MC74HC251ADTR2G

8-Input Data Selector/ Multiplexer with 3-State Outputs High−Performance Silicon−Gate CMOS MC74HC251A The MC54/74HC251 is identical in pinout to the LS251. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device selects one of the eight binary Data Inputs, as determined by the Address Inputs. The Output Enable pin must be a low level for the selected data to appear at the outputs. If Output Enable is high, both the Y and the Y outputs are in the high−impedance state. This 3−state feature allows the HC251 to be used in bus−oriented systems. The HC251 is similar in function to the HC251 which does not have 3−state outputs. Features • • • • • • • Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2 to 6 V Low Input Current: 1 mA High Noise Immunity Characteristic of CMOS Devices NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant www.onsemi.com 16 MARKING DIAGRAMS SOIC−16 D SUFFIX CASE 751B 16 1 HC251AG AWLYWW 1 16 TSSOP−16 DT SUFFIX CASE 948F 16 HC 251A ALYWG G 1 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) PIN ASSIGNMENT D3 1 16 VCC D2 2 15 D4 D1 3 14 D5 D0 4 13 D6 Y 5 12 D7 Y OUTPUT ENABLE GND 6 11 A0 7 10 A1 8 9 A2 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2010 January, 2020 − Rev. 1 1 Publication Order Number: MC74HC251A/D MC74HC251A DATA INPUTS D0 4 D1 3 D2 2 D3 1 FUNCTION TABLE Inputs 5 Y DATA OUTPUTS D4 15 D5 14 6 Y D6 13 D7 12 ADDRESS INPUTS A0 11 10 A1 A2 9 OUTPUT ENABLE Outputs A2 A1 A0 Output Enabled X L L L L H H H H X L L H H L L H H X L H L H L H L H H L L L L L L L L Y Y Z D0 D1 D2 D3 D4 D5 D6 D7 Z D0 D1 D2 D3 D4 D5 D6 D7 Z = high impedance D0, D1, …, D7 = the level of the respective D input. 7 PIN 16 = VCC PIN 8 = GND Figure 1. Logic Diagram MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) −0.5 to + 7.0 V Vin DC Input Voltage (Referenced to GND) −1.5 to VCC + 1.5 V Vout DC Output Voltage (Referenced to GND) −0.5 to VCC + 0.5 V Iin DC Input Current, per Pin ±25 mA Iout DC Output Current, per Pin ±50 mA ICC DC Supply Current, VCC and GND Pins ±75 mA PD Power Dissipation in Still Air 500 TBD mW Tstg Storage Temperature −65 to + 150 °C SOIC Package TSSOP Package Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figure 2) VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Min Max Unit 2.0 6.0 V 0 VCC V −55 +125 °C 0 0 0 1000 500 400 ns Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2 This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. MC74HC251A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) Guaranteed Limit Symbol Parameter Test Conditions VCC V − 55 to 25°C v 85°C v 125°C Unit VIH Minimum High−Level Input Voltage Vout = 0.1 V or VCC − 0.1 V |Iout| v 20 mA 2.0 4.5 6.0 1.5 3.15 4.2 1.5 3.15 4.2 1.5 3.15 4.2 V VIL Maximum Low−Level Input Voltage Vout = 0.1 V or VCC − 0.1 V |Iout| v 20 mA 2.0 4.5 6.0 0.3 0.9 1.2 0.3 0.9 1.2 0.3 0.9 1.2 V VOH Minimum High−Level Output Voltage Vin = VIH or VIL |Iout| v 20 mA 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V 4.5 6.0 3.98 5.48 3.84 5.34 3.70 5.20 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 4.5 6.0 0.26 0.26 0.33 0.33 0.40 0.40 Vin = VIH or VIL VOL Maximum Low−Level Output Voltage |Iout| v 4.0 mA |Iout| v 5.2 mA Vin = VIH or VIL |Iout| v 20 mA Vin = VIH or VIL |Iout| v 4.0 mA |Iout| v 5.2 mA V Iin Maximum Input Leakage Current Vin = VCC or GND 6.0 ± 0.1 ± 1.0 ± 1.0 mA IOZ Maximum Three−State Leakage Current Output in High−Impedance State Vin = VIL or VIH Vout = VCC or GND 6.0 ± 0.5 ± 5.0 ± 10 mA ICC Maximum Quiescent Supply Current (per Package) Vin = VCC or GND Iout = 0 mA 6.0 8 80 160 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 MC74HC251A AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) Guaranteed Limit Parameter Symbol VCC V − 55 to 25°C v 85°C v 125°C Unit tPLH, tPHL Maximum Propagation Delay, Input D to Output Y or Y (Figures 2, 3 and 6) 2.0 4.5 6.0 185 37 31 230 46 39 280 56 48 ns tPLH, tPHL Maximum Propagation Delay, Input A to Output Y or Y (Figures 3 and 6) 2.0 4.5 6.0 205 41 35 255 51 43 310 62 53 ns tPLZ, tPHZ Maximum Propagation Delay, Output Enable to Output Y (Figures 5 and 7) 2.0 4.5 6.0 195 39 33 245 49 42 295 59 50 ns tPZL, tPZH Maximum Propagation Delay, Output Enable to Output Y (Figures 5 and 7) 2.0 4.5 6.0 145 29 25 180 36 31 220 44 38 ns tPLZ, tPHZ Maximum Propagation Delay, Output Enable to Output Y (Figures 5 and 7) 2.0 4.5 6.0 220 44 37 275 55 47 330 66 56 ns tPZL, tPZH Maximum Propagation Delay, Output Enable to Output Y (Figures 5 and 7) 2.0 4.5 6.0 150 30 26 190 38 33 225 