MC74LCX574
Low-Voltage CMOS
Octal D-Type Flip-Flop
Flow Through Pinout
With 5 V−Tolerant Inputs and Outputs
(3−State, Non−Inverting)
The MC74LCX574 is a high performance, non−inverting octal
D−type flip−flop operating from a 2.3 to 3.6 V supply. High
impedance TTL compatible inputs significantly reduce current
loading to input drivers while TTL compatible outputs offer improved
switching noise performance. A VI specification of 5.5 V allows
MC74LCX574 inputs to be safely driven from 5.0 V devices.
The MC74LCX574 consists of 8 edge−triggered flip−flops with
individual D−type inputs and 3−state true outputs. The buffered clock
and buffered Output Enable (OE) are common to all flip−flops. The
eight flip−flops will store the state of individual D inputs that meet the
setup and hold time requirements on the LOW−to−HIGH Clock (CP)
transition. With the OE LOW, the contents of the eight flip−flops are
available at the outputs. When the OE is HIGH, the outputs go to the
high impedance state. The OE input level does not affect the operation
of the flip−flops. The LCX574 flow through design facilitates easy PC
board layout.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Designed for 2.3 to 3.6 V VCC Operation
5 V Tolerant − Interface Capability With 5 V TTL Logic
Supports Live Insertion and Withdrawal
IOFF Specification Guarantees High Impedance When VCC = 0 V
LVTTL Compatible
LVCMOS Compatible
24mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current in All Three Logic States (10 mA)
Substantially Reduces System Power Requirements
Latchup Performance Exceeds 500 mA
ESD Performance:
♦ Human Body Model >2000 V
♦ Machine Model >200 V
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
© Semiconductor Components Industries, LLC, 2014
December, 2014 − Rev. 10
1
www.onsemi.com
MARKING
DIAGRAMS
20
LCX574
AWLYYWWG
SOIC−20 WB
DW SUFFIX
CASE 751D
1
LCX
574
ALYWG
G
TSSOP−20
DT SUFFIX
CASE 948E
A
L, WL
Y, YY
W, WW
G or G
=
=
=
=
=
Assembly Location
Wafer Lot
Year
Work Week
Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Publication Order Number:
MC74LCX574/D
MC74LCX574
1
OE
CP
11
D0
VCC
O0
O1
O2
O3
O4
O5
O6
O7
CP
20
19
18
17
16
15
14
13
12
11
D
D1
4
5
6
7
8
9
10
OE
D0
D1
D2
D3
D4
D5
D6
D7
GND
D
Function
Output Enable Input
CP
Clock Pulse Input
D0−D7
Data Inputs
O0−O7
3−State Outputs
D4
15
CP
O4
Q
D
14
CP
O5
Q
D
D6
13
CP
8
O6
Q
D
12
CP
9
D7
O3
Q
D
D5
OE
16
CP
7
Pins
O2
Q
6
PIN NAMES
17
CP
D
D3
Figure 1. Pinout: 20−Lead (Top View)
O1
Q
5
3
18
CP
3
D2
2
O0
Q
4
1
19
CP
2
Q
O7
D
Figure 2. Logic Diagram
TRUTH TABLE
INPUTS
H
h
L
l
NC
X
Z
↑
↑
INTERNAL
LATCHES
OUTPUTS
OE
CP
Dn
Q
On
OPERATING MODE
L
L
↑
↑
l
h
L
H
L
H
Load and Read Register
L
↑
X
NC
NC
Hold and Read Register
H
↑
X
NC
Z
Hold and Disable Outputs
H
H
↑
↑
l
h
L
H
Z
Z
Load Internal Register and Disable Outputs
=
=
=
=
=
=
=
=
=
High Voltage Level
High Voltage Level One Setup Time Prior to the Low−to−High Clock Transition
Low Voltage Level
Low Voltage Level One Setup Time Prior to the Low−to−High Clock Transition
No Change
High or Low Voltage Level and Transitions are Acceptable
High Impedance State
Low−to−High Transition
Not a Low−to−High Transition; For ICC Reasons, DO NOT FLOAT Inputs
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2
MC74LCX574
MAXIMUM RATINGS
Symbol
VCC
Parameter
Value
DC Supply Voltage
Condition
Units
−0.5 to +7.0
V
V
VI
DC Input Voltage
−0.5 ≤ VI ≤ +7.0
VO
DC Output Voltage
−0.5 ≤ VO ≤ +7.0
Output in 3−State
V
−0.5 ≤ VO ≤ VCC + 0.5
(Note 1)
V
IIK
