MC74VHC1GT04DF1G

MC74VHC1GT04 Inverting Buffer / CMOS Logic Level Shifter with LSTTL−Compatible Inputs The MC74VHC1GT04 is a single gate inverting buffer fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The device input is compatible with TTL−type input thresholds and the output has a full 5.0 V CMOS level output swing. The input protection circuitry on this device allows overvoltage tolerance on the input, allowing the device to be used as a logic−level translator from 3.0 V CMOS logic to 5.0 V CMOS Logic or from 1.8 V CMOS logic to 3.0 V CMOS Logic while operating at the high−voltage power supply. The MC74VHC1GT04 input structure provides protection when voltages up to 7.0 V are applied, regardless of the supply voltage. This allows the MC74VHC1GT04 to be used to interface 5.0 V circuits to 3.0 V circuits. The output structures also provide protection when VCC = 0 V. These input and output structures help prevent device destruction caused by supply voltage − input/output voltage mismatch, battery backup, hot insertion, etc. • • • • • • • • • http://onsemi.com MARKING DIAGRAMS 5 SC−88A DF SUFFIX CASE 419A VKd 1 TSOP−5 DT SUFFIX CASE 483 5 VKd 1 VK = Specific Device Code d = Date Code High Speed: tPD = 3.8 ns (Typ) at VCC = 5.0 V Low Power Dissipation: ICC = 1
A (Max) at TA = 25°C PIN ASSIGNMENT TTL−Compatible Inputs: VIL = 0.8 V; VIH = 2.0 V CMOS−Compatible Outputs: VOH > 0.8 VCC; VOL < 0.1 VCC @ Load Power Down Protection Provided on Inputs and Outputs Balanced Propagation Delays Pin and Function Compatible with Other Standard Logic Families 1 NC 2 IN A 3 GND 4 OUT Y 5 VCC Chip Complexity: FETs = 105; Equivalent Gates = 26 Pb−Free Package is Available NC 1 IN A 2 GND 3 5 VCC 4 OUT Y FUNCTION TABLE 1 Y Output L H H L ORDERING INFORMATION Figure 1. Pinout (Top View) IN A A Input See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. OUT Y Figure 2. Logic Symbol  Semiconductor Components Industries, LLC, 2004 March, 2004 − Rev. 10 1 Publication Order Number: MC74VHC1GT04/D MC74VHC1GT04 MAXIMUM RATINGS Symbol Characteristics Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V VOUT DC Output Voltage −0.5 to 7.0 −0.5 to VCC + 0.5 V IIK Input Diode Current −20 mA IOK Output Diode Current +20 mA IOUT DC Output Current, per Pin +25 mA ICC DC Supply Current, VCC and GND +50 mA PD Power dissipation in still air SC−88A, TSOP−5 200 mW JA Thermal resistance SC−88A, TSOP−5 333
C/W TL Lead temperature, 1 mm from case for 10 s 260 °C TJ Junction temperature under bias +150 °C Tstg Storage temperature −65 to +150 °C VESD ESD Withstand Voltage Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) > 1500 > 200 N/A V ILatch−Up Latch−Up Performance Above VCC and Below GND at 125°C (Note 4) ±500 mA VCC = 0 High or Low State VOUT < GND; VOUT > VCC Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Tested to EIA/JESD22−A114−A 2. Tested to EIA/JESD22−A115−A 3. Tested to JESD22−C101−A 4. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC DC Supply Voltage 3.0 5.5 V VIN DC Input Voltage 0.0 5.5 V VOUT DC Output Voltage 0.0 0.0 5.5 VCC V TA Operating Temperature Range −55 +125 °C tr , tf Input Rise and Fall Time 0 0 100 20 ns/V VCC = 0 High or Low State 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 TJ = 80 ° C 80 TJ = 90 ° C Time, Years TJ = 100 ° C Time, Hours TJ = 110° C Junction Temperature °C FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 120° C Device Junction Temperature versus Time to 0.1% Bond Failures TJ = 130 ° C NORMALIZED FAILURE RATE VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V 1 1 10 100 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 1000 MC74VHC1GT04 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Test Conditions Min 1.4 2.0 2.0 VIH Minimum High−Level Input Voltage 3.0 4.5 5.5 VIL Maximum Low−Level Input Voltage 3.0 4.5 5.5 VOH Minimum High−Level Output Voltage VIN = VIH or VIL VOL Maximum Low−Level Output Voltage VIN = VIH or VIL TA ≤ 85°C TA = 25°C VCC (V) Typ Max Min 3.0 4.5 2.9 4.4 VIN = VIH or VIL IOH = −4 mA IOH = −8 mA 3.0 4.5 2.58 3.94 VIN = VIH or VIL IOL = 50
