MC74LCX125 Low−Voltage CMOS Quad Buffer
With 5 V−Tolerant Inputs and Outputs (3−State, Non−Inverting)
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The MC74LCX125 is a high performance, non−inverting quad buffer operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX125 inputs to be safely driven from 5.0 V devices. The MC74LCX125 is suitable for memory address driving and all TTL level bus oriented transceiver applications. Current drive capability is 24 mA at the outputs. The Output Enable (OEn) inputs, when HIGH, disable the outputs by placing them in a HIGH Z condition.
Features
MARKING DIAGRAMS
14 14 1 SOIC−14 D SUFFIX CASE 751A 1 LCX125G AWLYWW
• • • • • • • • • • •
Designed for 2.3 to 3.6 V VCC Operation 5.0 V Tolerant − Interface Capability With 5.0 V TTL Logic Supports Live Insertion and Withdrawal IOFF Specification Guarantees High Impedance When VCC = 0 V LVTTL Compatible LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current in all Three Logic States (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA ESD Performance: Human Body Model >2000 V Machine Model >200 V Pb−Free Packages are Available*
14 14 1 TSSOP−14 DT SUFFIX CASE 948G LCX 125 ALYWG G
1
A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G = Pb−Free Package G = Pb−Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2005
1
May, 2005 − Rev. 5
Publication Order Number: MC74LCX125/D
MC74LCX125
VCC 14 OE3 13 D3 12 O3 11 OE2 10 D2 9 O2 8 OE 0 D0 OE 1 D1 1 2 4 5 6 3 OE 2 O0 D2 OE 3 O1 D3 10 9 13 12 11 O3 8 O2
1 OE0
2 D0
3 O0
4 OE1
5 D1
6 O1
7 GND
Figure 1. Pinout: 14−Lead (Top View)
Figure 2. Logic Diagram
PIN NAMES
Pins OEn Dn On Function Output Enable Inputs Data Inputs 3−State Outputs
TRUTH TABLE
INPUTS OEn L L H Dn L H X OUTPUTS On L H Z
H = High Voltage Level L = Low Voltage Level Z = High Impedance State X = High or Low Voltage Level and Transitions Are Acceptable; for ICC reasons, DO NOT FLOAT Inputs
MAXIMUM RATINGS
Symbol VCC VI VO Parameter DC Supply Voltage DC Input Voltage DC Output Voltage Value −0.5 to +7.0 −0.5 ≤ VI ≤ +7.0 −0.5 ≤ VO ≤ +7.0 −0.5 ≤ VO ≤ VCC + 0.5 IIK IOK DC Input Diode Current DC Output Diode Current −50 −50 +50 IO ICC IGND TSTG DC Output Source/Sink Current DC Supply Current Per Supply Pin DC Ground Current Per Ground Pin Storage Temperature Range ±50 ±100 ±100 −65 to +150 Output in 3−State Output in HIGH or LOW State. (Note 1) VI < GND VO < GND VO > VCC Condition Unit V V V V mA mA mA mA mA mA °C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed.
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MC74LCX125
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VI VO IOH Supply Voltage Input Voltage Output Voltage HIGH Level Output Current (HIGH or LOW State) (3−State) VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V −40 0 Parameter Operating Data Retention Only Min 2.0 1.5 0 0 0 Typ 2.5, 3.3 2.5, 3.3 Max 3.6 3.6 5.5 VCC 5.5 − 24 − 12 −8 + 24 + 12 +8 +85 10 Unit V V V mA
IOL
LOW Level Output Current
mA
TA Dt/DV
Operating Free−Air Temperature Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
°C ns/V
DC ELECTRICAL CHARACTERISTICS
TA = −40°C to +85°C Symbol VIH Characteristic HIGH Level Input Voltage (Note 2) g( ) Condition 2.3 V ≤ VCC ≤ 2.7 V 2.7 V ≤ VCC ≤ 3.6 V VIL LOW Level Input Voltage (Note 2) g( ) 2.3 V ≤ VCC ≤ 2.7 V 2.7 V ≤ VCC ≤ 3.6 V VOH HIGH Level Output Voltage g 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA VCC = 2.3 V; IOH = −8 mA VCC = 2.7 V; IOH = −12 mA VCC = 3.0 V; IOH = −18 mA VCC = 3.0 V; IOH = −24 mA VOL LOW Level Output Voltage g 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA VCC = 2.3 V; IOL= 8 mA VCC = 2.7 V; IOL= 12 mA VCC = 3.0 V; IOL = 16 mA VCC = 3.0 V; IOL = 24 mA II ICC DICC Input Leakage Current Quiescent Supply Current y 2.3 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 5.5 V 2.3 ≤ VCC ≤ 3.6 V; VI = GND or VCC 2.3 ≤ VCC ≤ 3.6 V; 3.6 ≤ VI or VO ≤ 5.5 V Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 2. These values of VI are used to test DC electrical characteristics only. VCC − 0.2 1.8 2.2 2.4 2.2 0.2 0.6 0.4 0.4 0.55 ±5 10 ±10 500 mA mA mA V Min 1.7 2.0 0.7 0.8 V V Max Unit V
