MC74LVX126
Quad Bus Buffer
With 5V−Tolerant Inputs
The MC74LVX126 is an advanced high speed CMOS quad bus
buffer. The inputs tolerate voltages up to 7.0 V, allowing the interface
of 5.0 V systems to 3.0 V systems.
The MC74LVX126 requires the 3−state control input (OE) to be set
Low to place the output into the high impedance state.
http://onsemi.com
MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
•
w
High Speed: tPD = 4.4 ns (Typ) at VCC = 3.3 V
Low Power Dissipation: ICC = 4 mA (Max) at TA = 25°C
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Low Noise: VOLP = 0.5 V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300 mA
ESD Performance:
Human Body Model >2000 V
Machine Model >200 V
14
SOIC−14
D SUFFIX
CASE 751A
14
1
LVX126
AWLYWW
1
14
14
These devices are available in Pb−free package(s). Specifications herein
apply to both standard and Pb−free devices. Please see our website at
www.onsemi.com for specific Pb−free orderable part numbers, or
contact your local ON Semiconductor sales office or representative.
1
LVX
126
ALYW
TSSOP−14
DT SUFFIX
CASE 948G
1
14
74LVX126
ALYW
SOEIAJ−14
M SUFFIX
CASE 965
14
1
1
A
Location
L, WL
Y
W, WW
Week
=
Assembly
=
=
=
Wafer Lot
Year
Work
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 3
1
Publication Order Number:
MC74LVX126/D
MC74LVX126
VCC
OE3
D3
O3
OE2
D2
O2
14
13
12
11
10
9
8
1
OE0
2
D0
1
2
3
4
5
6
7
D0
O0
OE1
D1
O1
GND
3
O0
D2
4
OE1
OE0
OE2
OE3
5
D1
6
Figure 1. 14−Lead Pinout (Top View)
O1
D3
10
9
8
O2
13
12
11
O3
Figure 2. Logic Diagram
PIN NAMES
FUNCTION TABLE
Pins
Function
OEn
Dn
On
Output Enable Inputs
Data Inputs
3−State Outputs
INPUTS
OUTPUTS
OEn
Dn
On
H
H
L
L
H
X
L
H
Z
H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low Voltage Level and Transitions Are
Acceptable, for ICC reasons, DO NOT FLOAT Inputs
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
–0.5 to +7.0
V
VCC
DC Supply Voltage
Vin
DC Input Voltage
–0.5 to +7.0
V
Vout
DC Output Voltage
–0.5 to VCC +0.5
V
IIK
Input Diode Current
−20
mA
IOK
Output Diode Current
±20
mA
Iout
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±50
mA
PD
Power Dissipation
180
mW
Tstg
Storage Temperature
–65 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage
2.0
3.6
V
Vin
DC Input Voltage
0
5.5
V
Vout
DC Output Voltage
0
VCC
V
TA
Operating Temperature, All Package Types
−40
+125
°C
Dt/DV
Input Rise and Fall Time
0
100
ns/V
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2
MC74LVX126
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Test Conditions
TA = 25°C
VCC
V
Min
1.5
2.0
2.4
VIH
High−Level Input Voltage
2.0
3.0
3.6
VIL
Low−Level Input Voltage
2.0
3.0
3.6
VOH
High−Level Output Voltage
(Vin = VIH or VIL)
IOH = −50 mA
IOH = −50 mA
IOH = −4 mA
2.0
3.0
3.0
VOL
Low−Level Output Voltage
(Vin = VIH or VIL)
IOL = 50 mA
IOL = 50 mA
IOL = 4 mA
2.0
3.0
3.0
Iin
Input Leakage Current
Vin = 5.5 V or GND
IOZ
Maximum Three−State
Leakage Current
ICC
Quiescent Supply Current
Typ
Max
TA = ≤ 85°C
TA = ≤ 125°C
Min
Min
Max
1.5
2.0
2.4
0.5
0.8
0.8
1.9
2.9
2.58
2.0
3.0
0.0
0.0
Max
1.5
2.0
2.4
0.5
0.8
0.8
1.9
2.9
2.48
Unit
V
0.5
0.8
0.8
V
1.9
2.9
2.34
V
0.1
0.1
0.36
0.1
0.1
0.44
0.1
0.1
0.52
V
3.6
±0.1
±1.0
±1.0
mA
Vin = VIL or VIH
Vout = VCC or GND
3.6
±0.25
±2.5
±5.0
mA
Vin = VCC or GND
3.6
4.0
40
40
mA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
TA = 25°C
Symbol
tPLH,
tPHL
tPZL,
tPZH
tPLZ,
tPHZ
tOSHL
tOSLH
Output Enable Time
OE to O
