MC74HCT132ANG

MC74HCT132A Quad 2-Input NAND Gate with Schmitt-Trigger Inputs with LSTTL Compatible Inputs High−Performance Silicon−Gate CMOS The MC74HCT132A is identical in pinout to the LS132. The device inputs are compatible with standard CMOS outputs; with pull−up resistors, they are compatible with LSTTL outputs. The MC74HCT132A can be used to enhance noise immunity or to square up slowly changing waveforms. Features http://onsemi.com MARKING DIAGRAMS 14 PDIP−14 N SUFFIX CASE 646 1 14 SOIC−14 D SUFFIX CASE 751A 1 HCT132AG AWLYWW MC74HCT132AN AWLYYWWG • • • • • • • • Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 mA High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements as Defined by JEDEC Standard No. 7A Chip Complexity: 72 FETs or 18 Equivalent Gates These are Pb−Free Devices A1 B1 Y1 A2 B2 Y2 GND 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC B4 A4 Y4 B3 A3 Y3 14 TSSOP−14 DT SUFFIX CASE 948G 1 14 SOEIAJ−14 F SUFFIX CASE 965 1 A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) 74HCT132A ALYWG HCT 132A ALYWG G Figure 1. Pin Assignment FUNCTION TABLE Inputs A L L H H B L H L H Output Y H H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2009 November, 2009 − Rev. 1 1 Publication Order Number: MC74HCT132A/D MC74HCT132A A1 1 3 Y1 B1 A2 2 4 6 Y2 B2 A3 5 9 8 Y = AB Y3 B3 10 A4 12 11 B4 13 PIN 14 = VCC PIN 7 = GND Y4 Figure 2. Logic Diagram ORDERING INFORMATION Device MC74HCT132ANG MC74HCT132ADG MC74HCT132ADR2G MC74HCT132ADTR2G MC74HCT132AFELG Package PDIP−14 (Pb−Free) SOIC−14 (Pb−Free) SOIC−14 (Pb−Free) TSSOP−14* SOEIAJ−14 (Pb−Free) Shipping† 25 / Tape & Ammo Box 55 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 2000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 2 MC74HCT132A MAXIMUM RATINGS Symbol VCC VIN VOUT IIK IOK IOUT ICC IGND TSTG TL TJ qJA Positive DC Supply Voltage Digital Input Voltage DC Output Voltage Input Diode Current Output Diode Current DC Output Current, per Pin DC Supply Current, VCC and GND Pins DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Thermal Resistance 14−PDIP 14−SOIC 14−TSSOP PDIP SOIC TSSOP Output in 3−State High or Low State Parameter Value *0.5 to )7.0 *0.5 to )7.0 *0.5 to )7.0 *0.5 to VCC )0.5 *20 $20 $25 $75 $75 *65 to )150 260 )150 78 125 170 750 500 450 Level 1 Oxygen Index: 30% − 35% Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) Above VCC and Below GND at 85_C (Note 4) UL 94 V0 @ 0.125 in u2000 u100 u500 $300 V Unit V V V mA mA mA mA mA _C _C _C _C/W PD Power Dissipation in Still Air at 85_C mW MSL FR VESD Moisture Sensitivity Flammability Rating ESD Withstand Voltage ILatch−Up Latch−Up Performance mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Tested to EIA/JESD22−A114−A. 2. Tested to EIA/JESD22−A115−A. 3. Tested to JESD22−C101−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 3) Min 2.0 0 *55 − Max 6.0 VCC )125 No Limit (Note 5) Unit V V _C ns 5. When VIN X 0.5 VCC, ICC >> quiescent current. 6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level. http://onsemi.com 3 MC74HCT132A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol VT+max VT+min VT–max VT–min VHmin (Note 7) VOH Parameter Maximum Positive−Going Input Threshold Voltage Minimum Positive−Going Input Threshold Voltage Maximum Negative−Going Input Threshold Voltage Minimum Negative−Going Input Threshold Voltage Minimum Hysteresis Voltage Minimum High−Level Output Voltage Test Conditions VOUT = 0.1 V |IOUT| v 20 mA VOUT = 0.1 V |IOUT| v 20 mA VOUT = VCC – 0.1 V |IOUT| v 20 mA VOUT = VCC – 0.1 V |IOUT| v 20 mA VOUT = 0.1 V or VCC – 0.1 V |IOUT| v 20 mA VIN v VT−min or VT+max |IOUT| v 20 mA VIN v −VT−min or VT+max |IOUT| v 4.0 mA VOL Maximum Low−Level Output Voltage VIN ≥ VT+max |IOUT| v 20 mA VIN ≥ VT+max IIN ICC Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) VIN = VCC or GND VIN = VCC or GND IOUT = 0 mA |IOUT| v 4.0 mA V 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 4.5 4.5 5.5 4.5 5.5 5.5 1.9 2.1 1.2 1.4 1.2 1.4 0.5 0.6 0.4 0.4 4.4 5.4 3.98 0.1 0.1 0.26 $0.1 1.0 Guaranteed Limit *55_C to 25_C v85_C 1.9 2.1 1.2 1.4 1.2 1.4 0.5 0.6 0.4 0.4 4.4 5.4 3.84 0.1 0.1 0.33 $1.0 10 v125_C 1.9 2.1 1.2 1.4 1.2 1.4 0.5 0.6 0.4 0.4 4.4 5.4 3.7 0.1 0.1 0.4 $1.0 40 mA mA V Unit V V V V V V 7. VHmin u (VT+min) * (VT−max); VHmax = (VT+max) ) (VT−min). AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns, VCC = 5.0 V ± 10%) VCC Symbol tPLH, tPHL tTLH, tTHL Cin Parameter Maximum Propagation Delay, Input A or B to Output Y (Figures 3 and 4) Maximum Output Transition Time, Any Output (Figures 3 and 4) Maximum Input Capacitance V 5.0 5.0 — 25 15 10 Guaranteed Limit *55_C to 25_C v85_C 31 19 10 v125_C 38 22 10 Unit ns ns pF Typical @ 25°C, VCC = 5.0 V CPD Power Dissipation Capacitance (per Gate) (Note 8) 2f 24 + ICC VCC . pF 8. Used to determine the no−load dynamic power consumption: P D = CPD VCC http://onsemi.com 4 MC74HCT132A TEST POINT VCC GND DEVICE UNDER TEST OUTPUT CL * INPUT A OR B (VI) Y tTHL VI = GND to 3.0 V VM = 1.3 V tr 90% VM 10% tPHL 90% VM 10% tf tPLH tTLH *Includes all probe and jig capacitance Figure 3. Switching Waveforms Figure 4. Test Circuit VCC VH VIN VT + VT GND VOH VOUT VOL VCC VOUT (b) A SCHMITT TRIGGER OFFERS MAXIMUM NOISE IMMUNITY VOUT VIN VH VCC VT + VT GND VOH VOL VIN (a) A SCHMITT TRIGGER SQUARES UP INPUTS (a) WITH SLOW RISE AND FALL TIMES Figure 5. Typical Schmitt−Trigger Applications http://onsemi.com 5 MC74HCT132A PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 −−− 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 −−− 10 _ 0.38 1.01 14 8 B 1 7 A F N −T− SEATING PLANE L C H G D 14 PL K M J M DIM A B C D F G H J K L M N 0.13 (0.005) http://onsemi.com 6 MC74HCT132A PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 14 8 −B− P 7 PL 0.25 (0.010) M B M 1 7 G C −T− SEATING PLANE R X 45 _ F D 14 PL 0.25 (0.010) K M M S J TB A S DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 SOLDERING FOOTPRINT* 7X 7.04 1 0.58 14X 14X 1.52 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MC74HCT132A PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE B 14X K REF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 −−− 1.20 −−− 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ 0.10 (0.004) 0.15 (0.006) T U S M TU S V S N 2X L/2 14 8 0.25 (0.010) M L PIN 1 IDENT. 1 7 B −U− N F DETAIL E K K1 J J1 0.15 (0.006) T U S A −V− SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D G H DETAIL E DIM A B C D F G H J J1 K K1 L M SOLDERING FOOTPRINT* 7.06 1 0.36 14X 14X 1.26 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ 0.65 PITCH DIMENSIONS: MILLIMETERS MC74HCT132A PACKAGE DIMENSIONS SOEIAJ−14 CASE 965−01 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). 14 8 LE Q1 E HE M_ L DETAIL P 1 7 Z D e A VIEW P c b 0.13 (0.005) M A1 0.10 (0.004) DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --1.42 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.056 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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