MC74HC4066A
Quad Analog Switch/
Multiplexer/Demultiplexer
High−Performance Silicon−Gate CMOS
The MC74HC4066A utilizes silicon−gate CMOS technology to
achieve fast propagation delays, low ON resistances, and low
O F F −c h a n n e l l e a k a g e c u r r e n t . T h i s b i l a t e r a l s w i t c h /
multiplexer/demultiplexer controls analog and digital voltages that
may vary across the full power−supply range (from VCC to GND).
The HC4066A is identical in pinout to the metal−gate CMOS
MC14016 and MC14066. Each device has four independent switches.
The device has been designed so the ON resistances (RON) are more
linear over input voltage than RON of metal−gate CMOS analog
switches.
The ON/OFF control inputs are compatible with standard CMOS
outputs; with pullup resistors, they are compatible with LSTTL outputs.
For analog switches with voltage−level translators, see the HC4316A.
•
•
•
•
Fast Switching and Propagation Speeds
High ON/OFF Output Voltage Ratio
Low Crosstalk Between Switches
Diode Protection on All Inputs/Outputs
Wide Power−Supply Voltage Range (VCC − GND) = 2.0 to 12.0 V
Analog Input Voltage Range (VCC − GND) = 2.0 to 12.0 V
Improved Linearity and Lower ON Resistance over Input Voltage
than the MC14016 or MC14066
Low Noise
Chip Complexity: 44 FETs or 11 Equivalent Gates
These Devices are Pb−Free, Halogen Free and are RoHS Compliant
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
© Semiconductor Components Industries, LLC, 2014
March, 2014 − Rev. 12
MARKING
DIAGRAMS
14
SOIC−14
D SUFFIX
CASE 751A
14
1
1
HC4066AG
AWLYWW
1
14
14
1
Features
•
•
•
•
•
•
•
http://onsemi.com
HC
4066A
ALYWG
G
TSSOP−14
DT SUFFIX
CASE 948G
1
A
WL, L
Y
WW, W
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Publication Order Number:
MC74HC4066A/D
MC74HC4066A
PIN ASSIGNMENT
LOGIC DIAGRAM
XA
1
14
VCC
YA
2
13
A ON/OFF CONTROL
YB
3
12
D ON/OFF CONTROL
XB
4
11
XD
B ON/OFF CONTROL
5
10
YD
C ON/OFF CONTROL
6
9
YC
B ON/OFF CONTROL
GND
7
8
XC
XC
XA
A ON/OFF CONTROL
XB
C ON/OFF CONTROL
XD
FUNCTION TABLE
On/Off Control
Input
State of
Analog Switch
L
H
Off
On
D ON/OFF CONTROL
1
2
YA
13
4
3
YB
5
8
9
YC
ANALOG
OUTPUTS/INPUTS
6
11
10
YD
12
ANALOG INPUTS/OUTPUTS = XA, XB, XC, XD
PIN 14 = VCC
PIN 7 = GND
ORDERING INFORMATION
Package
Shipping†
MC74HC4066ADG
SOIC−14
(Pb−Free)
55 Units / Rail
MC74HC4066ADR2G
SOIC−14
(Pb−Free)
2500 / Tape & Reel
TSSOP−14
(Pb−Free)
2500 / Tape & Reel
Device
NLV74HC4066ADR2G*
MC74HC4066ADTR2G
NLVHC4066ADTR2G*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
http://onsemi.com
2
MC74HC4066A
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MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
Positive DC Supply Voltage (Referenced to GND)
– 0.5 to + 14.0
V
VIS
Analog Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Vin
Digital Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
± 25
mA
500
450
mW
– 65 to + 150
°C
I
DC Current Into or Out of Any Pin
PD
Power Dissipation in Still Air,
SOIC Package†
TSSOP Package†
Tstg
Storage Temperature
TL
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC or TSSOP Package)
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
I/O pins must be connected to a
properly terminated line or bus.
°C
260
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of
these limits are exceeded, device functionality should not be assumed, damage may occur and
reliability may be affected.
†Derating − SOIC Package: – 7 mW/°C from 65° to 125°C
TSSOP Package: − 6.1 mW/°C from 65° to 125°C
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RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
Positive DC Supply Voltage (Referenced to GND)
2.0
12.0
V
VIS
Analog Input Voltage (Referenced to GND)
GND
VCC
V
Vin
Digital Input Voltage (Referenced to GND)
GND
VCC
V
VIO*
Static or Dynamic Voltage Across Switch
−
1.2
V
–55
+ 125
°C
0
0
0
0
0
1000
600
500
400
250
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time, ON/OFF Control
Inputs (Figure 10)
ns
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 9.0 V
VCC = 12.0 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
*For voltage drops across the switch greater than 1.2 V (switch on), excessive VCC current may be drawn; i.e., the current out of the switch may
contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded.