Output Disable Time
OE to O
Output−to−Output Skew
(Note 1)
Min
TA = ≤ 125°C
Typ
Max
Min
Max
Min
Max
Unit
VCC = 2.7 V
CL = 15 pF
CL = 50 pF
5.5
7.5
10.1
13.6
1.0
1.0
13.5
17.0
1.0
1.0
15.0
19.0
ns
VCC = 3.3 ± 0.3 V
CL = 15 pF
CL = 50 pF
3.9
5.9
6.2
9.7
1.0
1.0
8.5
12.0
1.0
1.0
11.0
14.0
VCC = 2.7 V
RL =1 kW
CL = 15 pF
CL = 50 pF
5.3
7.8
9.3
12.8
1.0
1.0
12.5
16.0
1.0
1.0
15.5
18.5
VCC = 3.3 ± 0.3 V
RL =1 kW
CL = 15 pF
CL = 50 pF
4.0
6.5
5.6
9.1
1.0
1.0
7.5
11.0
1.0
1.0
9.5
13.0
VCC = 2.7 V
RL =1 kW
CL = 50 pF
10.0
15.7
1.0
19.0
1.0
21.0
VCC = 3.3 ± 0.3 V
RL =1 kW
CL = 50 pF
8.3
11.2
1.0
13.0
1.0
15.0
VCC = 2.7 V
VCC = 3.3 ± 0.3 V
CL = 50 pF
CL = 50 pF
Parameter
Propagation Delay
Input to Output
TA = ≤ 85°C
Test Conditions
1.5
1.5
1.5
1.5
1.5
1.5
ns
ns
ns
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
CAPACITIVE CHARACTERISTICS
TA = 25°C
Symbol
Min
Parameter
Typ
Max
10
TA = ≤ 85°C
TA = ≤ 125°C
Min
Min
Max
10
Max
Unit
10
pF
Cin
Input Capacitance
4
Cout
Maximum Three−State Output Capacitance
6
pF
CPD
Power Dissipation Capacitance (Note 2)
14
pF
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 4 (per bit). CPD is used to determine the no−load
dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
MC74LVX126
NOISE CHARACTERISTICS (Input tr = tf = 3.0 ns, CL = 50 pF, VCC = 3.3 V, Measured in SOIC Package)
TA = 25°C
Symbol
Characteristic
Typ
Max
Unit
VOLP
Quiet Output Maximum Dynamic VOL
0.3
0.5
V
VOLV
Quiet Output Minimum Dynamic VOL
−0.3
−0.5
V
VIHD
Minimum High Level Dynamic Input Voltage
2.0
V
VILD
Maximum Low Level Dynamic Input Voltage
0.8
V
ORDERING INFORMATION
Package
Shipping†
MC74LVX126D
SOIC−14
55 Units / Rail
MC74LVX126M
SOEIAJ−14
50 Units / Rail
MC74LVX126MEL
SOEIAJ−14
2000 Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
SWITCHING WAVEFORMS
D
O
VCC
50%
tPLH
tPHL
OE
GND
VCC
50%
tPZL
O
50% VCC
50% VCC
tPZH
O
tPHZ
50% VCC
Figure 3.
GND
tPLZ
HIGH
IMPEDANCE
VOL +0.3 V
VOH −0.3 V
HIGH
IMPEDANCE
Figure 4.
TEST CIRCUITS
TEST POINT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
OUTPUT
DEVICE
UNDER
TEST
CL*
*Includes all probe and jig capacitance
1 kW
CL*
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
*Includes all probe and jig capacitance
Figure 5. Propagation Delay Test Circuit
Figure 6. Three−State Test Circuit
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4
MC74LVX126
PACKAGE DIMENSIONS
PDIP−14
P SUFFIX
CASE 646−06
ISSUE N
14
8
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
A
F
L
N
DIM
A
B
C
D
F
G
H
J
K
L
M
N
C
−T−
SEATING
PLANE
H
D 14 PL
G
J
K
0.13 (0.005)
M
M
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
−−−
10 _
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
18.80
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
−−−
10 _
0.38
1.01
SOIC−14
D SUFFIX
CASE 751A−03
ISSUE G
−A−
14
8
−B−
P 7 PL
0.25 (0.010)
B
M
7
1
G
0.25 (0.010)
M
T B
J
M
K
D 14 PL
F
R X 45 _
C
−T−
SEATING
PLANE
M
S
A
S
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5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0_
7_
0.228 0.244
0.010 0.019
MC74LVX126
PACKAGE DIMENSIONS
SOEIAJ−14
M SUFFIX
CASE 965−01
ISSUE O
14
LE
8
Q1
E HE
L
7
1
M_
DETAIL P
Z
D
VIEW P
A
e
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.10 (0.004)
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
1.42
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−−
0.056
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MC74LVX126/D