DC Input Diode Current
−50
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
+50
VO > VCC
mA
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
±100
mA
−65 to +150
°C
IGND
DC Ground Current Per Ground Pin
TSTG
Storage Temperature Range
MSL
Moisture Sensitivity
Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Output in HIGH or LOW State. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
Operating
Data Retention Only
Min
Typ
Max
2.0
1.5
3.3
3.3
3.6
3.6
Units
V
VI
Input Voltage
0
5.5
VO
Output Voltage
(HIGH or LOW State)
(3−State)
0
0
VCC
5.5
V
V
IOH
HIGH Level Output Current, VCC = 3.0 V − 3.6 V
−24
mA
IOL
LOW Level Output Current, VCC = 3.0 V − 3.6 V
24
mA
IOH
HIGH Level Output Current, VCC = 2.7 V − 3.0 V
−12
mA
IOL
LOW Level Output Current, VCC = 2.7 V − 3.0 V
12
mA
TA
Operating Free−Air Temperature
−55
+125
°C
0
10
ns/V
Dt/DV
Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
MC74LCX574
DC ELECTRICAL CHARACTERISTICS
TA = −55°C to +125°C
Symbol
Characteristic
Condition
Min
2.0
VIH
HIGH Level Input Voltage (Note 2)
2.7 V ≤ VCC ≤ 3.6 V
VIL
LOW Level Input Voltage (Note 2)
2.7 V ≤ VCC ≤ 3.6 V
VOH
HIGH Level Output Voltage
VOL
LOW Level Output Voltage
IOZ
3−State Output Current
IOFF
Power Off Leakage Current
Max
V
0.8
2.7 V ≤ VCC ≤ 3.6 V; IOH = −100 mA
VCC − 0.2
VCC = 2.7 V; IOH = −12 mA
2.2
VCC = 3.0 V; IOH = −18 mA
2.4
VCC = 3.0 V; IOH = −24 mA
2.2
Units
V
V
2.7 V ≤ VCC ≤ 3.6 V; IOL = 100 mA
0.2
VCC = 2.7 V; IOL = 12 mA
0.4
VCC = 3.0 V; IOL = 16 mA
0.4
VCC = 3.0 V; IOL = 24 mA
0.55
VCC = 3.6 V, VIN = VIH or VIL,
VOUT = 0 to 5.5 V
±5
mA
VCC = 0, VIN = 5.5 V or VOUT = 5.5 V
10
mA
V
IIN
Input Leakage Current
VCC = 3.6 V, VIN = 5.5 V or GND
±5
mA
ICC
Quiescent Supply Current
VCC = 3.6 V, VIN = 5.5 V or GND
±10
mA
2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V
500
mA
DICC
Increase in ICC per Input
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. These values of VI are used to test DC electrical characteristics only.
AC CHARACTERISTICS (tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W)
Limits
TA = −55°C to +125°C
VCC = 3.0 V to 3.6 V
Symbol
Parameter
Waveform
Min
Max
VCC = 2.7 V
Min
Max
Units
fmax
Clock Pulse Frequency
1
150
tPLH
tPHL
Propagation Delay
CP to On
1
1.5
1.5
8.5
8.5
1.5
1.5
9.5
9.5
ns
tPZH
tPZL
Output Enable Time to HIGH and LOW Levels
2
1.5
1.5
8.5
8.5
1.5
1.5
9.5
9.5
ns
tPHZ
tPLZ
Output Disable Time from HIGH and LOW
Levels
2
1.5
1.5
6.5
6.5
1.5
1.5
7.0
7.0
ns
ts
Setup TIme, HIGH or LOW Dn to CP
1
2.5
2.5
ns
th
Hold TIme, HIGH or LOW Dn to CP
1
1.5
1.5
ns
tw
CP Pulse Width, HIGH or LOW
3
3.3
3.3
ns
tOSHL
tOSLH
Output−to−Output Skew (Note 3)
MHz
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
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4
MC74LCX574
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25°C
Symbol
Characteristic
Condition
Min
Typ
Max
Units
VOLP
Dynamic LOW Peak Voltage (Note 4)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
0.8
V
VOLV
Dynamic LOW Valley Voltage (Note 4)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
0.8
V
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
CIN
Parameter
Condition
Typical
Units
VCC = 3.3 V, VI = 0 V or VCC
7
pF
VCC = 3.3 V, VI = 0 V or VCC
8
pF
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
25
pF
Input Capacitance
COUT
Output Capacitance
CPD
Power Dissipation Capacitance
2.7 V
2.7 V
1.5 V
1.5 V
OE
Dn
1.5 V
0V
0V
tPZH
th
ts
tPHZ
2.7 V
CP
VOH - 0.3 V
1.5 V
On
1.5 V
VCC
≈0V
0V
fmax
tPLH, tPHL
tPZL
