MC74LCX244DWR2

MC74LCX244 Low-Voltage CMOS Octal Buffer With 5 V−Tolerant Inputs and Outputs (3−State, Non−Inverting) The MC74LCX244 is a high performance, non−inverting octal buffer operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX244 inputs to be safely driven from 5 V devices. The MC74LCX244 is suitable for memory address driving and all TTL level bus oriented transceiver applications. Current drive capability is 24 mA at the outputs. The Output Enable (OE) input, when HIGH, disables the output by placing them in a HIGH Z condition. http://onsemi.com MARKING DIAGRAMS 20 20 1 • • • LCX244 AWLYYWWG 1 20 Features • • • • • • • • SOIC−20 DW SUFFIX CASE 751D Designed for 2.3 to 3.6 V VCC Operation 5 V Tolerant − Interface Capability With 5 V TTL Logic Supports Live Insertion and Withdrawal IOFF Specification Guarantees High Impedance When VCC = 0 V LVTTL Compatible LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current in All Three Logic States (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA ESD Performance: Human Body Model >2000 V Machine Model >200 V Pb−Free Packages are Available 20 1 LCX 244 ALYW G G TSSOP−20 DT SUFFIX CASE 948E 1 20 20 1 SOEIAJ−20 M SUFFIX CASE 967 1 74LCX244 AWLYWWG 1 QFN20 MN SUFFIX CASE 485AA LCX 244 ALYWG G A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2010 February, 2010 − Rev. 9 1 Publication Order Number: MC74LCX244/D MC74LCX244 VCC 2OE 1O0 2D0 1O1 2D1 1O2 2D2 1O3 2D3 20 19 18 17 16 15 14 13 12 11 1OE 1D0 1D1 1 2 3 4 5 6 7 8 9 10 1OE 1D0 2O0 1D1 2O1 1D2 2O2 1D3 2O3 GND 1D2 1D3 19 1 2 18 4 16 6 14 8 12 1O0 1O1 1O2 1O3 12 11 20 QFN PIN #1 2OE 19 10 2D0 2 9 2D1 17 3 15 5 13 7 11 9 2O0 2O1 Figure 1. Pinouts: 20−Lead (Top View) 2D2 PIN NAMES PINS FUNCTION nOE 1Dn, 2Dn 1On, 2On Output Enable Inputs Data Inputs 3−State Outputs 2D3 2O3 Figure 2. Logic Diagram TRUTH TABLE INPUTS 2O2 OUTPUTS 1OE 2OE 1Dn 2Dn 1On, 2On L L L L H H H X Z H = High Voltage Level L = Low Voltage Level Z = High Impedance State X = High or Low Voltage Level and Transitions are Acceptable For ICC reasons, DO NOT FLOAT Inputs http://onsemi.com 2 MC74LCX244 MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VI VO Value Condition Unit −0.5 to +7.0 V DC Input Voltage −0.5 ≤ VI ≤ +7.0 V DC Output Voltage −0.5 ≤ VO ≤ +7.0 Output in 3−State V −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage Operating Data Retention Only (HIGH or LOW State) (3−State) Min Typ Max Unit 2.0 1.5 2.5, 3.3 2.5, 3.3 3.6 3.6 V 0 5.5 V 0 0 VCC 5.5 V IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V −24 −12 mA IOL LOW Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V 24 12 mA −55 +125 °C 0 10 ns/V TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V http://onsemi.com 3 MC74LCX244 DC ELECTRICAL CHARACTERISTICS TA = −55°C to +125°C Symbol Characteristic VIH HIGH Level Input Voltage (Note 2) VIL LOW Level Input Voltage (Note 2) VOH HIGH Level Output Voltage Condition Min 2.3 V ≤ VCC ≤ 2.7 V 1.7 2.7 V ≤ VCC ≤ 3.6 V 2.0 Max V 2.3 V ≤ VCC ≤ 2.7 V 0.7 2.7 V ≤ VCC ≤ 3.6 V VOL LOW Level Output Voltage Unit V 0.8 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA VCC − 0.2 VCC = 2.3 V; IOH = −8 mA 1.8 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 V 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA 0.2 VCC = 2.3 V; IOL= 8 mA 0.6 VCC = 2.7 V; IOL= 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 V VCC = 3.0 V; IOL = 24 mA 0.55 II Input Leakage Current 2.3 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 5.5 V ±5 mA IOZ 3−State Output Current 2.3 ≤ VCC ≤ 3.6 V; 0 V ≤ VO ≤ 5.5 V; VI = VIH or V IL ±5 mA IOFF Power−Off Leakage Current VCC = 0 V; VI or VO = 5.5 V 10 mA ICC Quiescent Supply Current mA DICC 2.3 ≤ VCC ≤ 3.6 V; VI = GND or VCC 10 2.3 ≤ VCC ≤ 3.6 V; 3.6 ≤ VI or VO ≤ 5.5 V ±10 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 Increase in ICC per Input mA 2. These values of VI are used to test DC electrical characteristics only. AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 