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DC ELECTRICAL CHARACTERISTIC Digital Section (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
VCC
V
– 55 to
25°C
v 85°C
v 125°C
Unit
VIH
Minimum High−Level Voltage
ON/OFF Control Inputs
Ron = Per Spec
2.0
3.0
4.5
9.0
12.0
1.5
2.1
3.15
6.3
8.4
1.5
2.1
3.15
6.3
8.4
1.5
2.1
3.15
6.3
8.4
V
VIL
Maximum Low−Level Voltage
ON/OFF Control Inputs
Ron = Per Spec
2.0
3.0
4.5
9.0
12.0
0.5
0.9
1.35
2.7
3.6
0.5
0.9
1.35
2.7
3.6
0.5
0.9
1.35
2.7
3.6
V
Iin
Maximum Input Leakage Current
ON/OFF Control Inputs
Vin = VCC or GND
12.0
± 0.1
± 1.0
± 1.0
A
ICC
Maximum Quiescent Supply Current
(per Package)
Vin = VCC or GND
VIO = 0 V
6.0
12.0
2
4
20
40
40
160
A
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3
MC74HC4066A
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DC ELECTRICAL CHARACTERISTICS Analog Section (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Ron
Parameter
VCC
V
– 55 to
25°C
v 85°C
v 125°C
Unit
Vin = VIH
VIS = VCC to GND
IS v 2.0 mA (Figures 1, 2)
2.0†
3.0†
4.5
9.0
12.0
−
−
120
70
70
−
−
160
85
85
−
−
200
100
100
Vin = VIH
VIS = VCC or GND
(Endpoints)
IS v 2.0 mA (Figures 1, 2)
2.0
3.0
4.5
9.0
12.0
−
−
70
50
50
−
−
85
60
60
−
−
120
80
80
Test Conditions
Maximum “ON” Resistance
Ron
Maximum Difference in “ON”
Resistance Between Any Two
Channels in the Same Package
Vin = VIH
VIS = 1/2 (VCC − GND)
IS v 2.0 mA
2.0
4.5
9.0
12.0
−
20
15
15
−
25
20
20
−
30
25
25
Ioff
Maximum Off−Channel Leakage
Current, Any One Channel
Vin = VIL
VIO = VCC or GND
Switch Off (Figure 3)
12.0
0.1
0.5
1.0
A
Ion
Maximum On−Channel Leakage
Current, Any One Channel
Vin = VIH
VIS = VCC or GND
(Figure 4)
12.0
0.1
0.5
1.0
A
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
†At supply voltage (VCC) approaching 3 V the analog switch−on resistance becomes extremely non−linear. Therefore, for low−voltage
operation, it is recommended that these devices only be used to control digital signals.
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AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, ON/OFF Control Inputs: tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
VCC
V
– 55 to
25°C
v 85°C
v 125°C
Unit
tPLH,
tPHL
Maximum Propagation Delay, Analog Input to Analog Output
(Figures 8 and 9)
2.0
3.0
4.5
9.0
12.0
40
30
10
10
10
50
40
13
13
13
60
50
15
15
15
ns
tPLZ,
tPHZ
Maximum Propagation Delay, ON/OFF Control to Analog Output
(Figures 10 and 11)
2.0
3.0
4.5
9.0
12.0
80
60
30
25
25
90
70
38
28
28
110
80
45
30
30
ns
tPZL,
tPZH
Maximum Propagation Delay, ON/OFF Control to Analog Output
(Figures 10 and 1 1)
2.0
3.0
4.5
9.0
12.0
80
45
25
25
25
90
50
32
32
32
100
60
37
37
37
ns
ON/OFF Control Input
−
10
10
10
pF
Control Input = GND
Analog I/O
Feedthrough
−
−
35
1.0
35
1.0
35
1.0
C
Maximum Capacitance
Typical @ 25°C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Per Switch) (Figure 13)*
* Used to determine the no−load dynamic power consumption: P D = CPD VCC2 f + ICC VCC .
