MC74LVX245
Octal Bus Transceiver
With 5 V−Tolerant Inputs
The MC74LVX245 is an advanced high speed CMOS octal bus
transceiver.
It is intended for two−way asynchronous communication between
data buses. The direction of data transmission is determined by the
level of the T/R input. The output enable pin (OE) can be used to
disable the device, so that the buses are effectively isolated.
All inputs are equipped with protection circuits against static
discharge.
• High Speed: tPD = 4.7 ns (Typ) at VCC = 3.3 V
• Low Power Dissipation: ICC = 4 A (Max) at TA = 25°C
• Power Down Protection Provided on Inputs
• Balanced Propagation Delays
• Low Noise: VOLP = 0.8 V (Max)
• Pin and Function Compatible with Other Standard Logic Families
• Latchup Performance Exceeds 300 mA
• ESD Performance: Human Body Model > 2000 V;
Machine Model > 200 V
• Pb−Free Packages are Available*
APPLICATION NOTES
• Do not force a signal on an I/O pin when it is an active output,
•
•
damage may occur.
All floating (high impedance) input or I/O pins must be fixed by
means of pullup or pulldown resistors or bus terminator ICs.
A parasitic diode is formed between the bus and VCC terminals.
Therefore, the LVX245 cannot be used to interface 5 V to 3 V
systems directly.
VCC
OE
B0
B1
B2
B3
B4
B5
B6
B7
20
19
18
17
16
15
14
13
12
11
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MARKING
DIAGRAMS
20
LVX245
AWLYYWW
SOIC−20
DW SUFFIX
CASE 751D
LVX
245
ALYW
TSSOP−20
DT SUFFIX
CASE 948E
LVX245
AWLYWW
SOEIAJ−20
M SUFFIX
CASE 967
A
WL, L
Y, YY
W, WW
1
2
3
4
5
6
7
8
9
10
T/R
A0
A1
A2
A3
A4
A5
A6
A7
GND
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Figure 1. 20−Lead Pinout (Top View)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2004
September, 2004 − Rev. 2
1
Publication Order Number:
MC74LVX245/D
MC74LVX245
Table 1. PIN NAMES
OE 19
Pins
T/R 1
A0
OE
T/R
A0−A7
Bo−B7
2
18
A1
A3
A5
B5
8
12
A7
B4
7
13
A6
B3
6
14
B6
9
11
OPERATING MODE
Non−Inverting
OE
T/R
L
L
B Data to A Bus
L
H
A Data to B Bus
H
X
Z
H = High Voltage Level; L = Low Voltage Level; Z = High
Impedance State; X = High or Low Voltage Level and Transitions
are Acceptable; For ICC reasons, Do Not Float Inputs
B2
5
15
A4
B1
4
16
Output Enable Input
Transmit/Receive Input
Side A 3−State Inputs or 3−State Outputs
Side B 3−State Inputs or 3−State Outputs
INPUTS
3
17
A2
B0
Function
B7
Figure 2. Logic Diagram
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2
MC74LVX245
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MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
–0.5 to +7.0
V
Vin
DC Input Voltage (T/R, OE)
–0.5 to +7.0
V
VI/O
DC Output Voltage
–0.5 to VCC +0.5
V
IIK
Input Diode Current
−20
mA
IOK
Output Diode Current
±20
mA
Iout
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±75
mA
PD
Power Dissipation
180
mW
Tstg
Storage Temperature
–65 to +150
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
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RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
2.0
3.6
V
VCC
DC Supply Voltage
Vin
DC Input Voltage (T/R, OE)
0
5.5
V
VI/O
DC Output Voltage
0
VCC
V
TA
Operating Temperature, All Package Types
−40
+85
°C
t/V
Input Rise and Fall Time
0
100
ns/V
TA = 25°C
TA = − 40 to 85°C
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Test Conditions
VCC
V
Min
1.5
2.0
2.4
VIH
High−Level Input Voltage
2.0
3.0
3.6
VIL
Low−Level Input Voltage
2.0
3.0
3.6
VOH
High−Level Output Voltage
(Vin = VIH or VIL)
IOH = −50 A
IOH = −50 A
IOH = −4 mA
2.0
3.0
3.0
VOL
Low−Level Output Voltage
(Vin = VIH or VIL)
IOL = 50 A
IOL = 50 A
IOL = 4 mA
2.0
3.0
3.0
Iin
Input Leakage Current
Vin = 5.5 V or GND
(T/R, OE)
IOZ
Maximum 3−State Leakage Current
ICC
Quiescent Supply Current
Typ
Max
Min
1.5
2.0
2.4
0.5
0.8
0.8
1.9
2.9
2.58
Max
2.0
3.0
V
0.5
0.8
0.8
1.9
2.9
2.48
V
V
0.1
0.1
0.36
0.1
0.1
0.44
V
3.6
±0.1
±1.0
A
Vin = VIL or VIH
Vout = VCC or GND
3.6
±0.25
±2.5
A
Vin = VCC or GND
3.6
4.0
40.0
A
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3
0.0
0.0
Unit
MC74LVX245
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AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
TA = 25°C
Symbol
tPLH,
tPHL
tPZL,