W) Limits TA = −55°C to +125°C VCC = 3.0 V to 3.6 V CL = 50 pF Symbol Parameter VCC = 2.7 V CL = 50 pF VCC = 2.5 V +0.2 CL = 30 pF Waveform Min Max Min Max Min Max Unit tPLH tPHL Propagation Delay Input to Output 1 1.5 1.5 6.5 6.5 1.5 1.5 7.5 7.5 1.5 1.5 7.8 7.8 ns tPZH tPZL Output Enable Time to High and Low Level 2 1.5 1.5 8.0 8.0 1.5 1.5 9.0 9.0 1.5 1.5 10 10 ns tPHZ tPLZ Output Disable Time From High and Low Level 2 1.5 1.5 7.0 7.0 1.5 1.5 8.0 8.0 1.5 1.5 8.4 8.4 ns tOSHL tOSLH Output−to−Output Skew (Note 3) 1.0 1.0 ns 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. http://onsemi.com 4 MC74LCX244 DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol Characteristic Condition Min Typ Max Unit VOLP Dynamic LOW Peak Voltage (Note 4) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.8 0.6 V VOLV Dynamic LOW Valley Voltage (Note 4) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.8 −0.6 V 4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF VCC Vmi 1Dn, 2Dn Vmi 0V tPLH tPHL VOH Vmo 1On, 2On Vmo VOL WAVEFORM 1 − PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VCC Vmi 1OE, 2OE Vmi 0V tPZH tPHZ VCC VOH - 0.3 V Vmo 1On, 2On ≈0V tPZL tPLZ ≈ 3.0 V Vmo 1On, 2On VOL + 0.3 V GND WAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. AC Waveforms VCC Symbol 3.3 V ± 0.3 V 2.7 V Vmi 1.5 V 1.5 V VCC/2 Vmo 1.5 V 1.5 V VCC/2 VHZ VOL + 0.3 V VOL + 0.3 V VOL + 0.15 V VLZ VOH − 0.3 V VOH − 0.3 V VOH − 015 V http://onsemi.com 5 2.5 V ± 0.2 V MC74LCX244 VCC PULSE GENERATOR DUT RT CL RL SWITCH TEST tPLH, tPHL Open tPZL, tPLZ 6 V at VCC = 3.3 0.3 V 6 V at VCC = 2.5 0.2 V Open Collector/Drain tPLH and tPHL 6V tPZH, tPHZ CL = CL = RL = RT = 6V OPEN GND R1 GND 50 pF at VCC = 3.3 0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 W or equivalent ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit ORDERING INFORMATION Device Package MC74LCX244DW SOIC−20 MC74LCX244DWG SOIC−20 (Pb−Free) MC74LCX244DWR2 SOIC−20 MC74LCX244DWR2G SOIC−20 (Pb−Free) Shipping† 38 Units / Rail 1000 / Tape & Reel MC74LCX244DT TSSOP−20* MC74LCX244DTG TSSOP−20* MC74LCX244DTR2 TSSOP−20* MC74LCX244DTR2G TSSOP−20* MC74LCX244MELG SOEIAJ−20 (Pb−Free) 2000 / Tape & Reel QFN20 (Pb−Free) 3000 / Tape & Reel MC74LCX244MNTWG 75 Units / Rail 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 6 MC74LCX244 PACKAGE DIMENSIONS SOIC−20 DW SUFFIX CASE 751D−05 ISSUE G A 20 11 X 45 _ E h 1 10 20X B B 0.25 M T A S B S A L H M 10X 0.25 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. q B M D 18X e A1 SEATING PLANE C T http://onsemi.com 7 DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ MC74LCX244 TSSOP−20 CASE 948E−02 ISSUE C 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V K K1 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ S J J1 11 B −U− PIN 1 IDENT SECTION N−N 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C G D H DETAIL E 0.100 (0.004) −T− SEATING DIM A B C D F G H J J1 K K1 L M PLANE SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 1.20 --0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 0.047 --0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74LCX244 PACKAGE DIMENSIONS SOEIAJ−20 CASE 967−01 ISSUE A 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 11 Q1 E HE 1 M_ L 10 DETAIL P Z D e VIEW P A A1 b 0.13 (0.005) c M 0.10 (0.004) http://onsemi.com 9 DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --0.81 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.032 MC74LCX244 PACKAGE DIMENSIONS QFN20 CASE 485AA−01 ISSUE A D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B PIN ONE REFERENCE DIM A A1 A2 A3 b D D2 E E2 e K L E 2X 0.15 C 2X MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.65 0.75 0.20 REF 0.20 0.30 2.50 BSC 0.85 1.15 4.50 BSC 2.85 3.15 0.50 BSC 0.20 --0.35 0.45 0.15 C 0.10 C A2 20X A 0.08 C (A3) SEATING PLANE A1 C D2 20X L 11 9 e 12 e E2 20X b 0.10 C A B 0.05 C NOTE 3 19 2 20X K 1 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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