http://onsemi.com
4
15
pF
MC74HC4066A
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)
VCC
V
Limit*
25°C
54/74HC
Symbol
Parameter
Test Conditions
BW
Maximum On−Channel Bandwidth or
Minimum Frequency Response
(Figure 5)
fin = 1 MHz Sine Wave
Adjust fin Voltage to Obtain 0 dBm at VOS
Increase fin Frequency Until dB Meter Reads – 3 dB
RL = 50 , CL = 10 pF
4.5
9.0
12.0
150
160
160
MHz
Off−Channel Feedthrough Isolation
(Figure 6)
fin Sine Wave
Adjust fin Voltage to Obtain 0 dBm at VIS
fin = 10 kHz, RL = 600 , CL = 50 pF
4.5
9.0
12.0
− 50
− 50
− 50
dB
fin = 1.0 MHz, RL = 50 , CL = 10 pF
4.5
9.0
12.0
− 40
− 40
− 40
Vin v 1 MHz Square Wave (tr = tf = 6 ns)
Adjust RL at Setup so that IS = 0 A
RL = 600 , CL = 50 pF
4.5
9.0
12.0
60
130
200
RL = 10 k, CL = 10 pF
4.5
9.0
12.0
30
65
100
fin Sine Wave
Adjust fin Voltage to Obtain 0 dBm at VIS
fin = 10 kHz, RL = 600 , CL = 50 pF
4.5
9.0
12.0
– 70
– 70
– 70
fin = 1.0 MHz, RL = 50 , CL = 10 pF
4.5
9.0
12.0
– 80
– 80
– 80
−
−
−
THD
Feedthrough Noise, Control to
Switch
(Figure 7)
Crosstalk Between Any Two
Switches
(Figure 12)
Total Harmonic Distortion
(Figure 14)
fin = 1 kHz, RL = 10 k, CL = 50 pF
THD = THDMeasured − THDSource
VIS = 4.0 VPP sine wave
VIS = 8.0 VPP sine wave
VIS = 11.0 VPP sine wave
*Guaranteed limits not tested. Determined by design and verified by qualification.
http://onsemi.com
5
Unit
mVPP
dB
%
4.5
9.0
12.0
0.10
0.06
0.04
MC74HC4066A
400
350
RON @ 2 V
300
250
200
150
+25 °C
+125°C
−55°C
100
50
0
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
2.00
Vis, INPUT VOLTAGE (VOLTS), REFERENCED TO GROUND
Figure 1a. Typical On Resistance, VCC = 2.0 V
200
180
RON @ 3 V
160
140
120
100
80
60
+25 °C
+125°C
−55°C
40
20
0
0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 2.20 2.40 2.60 2.80 3.00
Vis, INPUT VOLTAGE (VOLTS), REFERENCED TO GROUND
Figure 1b. Typical On Resistance, VCC = 3.0 V
200
180
RON @ 4.5 V
160
140
+25 °C
+125°C
−55°C
120
100
80
60
40
20
0
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
Vis, INPUT VOLTAGE (VOLTS), REFERENCED TO GROUND
Figure 1c. Typical On Resistance, VCC = 4.5 V
http://onsemi.com
6
4.00
4.50
MC74HC4066A
90
80
RON @ 6 V
70
60
50
40
30
+25 °C
+125°C
−55°C
20
10
0
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
4.00
4.50
5.00
5.50
6.00
Vis, INPUT VOLTAGE (VOLTS), REFERENCED TO GROUND
Figure 1d. Typical On Resistance, VCC = 6.0 V
90
+25 °C
+125°C
−55°C
80
RON @ 9V
70
60
50
40
30
20
10
0
0.00
1.00
2.00
3.00
4.00
5.00
6.00
7.00
8.00
9.00
Vis, INPUT VOLTAGE (VOLTS), REFERENCED TO GROUND
Figure 1e. Typical On Resistance, VCC = 9.0 V
60
RON @ 12 V
50
40
30
20
+25 °C
+125°C
−55°C
10
0
0.00
1.00
2.00
3.00
4.00
5.00
6.00
7.00
8.00
9.00
10.00
Vis, INPUT VOLTAGE (VOLTS), REFERENCED TO GROUND
Figure 1f. Typical On Resistance, VCC = 12.0 V
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7
11.00
12.00
MC74HC4066A
PLOTTER
PROGRAMMABLE
POWER
SUPPLY
-
MINI COMPUTER
+
DC ANALYZER
VCC
DEVICE
UNDER TEST
ANALOG IN
COMMON OUT
GND
Figure 2. On Resistance Test Set−Up
VCC
VCC
VCC
VCC
14
GND
14
A
VCC
A
OFF
7
SELECTED
CONTROL
INPUT
N/C
ON
GND
VIL
7
Figure 3. Maximum Off Channel Leakage Current,
Any One Channel, Test Set−Up
SELECTED
CONTROL
INPUT
VIH
Figure 4. Maximum On Channel Leakage Current,
Test Set−Up
http://onsemi.com
8
MC74HC4066A
VOS
VCC
VCC
VIS
14
fin
14
ON
0.1F
CL*
7
VOS
SELECTED
CONTROL
INPUT
fin
dB
METER
OFF
0.1F
CL*
RL
dB
METER
SELECTED
CONTROL
INPUT
VCC
7
*Includes all probe and jig capacitance.