tPZH
tPLZ,
tPHZ
tOSHL
tOSLH
Parameter
Test Conditions
Propagation Delay
Input to Output
Output Enable Time to
High and Low Level
Output Disable Time From
High and Low Level
Output−to−Output Skew
(Note 1)
Min
TA = − 40 to 85°C
Typ
Max
Min
Max
Unit
ns
VCC = 2.7 V
CL = 15 pF
CL = 50 pF
6.1
8.6
10.7
14.2
1.0
1.0
13.5
17.0
VCC = 3.3 ± 0.3 V
CL = 15 pF
CL = 50 pF
4.7
7.2
6.6
10.1
1.0
1.0
8.0
11.5
VCC = 2.7 V
RL = 1 k
CL = 15 pF
CL = 50 pF
9.0
11.5
16.9
20.4
1.0
1.0
20.5
24.0
VCC = 3.3 ± 0.3 V
RL = 1 k
CL = 15 pF
CL = 50 pF
7.1
9.6
11.0
14.5
1.0
1.0
13.0
16.5
VCC = 2.7 V
RL = 1 k
CL = 50 pF
11.5
18.0
1.0
21.0
VCC = 3.3 ± 0.3 V
RL = 1 k
CL = 50 pF
9.6
12.8
1.0
14.5
VCC = 2.7 V
VCC = 3.3 ±0.3 V
CL = 50 pF
CL = 50 pF
1.5
1.5
1.5
1.5
ns
ns
ns
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
TA = 25°C
Symbol
Min
Parameter
TA = − 40 to 85°C
Typ
Max
10
Min
Max
Unit
10
pF
Cin
Input Capacitance (T/R, OE)
4
CI/O
Maximum 3−State I/O Capacitance
8
pF
CPD
Power Dissipation Capacitance (Note 2)
21
pF
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 8 (per bit). CPD is used to determine the no−load
dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50pF, VCC = 3.3V, Measured in SOIC Package)
TA = 25°C
Symbol
Characteristic
Typ
Max
Unit
VOLP
Quiet Output Maximum Dynamic VOL
0.5
0.8
V
VOLV
Quiet Output Minimum Dynamic VOL
−0.5
−0.8
V
VIHD
Minimum High Level Dynamic Input Voltage
2.0
V
VILD
Maximum Low Level Dynamic Input Voltage
0.8
V
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4
MC74LVX245
SWITCHING WAVEFORMS
T/R
Input
A or B
Output
B or A
VCC
50%
tPLH
tPHL
OE
50%
50% VCC
50% VCC
tPZL
GND
A or B
50% VCC
VCC
GND
VOL +0.3V
tPHZ
VOH −0.3V
50% VCC
Figure 3.
GND
HIGH
IMPEDANCE
50% VCC
tPZH
A or B
tPLZ
VCC
HIGH
IMPEDANCE
Figure 4.
TEST CIRCUITS
TEST POINT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
OUTPUT
DEVICE
UNDER
TEST
CL*
*Includes all probe and jig capacitance
1 k
CL*
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
*Includes all probe and jig capacitance
Figure 5. Propagation Delay Test Circuit
Figure 6. 3−State Test Circuit
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5
MC74LVX245
ORDERING INFORMATION
Package
Shipping†
MC74LVX245DT
TSSOP−20
(Pb−Free)
75 Units / Rail
MC74LVX245DTR2
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
SOIC−20
38 Units / Rail
Device
MC74LVX245DW
MC74LVX245DWR2
SOIC−20
1000 / Tape & Reel
MC74LVX245M
SOEIAJ−20
(Pb−Free)
50 Units / Rail
MC74LVX245MEL
SOEIAJ−20
(Pb−Free)
2000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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6
MC74LVX245
PACKAGE DIMENSIONS
SO−20 WB
DW SUFFIX
CASE 751D−05
ISSUE G
A
20
X 45
h
1
10
20X
B
B
0.25
M
T A
B
S
DIM
A
A1
B
C
D
E
e
H
h
L
S
A
L
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
11
B
M
D
e
18X
SEATING
PLANE
A1
C
T
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE B
20X
0.15 (0.006) T U
2X
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
S
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
K
K1
11
J J1
B
L
−U−
PIN 1
IDENT
SECTION N−N
1
10
0.25 (0.010)
N
0.15 (0.006) T U
S
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER
SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN
FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
M
A
−V−
N
F
DETAIL E
−W−
C
D
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0
7
G
H
DETAIL E
0.100 (0.004)
−T− SEATING
PLANE
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7
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0
8
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
−−−
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0
8
MC74LVX245
PACKAGE DIMENSIONS
SOEIAJ−20
M SUFFIX
CASE 967−01
ISSUE O
20
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
11
Q1
E HE
1
M
L
10
DETAIL P
Z
D
VIEW P
e
A
c
A1
b
0.13 (0.005)
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
12.35
12.80
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10
0
0.70
0.90
−−−
0.81
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.486
0.504
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10
0
0.028
0.035
−−−
0.032
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MC74LVX245/D