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MC74LCX125
AC CHARACTERISTICS tR = tF = 2.5 ns; RL = 500 W
Limits TA = −40°C to +85°C VCC = 3.3 V ± 0.3 V CL = 50 pF Symbol tPLH tPHL tPZH tPZL tPHZ tPLZ tOSHL tOSLH Parameter Propagation Delay Time Input to Output Output Enable Time to High and Low Level Output Disable Time From High and Low Level Output−to−Output Skew (Note 3) Waveform 1 2 2 Min 1.5 1.5 1.5 1.5 1.5 1.5 Max 6.0 6.0 7.0 7.0 6.0 6.0 1.0 1.0 VCC = 2.7 V CL = 50 pF Min 1.5 1.5 1.5 1.5 1.5 1.5 Max 6.5 6.5 8.0 8.0 7.0 7.0 VCC = 2.5 V ± 0.2 V CL = 30 pF Min 1.5 1.5 1.5 1.5 1.5 1.5 Max 7.2 7.2 9.1 9.1 7.2 7.2 Unit ns ns ns ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25°C Symbol VOLP VOLV Characteristic Dynamic LOW Peak Voltage (Note 4) Dynamic LOW Valley Voltage (Note 4) Condition VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V Min Typ 0.8 0.6 −0.8 −0.6 Max Unit V V V V
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol CIN COUT CPD Parameter Input Capacitance Output Capacitance Power Dissipation Capacitance Condition VCC = 3.3 V, VI = 0 V or VCC VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 3.3 V, VI = 0 V or VCC Typical 7 8 25 Unit pF pF pF
ORDERING INFORMATION
Device MC74LCX125D MC74LCX125DG MC74LCX125DR2 MC74LCX125DR2G MC74LCX125DT MC74LCX125DTG MC74LCX125DTR2 MC74LCX125DTR2G Package SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) TSSOP−14* TSSOP−14* TSSOP−14* TSSOP−14* Shipping† 55 Units / Rail 55 Units / Rail 2500 Tape & Reel 2500 Tape & Reel 96 Units / Rail 96 Units / Rail 2500 Tape & Reel 2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free.
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MC74LCX125
VCC Dn Vmi Vmi 0V tPLH Vmo tPHL VOH On Vmo VOL WAVEFORM 1 − PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
VCC OEn Vmi Vmi 0V tPZH Vmo ≈0V tPZL tPLZ ≈ 3.0 V tPHZ VCC VOH − 0.3 V On
On
Vmo VOL + 0.3 V GND WAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VCC Symbol Vmi Vmo 3.3 V ± 0.3 V 1.5 V 1.5 V 2.7 V 1.5 V 1.5 V 2.5 V ± 0.2 V VCC/2 VCC/2
Figure 3. AC Waveforms
VCC
PULSE GENERATOR RT
DUT CL RL
CL = CL = RL = RT =
50 pF at VCC = 3.3 0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 W or equivalent ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
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MC74LCX125
PACKAGE DIMENSIONS
SOIC−14 D SUFFIX CASE 751A−03 ISSUE G
−A−
14 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019
−B−
P 7 PL 0.25 (0.010)
M
B
M
1
7
G C
R X 45 _
F
−T−
SEATING PLANE
D 14 PL 0.25 (0.010)
K
M
M
S
J
TB
A
S
DIM A B C D F G J K M P R
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MC74LCX125
PACKAGE DIMENSIONS
TSSOP−14 DT SUFFIX CASE 948G−01 ISSUE A
14X K REF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
N
2X
L/2
14
8
0.25 (0.010) M
L
PIN 1 IDENT. 1 7
B −U−
N F DETAIL E K
0.15 (0.006) T U
S
J J1
C 0.10 (0.004) −T− SEATING
PLANE
D
G
H
DETAIL E
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ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ
A −V−
K1
SECTION N−N −W−
DIM A B C D F G H J J1 K K1 L M
MC74LCX125
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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MC74LCX125/D