55
+125
°C
SC−88A (NLV), TSOP−5
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
−
−
−
−
No Limit
No Limit
No Limit
No Limit
SC−88A, SC−74A
VCC = 2.0 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 6.0 V
−
−
−
−
No Limit
No Limit
No Limit
No Limit
VOUT
TA
tr , tf
Input Rise and Fall Time
Input Rise and Fall Time
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
Symbol
VT+
Parameter
Test
Conditions
Positive Threshold
Voltage (NLV)
Positive Threshold
Voltage
VT−
Negative Threshold
Voltage (NLV)
Negative Threshold
Voltage
VH
Hysteresis Voltage
VOH
High−Level Output
Voltage
VIN = VIH or VIL
IOH = −20 mA
VIN = VIH or VIL
IOH = −2 mA
IOH = −2.6 mA
VOL
Low−Level Output
Voltage
VIN = VIH or VIL
IOL = 20 mA
VIN = VIH or VIL
IOL = 2 mA
IOL = 2.6 mA
−40°C ≤ TA ≤ 85°C
TA = 255C
VCC
(V)
Min
Typ
Max
Min
3.0
1.85
4.5
2.86
2.0
2.2
3.0
3.15
5.5
3.0
3.5
3.6
−
2.0
4.5
−
5.5
3.0
4.5
5.5
−55°C ≤ TA ≤ 125°C
Max
Min
Max
Unit
−
2.2
−
3.15
−
2.2
V
−
3.15
3.85
−
2.2
−
3.85
−
3.85
2.2
−
2.2
3.0
3.15
−
3.15
−
3.15
−
3.6
0.9
1.5
3.85
−
3.85
−
3.85
1.65
0.9
−
0.9
−
1.35
1.65
2.3
2.46
1.35
−
1.35
−
2.9
3.05
1.65
−
1.65
−
3.0
0.9
1.5
−
0.9
−
0.9
−
4.5
1.35
2.3
−
1.35
−
1.35
−
5.5
1.65
2.9
−
1.65
−
1.65
−
3.0
4.5
5.5
0.30
0.40
0.50
0.57
0.67
0.74
1.20
1.40
1.60
0.30
0.40
0.50
1.20
1.40
1.60
0.30
0.40
0.50
1.20
1.40
1.60
V
2.0
3.0
4.5
6.0
1.9
2.9
4.4
5.9
2.0
3.0
4.5
6.0
−
−
−
−
1.9
2.9
4.4
5.9
−
−
−
−
1.9
2.9
4.4
5.9
−
−
−
−
V
4.5
6.0
4.18
5.68
4.31
5.80
−
−
4.13
5.63
−
−
4.08
5.58
−
−
2.0
3.0
4.5
6.0
−
−
−
−
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
−
−
−
−
0.1
0.1
0.1
0.1
−
−
−
−
0.1
0.1
0.1
0.1
4.5
6.0
−
−
0.17
0.18
0.26
0.26
−
−
0.33
0.33
−
−
0.40
0.40
V
V
V
V
IIN
Input Leakage
Current
VIN = 6.0 V or
GND
6.0
−
−
$0.1
−
$1.0
−
$1.0
mA
ICC
Quiescent Supply
Current
VIN = VCC or
GND
6.0
−
−
1.0
−
10
−
40
mA
www.onsemi.com
3
MC74HC1G14
AC ELECTRICAL CHARACTERISTICS
−40°C ≤ TA ≤ 85°C
TA = 255C
Symbol
Parameter
Test Conditions
Min
Typ
VCC = 5.0 V CL = 15 pF
−
VCC = 2.0 V CL = 50 pF
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
−
−
−
−
VCC = 5.0 V CL = 15 pF
−
VCC = 2.0 V CL = 50 pF
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
−
−
−
−
−
5
tPLH,
tPHL
Propagation Delay,
Input A or B to Y
tTLH,
tTHL
Output Transition
Time
CIN
Input Capacitance
CPD
Power Dissipation Capacitance (Note 4)
Max
Min
3.5
15
19
10.5
7.5
6.5
100
27
20
17
3
10
25
16
11
9
125
35
25
21
10
−55°C ≤ TA ≤ 125°C
Max
Min
Max
Unit
−
20
−
−
−
−
125
35
25
21
−
25
ns
−
−
−
−
155
90
35
26
−
15
−
20
−
−
−
−
155
45
31
26
−
−
−
−
200
60
38
32
−
10
−
10
ns
pF
Typical @ 255C, VCC = 5.0 V
10
pF
4. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
www.onsemi.com
4
MC74HC1G14
OPEN
VCC
Test
Switch
Position
tPLH / tPHL
Open
tTLH / tTHL
(Note 5)
Open
tPLZ / tPZL
VCC
1k
tPHZ / tPZH
GND
1k
GND
RL
DUT
OUTPUT
RT
RL, W
CL, pF
X
X
See AC Characteristics
Table
X − Don’t Care
CL*
*CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
Figure 3. Test Circuit