*Includes all probe and jig capacitance.
Figure 5. Maximum On−Channel Bandwidth
Test Set−Up
VCC
VCC/2
Figure 6. Off−Channel Feedthrough Isolation,
Test Set−Up
VCC/2
14
RL
RL
OFF/ON
VOS
IS
VCC
CL*
VCC
GND
Vin ≤ 1 MHz
tr = tf = 6 ns
7
ANALOG IN
SELECTED
CONTROL
INPUT
50%
GND
tPLH
CONTROL
ANALOG OUT
tPHL
50%
*Includes all probe and jig capacitance.
Figure 7. Feedthrough Noise, ON/OFF Control to
Analog Out, Test Set−Up
Figure 8. Propagation Delays, Analog In to
Analog Out
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9
MC74HC4066A
VCC
tr
tf
14
ANALOG IN
ANALOG OUT
ON
TEST
POINT
VCC
90%
50%
10%
CONTROL
GND
CL*
7
SELECTED
CONTROL
INPUT
tPZL
tPLZ
HIGH
IMPEDANCE
50%
VCC
ANALOG
OUT
tPZH
Figure 9. Propagation Delay Test Set−Up
VOH
HIGH
IMPEDANCE
VIS
VCC
2
POSITIONWHEN
TESTING tPLZ AND tPZL
14
RL
2
VCC
fin
1
0.1 F
TEST
POINT
ON/OFF
VOS
ON
1 k
14
2
90%
tPHZ
Figure 10. Propagation Delay, ON/OFF Control
to Analog Out
1
POSITIONWHEN
TESTING tPHZ AND tPZH
VCC
VOL
50%
*Includes all probe and jig capacitance.
1
10%
OFF
VCC OR GND
CL*
RL
RL
SELECTED
CONTROL
INPUT
SELECTED
CONTROL
INPUT
CL*
VCC/2
RL
CL*
VCC/2
7
7
VCC/2
*Includes all probe and jig capacitance.
*Includes all probe and jig capacitance.
Figure 11. Propagation Delay Test Set−Up
Figure 12. Crosstalk Between Any Two Switches,
Test Set−Up
VCC
A
VIS
VCC
14
N/C
OFF/ON
VOS
0.1 F
N/C
fin
ON
RL
7
CL*
TO
DISTORTION
METER
VCC/2
SELECTED
CONTROL
INPUT
7
SELECTED
CONTROL
INPUT
VCC
ON/OFF CONTROL
*Includes all probe and jig capacitance.
Figure 13. Power Dissipation Capacitance
Test Set−Up
Figure 14. Total Harmonic Distortion, Test Set−Up
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10
MC74HC4066A
0
-10
FUNDAMENTAL FREQUENCY
-20
dBm
-30
-40
-50
DEVICE
-60
SOURCE
-70
-80
-90
1.0
3.0
2.0
FREQUENCY (kHz)
Figure 15. Plot, Harmonic Distortion
APPLICATION INFORMATION
below, the difference between VCC and GND is twelve volts.
Therefore, using the configuration in Figure 16, a maximum
analog signal of twelve volts peak−to−peak can be
controlled.
When voltage transients above VCC and/or below GND
are anticipated on the analog channels, external diodes (Dx)
are recommended as shown in Figure 17. These diodes
should be small signal, fast turn−on types able to absorb the
maximum anticipated current surges during clipping. An
alternate method would be to replace the Dx diodes with
Mosorbs (Mosorb™ is an acronym for high current surge
protectors). Mosorbs are fast turn−on devices ideally suited
for precise DC protection with no inherent wear out
mechanism.
The ON/OFF Control pins should be at VCC or GND logic
levels, VCC being recognized as logic high and GND being
recognized as a logic low. Unused analog inputs/outputs
may be left floating (not connected). However, it is
advisable to tie unused analog inputs and outputs to VCC or
GND through a low value resistor. This minimizes crosstalk
and feedthrough noise that may be picked−up by the unused
I/O pins.