≈ 3.0 V
VOH
On
tPLZ
1.5 V
On
VOL + 0.3 V
1.5 V
GND
VOL
WAVEFORM 2 - OUTPUT ENABLE AND DISABLE TIMES
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
WAVEFORM 1 - PROPAGATION DELAYS, SETUP AND HOLD TIMES
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
2.7 V
CP
1.5 V
1.5 V
tw
0V
2.7 V
tw
CP
1.5 V
1.5 V
0V
WAVEFORM 3 - PULSE WIDTH
tR = tF = 2.5 ns (or fast as required) from 10% to 90%;
Output requirements: VOL ≤ 0.8 V, VOH ≥ 2.0 V
Figure 3. AC Waveforms
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5
MC74LCX574
VCC
R1
PULSE
GENERATOR
DUT
RT
CL
Test
Switch
tPLH, tPHL
Open
tPZL, tPLZ
6V
Open Collector/Drain tPLH and tPHL
6V
tPZH, tPHZ
GND
6V
OPEN
GND
RL
CL = 50 pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 500 W or equivalent
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
ORDERING INFORMATION
Package
Shipping†
MC74LCX574DWR2G
SOIC−20
(Pb−Free)
1000 / Tape & Reel
MC74LCX574DWR2G
SOIC−20
(Pb−Free)
1000 / Tape & Reel
MC74LCX574DTR2G
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
NLV74LCX574DTR2G*
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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6
MC74LCX574
PACKAGE DIMENSIONS
SOIC−20 WB
CASE 751D−05
ISSUE G
q
A
20
X 45 _
h
1
10
20X
B
B
0.25
M
T A
S
B
S
A
L
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
11
B
M
D
18X
e
A1
SEATING
PLANE
C
T
www.onsemi.com
7
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
MC74LCX574
PACKAGE DIMENSIONS
TSSOP−20
CASE 948E−02
ISSUE C
20X
0.15 (0.006) T U
2X
S
L/2
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
K REF
0.10 (0.004)
20
M
T U
S
V
K
K1
S
J J1
11
B
L
SECTION N−N
−U−
PIN 1
IDENT
0.25 (0.010)
N
1
10
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
G
D
0.100 (0.004)
−T− SEATING
H
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SOLDERING FOOTPRINT*
PLANE
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
8
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
--1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
--0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
MC74LCX574
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
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9
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC74LCX574/D
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−20 WB
CASE 751D−05
ISSUE H
DATE 22 APR 2015
SCALE 1:1
A
20
q
X 45 _
M
E
h
0.25
H
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
11
B
M
D
1
10
20X
B
b
0.25
M
T A
S
B
DIM
A
A1
b
c
D
E
e
H
h
L
q
S
L
A
18X
e
SEATING
PLANE
A1
c
T
GENERIC
MARKING DIAGRAM*
RECOMMENDED
SOLDERING FOOTPRINT*
20
20X
20X
1.30
0.52
20
XXXXXXXXXXX
XXXXXXXXXXX
AWLYYWWG
11
1
11.00
1
XXXXX
A
WL
YY
WW
G
10
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
98ASB42343B
SOIC−20 WB
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−20 WB
CASE 948E
ISSUE D
DATE 17 FEB 2016
SCALE 2:1
20X
0.15 (0.006) T U
2X
L
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
K
K1
S
J J1
11
B
SECTION N−N
−U−
PIN 1
IDENT
0.25 (0.010)
N
1
10
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
G
D
H
DETAIL E
0.100 (0.004)
−T− SEATING
PLANE
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
--1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
--0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT
7.06
XXXX
XXXX
ALYWG
G
1
0.65
PITCH
16X
0.36
16X
1.26
DOCUMENT NUMBER:
98ASH70169A
DESCRIPTION:
TSSOP−20 WB
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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