tr = 6 ns
tf = 6 ns
90%
90%
VCC
INPUT
Vmi
Vmi
Vmi
Vmi
INPUT
VCC
GND
10%
10%
tPHL
OUTPUT
tPLH
tTLH
VH
VH
VL
VL
tPLH
VH
OUTPUT
VOH
OUTPUT
tPLZ
VOL + VY
VOL
Vmo
tPZH
VOH
VH
~ VCC
Vmo
VOL
tPHL
tTLH
tPZL
Vmo
Vmo
tTHL
GND
OUTPUT
tPHZ
VOH
VOH - VY
Vmo
Vmo
VL
VL
tTHL
~0 V
VOL
Figure 4. Switching Waveforms
Vmo, V
VCC, V
Vmi, V
tPLH, tPHL
tPZL, tPLZ, tPZH, tPHZ
VL, V
VH, V
VY, V
3.0 to 3.6
VCC/2
VCC/2
VCC/2
VOL + 0.1 (VOH − VOL)
VOL + 0.9 (VOH − VOL)
0.3
4.5 to 5.5
VCC/2
VCC/2
VCC/2
VOL + 0.1 (VOH − VOL)
VOL + 0.9 (VOH − VOL)
0.3
5. tTLH and tTHL are measured from 10% to 90% of (VOH − VOL), and 90% to 10% of (VOH − VOL), respectively.
www.onsemi.com
5
MC74HC1G14
ORDERING INFORMATION
Packages
Specific Device
Code
Pin 1 Orientation
(See below)
Shipping†
MC74HC1G14DFT1G
SC−88A
HA
Q2
3000 / Tape & Reel
MC74HC1G14DFT1G−F22038**
SC−88A
HA
Q2
3000 / Tape & Reel
NLVHC1G14DFT1G*
SC−88A
HA
Q2
3000 / Tape & Reel
MC74HC1G14DFT2G
SC−88A
HA
Q4
3000 / Tape & Reel
MC74HC1G14DFT2G−L22038**
SC−88A
HA
Q4
3000 / Tape & Reel
NLVHC1G14DFT2G*
SC−88A
HA
Q4
3000 / Tape & Reel
MC74HC1G14DTT1G**
TSOP−5
HA
Q4
3000 / Tape & Reel
NLV74HC1G14DTT1G*
TSOP−5
HA
Q4
3000 / Tape & Reel
MC74HC1G14DBVT1G
SC−74A
HA
Q4
3000 / Tape & Reel
Device
†For complete information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
**Please refer to NLV specifications for this device.
Pin 1 Orientation in Tape and Reel
www.onsemi.com
6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
SCALE 2:1
5X
DATE 18 JAN 2018
b
0.20 C A B
E1
5
M
4
1
2
E
3
B
0.05
A1
e
D
A
L
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM
A
A1
b
c
D
E
E1
e
L
M
TOP VIEW
A
SIDE VIEW
DETAIL A
C
c
SEATING
PLANE
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
MILLIMETERS
MIN
MAX
0.90
1.10
0.01
0.10
0.25
0.50
0.10
0.26
2.85
3.15
2.50
3.00
1.35
1.65
0.95 BSC
0.20
0.60
0_
10 _
GENERIC
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
G
2.40
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
5X
1.00
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
SCALE 2:1
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DATE 17 JAN 2013
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
GENERIC MARKING
DIAGRAM*
C
K
H
XXXMG
G
SOLDER FOOTPRINT
0.50
0.0197
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
mm Ǔ
ǒinches
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE N
5
1
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
NOTE 5
2X
DATE 12 AUG 2020
0.20 C A B
0.10 T
M
2X
0.20 T
5
B
1
4
2
B
S
3
K
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
C
SIDE VIEW
SEATING
PLANE
END VIEW
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
0.95
0.037
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
1.9
0.074
5
5
XXXAYWG
G
1
1
Analog
2.4
0.094
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
1.0
0.039
XXX MG
G
Discrete/Logic
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98ARB18753C
TSOP−5
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
工商网监
湘ICP备2023018690号