The maximum analog voltage swings are determined by
the supply voltages VCC and GND. The positive peak analog
voltage should not exceed VCC. Similarly, the negative peak
analog voltage should not go below GND. In the example
VCC
VCC = 12 V
+ 12 V
14
ANALOG I/O
ON
ANALOG O/I
Dx
+ 12 V
SELECTED
CONTROL
INPUT
7
16
Dx
ON
0V
0V
VCC
Dx
VCC
OTHER CONTROL
INPUTS
(VCC OR GND)
Dx
SELECTED
CONTROL
INPUT
7
Figure 16. 12 V Application
OTHER CONTROL
INPUTS
(VCC OR GND)
Figure 17. Transient Suppressor Application
http://onsemi.com
11
MC74HC4066A
+5 V
+5 V
14
ANALOG
SIGNALS
R*
R* R* R*
HC4066A
LSTTL/
NMOS
6
HCT
BUFFER
LSTTL/
NMOS
5
14
ANALOG
SIGNALS
HC4066A
5
6
CONTROL
INPUTS
15
14
ANALOG
SIGNALS
ANALOG
SIGNALS
14
CONTROL
INPUTS
15
7
7
R* = 2 TO 10 k
a. Using Pull-Up Resistors
b. Using HCT Buffer
Figure 18. LSTTL/NMOS to HCMOS Interface
VDD = 5 V
13
1
VCC = 5 TO 12 V
16
14
ANALOG
SIGNALS
3
HC4066A
5
7
ANALOG
SIGNALS
MC14504
2
5
9
4
6
11
6
14
CONTROL
INPUTS
10
15
7
14
8
Figure 19. TTL/NMOS−to−CMOS Level Converter
Analog Signal Peak−to−Peak Greater than 5 V
(Also see HC4316A)
CHANNEL 4
1 OF 4
SWITCHES
CHANNEL 3
1 OF 4
SWITCHES
CHANNEL 2
1 OF 4
SWITCHES
CHANNEL 1
1 OF 4
SWITCHES
COMMON I/O
INPUT
1 OF 4
SWITCHES
+
OUTPUT
LF356 OR
EQUIVALENT
0.01 F
1
2
3 4
CONTROL INPUTS
Figure 20. 4−Input Multiplexer
Figure 21. Sample/Hold Amplifier
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12
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE L
14
1
SCALE 1:1
D
DATE 03 FEB 2016
A
B
14
8
A3
E
H
L
1
0.25
B
M
DETAIL A
7
13X
M
b
0.25
M
C A
S
B
S
0.10
X 45 _
M
A1
e
DETAIL A
h
A
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
6.50
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
14
14X
1.18
XXXXXXXXXG
AWLYWW
1
1
1.27
PITCH
XXXXX
A
WL
Y
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOIC−14
CASE 751A−03
ISSUE L
DATE 03 FEB 2016
STYLE 1:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. NO CONNECTION
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. NO CONNECTION
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 2:
CANCELLED
STYLE 3:
PIN 1. NO CONNECTION
2. ANODE
3. ANODE
4. NO CONNECTION
5. ANODE
6. NO CONNECTION
7. ANODE
8. ANODE
9. ANODE
10. NO CONNECTION
11. ANODE
12. ANODE
13. NO CONNECTION
14. COMMON CATHODE
STYLE 4:
PIN 1. NO CONNECTION
2. CATHODE
3. CATHODE
4. NO CONNECTION
5. CATHODE
6. NO CONNECTION
7. CATHODE
8. CATHODE
9. CATHODE
10. NO CONNECTION
11. CATHODE
12. CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 5:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. NO CONNECTION
7. COMMON ANODE
8. COMMON CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 6:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. ANODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
STYLE 7:
PIN 1. ANODE/CATHODE
2. COMMON ANODE
3. COMMON CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. ANODE/CATHODE
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. COMMON CATHODE
12. COMMON ANODE
13. ANODE/CATHODE
14. ANODE/CATHODE
STYLE 8:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. ANODE/CATHODE
7. COMMON ANODE
8. COMMON ANODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. NO CONNECTION
12. ANODE/CATHODE
13. ANODE/CATHODE
14. COMMON CATHODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−14 WB
CASE 948G
ISSUE C
14
DATE 17 FEB 2016
1
SCALE 2:1
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
DETAIL E
K
A
−V−
K1
J J1
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
H
G
D
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
GENERIC
MARKING DIAGRAM*
14
SOLDERING FOOTPRINT
XXXX
XXXX
ALYWG
G
7.06
1
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
98ASH70246A
DESCRIPTION:
TSSOP−14 WB
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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