A 3.0 4.5 VIN = VIH or VIL IOL = 4.0 mA IOL = 8.0 mA Max 1.4 2.0 2.0 0.53 0.8 0.8 VIN = VIH or VIL IOH = −50
A −55 ≤ TA ≤ 125°C 3.0 4.5 Min Max 1.4 2.0 2.0 0.53 0.8 0.8 V 0.53 0.8 0.8 2.9 4.4 2.9 4.4 2.48 3.80 2.34 3.66 Unit V V V 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V V IIN Maximum Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 ±1.0
A ICC Maximum Quiescent Supply Current VIN = VCC or GND 5.5 1.0 20 40
A ICCT Quiescent Supply Current Input: VIN = 3.4 V 5.5 1.35 1.50 1.65 mA IOPD Output Leakage Current VOUT = 5.5 V 0.0 0.5 5.0 10
A ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ AC ELECTRICAL CHARACTERISTICS Cload = 50 pF, Input tr = tf = 3.0 ns TA ≤ 85°C TA = 25°C Symbol tPLH, tPHL CIN Parameter Maximum Propagation Delay, g y I Input t A to t Y Min Test Conditions Typ Max Min −55 ≤ TA ≤ 125°C Max Min Max Unit ns VCC = 3.3 ± 0.3 V CL = 15 pF CL = 50 pF 5.0 6.2 10.0 13.5 11.0 15.0 13.0 17.5 VCC = 5.0 ± 0.5 V CL = 15 pF CL = 50 pF 3.8 4.2 6.7 7.7 7.5 8.5 8.5 9.5 5.0 10 10 10 Maximum Input Capacitance pF Typical @ 25°C, VCC = 5.0 V CPD 10 Power Dissipation Capacitance (Note 5) pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD
VCC
fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD
VCC2
fin + ICC
VCC. http://onsemi.com 3 MC74VHC1GT04 TEST POINT 3.0 V A OUTPUT 50% DEVICE UNDER TEST GND tPLH tPHL CL * VOH Y 50% VCC VOL *Includes all probe and jig capacitance Figure 4. Switching Waveforms Figure 5. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number Circuit Indicator Temp Range Identifier Technology Device Function Package Suffix Tape & Reel Suffix Package Type Package† MC74VHC1GT04DFT1 MC 74 VHC1G T04 DF T1 SC−88A 3000 / Tape & Reel 178 mm (7 inch) MC74VHC1GT04DFT2 MC 74 VHC1G T04 DF T2 SC−88A 3000 / Tape & Reel 178 mm (7 inch) MC74VHC1GT04DTT1 MC 74 VHC1G T04 DT T1 TSOP−5 3000 / Tape & Reel 178 mm (7 inch) MC74VHC1GT04DF2G MC 74 VHC1G T04 DT T1 SC−88A (Pb−Free) 3000 / Tape & Reel 178 mm (7 inch) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MC74VHC1GT04 PACKAGE DIMENSIONS SC−88A−5 / SOT−353 / SC−70−5 DF SUFFIX CASE 419A−02 ISSUE G A G 5 4 DIM A B C D G H J K N S −B− S 1 2 3 D 5 PL 0.2 (0.008) B M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm 
inches SC−88A/SC70−5/SOT−353 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 MC74VHC1GT04 PACKAGE DIMENSIONS TSOP−5 / SOT−23 / SC−59 DT SUFFIX 5−LEAD PACKAGE CASE 483−02 ISSUE C D S 5 4 1 2 3 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. L MILLIMETERS INCHES DIM MIN MAX MIN MAX A 2.90 3.10 0.1142 0.1220 B 1.30 1.70 0.0512 0.0669 C 0.90 1.10 0.0354 0.0433 D 0.25 0.50 0.0098 0.0197 G 0.85 1.05 0.0335 0.0413 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.55 0.0493 0.0610 M 0_ 10 _ 0_ 10 _ S 2.50 3.00 0.0985 0.1181 G A J C 0.05 (0.002) H M K SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm 
inches THIN SOT23−5/TSOP−5/SC59−5 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 6 For additional information, please contact your local Sales Representative. MC74VHC1GT04/D