45 38 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 2 and 6) 2.0 4.5 6.0 75 15 13 95 19 16 110 22 19 ns Cin Maximum Input Capacitance − 10 10 10 pF Cout Maximum Three−State Output Capacitance (Output in High−Impedance State) − 15 15 15 pF Typical @ 25°C, VCC = 5.0 V CPD 36 Power Dissipation Capacitance (Per Package) pF PIN DESCRIPTIONS INPUTS Output Enable (Pin 7) D0, D1, …, D7 (Pins 4, 3, 2, 1, 15, 14, 13, 12) Output Enable. This input pin must be at a low level for the selected data to appear at the outputs. If the Output Enable pin is high, both the Y and Y outputs are taken to the high−impedance state. Data inputs. Data on one of these eight binary inputs may be selected to appear on the output. CONTROL INPUTS OUTPUTS A0, A1, A2 (Pins 11, 10, 9) Y, Y (Pins 5, 6) Address inputs. The data on these pins are the binary address of the selected input (see the Function Table). Data outputs. The selected data is presented at these pins in both true (Y output) and complemented (Y output) forms. www.onsemi.com 4 MC74HC251A SWITCHING WAVEFORMS tr tf INPUT D tr VCC 90% 50% 10% tPHL tPLH 90% 50% 10% OUTPUT Y tTHL tTLH GND tPHL 90% 50% 10% OUTPUT Y VCC 90% 50% 10% INPUT D GND tPLH tf tTLH tTHL Figure 2. Figure 3. VCC VALID OUTPUT ENABLE VALID VCC INPUT A OUTPUT Y OR Y GND tPZL 50% GND tPLH 50% Y OR Y tPHL tPLZ 50% tPZH tPHZ 50% Y OR Y HIGH IMPEDANCE 10% VOL 90% VOH 50% Figure 4. HIGH IMPEDANCE Figure 5. TEST CIRCUITS TEST POINT TEST POINT OUTPUT DEVICE UNDER TEST OUTPUT DEVICE UNDER TEST CL* *Includes all probe and jig capacitance 1 kW CL* CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH. *Includes all probe and jig capacitance Figure 6. Figure 7. www.onsemi.com 5 MC74HC251A 4 D0 3 D1 D2 2 D3 1 DATA INPUTS 5 Y D4 15 6 Y D5 14 DATA OUTPUTS D6 13 D7 12 A 11 B 10 9 C OUTPUT 7 ENABLE Figure 8. Expanded Logic Diagram ORDERING INFORMATION Device Package MC74HC251ADG MC74HC251ADR2G 48 Units / Rail SOIC−16 (Pb−Free) NLV74HC251ADR2G* MC74HC251ADTG MC74HC251ADTR2G Shipping† 2500 Tape & Reel 2500 Tape & Reel TSSOP−16 (Pb−Free) 96 Units / Rail 2500 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. www.onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−16 CASE 751B−05 ISSUE K DATE 29 DEC 2006 SCALE 1:1 −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 16 PL 0.25 (0.010) M T B S A S STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. COLLECTOR BASE EMITTER NO CONNECTION EMITTER BASE COLLECTOR COLLECTOR BASE EMITTER NO CONNECTION EMITTER BASE COLLECTOR EMITTER COLLECTOR STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. CATHODE ANODE NO CONNECTION CATHODE CATHODE NO CONNECTION ANODE CATHODE CATHODE ANODE NO CONNECTION CATHODE CATHODE NO CONNECTION ANODE CATHODE STYLE 3: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. COLLECTOR, DYE #1 BASE, #1 EMITTER, #1 COLLECTOR, #1 COLLECTOR, #2 BASE, #2 EMITTER, #2 COLLECTOR, #2 COLLECTOR, #3 BASE, #3 EMITTER, #3 COLLECTOR, #3 COLLECTOR, #4 BASE, #4 EMITTER, #4 COLLECTOR, #4 STYLE 4: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. STYLE 5: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. DRAIN, DYE #1 DRAIN, #1 DRAIN, #2 DRAIN, #2 DRAIN, #3 DRAIN, #3 DRAIN, #4 DRAIN, #4 GATE, #4 SOURCE, #4 GATE, #3 SOURCE, #3 GATE, #2 SOURCE, #2 GATE, #1 SOURCE, #1 STYLE 6: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE STYLE 7: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. SOURCE N‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) GATE P‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) SOURCE P‐CH SOURCE P‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) GATE N‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) SOURCE N‐CH COLLECTOR, DYE #1 COLLECTOR, #1 COLLECTOR, #2 COLLECTOR, #2 COLLECTOR, #3 COLLECTOR, #3 COLLECTOR, #4 COLLECTOR, #4 BASE, #4 EMITTER, #4 BASE, #3 EMITTER, #3 BASE, #2 EMITTER, #2 BASE, #1 EMITTER, #1 SOLDERING FOOTPRINT 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: DESCRIPTION: 98ASB42566B SOIC−16 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−16 CASE 948F−01 ISSUE B 16 DATE 19 OCT 2006 1 SCALE 2:1 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S K S ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. N 8 1 0.25 (0.010) M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT 7.06 16 XXXX XXXX ALYW 1 1 0.65 PITCH 16X 0.36 DOCUMENT NUMBER: DESCRIPTION: 16X 1.26 98ASH70247A TSSOP−16 DIMENSIONS: MILLIMETERS XXXX A L Y W G or G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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